Claims:CLAIMS
We Claim :
1. A process of recycling of discarded and jettisoned scrap of Electronic waste into 3D Printing Filament using a Filament Recycler Process comprising:
a. collection of discarded and jettisoned scrap of Electronic waste (E-waste);
b. breaking down of actionable substrate from the Electronic boards and further fragmenting using the deconstruction techniques to dissever the substrate from layers of other materials such as Silkscreen, Solder mask, copper.;
c. further processing of the well secured substrate from the boards in a shredder machine where it is metamorphosed into useful pallets which are dilapidated further using the extruder;
d. whereby a filament with a size compatible with 3d printer is obtained.
Dated this the 17th September 2020
Senthil Kumar B
Agent for the applicant
IN/PA-1549 , Description:
FORM 2

THE PATENTS ACT, 1970
(39 of 1970)
&
THE PATENT RULES, 2003
Complete Specification
(See section 10 and rule 13)

1.Title of the Invention :
3D PRINTING FILAMENTS FROM PLASTIC AND ELECTRONIC WASTE
2. Applicants
Name Nationality Address
S.Ajay Vaidhyanathan

Abhishekh Christian Samuel J

M.Balaji

S.D.Kumar

Dr.G.Swaminathan

Dr.A.Mathivanan

C.Uthirapathy

G.Manikandan

N.Manikandan

Sanjay Muralidharan Indian

Indian

Indian

Indian

Indian

Indian

Indian

Indian

Indian “D-309, 3rd floor, VGN Temple Town, No.99 Sivan Kovil road, Thiruverkadu, Chennai - 600077.

Flat 5A Gardenia Apartments Kilpauk Garden Main Road Kilpauk Chennai 600 010.

1A, Aishwarya Flats, West kamakoti nagar, Valasaravakkam, Chennai - 600087.

12/291, Moogambigai Nagar Extension, Sikkarayapuram, Chennai-600122

Block 22/S2, Ruby Residency, Narmadha Street, Irumbuliyur, Tambaram, Chennai-600059

2/16, Flat F2, Thiruvalluvar Nagar, 1st street , Alandur, Chennai-600016.

Flat No 29, Genesis Home, Moovendhar Nagar, Old Perungalathur, Chennai-600063

149, Kattukottai, Sadayampattu, Somandargudi, Kallakuruchi, Tamil Nadu

No.61B, 4th street, Srinivasan Nagar, Poonamallee, Chennai 600056

AS1 Guru Royal Palace, 142 Rayala Nagar, 1st Main Road, Ramapuram, Chennai 600089

3. Preamble to the Description :
The following specification particularly describes the invention and the manner in which it is to be performed.

4. DESCRIPTION
Field of the Invention
The present invention is related to the field of waste management. More particularly, this invention is related to provide input material to the additive manufacturing industry.
Background of the invention
3D printing is vastly used in almost every product for prototype testing before actual production. Thus, this might be a solution to both reducing production of plastic and implement an alternative solution to manage E-waste. The use of 3D printers is widely accepted due to its faster rate of production. Now, 3D printers are said to produce all products that are needed but the raw materials and substrate are mainly required for this process. This invention aims to utilize plastic wastes as well as effectively reducing the cost of 3d printing filaments.
Summary of the invention
The principal aim of this invention is to provide a system and process for use of the discarded and jettisoned scrap of Electronic waste (E-waste) into a beneficial and useful 3D Printing Filament using the Filament Recycler Process. Nowadays the amount of E-Waste produced globally is soaring to an alarming and a high level and it is leading to an increase in the environmental pollution. Therefore, one of the aims of this invention is control and reduction of E-waste by devising its use as a different alternative in the additive manufacturing industry.
Electronic Wastes can cause critical effects in Environment if not handled properly. This invention not only reduces E-Waste but also contributes to the additive manufacturing industry which is out growing any other industry. Usage of 3D printing is outgrowing since the concept of prototyping was made easier. Hence the proposal of using 3D printing filament can be advantageous because of ensured quality and relatively low cost from existing products. Thus, it delivers high promises to newer product development in the field of waste management industry.

Detailed description of the invention:
The actionable substrate from the Electronic boards are broken down and further fragmented using the deconstruction techniques which in turn dissevers the substrate from layers of other materials, i.e. Silkscreen, Solder mask, copper. These materials are now used for making the 3D printing filament where the detailed and exact process has been detailed below. The process of Deconstruction before Extrusion of the substrate from the Electronic boards on a major scale tends to diminish the plethora of harmful effects caused by layers of toxic materials in solder mask. This is a key factor which increases the overall functionality, effectively and across the board practicality of this invention. The commensurate idea can be invoked to other plastic wastes which can also be reused in a similar manner which in their own way can separately be used to produce a uniform filament. The further processing of the well secured substrate from the boards is favorably accomplished in the shredder machine where it is metamorphosed making it into useful pallets which are dilapidated further using the extruder. In this way the final filament obtained after cooling finds its right place in the evergreen field of additive manufacturing in turn contributing in reducing the hazards of E-waste in the environment. Thus, 3D printing filament with quality almost the same as the market product at a low cost is delivered.
The main aim of the invention is the use of e-wastes and plastic wastes to produce 3D filaments which can be used in 3d printers. The main objective of this invention is to reduce production of plastics, and existing plastics can be used into usable filaments. This invention uses the filament recycle process to recycle said wastes to produce filaments to be used in 3D printing. The use of these filaments can be based on the working of the 3D printer. E-wastes are much harder to process than plastic wastes. This is because of the toxic wastes that are present in these e-wastes. So, various chemical and physical processes are undergone in order to separate the substrate for the processing of filaments. Once after deconstruction of plastic substrate from PCB board through above mentioned chemical process, it can be shredded into tiny pellets for extrusion process. The result obtained from this is a filament with a size compatible with 3d printer with quality similar to current existing filaments.
While the foregoing disclosure shows illustrative aspects of the disclosure, it should be noted that various changes and modifications could be made herein without departing from the scope of the disclosure as defined by the appended claims. Furthermore, although elements of the disclosure may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.

Senthil Kumar B
(Agent for the applicant)
IN/PA-1549