Company Information
CIN
Status
Date of Incorporation
06 February 2001
State / ROC
Delhi / ROC Delhi
Industry
Sub Category
Non-govt company
Last Balance Sheet
Last Annual Meeting
Paid Up Capital
0
Authorised Capital
20,000,000
Directors
Past Directors
Patents
A heat transfer device includes a chamber with a condensable fluid with an evaporative region coupled to a heat source. Within the chamber is a boiling-enhanced multi-wick structure.
Trademarks
[Class : 37] Custom Assembly Of Heat Sinks For Computers, Computer Chips, Motherboards, And Chassis For Personal Computers, And Computer Systems.[Class : 9] Heat Sinks For Computers; Computer Chips, Computer Units.[Class : 42] Custom Design Of, And Research And Development In The Field Of, Heat Sinks For Computers, Computer Chips, Motherboards, And Chassis For Personal Compu...
["Trade mark is likely to be removed due to non filing of Renewal request within prescribed time limit In case of any discripancy contact respective TM Registry. "]
