[Class : 7] Die Bonders For Use In Semiconductor Manufacturing; Wire Bonders For Use In Semiconductor Manufacturing; Chip On Film Bonders For Use In Semiconductor Manufacturing; Flip Chip Bonders For Use In Semiconductor Manufacturing; Bump Bonders For Use In Semiconductor Manufacturing; Semiconductor Manufacturing Machines And Systems; Ultrasonic Cleaning Machin...

[Class : 9] Generators For Ultrasonic Cleaning Machines; Transducers For Ultrasonic Cleaning Machines; Electronic Ultrasonic Defection Apparatus For Motor Vehicles; Transducer Devices For Converting Incident Ultrasonic Signals To Electrical Signals; Ultrasonic Apparatus For Scanning Components For Flaws; Ultrasonic Apparatus For The Drying Of Articles; Ultrasonic ...