A circuit subassembly is disclosed comprising a conductive metal layer and a dielectric substrate layer having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006 at 10 GHz wherein the composition of the dielectric substrate layer comprises about 5 to about 70 volume percen...
A thermal management circuit material comprises a thermally conductive metallic core substrate metal oxide dielectric layers on both sides of the metallic core substrate electrically conductive metal layers on the metal oxide metal oxide dielectric layers and at least one through hole via filled with an electrically...
A circuit subassembly is disclosed comprising a conductive metal layer and a dielectric substrate layer having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006 at 10 GHz, wherein the composition of the dielectric substrate layer comprises about 5 to about 70 volume perce...
[Class : 17] Electrically Conductive Urethane Foams For Use As Grounding Pads, Electro Magnetic And Radio Frequency Interference Shielding, Gasketing, Sealing And Cushioning In Electronic Devices And Industrial Applications
[Class : 9] "Protective Clothing; Protective Clothing For Use In Sports, Military, Rescue, Police, Medical And Workplace Environments; Protective Lining For Clothing For Use In Sports, Military, Rescue, Police, Medical And Workplace Environments; Protective Guards For Use In Sports, Military, Rescue, Police, Medical And Workplace Environments; Protective Pads For Use In Spor...
[Class : 17] Electronic Circuit Material, Namely, A Dielectric Substrate Clad On One Or Both Sides With A Conductive Layer For Fabricating Electronic Circuits
Renewal of trademark is due. Renewal request in prescribed form is to be filed by the applicant.
[Class : 17] Microporous Plastic Material, Namely, Microporous Plastic Foams That Are Highly Resilient And Shock Absorbing, Available In Sheet, Rolled And Semi Finished Form
[Class : 17] Semi Finished And Finished Polyurethane Foam Used In The Further Manufacture Of Various Products For Applications Within The Electronics And General Industrial Market Segments; Microporous Polyurethane Material As Semi Finished Products In Sheet Or Roll Form, Or Molded Shape Form For Use In The Further Manufacture Of Various Products In A Variety Of Industries
[Class : 17] Electronic Circuit Material, Namely, A Dielectric Substrate Clad On One Or Both Sides With A Conductive Layer For Fabricating Electronic Circuits
Renewal of trademark is due. Renewal request in prescribed form is to be filed by the applicant.
[Class : 17] Microporous Plastic Material, Namely,
Microporous Plastic Foams, In Finished Form,
And Semi Finished Form And Used In The
Further Manufacture Of Various Products For
Applications Within The Electronics And
General Industrial Market Segments,
Microporous Plastic Material In Sheet Or Roll
Form, Or In Molded Shape Form; In
International Class 17
[Class : 17] Microporous Plastic Material, Namely Microporous Plastic Foams, In Finished Form, And Semi Finished Form And Used In The Further Manufacture Of Various Products; Microporous Plastic Material In Sheet Or Roll Form, Or In Molded Shape Form.
[Class : 17] Electronic Circuit Material, Namely, A Dielectric Substrate Clad On One Or Both Sides With A Conductive Layer For Fabricating Electronic Circuits, Alternatively A Dielectric Prepreg Adhesive Or Bonding Film Used For Fabricating Electronic Circuits
Renewal of trademark is due. Renewal request in prescribed form is to be filed by the applicant.
[Class : 17] Electronic Circuit Material, Namely, A Dielectric Substrate Clad On One Or Both Sides With A Conductive Layer For Fabricating Electronic Circuits, Alternatively A Dielectric Prepreg Adhesive Or Bonding Film Used For Fabricating Electronic Circuits
Renewal of trademark is due. Renewal request in prescribed form is to be filed by the applicant.
[Class : 17] Laminate Materials;
Materials For Use In The Manufacture Of
Antennas And Radio Frequency Applications,
Laminate Materials That Have Specifically
Designed Magnetic Permeability And
Electric Permittivity For Operating At
Selective Frequencies.
Renewal of trademark is due. Renewal request in prescribed form is to be filed by the applicant.
[Class : 9] Electronic Circuit Material, Namely, An Insulating Dielectric Substrate Material Which Is Clad On One Or Both Sides With A Conductor Layer For Fabricating Electronic Circuits
[Class : 17] Electronic Circuit Material, Namely, An Insulated Dielectric Substrate Material Which Is Clad On One Side With A Conductive Layer Of Heavy Metals For Fabricating Electronic Circuits
Renewal of trademark is due. Renewal request in prescribed form is to be filed by the applicant.
[Class : 17] Electronic Circuit Material, Namely, A Dielectric Substrate Clad On One Or Both Sides With A Conductive Layer For Fabricating Electronic Circuits, Alternatively A Dielectric Prepreg Adhesive Or Bonding Film Used For Fabricating Electronic Circuits
Renewal of trademark is due. Renewal request in prescribed form is to be filed by the applicant.
[Class : 17] Electronic Circuit Material, Namely, An Insulating Dielectric Substrate Material Which Is Clad On One Of Both Sides With A Conductor Layers For Use In Fabricating Electronic Circuits.
[Class : 17] Circuit Materials; Magnetodielectric Material Cores And Laminate Materials; Materials For Use In The Manufacture Of Antennas And Radio Frequency Applications; Magnetodielectric Material Cores And Laminate Materials That Have Specifically Designed Magnetic Permeability And Electric Permittivity For Operating At Selective Frequencies.
[Class : 17] Electronic Circuit Material, Namely, A Dielectric Substrate Clad On One Or Both Sides With A Conductive Layer For Fabricating Electronic Circuits, Alternatively A Dielectric Prepreg Adhesive Or Bonding Film Used For Fabricating Electronic Circuits
[Class : 17] Thermoplastic Material; Thermoplastic Material For Thermoformability, Heat Dissipation / Cooling, Heat Absorbing, Impact Protection; Plastic Material In Roll Form For Use In The Further Manufacture Of Various Products. Plastic Materials For Use In Heat Absorption In Consumer And Industrial Electronics For Thermal Management; Heat Management Film; Heat Absorbing ...
[Class : 9] Circuit Materials In The Nature Of Connectors For Electronic Circuits, Electric Circuit Closers, Electric Circuit Openers, Electric Circuit Switches, Electrical Circuit Boards, Electronic Circuit Cards, And Electronic Integrated Circuits.[Class : 17] Circuit Materials In The Nature Of Insulating And Protective Interlayer Dielectric Materials And Coatings For Use ...
[Class : 17] Electronic Circuit Material, Namely, An Insulating Dielectric Substrate Material Which Is Clad On One Or Both Sides With A Conductor Layer For Use In Fabricating Electronic Circuits.
[Class : 17] Microporous Plastic Material, Namely, Microporous Plastic Foams, In Sheet, Roll And Semi Finished Form For Use In The Further Manufacture Of Various Products; Microporous Plastic Material In Sheet Or Roll Form.
[Class : 1] Adhesives For Printed Circuit Boards And Heat Sink Bonding Applications; Adhesives For Commercial And Industrial Use, Namely, Transfer Adhesives.[Class : 7] Non Metal Mechanical Seals Being Machine Parts For Use In Automotive Applications, Namely, For Reducing Noise, Friction, And Wear Among Automotive Parts.[Class : 17] Polytetrafluoroethylene (Ptfe) Films And T...
[Class : 17] Urethane Foam Rubber; Microporous Plastic Material, Namely, Microporous Plastic Foams, In Finished Form And In Molded Form In The Nature Of Sheets And Rolls Used For The Further Manufacture Of Building Construction Materials Such As Full Surface Bearings, Strip Bearings, And Point Bearings; Microporous Plastic Material, Namely, Microporous Plastic Foams In Semi ...
[Class : 9] Electronic Circuit Material, Namely, A Dielectric Substrate Clad On One Or Both Sides With A Conductive Layer For Fabricating Electronic Circuits.
[Class : 17] Electronic Circuit Material, Namely, An Insulating Dielectric Substrate Material Which Is Clad On One Or Both Sides With A Conductor Layer For Use In Fabricating Electronic Circuits.