Company Information

CIN
Status
Date of Incorporation
03 January 2000
State / ROC
/ ROC Hyderabad
Last Balance Sheet
31 March 2023
Last Annual Meeting
21 July 2023
Paid Up Capital
70,889,600
Authorised Capital
75,000,000

Directors

Basanta Kumar Mishra
Basanta Kumar Mishra
Director/Designated Partner
over 2 years ago
Narasimham Venkata Rachakonda
Narasimham Venkata Rachakonda
Director/Designated Partner
over 2 years ago
Venkatakumar Raju Vadapalli
Venkatakumar Raju Vadapalli
Director/Designated Partner
over 3 years ago
Venkateswara Rao Gajjala
Venkateswara Rao Gajjala
Director/Designated Partner
over 5 years ago
Krishna Kumari Palle
Krishna Kumari Palle
Director/Designated Partner
over 5 years ago
Srinivasa Rao Vadlamudi
Srinivasa Rao Vadlamudi
Manager/Secretary
about 7 years ago
Subramanyam Reddy Chelikam
Subramanyam Reddy Chelikam
Director/Designated Partner
about 10 years ago
Venkateswarlu Jonnalagadda
Venkateswarlu Jonnalagadda
Director/Designated Partner
about 10 years ago
Aradhana Dilip Rewatkar
Aradhana Dilip Rewatkar
Company Secretary
about 14 years ago
Shivanand Raja
Shivanand Raja
Nominee Director
over 15 years ago
Chander Prakash Gurnani
Chander Prakash Gurnani
Nominee Director
over 16 years ago
Jayaraman Ganapathy
Jayaraman Ganapathy
Director/Designated Partner
over 17 years ago
Murali Venkataramani
Murali Venkataramani
Director
almost 23 years ago

Past Directors

Palepu Sucharita Rao
Palepu Sucharita Rao
Additional Director
over 8 years ago
Rakesh Soni
Rakesh Soni
Director
over 9 years ago
Karthikeyan Natarajan
Karthikeyan Natarajan
Nominee Director
over 15 years ago
Sujit Baksi
Sujit Baksi
Nominee Director
over 16 years ago
Vadlamani Srinivasu
Vadlamani Srinivasu
Director
over 17 years ago

Patents

Medium For Providing Electrical Connectivity Between End Terminal Connections

Exemplary embodiment of the present disclosure is directed towards a medium for providing electrical connectivity between end terminal connections. The medium includes a flexible circuit comprising three or more layers for carrying a signal and carrying a power between at least two automotive components which are in...

Compact Molded Interconnect Device For Automotive Applications

A compact molded interconnect device for automotive applications is disclosed. The electronic circuit laid on a molded plastic component of the compact molded interconnect device to activate and deactivate the electronic switching, dynamic sensing, electronic activation and electronic deactivation of the control uni...

Charges

16 October 2000
Citi Bank
0
16 August 2004
Icici Bank Limited
0
16 October 2000
Icici Bank N.a.
0
16 October 2000
Citi Bank
0
16 August 2004
Icici Bank Limited
0
16 October 2000
Icici Bank N.a.
0
16 October 2000
Citi Bank
0
16 August 2004
Icici Bank Limited
0
16 October 2000
Icici Bank N.a.
0