Abstract: The present application relates to a resin composition and a use thereof. The application may provide a resin composition or a cured product thereof that exhibits low adhesive strength to a predetermined adherend while exhibiting high thermal conductivity. In addition, in the present application, the low adhesive strength may be achieved without using an adhesive strength-adjusting component such as a plasticizer or by minimizing the use ratio thereof. The present application may provide a product including the curable composition or a cured product thereof.
| # | Name | Date |
|---|---|---|
| 1 | 202317071519-STATEMENT OF UNDERTAKING (FORM 3) [19-10-2023(online)].pdf | 2023-10-19 |
| 2 | 202317071519-PRIORITY DOCUMENTS [19-10-2023(online)].pdf | 2023-10-19 |
| 3 | 202317071519-POWER OF AUTHORITY [19-10-2023(online)].pdf | 2023-10-19 |
| 4 | 202317071519-NOTIFICATION OF INT. APPLN. NO. & FILING DATE (PCT-RO-105-PCT Pamphlet) [19-10-2023(online)].pdf | 2023-10-19 |
| 5 | 202317071519-FORM 1 [19-10-2023(online)].pdf | 2023-10-19 |
| 6 | 202317071519-DRAWINGS [19-10-2023(online)].pdf | 2023-10-19 |
| 7 | 202317071519-DECLARATION OF INVENTORSHIP (FORM 5) [19-10-2023(online)].pdf | 2023-10-19 |
| 8 | 202317071519-COMPLETE SPECIFICATION [19-10-2023(online)].pdf | 2023-10-19 |
| 9 | 202317071519-Proof of Right [09-11-2023(online)].pdf | 2023-11-09 |
| 10 | 202317071519-FORM 3 [09-11-2023(online)].pdf | 2023-11-09 |
| 11 | 202317071519-MARKED COPIES OF AMENDEMENTS [28-11-2023(online)].pdf | 2023-11-28 |
| 12 | 202317071519-FORM 13 [28-11-2023(online)].pdf | 2023-11-28 |
| 13 | 202317071519-AMMENDED DOCUMENTS [28-11-2023(online)].pdf | 2023-11-28 |
| 14 | 202317071519-FORM 18 [26-05-2025(online)].pdf | 2025-05-26 |