DESC:FIELD
The present disclosure relates to a cooling system, in particular, it relates to a chiller for cooling a space that contains electronic equipment, such as computer server rooms and server racks in computer data centers.
BACKGROUND
The background information herein below relates to the present disclosure but is not necessarily prior art
A data center is a dedicated facility where computers, servers and electronic devices are kept. The data center has a controlled environment where dust, humidity and ambient temperature are monitored closely. These electronic devices require electricity for their operation. During the operation of these electronic components, a portion of the electrical energy is converted to heat due to the electrical resistance of the circuitry. The overheating results in the failure of electronic components.
Generally, a chiller is used for cooling the interior spaces of data centers. The chiller removes the heat generated by the electronic devices so that electronic devices function correctly and avoid failures of components.
However, the conventional chillers do not provide any access to the interior space of the chiller. Hence repair, and maintenance of inner components of the chiller becomes a cumbersome task.
For cooling industrial plants and large data centers, large-sized chillers are used. These chillers have a large footprint and hence require bigger space for installation. These conventionally used chillers cannot be readily installed like a plug-and-play type of device.
Further, a large-sized chiller comprises a large condenser which consumes a large amount of electricity. Also, conventional chillers do not have an aesthetic view.
Furthermore, the conventional chillers includes one or more compressors of predefined capacity. Therefore, during operation, all the compressors are required to function, there is no option available in the conventional chiller to selectively operate any one of the compressors as per the cooling load requirement and thus, the conventional chillers possess high redundancy.
Therefore, there is a need for a chiller that eliminates the aforementioned drawbacks.
OBJECTS
Some of the objects of the present disclosure, which at least one embodiment herein satisfies, are as follows:
An object of the present disclosure is to provide a chiller.
Another object of the present disclosure is to provide a chiller with a less footprint.
Yet another object of the present disclosure is to provide a chiller that effectively cool a required space.
Still another object of the present disclosure is to provide a chiller that offers ease of servicing.
Another object of the present disclosure is to provide a chiller that can be easily installed.
Yet another object of the present disclosure is to provide a chiller that has an aesthetic view.
Still another object of the present disclosure is to provide a chiller that has low redundancy.
Another object of the present disclosure is to provide a chiller that consumes less power.
Yet another object of the present disclosure is to provide a chiller that offers maximum air flow to the condenser.
Other objects and advantages of the present disclosure will be more apparent from the following description, which is not intended to limit the scope of the present disclosure.
SUMMARY
The present disclosure envisage a chiller. The chiller is configured to be mounted in fluid communication with an indoor unit to maintain a thermodynamically stable-controlled environment within a confined space. The chiller includes a refrigerant flowing therethrough and a cooling media water flowing through the indoor unit.
The chiller comprises a frame structure with an upper operative section and a lower operative section; at least one condensing unit, configured to be disposed in the upper operative section, the condensing unit defined by a V shaped body extending along the length of the upper operative section, the condensing unit is configured with at least one condenser module with at least one condenser coil disposed on each of inclined limb of the V-shaped body to facilitate the flow of the high-pressure high temperature vapor refrigerant therethrough; at least one air circulating mean disposed on the operative top of the V-shaped body nested between the undulated limb of the condensing unit, the air circulating mean is configured to create low pressure zones within the condenser module to draw ambient air across the condenser coil to facilitate exchange of heat with the refrigerant flowing through the condenser coil to convert the high-pressure high temperature vapor refrigerant to high-pressure high temperature liquid refrigerant; at least one expansion mean, configured to be disposed in the lower operative section in fluid communication with an outlet of the condensing unit to receive the high-pressure high temperature liquid refrigerant and is further configured to convert to low-temperature, low-pressure liquid refrigerant; an evaporating unit, configured to be disposed in the lower operative section in fluid communication with an outlet of the expansion means to receive the low-temperature, low-pressure liquid refrigerant, the evaporating unit is configured to be in communication with the indoor unit to receive the water to be cooled and is further configured to exchange heat between the low-temperature, low-pressure liquid refrigerant and the water to generate the vapor refrigerant; and at least one compressing means, configured to be disposed in the lower operative section in fluid communication with an outlet of the evaporating unit and is further configured to compress the low temperature low-pressure vapor refrigerant to convert in to the high-pressure high temperature vapor refrigerant.
In an embodiment, the condenser modules includes a first condenser module and a second condenser module. The first condenser module is configured to be cascadly and removably attached to the operative side of the second condenser module. Each of the condenser modules of the condensing unit is configured with a separate the air circulating means, the compressing means, and the expansion means to facilitate independent actuation of the first condenser module and the second condenser module based on the desired cooling tonnage requirement.
In an embodiment, the first condenser module and the condenser module are configured to be coupled in fluid communication with the evaporating unit.
In an embodiment, the first condenser module and the second condenser module are configured with at least one first condenser coil and at least one second condenser coil. The first condenser coil is configured to be disposed oppositely to the second condenser coil on the inclined limb of the V-shaped body, wherein the ambient air drawn by the air circulating means flows across each of the condenser coils of the condenser module to uniformly cool the flowing refrigerant through the condensing unit and radiate the heat to the surrounding.
In an embodiment, each of the first condenser coil and the second condenser coil is configured with a discharge header and a liquid header.
In an embodiment, each of the condenser coils are selected from a group of consisting of fin and tube type, double pipe, and shell and coil type or any combination thereof.
In an embodiment, the air circulating means is selected from group consisting of fans, blowers, impellers, turbines, propellers, or combinations thereof.
In an embodiment, the frame structure includes removably attached lower panels and side panels to provide access for internal components.
In an embodiment, the chiller includes a plurality of tubes, configured to couple different components of the upper operative section to the lower operative section to transport the desired refrigerant across different component at different temperature and at different pressure and form a refrigerant flow cycle.
In an embodiment, the chiller includes two or more compressing means to facilitate four stage capacity control.
In an embodiment, the chiller includes a filtering and drying means, configured to be coupled in communication between the condensing unit and the expansion means and is further configured to filter out any undesired material(s) from the refrigerant before feeding in the expansion means.
In an embodiment, the chiller includes a Human Machine Interface (HMI) panel, and a control unit disposed in the lower operative section in communication to the evaporating section, the HMI panel is configured to receive user commands to control the operation of the chiller.
BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWING
A chiller of the present disclosure will now be described with the help of the accompanying drawing in which:
Figure 1 illustrates a perspective isometric view of the chiller in accordance with an embodiment of the present disclosure.
Figure 2 illustrates a perspective isometric view of the first condenser module in accordance with an embodiment of the present disclosure.
Figure 3 illustrates a perspective side view of the chiller in which air is entering from sides of the condenser coils and the air escapes out through the top section of air circulating means, in accordance with an embodiment of the present disclosure.
Figure 4 illustrates a perspective isometric view of an electrical connection means, control panel, a HMI panel of the chiller with lower panels in accordance with an embodiment of the present disclosure.
Figure 5 illustrates a perspective isometric view of the chiller with different refrigeration devices installed thereon in accordance with an embodiment of the present disclosure.
Figure 6 illustrates a perspective view of a chiller to cool a desired room space in accordance with an embodiment of the present disclosure.
LIST OF REFERENCE NUMERALS
100 - chiller
102 - condensing unit
103 - frame structure
103A - upper section
103B - lower section
104 - first condenser module
106 - second condenser module
108 - first condenser coil
110 - second condenser coil
112 - air circulating means
116 - discharge header
118 - liquid header
122 - lower panels
124 - side panels
102A- inlet port
102B - outlet port
128 - electrical connection means
130 - control unit
132 - HMI panel
134 - evaporating means
136 - compressing means
138 - pumping means
140 - filter and drying means
142 - expansion means
144 - air handling unit
DETAILED DESCRIPTION
Embodiments, of the present disclosure, will now be described with reference to the accompanying drawing.
Embodiments are provided so as to thoroughly and fully convey the scope of the present disclosure to the person skilled in the art. Numerous details are set forth, relating to specific components, and methods, to provide a complete understanding of embodiments of the present disclosure. It will be apparent to the person skilled in the art that the details provided in the embodiments should not be construed to limit the scope of the present disclosure. In some embodiments, well-known processes, well-known apparatus structures, and well-known techniques are not described in detail.
The terminology used, in the present disclosure, is only for the purpose of explaining a particular embodiment and such terminology shall not be considered to limit the scope of the present disclosure. As used in the present disclosure, the forms "a,” "an," and "the" may be intended to include the plural forms as well, unless the context clearly suggests otherwise. The terms "comprises," "comprising," “including,” and “having,” are open ended transitional phrases and therefore specify the presence of stated features, elements, modules, units and/or components, but do not forbid the presence or addition of one or more other features, elements, components, and/or groups thereof.
Generally, a chiller is used for cooling the interior spaces of data centers. The chiller removes the heat generated by the electronic devices so that electronic devices function correctly and avoid failures of components. However, the conventional chillers do not provide any access to the interior space of the chiller. Hence repair, and maintenance of inner components of the chiller becomes a cumbersome task.
Further, for cooling the industrial plants and large data centers, large-sized chillers are used. These conventional chillers have a large footprint which increases the maintenance requirement, overall cost and power consumption of the system.
To overcome the aforementioned drawbacks, the present disclosure envisages a chiller 100 for cooling a space, containing electronic equipment, such as computer server arranged in server racks of computer data centers. Figure 1 illustrates a perspective isometric view of the chiller in accordance with an embodiment of the present disclosure. The data center hall includes one or more rows and columns of computers or servers supported in racks. The rows are arranged substantially parallel to each other. The chiller 100 is specifically configured to maintain a thermodynamically stable -controlled environment in the data center hall without exposing the server or data hall to any unauthorized access.
According to an embodiment of the present disclosure, the Figure 1 shows the principal elements of the chiller 100. The chiller 100 is defined by a frame structure with an upper operative section 103A and a lower operative section 103B. The upper operative section 103A of the frame structure 103 comprises at least one condensing unit 102 and the lower operative section 103B comprises at least one evaporating unit 134, at least compressing means 136, at least one expansion means 142, at least one filtering and drying means 140, HMI (Human machine interface) panel 132 and a control unit 130. The components of the upper operative section 103A and the components of the lower operative section 103B are in fluid communication with each other by means of a plurality of tubes. These tubes are configured to transport a desired refrigerant across different component at different temperature and at different pressure and thus forming a refrigerant flow cycle.
Advantageously, the condensing unit 102, the evaporating unit 134, the compressing means 136, the expansion means 142, the filtering and drying means 140, the HMI panel 132 and the control unit 130 are enclosed and mounted on a frame structure 103 to form a compact assembly and thus, reduces the overall footprint of the chiller 100.
The lower operative section 103B of the frame structure 103 is provided with removably attached lower panels 122 and side panels 124, which in open condition provides easy access to the internal components of the chiller 100. Advantageously, the removable attached lower panels 122 and side panels 124 facilitates ease of maintenance of the chiller 100.
Further, the condensing unit 102 is configured to be disposed in the upper operative section. The condensing unit is defined by a V shaped body extending along the length of the upper operative section. The condensing unit is configured with at least one condenser module having at least one condenser coil disposed on each of inclined limb of the V-shaped body to facilitate the flow of the high-pressure high temperature vapor refrigerant therethrough.
In a preferred embodiment, the condenser module includes a first condenser module and a second condenser module. The first condenser module configured to be cascadly and removably attached to the operative side of the second condenser module.
The air circulating means is configured to be disposed on the operative top of the V-shaped body, nested between the undulated limb of the condensing unit. The air circulating means 112 is configured to be mounted with an inlet port 102A and an outlet port 102B.The air circulating mean is configured to create low pressure zones within the condenser module to draw ambient air across the condenser coil to facilitate exchange of heat with the refrigerant flowing through said condenser coil to convert the high-pressure high temperature vapor refrigerant to high-pressure high temperature liquid refrigerant. At least one air circulating means 112 is configured to be mounted with an inlet port 102A and an outlet port 102B. The condenser modules are mounted on the side surfaces, whereas the air circulating means 112 are configured to be mounted on the operative top of the condensing unit 102.
In an embodiment, each condenser modules 104,106 includes at least one air circulating means 112.
In an embodiment, the air circulating means 112 is selected from a group consisting of Fan, Blower, Impeller, Turbine, Propeller or combination thereof.
In an embodiment, the first condenser module 104 and the second condenser module 106 is identical in geometry and construction to uniformly cool the refrigerant and radiate the heat to the surrounding.
In another embodiment, the first condenser module 104 and the second condenser module 106 is different in geometry to exchange heat with the surrounding as per the available space.
Further, each condenser module 104 ,106 is configured with at least one first condenser coils 108 and a second condenser coil 110. Each condenser coil 108,110 is configured with a plurality of tubes in communication with the inlet port 102A and the outlet port 102B to facilitate the flow of refrigerant across the coil. The first condenser coil is configured to be disposed oppositely to the second condenser coil on the inclined limb of the V-shaped body, wherein the ambient air drawn by the air circulating means flows across each of the condenser coils 108,110 of the condenser module 104,106 to uniformly cool the flowing refrigerant through the condensing unit and radiate the heat to the surrounding.
The air circulating means 112 is configured to create a low pressure area inside each of the condenser module 104, 106, to thereby allow the ambient air from the atmosphere to flow across the condenser coil 108,110 of the condenser module 104,106 and thus to cool the refrigerant flowing through the tube.
In an embodiment, the first condenser module 104 and the second condenser module 106, are removably mounted on the operative upper section 103A of the frame structure 103. Figure 2 illustrates a perspective isometric view of the first condenser module in accordance with an embodiment of the present disclosure.
In an embodiment, the first condenser module 104 and the second condenser module 106 works or actuate independently based on the desired cooling tonnage requirement. Each condenser module 104,106 is in communication with its separate compressing means 136, and the expansion means 142. Based on the cooling load requirements and the user input, either or both the condenser module 104, 106 activates.
Further, when the air flows across an operating surface of the first condenser coil 108 and the second condenser coil 110, the flowing refrigerant across the tube’s exchanges heat with the flowing air. Thereby, the cooled refrigerant exits out from the outlet port 102B, and the heated air blows out from the top of the condensing unit 102 by means of the air circulating means 112 in the operative configuration of the chiller 100. Figure 3 illustrates a perspective side view of the chiller in which air is entering from sides of the condenser coils and the air escape out through top section of the air circulating means, in accordance with an embodiment of the present disclosure.
Ina n embodiment, the first condenser module and the condenser module are configured to be coupled in fluid communication with the evaporating unit.
In an embodiment, each of the condensing coil 108,110 of each condensing module 104, 106 is provided with a discharge header 116 and a liquid header 118.
In an embodiment, the inlet port 102A of the condensing unit 102 is configured to receive a high temperature and a high-pressure vapor refrigerant, which flows across each of the condensing coils 108, 110 of the different condensing modules. Thereby, the flowing refrigerant rejects the heat to the flowing air so as to obtain a high temperature and a high-pressure liquid refrigerant.
In an embodiment, the first condenser coil 108 and the second condenser coil 110 are mounted on mutually perpendicular surface.
In an embodiment, the first condenser coil 108 and the second condenser coil 110 of the first condenser module 104 is in fluid communication with each other.
In an embodiment, the first condenser coil 108 and the second condenser coil 110 of the second condenser module 106 is in fluid communication with each other.
In a preferred embodiment, the first condenser coil 108 and the second condenser coil 110 is splitted in to two-halves to increase the effectiveness, robustness and ease of maintenance of the condenser module.
In an embodiment, each condenser module 104, 106 is configured with at least one control valve to control the flow of refrigerant across the condenser coil 108,110 of the condenser module.
Advantageously, the V-shaped body of the first condenser coils 108 increases the effective surface area for heat exchange between the atmosphere and the condenser coil 108.
In an embodiment, each condenser coil 108,110 is selected from a group of Fin and tube type, double pipe and shell and coil type. The heat transfer area, temperature of the air, velocity of the air, overall heat transfer co-efficient of the tube affects the performance of the condenser.
Further, the liquid refrigerant from the outlet of condenser flows across the expansion means 142. The expansion mean is configured to be disposed in the lower operative section in fluid communication with an outlet of the condensing unit to receive the high-pressure high temperature liquid refrigerant. The expansion means 142 is configured to convert the high-pressure liquid refrigerant in to a low temperature and a low-pressure liquid refrigerant.
In an embodiment, the high temperature and the high-pressure liquid refrigerant is allowed to expand in the expansion means 142 to cool the refrigerant flowing through the evaporating unit 134.
The evaporating unit is configured to be disposed in the lower operative section in fluid communication with an outlet of the expansion means to receive the low-temperature. The evaporating unit 134 is configured to serve as a heat exchanger between the cold liquid refrigerant and water to be cooled as received from the area which is to be cooled. The evaporating unit 134 is configured to receive water by means of an additional inlet passage and an additional outlet passage to facilitate the flow of water from the area to be cooled or the indoor unit. The evaporating unit is configured to exchange heat between the low-temperature, low-pressure liquid refrigerant and the water to generate the vapor refrigerant.
Advantageously, the additional inlet passage and the additional outlet passage configured within the evaporating unit 134 provides easy access to connect the heat exchanging unit of the space or the area required to be cooled, thus it offers plug and play with ease of compatibility during usage.
The vapour refrigerant exiting the evaporating unit 134 passes through the compressing unit. The compressing means is configured to be disposed in the lower operative section in fluid communication with an outlet of the evaporating unit. The compressing unit is configured to compress the low pressure and low temperature vapour refrigerant to a high pressure and high temperature vapor refrigerant. The outlet of the compressing unit is in fluid communication with the condensing unit 102 which facilitates rejection of heat to the surrounding atmosphere and thus allow the conversion of the high pressure and high temperature vapor refrigerant to a high pressure and high temperature liquid refrigerant. Figure 5 illustrates a perspective isometric view of the chiller in accordance with an embodiment of the present disclosure.
In a preferred embodiment, the chiller 100 comprises four compressing means 136. The chiller 100 is configured to operate on even a single compressing means 136. Depending on the cooling requirement of the space, the number of compressing means 136 operated in the chiller 100 can be changed. Hence the redundancy of the chiller 100 is reduced.
In a preferred embodiment, the chiller 100 work on refrigerant cycle and the same refrigerant flows across the different component in a cycle.
In an embodiment, the control panel 130 and HMI panel 132 are in electrical connection and are installed in the lower operative section 103B of the frame structure 103. The control panel 130 and HMI panel 132 consist of various indicators and switches to monitor and control the chiller operation. Figure 4 illustrates a perspective isometric view of an electrical connection means, control panel, a HMI panel of the chiller with lower panels in accordance with an embodiment of the present disclosure.
In an embodiment, the HMI (Human machine interface) panel 132 is a user interface to input at least one user command to control the operation of chiller 100.
In an embodiment, the evaporating unit 134 is selected from a group of evaporators.
In an embodiment, the filtering and drying means 140 are two separate components, assembled together to filter out any undesired means from the refrigerant.
In an embodiment, the chiller includes two or more compressing means to facilitate four stage capacity control. The four-stage capacity control 25%, 50%, 75% & 100% due to tandem compressors & dual circuit
In an embodiment, the compressing means is typically a Scroll Compressor with Dual Circuit with inbuilt Pump.
EXAMPLE
In an exemplary embodiment, In an operative configuration of the chiller 100, the evaporating unit 134 is configured to be in communication with a heat exchanging means of a datacenter or a space required to cool. The data center is provided with a water type cooling arrangement. Therefore, the water circulates within the datacenter across the plurality of conduits. The plurality of conduits is configured to be in communication with an air handling unit (AHU) 144. The inlet and the outlet conduit of the datacenter is in fluid communication with the additional inlet and outlet of the evaporating means. Thus, the AHU 144 enables exchange heat with the water flowing across the conduit and extracts heat from the air handling unit 144 of the datacenter. Thereby, it cool down the surrounding temperature of the server room or the datacenter. Thus, in the operative configuration of the chiller 100, the water flowing from the datacenter exchanges heat with the refrigerant flowing across the evaporating unit 134, and thus, it facilitates the cooling of the datacenter. Figure 6 illustrates a perspective view of a chiller to cool a desired room space in accordance with an embodiment of the present disclosure.
In an embodiment, the additional outlet of the evaporating unit 134 is in fluid communication to the inlet of the conduit, and the additional inlet of the evaporating unit 134 is in fluid communication to the outlet of the conduit of the datacenter.
In an embodiment, to maintain the desired pressure, the conduits provided within the datacenter is configured with a pumping means 138.
The foregoing description of the embodiments has been provided for purposes of illustration and not intended to limit the scope of the present disclosure. Individual components of a particular embodiment are generally not limited to that particular embodiment, but, are interchangeable. Such variations are not to be regarded as a departure from the present disclosure, and all such modifications are considered to be within the scope of the present disclosure.
TECHNICAL ADVANCEMENTS
The present disclosure described hereinabove has several technical advantages including, but not limited to, a chiller that offers;
• less footprint;
• effectively cools a required space;
• ease of maintenance;
• ease of servicing;
• easy installation;
• aesthetic view;
• low redundancy;
• consumes less power;
• offers maximum air flow to the condenser;
• provides removably attached panels;
• facilitates plug and play configuration;
• compact assembly;
The foregoing disclosure has been described with reference to the accompanying embodiments which do not limit the scope and ambit of the disclosure. The description provided is purely by way of example and illustration.
The embodiments herein and the various features and advantageous details thereof are explained with reference to the non-limiting embodiments in the following
description. Descriptions of well-known components and processing techniques are omitted so as to not unnecessarily obscure the embodiments herein. The examples used herein are intended merely to facilitate an understanding of ways in which the embodiments herein may be practiced and to further enable those of skill in the art to practice the embodiments herein. Accordingly, the examples should not be construed as limiting the scope of the embodiments herein.
The foregoing description of the specific embodiments so fully reveal the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the spirit and scope of the embodiments as described herein.
Any discussion of devices, articles or the like that has been included in this specification is solely for the purpose of providing a context for the disclosure. It is not to be taken as an admission that any or all of these matters form a part of the prior art base or were common general knowledge in the field relevant to the disclosure as it existed anywhere before the priority date of this application.
While considerable emphasis has been placed herein on the components and component parts of the preferred embodiments, it will be appreciated that many embodiments can be made and that many changes can be made in the preferred embodiments without departing from the principles of the disclosure. These and other changes in the preferred embodiment as well as other embodiments of the disclosure will be apparent to those skilled in the art from the disclosure herein, whereby it is to be distinctly understood that the foregoing descriptive matter is to be interpreted merely as illustrative of the disclosure and not as a limitation.
,CLAIMS:WE CLAIM:
1. A chiller (100), configured to be mounted in fluid communication with an indoor unit to maintain a thermodynamically stable-controlled environment within a confined space, said chiller (100) includes a refrigerant flowing therethrough and a cooling media water flowing through the indoor unit, said chiller (100) comprising:
• a frame structure (103) having an upper operative section (103A) and a lower operative section (103B);
• at least one condensing unit (102) configured to be disposed in said upper operative section (103A), said condensing unit (102) defined by a V shaped body extending along the length of said upper operative section (103A), said condensing unit (102) configured with at least one condenser module (104, 106) having at least one condenser coil (108, 110) disposed on each of an inclined limb of said V-shape to facilitate the flow of high-pressure high temperature vapor refrigerant therethrough;
• at least one air circulating means (112) disposed on the operative top of the V-shaped body nested between the undulated limb of said condensing unit (102), said air circulating means (112) configured to create low pressure zones within said condenser module (104, 106) to draw ambient air across said condenser coil (108, 110) to facilitate exchange of heat with the refrigerant flowing through said condenser coil (108, 110) to convert the high-pressure high temperature vapor refrigerant to high-pressure high temperature liquid refrigerant;
• at least one expansion means (142) configured to be disposed in said lower operative section (103B) in fluid communication with an outlet of said condensing unit (102) to receive the high-pressure high temperature liquid refrigerant and further configured to convert to low-temperature, low-pressure liquid refrigerant;
• an evaporating unit (134) configured to be disposed in said lower operative section (103B) in fluid communication with an outlet of said expansion means to receive the low-temperature, low-pressure liquid refrigerant, said evaporating unit (134) configured to be in communication with the indoor unit to receive the water to be cooled and further configured to exchange heat between the low-temperature, low-pressure liquid refrigerant and the water to generate the vapor refrigerant; and
• at least one compressing means (136) configured to be disposed in said lower operative section (103B) in fluid communication with an outlet of said evaporating unit (134) and further configured to compress the low temperature low-pressure vapor refrigerant to convert in to the high-pressure high temperature vapor refrigerant.
2. The chiller (100) as claimed in claim 1, wherein said condenser modules includes a first condenser module (104) and a second condenser module (106), said first condenser module (104) configured to be cascadly and removably attached to the operative side of said second condenser module (106).
3. The chiller (100) as claimed in claim 2, wherein each of said condenser modules of said condensing unit (102) is configured with a separate said air circulating means (112), said compressing means (136) 136, and said expansion means (142) to facilitate independent actuation of said first condenser module (104) and said second condenser module (106) based on the desired cooling tonnage requirement.
4. The chiller (100) as claimed in claim 3, wherein said first condenser module (104) and said condenser module (104, 106) are configured to be coupled in fluid communication with said evaporating unit (134).
5. The chiller (100) as claimed in claim 4, wherein said first condenser module (104) and said second condenser module (106) are configured with at least one first condenser coil (108) and at least one second condenser coil (110), said first condenser coil (108) is configured to be disposed oppositely to said second condenser coil (110) on the inclined limb of said V-shaped body, wherein the ambient air drawn by said air circulating means (112) flows across each of said condenser coils (108,110) of said condenser module (104,106) to uniformly cool the flowing refrigerant through said condensing unit (102) and radiate the heat to the surrounding.
6. The chiller (100) as claimed in claim 5, wherein each of said first condenser coil (108) and said second condenser coil (110) is configured with a discharge header (116) 116 and a liquid header (118) 118.
7. The chiller (100) as claimed in claim 6, wherein each of said condenser coils (108, 110) are selected from a group of consisting of fin and tube type, double pipe, and shell and coil type or any combination thereof.
8. The chiller (100) as claimed in claim 5, wherein said air circulating means (112) is selected from group consisting of fans, blowers, impellers, turbines, propellers, or combinations thereof.
9. The chiller (100) as claimed in claim 1, wherein said frame structure (103) includes removably attached lower panels (122) and side panels (124) to provide access for internal components.
10. The chiller (100) as claimed in claim 1, includes a plurality of tubes, configured to couple different components of said upper operative section (103A) to said lower operative section (103B) to transport the desired refrigerant across different component at different temperature and at different pressure and form a refrigerant flow cycle.
11. The chiller (100) as claimed in claim 1, includes two or more compressing means (136) to facilitate four stage capacity control.
12. The chiller (100) as claimed in claim 1, includes a filtering and drying means, configured to be coupled in communication between said condensing unit (102) and said expansion means and is further configured to filter out any undesired material(s) from the refrigerant before feeding in said expansion means.
13. The chiller (100) as claimed in claim 1, includes a Human Machine Interface (HMI) panel (132), and a control unit (130) disposed in the lower operative section (103B) in communication to said evaporating section, said HMI panel (132) is configured to receive user commands to control the operation of the chiller (100).
Dated this 05th Day of June, 2024

_______________________________
MOHAN RAJKUMAR DEWAN, IN/PA – 25
of R.K. DEWAN & CO.
Authorized Agent of Applicant

TO,
THE CONTROLLER OF PATENTS
THE PATENT OFFICE, AT MUMBAI