FORM 2
THE PATENTS ACT, 1970 (39 OF 1970) & THE PATENT RULES, 2003
COMPLETE SPECIFICATION
(See section 10 and rule 13)
“A THERMAL EFFICIENT AND WEIGHT OPTIMIZED OUTDOOR SMALL CELL”
We, Jio Platforms Limited, an Indian National, of Office - 101, Saffron, Nr. Centre Point, Panchwati 5 Rasta, Ambawadi, Ahmedabad - 380006, Gujarat, India.
The following specification particularly describes the invention and the manner in which it is to be performed.

A THERMAL EFFICIENT AND WEIGHT OPTIMIZED OUTDOOR SMALL CELL
FIELD OF THE DISCLOSURE
[0001] The present disclosure relates generally to the field of wireless communication systems.
More particularly, the present disclosure relates to methods and systems for enabling a thermal efficient and weight optimized outdoor small cell (ODSC).
BACKGROUND
[0002] The following description of related art is intended to provide background information
pertaining to the field of the disclosure. This section may include certain aspects of the art that may be related to various features of the present disclosure. However, it should be appreciated that this section be used only to enhance the understanding of the reader with respect to the present disclosure, and not as admissions of prior art.
[0003] Wireless communication technology has rapidly evolved over the past few decades, with
each generation bringing significant improvements and advancements. The first generation of wireless communication technology was based on analog technology and offered only voice services. However, with the advent of the second-generation (2G) technology, digital communication and data services became possible, and text messaging was introduced. 3G technology marked the introduction of high¬speed internet access, mobile video calling, and location-based services. The fourth-generation (4G) technology revolutionized wireless communication with faster data speeds, better network coverage, and improved security. Currently, the fifth-generation (5G) technology is being deployed, promising even faster data speeds, low latency, and the ability to connect multiple devices simultaneously. With each generation, wireless communication technology has become more advanced, sophisticated, and capable of delivering more services to its users.
[0004] Moreover, the 5G networks are generally based on small cell technology. Small cells use low-
power and short-range wireless transmission systems (or base stations). A small geographical area or small-proximity indoor and outdoor space is covered by the small cells in the 5G networks. Also, 5G new radio (NR) outdoor small cell (ODSC) is a medium power gNB (i.e., gNodeB or Next Generation Node B) which operates in micro class (typically 6.25 W or 38dBm per antenna port). It complements macro-level wide-area solutions for coverage and capacity and is particularly useful in hot zone/hot spot areas with

high traffic and quality of service (QoS) demands. Thus, making it a power efficient solution. It offers two 1Gbps (gigabits per second) Fiber Optic Connections (e.g., small form-factor pluggable (SFP) connections) as a backhaul connection to networks.
[0005] While a Macro gNB can offer satisfactory coverage and capacity in many situations, dense
urban environments with tall buildings may experience intermittent mobile coverage issues. Simply adding more radios becomes impractical. Similarly, meeting the high capacity demands of numerous mobile users in commercial hubs such as malls, hotels, office blocks, and transportation hubs poses significant challenges. In such scenarios, deploying 5G Outdoor small cell (ODSC) solutions in hotspot locations becomes essential to enhance coverage and capacity, complementing the capabilities of 4G/5G gNB. This efficiently addresses the increased traffic demands in these areas.
[0006] As the ODSCs play an important role in the 5G networks there is a requirement to optimize
the thermal efficiency and weight of these ODSCs. Therefore, there is a need in the art to provide a system and a method that can enable a thermal efficient and weight optimized outdoor small cell design to provide a thermal efficient and weight optimised ODSC, for instance a thermal efficient and weight optimized Sub-6GHz 5G new radio (NR) four-transmitter-four-receiver Outdoor Small Cell (4T4R ODSC).
OBJECTS OF THE DISCLOSURE
[0007] Some of the objects of the present disclosure, which at least one embodiment disclosed
herein satisfies are listed herein below.
[0008] It is an object of the present disclosure to provide an efficient and effective system and
method that can enable a thermal efficient and weight optimized outdoor small cell design to provide a thermal efficient and weight optimized ODSC.
[0009] It is another object of the present disclosure to provide a solution that can provide an overall
integrated ODSC system having network (NW) processor and field-programmable gate array / application-specific integrated circuits (FPGA/ASIC) for Baseband Transceiver. All these are integrated on 18 or more layers Integrated baseband and Transceiver board (IBTB).

[00010] It is another object of the present disclosure to provide a solution that can provide clock
synchronization architecture in the ODSC using system synchronizer Integrated Circuit (IC) based on Global Positioning System (GPS)/ Precision Time Protocol (PTP)/Holdover and clock generators.
[00011] It is another object of the present disclosure to provide a solution that can provide blind
mating and cable less design in ODSC.
[00012] It is yet another object of the present disclosure to feature a thermal-efficient design of the
ODSC that utilizes advanced heat pipe technology to address localized hot spots generated by the Network processor and FPGA/ASIC used for baseband transceiver.
SUMMARY OF THE DISCLOSURE
[00013] This section is provided to introduce certain aspects of the present disclosure in a simplified
form that are further described below in the detailed description. This summary is not intended to identify the key features or the scope of the claimed subject matter.
[00014] An aspect of the present disclosure relates a thermal efficient and weight optimized outdoor
small cell (ODSC). The thermal efficient and weight optimized ODSC comprises an integrated baseband and transceiver board (IBTB); a radio frequency (RF) front end board (RFEB); a cavity filter; a multiple-input multiple-output (MIMO) antenna; a clock and synchronization circuit, and a heat pipe based mechanical housing. The heat pipe based mechanical housing comprises a set of heat pipes integrated into a finned heat sink to distribute a localized heat of a network processor and a field-programmable gate array/application-specific integrated circuit (FPGA/ASIC) of the IBTB, across the finned heat sink.
BRIEF DESCRIPTION OF DRAWINGS
[00015] The accompanying drawings, which are incorporated herein, and constitute a part of this
disclosure, illustrate exemplary embodiments of the disclosed methods and systems in which like reference numerals refer to the same parts throughout the different drawings. Components in the drawings are not necessarily to scale, emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Some drawings may indicate the components using block diagrams and may not represent the internal circuitry of each component. It will be appreciated by those skilled in

the art that disclosure of such drawings includes disclosure of electrical components, electronic components or circuitry commonly used to implement such components.
[00016] FIG.1 illustrates an exemplary block diagram of a thermal efficient and weight optimised
outdoor small cell (ODSC) [100], in accordance with exemplary embodiments of the present disclosure.
[00017] FIG. 1a illustrates an exemplary block diagram of an integrated baseband and transceiver
board (IBTB) [102], in accordance with exemplary embodiments of the present disclosure.
[00018] FIG. 1b illustrates an exemplary block diagram of a radio frequency front end board (RFEB)
[104], in accordance with exemplary embodiments of the present disclosure.
[00019] FIG. 1c illustrates an exemplary block diagram depicting a clock and synchronization circuit
[110] in connection with the (IBTB) [102], in accordance with exemplary embodiments of the present disclosure.
[00020] FIG. 1d illustrates an exemplary diagram of a heat pipe based mechanical housing [112], in
accordance with exemplary embodiments of the present disclosure.
[00021] FIG. 1e illustrates an exemplary diagram depicting a finned heat sink [114] of a thermal
efficient and weight optimized outdoor small cell (ODSC) [100], in accordance with exemplary embodiments of the present disclosure.
[00022] FIG.2 illustrates an exemplary high-level block diagram of a four-transmitter-four-receiver
5th generation new radio outdoor small cell (4T4R 5G NR ODSC) [200], in accordance with exemplary embodiments of the present disclosure.
[00023] The foregoing shall be more apparent from the following more detailed description of the
disclosure.
DETAILED DESCRIPTION
[00024] In the following description, for the purposes of explanation, various specific details are set
forth in order to provide a thorough understanding of embodiments of the present disclosure. It will be

apparent, however, that embodiments of the present disclosure may be practiced without these specific details. Several features described hereafter can each be used independently of one another or with any combination of other features. An individual feature may not address any of the problems discussed above or might address only some of the problems discussed above. Some of the problems discussed above might not be fully addressed by any of the features described herein. Example embodiments of the present disclosure are described below, as illustrated in various drawings in which like reference numerals refer to the same parts throughout the different drawings.
[00025] The ensuing description provides exemplary embodiments only, and is not intended to limit
the scope, applicability, or configuration of the disclosure. Rather, the ensuing description of the exemplary embodiments will provide those skilled in the art with an enabling description for implementing an exemplary embodiment. It should be understood that various changes may be made in the function and arrangement of elements without departing from the spirit and scope of the disclosure as set forth.
[00026] Specific details are given in the following description to provide a thorough understanding of
the embodiments. However, it will be understood by one of ordinary skill in the art that the embodiments may be practiced without these specific details. For example, circuits, systems, networks, processes, and other components may be shown as components in block diagram form in order not to obscure the embodiments in unnecessary detail. In other instances, well-known circuits, processes, algorithms, structures, and techniques may be shown without unnecessary detail in order to avoid obscuring the embodiments.
[00027] The word “exemplary” and/or “demonstrative” is used herein to mean serving as an
example, instance, or illustration. For the avoidance of doubt, the subject matter disclosed herein is not limited by such examples. In addition, any aspect or design described herein as “exemplary” and/or “demonstrative” is not necessarily to be construed as preferred or advantageous over other aspects or designs, nor is it meant to preclude equivalent exemplary structures and techniques known to those of ordinary skill in the art. Furthermore, to the extent that the terms “includes,” “has,” “contains,” and other similar words are used in either the detailed description or the claims, such terms are intended to be inclusive—in a manner similar to the term “comprising” as an open transition word—without precluding any additional or other elements.

[00028] Further, as used herein a “processor” or “processing unit” includes processing unit, wherein
processor refers to any logic circuitry for processing instructions. The processor may be a general-purpose processor, a special purpose processor, a conventional processor, a digital signal processor, a plurality of microprocessors, one or more microprocessors in association with a Digital Signal Processor (DSP) core, a controller, a microcontroller, Application Specific Integrated Circuits, Field Programmable Gate Array circuits, any other type of integrated circuits, etc. The processor may perform signal coding data processing, input/output processing, and/or any other functionality that enables the working of the system according to the present disclosure. More specifically, the processor is a hardware processor or a network processor comprising of an integrated circuit capable of facilitating one or more functionalities of a telecom network such as a voice communication functionality, and a data communication functionality etc., wherein such network processor may be obvious to a person skilled in the art to implement the technical features as disclosed in the present disclosure.
[00029] As portable electronic devices and wireless technologies continue to improve and grow in
popularity, the advancing wireless technologies for data transfer are also expected to evolve and replace the older generations of technologies. In the field of wireless data communications, the dynamic advancement of various generations of cellular technology are also seen. The development, in this respect, has been incremental in the order of second generation (2G), third generation (3G), fourth generation (4G), and now fifth generation (5G), and more such generations are expected to continue in the forthcoming time.
[00030] As discussed in the background section, the current known solutions have several
shortcomings and there is a requirement to optimize the thermal efficiency and weight of outdoor small cells (ODSCs) as currently there is no existing solution to optimize the thermal efficiency and weight of the ODSCs in an effective and efficient manner.
[00031] The present disclosure aims to overcome the above-mentioned and other existing problems
in the field of communication technologies by providing methods and systems for enabling a thermal efficient and weight optimized outdoor small cell design to provide a thermal efficient and weight optimised ODSC, for instance a thermal efficient and weight optimized Sub-6GHz 5G new radio (NR) four-transmitter-four-receiver Outdoor Small Cell (4T4R ODSC). The present disclosure also aims to provide thermal efficient and weight optimized 5G NR gNB (e.g., the thermal efficient and weight optimized ODSC) that brings together an application layer, a Media Access Control (MAC) layer and a baseband layer based on Baseband Processor chipset, RF transceiver based on FPGA and RF front end module (FEM) which

includes one or more RF power amplifiers, one or more Low noise amplifiers (LNAs), one or more RF switches and one or more cavity filters—all in a passively cooled enclosure and weighing less than or equal to a target weight for example 11 kilograms. Mainly, the 5G NR Outdoor Small cell as disclosed in the present disclosure has a design that is compact and provided with an integrated antenna solution without any use of cable. Thus, making the 5G NR ODSC a cable less design. The 5G NR ODSC can be easily installed on sites such as Tower sites and Lampposts etc. It is quick to deploy and delivers high performance with low power consumption. Thus, making it a power efficient solution. It offers two 1Gbps Fiber Optic connections (e.g., small form-factor pluggable (SFP) connections) as a backhaul connection to networks.
[00032] Hereinafter, exemplary embodiments of the present disclosure will be described with
reference to the accompanying drawings.
[00033] Referring to FIG.1 that illustrates an exemplary block diagram of a thermal efficient and
weight optimised outdoor small cell (ODSC) [100], in accordance with exemplary embodiments of the present disclosure. For ease of reference, FIG. 1 depicts units/components of the thermal efficient and weight optimised ODSC [100] by way of representation of blocks and FIG. 1 do not represent the internal circuitry of each component/unit of the thermal efficient and weight optimised ODSC [100]. It will be appreciated by those skilled in the art that disclosure of such drawings/block diagrams includes disclosure of electrical components and connections between said electronic components, and electronic components or circuitry commonly used to implement such components.
[00034] Also, in an implementation the thermal efficient and weight optimised ODSC [100] may be a
four-transmitter-four-receiver 5th generation new radio outdoor small cell (4T4R 5G NR ODSC) [200]. FIG. 2 illustrates an exemplary high-level block diagram of the four-transmitter-four-receiver 5th generation new radio outdoor small cell (4T4R 5G NR ODSC) [200], in accordance with exemplary embodiments of the present disclosure. The thermal efficient and weight optimised ODSC [100] or the 4T4R 5G NR ODSC is medium power gNB (next generation Node B) which operates in micro class (typically ≤ 38dBm per antenna port). It complements macro-level wide-area network solutions for coverage and capacity and is particularly useful in hot zone/hot spot areas with high traffic and Quality of Standard (QoS) demands. As shown in FIG.1 / FIG. 2 the thermal efficient and weight optimised ODSC [100] / the 4T4R 5G NR ODSC is an integration of different boards and Sub-Modules / Sub-Units.

[00035] Particularly, FIG. 1 depicts that the thermal efficient and weight optimised ODSC [100]
comprises an integrated baseband and transceiver board (IBTB) [102]; a radio frequency (RF) front end board (RFEB) [104]; a cavity filter [106]; a multiple-input multiple-output (MIMO) antenna [108]; a clock and synchronization circuit [110], and a heat pipe based mechanical housing [112], however the present disclosure is not limited thereto and the thermal efficient and weight optimised ODSC [100] may also include units or components that may be obvious to a person skilled in the art to facilitate one or more functionalities of the thermal efficient and weight optimised ODSC [100]. Further, an exemplary block diagram of the IBTB [102] is depicted in FIG. 1a, in accordance with exemplary embodiments of the present disclosure. Also, an exemplary block diagram of the RFEB [104] is depicted in FIG. 1b, in accordance with exemplary embodiments of the present disclosure. Additionally, an exemplary block diagram depicting the clock and synchronization circuit [110] in connection with the (IBTB) [102] is shown in FIG. 1c, in accordance with exemplary embodiments of the present disclosure. Moreover, an exemplary diagram of the heat pipe based mechanical housing [112] is depicted in FIG. 1d, in accordance with exemplary embodiments of the present disclosure. Unless otherwise indicated below, in an implementation of the present disclosure, all units or components of the thermal efficient and weight optimised ODSC [100] are connected to each other in a manner that is obvious to a person skilled in the art to implement the features as disclosed in the present disclosure.
[00036] Further, the integrated baseband and transceiver board (IBTB) [102] of the thermal efficient
and weight optimised ODSC [100] is a board which comprises both a baseband unit as well as a transceiver unit which are integrated into a single unit as the IBTB [102]. Also, as indicated in the FIG. 1a the IBTB [102] comprises at least a network processor [102a] connected to a backhaul , a baseband and transceiver module [102c], one or more control units [102d], and one or more controller circuits [102e]. The one or more control units [102d], in an implementation, may comprise at least one of a L2 control unit, a L3 control unit and a system control unit. Moreover, in an implementation, the one or more controller circuits [102e] operates in line with at least one of a L1-PHY (Physical layer L1 / Lower PHY layer), Digital Up-Conversion (DUC), Digital Down-Conversion (DDC), Crest Factor Reduction (CFR), Digital Pre-Distortion (DPD), Time division duplex (TDD) Controller. Also, the baseband and transceiver module [102c], may be a baseband processor as well as a transmitter device, or may also be a receptor device. The backhaul as used herein may be at least one of a set of copper links, a set of fiber links, and a set of wireless links that connects a core network of a telecommunication network or one or more backbone networks of the telecommunication network with a set of smaller subnetworks within the telecommunication network. Also, the network processor [102a] comprises an integrated circuit capable of facilitating one or more functionalities of the telecommunication network such as a voice communication functionality, and a data

communication functionality etc., wherein such network processor [102a] may be any processor that may be obvious to a person skilled in the art to implement the technical features as disclosed in the present disclosure. In an implementation, the network processor [102a] works in conjunction with one or more units of the IBTB [102] and/or with one or more other units of the thermal efficient and weight optimised ODSC [100] to provide a required network coverage and capacity at one or more hot zones/hot spot areas with high traffic and Quality of Standard (QoS) demands. Additionally, the IBTB [102] may also be configured to measure a temperature of different sections of the thermal efficient and weight optimised ODSC [100] with the help of one or more on-board temperature sensors, which may provide a thermal profile and enable a functionality with a capability to take decision in case of a thermal failure. Also, referring to FIG. 2, the FIG. 2 depicts that the 4T4R 5G NR ODSC includes an IBTB [202] which further includes at least a network processor [202a] connected to a backhaul, a baseband and transceiver module [202b], one or more control units [202c], and one or more controller circuits [202d].
[00037] The IBTB [102] is blind mated to the RFEB [104]. Also, in an implementation the RFEB [104]
is blind mated to the cavity filter [106] and the multiple-input multiple-output (MIMO) antenna [108]. Additionally, in an implementation, the cavity filter [106] comprises a 4-port cavity filter for a 4T4R configuration providing a steeper roll-off outside an operating band, and the MIMO antenna [108] comprises a set of 4-port cross-polarized patch antennas for the 4T4R configuration, however the present disclosure is not limited thereto and any configuration of the cavity filter [106] and the MIMO antenna [108] may be considered depending on a use case/requirement. Also, the cavity filter [106] in accordance with the implementation of features as disclosed in the present disclosure enables a reduced loss of signals and also contributes to reduced overall power consumption. In an implementation, the configuration of the cavity filter [106] may be based on a number of the MIMO antenna [108] used in the thermal efficient and weight optimised ODSC [100]. Furthermore, a blind mated connection between the IBTB [202] and an RFEB [204] of the 4T4R 5G NR ODSC is also indicated in FIG. 2. Further, FIG. 2 depicts that the RFEB [204] is blind mated to a cavity filter [106] and a multiple input multiple output antenna [210]. The blind mating is a connection through one or more blind mating connectors, such as one or more mating bullets, to provide a robust connection between the blind mated components such as: the IBTB [202] and the RFEB [204]; and the RFEB [204], the cavity filter [106], and the MIMO antenna [108]. The blind mating connectors have self-aligning features for sliding/ snapping plug(s) for connection between the one or more blind mating connectors.
[00038] The blind mating of the IBTB [102] to the RFEB [104] enables removal of complexities
involved in routing of cables for avoiding RF signal oscillations. The blind mating also provides a robust

connection between the IBTB [102] and the RFEB [104]. Further as indicated in FIG. 1b the RFEB [104] may include one or more of a plurality of RF chains [104a], a driver amplifier [104b], a digital step attenuator [104c], a power amplifier (PA) [104d], one or more low noise amplifiers (LNAs) [104e], and a circulator and time division duplex (TDD) switch [104f]. Also, referring to FIG.2 that depicts the 4T4R 5G NR ODSC including the RFEB [204], wherein it is also depicted in FIG. 2 that the RFEB [204] further includes four RF chains (such as RF chain 1 [204a], RF chain 2 [204a], RF chain 3 [204a] and RF chain 4 [204a]), and a unit [206] including a driver amplifier, a digital step attenuator, a PA, a LNA, a circulator and TDD switch. The RFEB [104] works in conjunction with one or more other units of the thermal efficient and weight optimised ODSC [100] to provide a network coverage and capacity, wherein such working of the RFEB [104] may be executed in a manner as obvious to a person skilled in the art.
[00039] Further, referring to FIG. 1c that illustrates an exemplary block diagram depicting the clock
and synchronization circuit [110] in connection with the (IBTB) [102], in accordance with exemplary embodiments of the present disclosure. As indicated in the FIG. 1c the clock and synchronization circuit [110] may include one or more ultra-low noise clock generation phase-locked loops (PLLs) [110a], a programmable oscillator [110b] and a system synchronizer [110c]. As used herein a “ultra-low noise clock generation phase-locked loops (PLL) [110a]” provides a stable and low noise signals for high frequency clock, and serial data communications. The programmable oscillator [110b] is an oscillator in which the resonator frequency is post-processed to a desired output frequency utilizing an integer-mode or fractional-phase-locked loop (PLL). The Programmable oscillator [110b] and the system synchronizer [110c] performs phase locking and locks to a common frequency with constant phase differences. The clock and synchronization circuit [110] is configured to synchronize the IBTB [102] with one or more units connected to the thermal efficient and weight optimised ODSC [100]. Therefore, complete system of the thermal efficient and weight optimised ODSC [100] is synchronized within the IBTB [102] and to its externally connected unit(s) using the clock and synchronization circuit [110] on board. Also, the clock and synchronization circuit [110] also takes care of holdover requirement as per telecom standards.
[00040] Further, referring to FIG. 1d and FIG. 1e. FIG. 1d depicts an exemplary diagram of the heat
pipe based mechanical housing [112], in accordance with exemplary embodiments of the present disclosure. Also, FIG. 1e illustrates an exemplary diagram depicting a finned heat sink [114] of a thermal efficient and weight optimized outdoor small cell (ODSC) [100], in accordance with exemplary embodiments of the present disclosure. In an implementation, the heat pipe based mechanical housing [112] is a IP65 ingress protected mechanical housing. As indicated in FIG. 1d the heat pipe based mechanical housing [112] comprises a set of heat pipes [112a]. The set of heat pipes [112a] includes one

or more heat pipes [112a] that are integrated into a finned heat sink [114] of the thermal efficient and weight optimised outdoor small cell (ODSC) [100]. As used herein, the finned heat sink [114] is a heat dissipation unit which has one or more fins for dissipating heat and the set of heat pipes [112a] are provided in the finned heat sink [114] for dissipating the localized heat e.g., the heat dissipated in a region around the set of heat pipes [112a]. In a preferred implementation of the present disclosure, the finned heat sink [114] comprises a set of vertical fins that helps in regulation of heat of the thermal efficient and weight optimised outdoor small cell (ODSC) [100]. Also, a thickness of each vertical fin from the set of vertical fins is lesser than a pre-defined thickness, and a height of each vertical fin from the set of vertical fins is lesser than a pre-defined height. The pre-defined thickness and the pre-defined height provides a reference point to optimise heat dissipation capabilities and weight of said ODSC and for providing a compact and lightweight configuration of the ODSC having a reduced overall weight and size, improved thermal efficiency, high performance and low power consumption. As per an exemplary range, the height may range from 25 millimetres to 30 millimetres. Further, the thickness may in an exemplary implementation range from 1.0 millimetres to 1.5 millimetres and also may range from 1.2 millimetres to 1.5 millimetres in another exemplary preferred implementation.
[00041] The set of heat pipes [112a] are configured to distribute a localized heat of the network
processor [102a] and a field-programmable gate array/application-specific integrated circuit (FPGA/ASIC) [102f] of the IBTB [102], across the finned heat sink [114].
[00042] The thermal efficient and weight optimised outdoor small cell (ODSC) [100] incorporates
highly efficient heat pipes (i.e., the set of heat pipes [112a]) with superior thermal conductivity to effectively distribute localized heat of the network processor [102a] and the FPGA/ASIC [102f] across the finned heat sink [114]. The finned heat sink [114] featuring the set of vertical fins having a reduced thickness (e.g., a set of vertical fins (having a reduced thickness) that are configured on an integrated baseband side and RF side of the thermal efficient and weight optimised outdoor small cell (ODSC) [100]) enhances heat dissipation capabilities in the thermal efficient and weight optimised outdoor small cell (ODSC) [100].
[00043] By integrating the set of heat pipes [112a] into the finned heat sink [114], an overall size and
weight of the thermal efficient and weight optimised outdoor small cell (ODSC) [100] is reduced, resulting in a compact and lightweight outdoor small cell (ODSC) for e.g., within 11kg. This compact design not only saves space but also ensures optimal power efficiency. Thus, the heat pipe based mechanical housing [112] offers weight reduction, improved thermal efficiency, high performance and low power

consumption making the thermal efficient and weight optimised outdoor small cell (ODSC) [100] a reliable and efficient choice for network coverage and capacity enhancement.
[00044] Also, during an experimentation, a thermal performance of the thermal efficient and weight
optimised outdoor small cell (ODSC) [100] was thoroughly analyzed using advanced computational fluid dynamics (CFD)-based thermal simulation analysis in techniques such as 3D simulation techniques for thermal design of electronic components and systems. The results of this comprehensive analysis were compared with actual lab thermal measurements under full load conditions. Remarkably, the simulation results for the Network processor [102a], the FPGA/ASIC [102f] and four Power Amplifiers [104d] closely matched the lab measurements with a deviation of within 1 degree Celsius as described in Table 1 provided below. This validates the accuracy and reliability of the thermal efficient and weight optimised outdoor small cell (ODSC) [100] and demonstrates its effectiveness with the heat pipe based mechanical housing [112] in maintaining optimal temperature levels.
Network Network
Baseband RF PA PA PA PA
Sr Processor Processor FPGA
Case Heatsink Heatsink Ch0 Ch1 Ch2 Ch3
No. Sensor 0 sensor1 ( ̊C)
( ̊C) ( ̊C) ( ̊C) ( ̊C) ( ̊C) ( ̊C)
( ̊C) ( ̊C)
Thermal
Simulation
1 Results 86.4 83.0 - - - 109.0 111.0 111.0 110.0
(Case
Temperature)
Thermal
Simulation
2 results - - 96.1 96.1 94.0 120.0 122.0 122.0 121.0
(Junction
Temperature)
Actual Thermal
3 86.9 83.5 88.0 88.7 88.4 108.8 111.6 112.2 110.8
Measurements
Margin
available w.r.t
4 Thermal -0.5 -0.5 8.1 7.4 5.6 0.2 -0.6 -1.2 -0.8
Simulation
Result
Margin
available w.r.t
5 Max - - 17.0 16.4 11.6 16.2 13.4 12.8 14.2
Junction/Case
Temperature
Table 1

[00045] Therefore, in light of the above disclosure it is provided that an overall integrated system
(i.e., the thermal efficient and weight optimised outdoor small cell (ODSC) [100]) having a NW processor and FPGA/ASIC for Baseband Transceiver is provided where all these may be integrated on 18 or more layers Integrated baseband and Transceiver board. Also, according to an implementation of the present disclosure a clock synchronization architecture using system synchronizer IC based on GPS/PTP/Holdover and clock generators is provided along with L1 layer development and bit stream generation in the FPGA/ASIC, in blind mating and cable less ODSC design. Further, basis the present disclosure, thermal efficiency and weight optimization in an ODSC is achieved by providing a heat pipe based mechanical housing. The present disclosure discloses an OSDC that has low power consumption, where such ODSC may be thermally handed properly by IP65 ingress protected mechanical housing. Particularly, in the present disclosure, a thermal-efficient design of the OSDC is provided that utilizes advanced heat pipe technology to address localized hot spots generated by the Network processor and FPGA/ASIC used for baseband transceiver. This innovative approach as disclosed in the present disclosure optimizes the overall cost, thermal efficiency and reduces the weight and volume of the ODSC for instance by 30% or more from the current design by minimizing a height and thickness of fins in the ODSC on the baseband and RF side and by removing the fins completely below the Cavity filter in RF side heatsink of the ODSC.
[00046] As is evident from the above, the present disclosure provides a technically advanced solution
of enabling a thermal efficient and weight optimized outdoor small cell (ODSC) design to provide a thermal efficient and weight optimised ODSC [100] such as a Sub-6GHz 5G new radio (NR) 4T4R Outdoor Small Cell (ODSC) [200]. The thermal efficient and weight optimised ODSC is also technically advanced over the existing ODSCs as in this integrated antenna solution are used which blind mates with Front End board such as RFEB [104], thus, making it a cable less design and easy to deploy on street furniture and Electric light Pole etc.
[00047] While considerable emphasis has been placed herein on the disclosed embodiments, it will
be appreciated that many embodiments can be made and that many changes can be made to the embodiments without departing from the principles of the present disclosure. These and other changes in the embodiments of the present disclosure will be apparent to those skilled in the art, whereby it is to be understood that the foregoing descriptive matter to be implemented is illustrative and non-limiting.

We Claim
1. A thermal efficient and weight optimized outdoor small cell (ODSC) [100], the thermal efficient
and weight optimized ODSC [100] comprising:
- an integrated baseband and transceiver board (IBTB) [102];
- a radio frequency (RF) front end board (RFEB) [104];
- a cavity filter [106];
- a multiple-input multiple-output (MIMO) antenna [108];
- a clock and synchronization circuit [110]; and
- a heat pipe based mechanical housing [112], wherein the heat pipe based mechanical housing [112] comprises:
a set of heat pipes [112a] integrated into a finned heat sink [114] to distribute a localized heat of a network processor [102a] and a field-programmable gate array/application-specific integrated circuit (FPGA/ASIC) [102f] of the IBTB [102], across the finned heat sink [114].
2. The thermal efficient and weight optimized ODSC [100] as claimed in claim 1, wherein the IBTB
[102] is blind mated to the RFEB [104], and the IBTB [102] comprises at least:
- the network processor [102a] connected to a backhaul ,
- a baseband and transceiver module [102c],
- one or more control units [102d] comprising at least one of a L2 control unit, a L3 control unit and a system control unit, and
- one or more controller circuits [102e].
3. The thermal efficient and weight optimized ODSC [100] as claimed in claim 1, wherein the RFEB
[104] comprises at least:
- a plurality of RF chains [104a],
- a driver amplifier [104b],
- a digital step attenuator [104c],
- a power amplifier (PA) [104d],
- one or more low noise amplifiers (LNAs) [104e], and
- a circulator and time division duplex (TDD) switch [104f].
4. The thermal efficient and weight optimized ODSC [100] as claimed in claim 1, wherein the clock
and synchronization circuit [110] is configured to synchronize the IBTB [102] with one or more

units connected to the thermal efficient and weight optimized ODSC [100] and wherein the clock and synchronization circuit [110] at least comprises one or more ultra-low noise clock generation phase-locked loops (PLLs) [110a], a programmable oscillator [110b] and a system synchronizer [110c].
5. The thermal efficient and weight optimized ODSC [100] as claimed in claim 1, wherein the cavity filter [106] comprises a 4-port cavity filter for a four-transmitter-four-receiver (4T4R) configuration providing a steeper roll-off outside an operating band.
6. The thermal efficient and weight optimized ODSC [100] as claimed in claim 5, wherein the MIMO antenna [108] comprises a 4-port cross-polarized patch antenna for the 4T4R configuration.
7. The thermal efficient and weight optimized ODSC [100] as claimed in claim 1, wherein the finned heat sink [114] comprises a set of vertical fins.
8. The thermal efficient and weight optimized ODSC [100] as claimed in claim 7, wherein a thickness of each vertical fin from the set of vertical fins is lesser than a pre-defined thickness, and a height of each vertical fin from the set of vertical fins is lesser than a pre-defined height.