FORM 2
THE PATENTS ACT, 1970 (39 OF 1970)
& THE PATENT RULES, 2003
COMPLETE SPECIFICATION
(See section 10 and rule 13)
“HEAT DISSIPATION ASSEMBLY FOR COMMUNICATION DEVICE”
We, Jio Platforms Limited, an Indian National, of Office - 101, Saffron, Nr. Centre Point, Panchwati 5 Rasta, Ambawadi, Ahmedabad - 380006, Gujarat, India.
The following specification particularly describes the invention and the manner in which it is to be performed.

HEAT DISSIPATION ASSEMBLY FOR COMMUNICATION DEVICE
FIELD OF THE INVENTION
[0001] The present invention generally relates to technologies for enhancing functioning of an antenna module of a wireless communication system. In particular, the present invention relates to effective dissipation of heat generated during operation of an antenna module of a wireless communication system.
BACKGROUND OF THE INVENTION
[0002] The following description of related art is intended to provide background information pertaining to the field of the invention. This section may include certain aspects of the art that may be related to various features of the present invention. However, it should be appreciated that this section be used only to enhance the understanding of the reader with respect to the present invention, and not as admissions of prior art.
[0003] Currently, as the advanced communication technology is being deployed such as a fifth generation (5G) communication technology, promising faster data speeds, low latency, and the ability to connect multiple devices simultaneously. In these technologies, communication devices have started to utilize higher communication bands in order to support higher data-flow rates. In order to achieve higher data-flow rates, 5G communication systems utilize spectrum in millimetre wave (mm-Wave) bands (24-86 GHz). In the 5G mm-Wave products, the heat generation of the Phased Array Antenna Module (PAAM) is in the range of 30 to 60W, as it includes the RF front end (Up-convertor, Down-Convertor, Power Amplifier, LNA and mixers) integrated into a small module. Moreover, the 5G communication systems utilizing the mm-Wave band have short wavelengths in the range of 1-10 mm, and in order to achieve the same, Phased Array Antenna Module (PAAM) are required to be mounted either within or near surface of the communication devices to allow the communication devices to work in an efficient manner and allowing maximum PAAM performance.
[0004] These communication devices are configured to equip multiple PAAMs configurations to allow these communication devices to accommodate multiple transmit

and receive antennas to exploit multipath propagation, particularly in the mm-Wave bands. The communication devices utilized to provide 5G communication are implemented for higher data-flow rates and faster communication performance. However, the higher data¬flow rates and faster communication performance leads to extensive heat generation. Since, the placement of the PAAMs is close to the communication devices, the extensive heat generation can lead to device shutdown, system failure, equipment damage, PAAMs reaching their thermal specification limits in a short amount of time, disrupted communication, and the like.
[0005] There is, therefore, a requirement in the art for a way to provide effective heat dissipation for an antenna module of a wireless communication device without significantly affecting the signal transmission characteristics of the antenna module.
OBJECTS OF THE INVENTION
[0006] Some of the objects of the present invention, which at least one embodiment disclosed herein satisfies are listed herein below.
[0007] An object of the present invention is to provide an effective heat dissipating means for an antenna module of a wireless communication device.
[0008] Another object of the present invention is to provide an effective heat dissipating means that can be implemented in millimetre-wave antenna modules.
[0009] Another object of the present invention is to provide a heat dissipating means that does not require significant energy for its operation.
[0010] Yet another object of the present invention is to provide a heat dissipating means that does not require additional material resources.
[0011] Another object of the present invention is to provide a heat dissipating means that is lightweight and cost-effective.

[0012] Yet another object of the present invention is to provide a heat dissipating mechanism that does not significantly affect the signal transmission performance of the antenna module of the wireless communication device.
SUMMARY OF THE INVENTION
[0013] This section is provided to introduce certain implementations of the present invention in a simplified form that are further described below in the detailed description. This summary is not intended to identify the key features or the scope of the claimed subject matter.
[0014] In an aspect of the present invention, there is provided a heat dissipation assembly for a communication device, comprising: one or more bottom heat sinks; one or more Phased Array Antenna module (PAAM); and at least one heat dissipation plate assembly in connection with at least one baseband printed circuit board (PCB) of the communication device, wherein the at least one heat dissipation plate assembly comprises: one or more heat dissipation plates; one or more heat dissipation tubes; and one or more pedestals.
[0015] In an aspect of the present invention, the at least one heat dissipation plate assembly is configured to conduct a heat generated by the one or more PAAMs to the one or more bottom heat sinks.
[0016] In an aspect of the present invention, each of the one or more bottom heat sinks is configured to dissipate heat associated with the at least one baseband PCB and the one or more PAAMs.
[0017] In an aspect of the present invention, the one or more pedestals is configured to facilitate a predetermined space between the at least one heat dissipation plate assembly and the at least one baseband PCB.
[0018] In an aspect of the present invention, the one or more PAAMs is integrated on a side of the one or more heat dissipation plates, wherein the one or more heat dissipation plates is further connected to the one or more bottom heat sinks.

[0019] In an aspect of the present invention, the one or more heat dissipation plates is mounted on the one or more bottom heat sinks via one or more spacers.
[0020] In an aspect of the present invention, the one or more heat dissipation tubes are embedded in the one or more heat dissipation plates.
BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWINGS
[0021] The accompanying drawings, which are incorporated herein, and constitute a part of this invention, illustrate exemplary embodiments of the disclosed methods and systems in which like reference numerals refer to the same parts throughout the different drawings. Components in the drawings are not necessarily to scale, emphasis instead being placed upon clearly illustrating the principles of the present invention. Some drawings may indicate the components using block diagrams and may not represent the internal circuitry of each component. It will be appreciated by those skilled in the art that invention of such drawings includes invention of electrical components, electronic components or circuitry commonly used to implement such components.
[0022] FIG. 1 illustrates a schematic perspective view of internal components of the communication device, in accordance with an embodiment of the present invention;
[0023] FIG. 2 illustrates a schematic top view of the internal components of the communication device, in accordance with an embodiment of the present invention;
[0024] FIG. 3 illustrates a schematic view of a heat dissipation plate assembly of the communication device, in accordance with an embodiment of the present invention;
[0025] FIG. 4 illustrates a schematic view of a communication device, in accordance with an embodiment of the present invention; and
[0026] FIG. 5 illustrates an exemplary schematic view of an operational assembly of the communication device.

[0027] The foregoing shall be more apparent from the following more detailed description of the disclosure.
DETAILED DESCRIPTION OF THE INVENTION
[0028] In the following description, for the purposes of explanation, various specific details are set forth in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent, however, that embodiments of the present disclosure may be practiced without these specific details. Several features described hereafter may each be used independently of one another or with any combination of other features. An individual feature may not address any of the problems discussed above or might address only some of the problems discussed above.
[0029] The ensuing description provides exemplary embodiments only, and is not intended to limit the scope, applicability, or configuration of the disclosure. Rather, the ensuing description of the exemplary embodiments will provide those skilled in the art with an enabling description for implementing an exemplary embodiment. It should be understood that various changes may be made in the function and arrangement of elements without departing from the spirit and scope of the disclosure as set forth.
[0030] Specific details are given in the following description to provide a thorough understanding of the embodiments. However, it will be understood by one of ordinary skill in the art that the embodiments may be practiced without these specific details. For example, circuits, systems, processes, and other components may be shown as components in block diagram form in order not to obscure the embodiments in unnecessary detail.
[0031] The word “exemplary” and/or “demonstrative” is used herein to mean serving as an example, instance, or illustration. For the avoidance of doubt, the subject matter disclosed herein is not limited by such examples. In addition, any aspect or design described herein as “exemplary” and/or “demonstrative” is not necessarily to be construed as preferred or advantageous over other aspects or designs, nor is it meant to preclude equivalent exemplary structures and techniques known to those of ordinary skill in the art. Furthermore, to the extent that the terms “includes,” “has,” “contains,” and other similar words are used in either the detailed description or the claims, such terms are intended to

be inclusive—in a manner similar to the term “comprising” as an open transition word— without precluding any additional or other elements.
[0032] As discussed in the background section, the current known solutions have several shortcomings. The present disclosure aims to overcome the above-mentioned and other existing problems in this field of technology by providing a heat dissipating assembly for a communication device.
[0033] FIG. 1 illustrates a schematic perspective view of internal components of a communication device [102], in accordance with an embodiment of the present invention.
[0034] FIG. 2 illustrates a schematic top view of the internal components of the communication device [102], in accordance with an embodiment of the present invention.
[0035] FIG. 3 illustrates a schematic view of a heat dissipation plate assembly [108] of the communication device [102], in accordance with an embodiment of the present invention.
[0036] FIG. 4 illustrates a schematic view of the communication device [102], in accordance with an embodiment of the present invention.
[0037] FIG. 5 illustrates an exemplary schematic view of an operational assembly of the communication device [102].
[0038] Referring to FIGs. 1 to 5, the communication device [102] comprises a heat dissipation assembly [100]. The heat dissipation assembly [100] comprises: one or more bottom heat sinks [104]; one or more Phased Array Antenna modules (PAAM) [106]; and at least one heat dissipation plate assembly [108] in connection with at least one baseband printed circuit board (PCB) [110] of the communication device [102], wherein the at least one heat dissipation plate assembly [108] comprises: one or more heat dissipation plates [112]; one or more heat dissipation tubes [114]; and one or more pedestals [116].
[0039] The various components of the communication device [102] are described in detail below.

[0040] One or more bottom heat sinks [104]: In an embodiment, the one or more bottom heat sinks [104] is located at a base of the communication device [102] and is adapted to dissipate any received heat to the exterior of the communication device [102]. In an embodiment, the one or more bottom heat sinks [104] dissipates heat to an ambient exterior of the communication device [102]. In an embodiment, the heat that is received by the one or more bottom heat sinks [104] is generated by operation of one or more components of the communication device [102]. In an embodiment, the one or more bottom heat sinks [104] is configured to dissipate heat associated with the at least one baseband PCB [110] and the one or more PAAMs [106]. In an embodiment, the one or more bottom sinks [104] is made of a material having high thermal conductivity, and low co-efficient of thermal expansion. In an embodiment, the material of the one or more bottom sinks [104] is selected from a group consisting of metals, alloys, ceramics, and combinations thereof. In an embodiment, the one or more heat sinks [104] comprises a single heat sink. In an embodiment, the one or more heat sinks [104] is integrated with a mechanical housing [120] of the communication device [102].
[0041] One or more Phased Array Antenna Modules (PAAM) [106]: In an embodiment, the one or more PAAMs [106] is located within the mechanical housing [120] of the communication device [102]. In an embodiment, the one or more PAAMs [106] is located on top of the at least one baseband PCB [110], and electrically and/or communicably coupled to the at least one baseband PCB [110]. In an embodiment, each of the one or more PAAMs [106] comprises at least one radio frequency (RF) Front End PCB (not shown in figure) and at least one RF Front End antenna (not shown in figure). The at least one RF Front End PCB is connected to the at least one RF Front End Antenna and is adapted to operate the at least one RF Front End Antenna. In an embodiment, the RF Front End PCB and the RF Front End Antenna form an integrated unit. In an embodiment, the communication device [102] comprises a single PAAM. In an embodiment, the communication device [102] comprises a plurality of PAAMs. In an embodiment, each of the plurality of PAAMs is similar to each other in terms of construction and/or signal characteristics. In other embodiments, at least one PAAM of the plurality of PAAMs is different from the others in terms of construction and/or signal characteristics. In an embodiment, the one or more PAAMs [106] is adapted to generate a millimetre (mm)-Wave signal.

[0042] At least one heat dissipation plate assembly [108]: In an embodiment, the at least
one heat dissipation plate assembly [108] is located within the mechanical housing [120]
of the communication device [102]. In an embodiment, the at least one heat dissipation
5 plate assembly [108] is thermally coupled to the one or more bottom heat sinks [104] of
the communication device [102]. In an embodiment, the at least one heat dissipation plate assembly [108] is thermally coupled to the one or more bottom heat sinks [104] via an edge of the mechanical housing [120].
10 [0043] In an embodiment, the at least one heat dissipation plate assembly [108] comprises
one or more heat dissipation plates [112]. In an embodiment, the at least one heat dissipation plate assembly [108] comprises a single heat dissipation plate. In an embodiment, the one or more heat dissipation plates [112] is made of a material having high thermal conductivity, and low co-efficient of thermal expansion or any other material
15 that may be obvious to the person skilled in the art to implement the solution of the present
disclosure. In an embodiment, the material of the one or more heat dissipation plates [112] is selected from a group consisting of metals, alloys, ceramics, and combinations thereof. In a preferred embodiment, the one or more heat dissipation plates [112] is made of copper. In an embodiment, the one or more heat dissipation plates [112] comprises a first section
20 secured to the edge of the mechanical housing [120], and a second section disposed at an
angle to the first section and extending from the edge of the mechanical housing [120]. In an embodiment, the second section is orthogonal to the first section. In an embodiment, a thermal grease is applied between the first section of the one or more heat dissipation plates [112] and the edge of the mechanical housing [120] to facilitate effective thermal
25 conduction therebetween. In an embodiment, the one or more heat dissipation plates [112]
is mounted on the one or more bottom heat sinks [104] via the one or more spacers [118]. In an embodiment, the one or more spacers [118] is located at the edge of the mechanical housing [120]. In various embodiments, the one or more spacers [118] may be made of a thermally conducting material or a thermally insulating material to implement the solution
30 of the present disclosure. In embodiments where the one or more spacers [118] are made
of thermally conducting material, the one or more spacers [118] are adapted to thermally couple the first section of the one or more heat dissipation plates [112] with the one or more bottom heat sinks [104]. In an embodiment, the second section is unsupported, and thus, the one or more heat dissipation plates [112] has a cantilever support at the edge of the
9

mechanical housing [120]. In another embodiment, the second section is supported on the
at least one baseband PCB [110] via one or more pedestals [116]. In an embodiment, the
one or more pedestals [116] facilitate a predetermined space between the at least one heat
dissipation plate assembly [108] and the at least one baseband PCB [110]. In various
5 embodiments, the one or more pedestals [116] may be made of a thermally conducting
material or a thermally insulating material. The one or more pedestals [116] are configured such that they do not affect the operation of the PAAMs [106].
[0044] In an embodiment, the at least one heat dissipation plate assembly [108] comprises
10 one or more heat dissipation tubes [114]. In an embodiment, the one or more heat
dissipation tubes [114] are located on a surface of at least one of the one or more heat
dissipation plates [112]. In an embodiment, the one or more heat dissipation tubes [114] are
located on a top surface of the at least one heat dissipation plate [112]. In an embodiment,
the one or more heat dissipation tubes [114] are embedded in the at least one heat
15 dissipation plate [112]. In an embodiment, the one or more heat dissipation tubes [114] are
adapted to allow a flow of a thermal fluid therein. The thermal fluid may be adapted to
transport thermal energy. In an embodiment, the one or more heat dissipation tubes [114]
are configured such that the thermal fluid transports thermal energy from the second section
to the first section of the at least one heat dissipation plate [112].
20
[0045] In an embodiment, the at least one heat dissipation plate assembly [108] is adapted
to accommodate the one or more PAAMs [106]. In an embodiment, at least one of the one
or more heat dissipation plates [112] is adapted to accommodate at least one PAAM [106].
Specifically, the second section of the at least one heat dissipation plate [112] is adapted to
25 accommodate the at least one PAAM [106]. In an embodiment, the at least one PAAM
[106] is secured to the at least one dissipation plate [112] via one or more fasteners. In an embodiment, the fasteners are selected from a group consisting of screws, bolts, rivets, soldered joints, and combinations thereof in order to implement the solution of the present disclosure as disclosed herein. In an embodiment, a PAAM [106] is mounted on the at least
30 one heat dissipation plate [112] through one or more fixing plates. For example, a PAAM
[106] is mounted on the at least one heat dissipation plate [112] through two fixing plates [124-1, 124-2]. Further, in an embodiment, the PAAM [106] is electrically and/or communicably coupled to the at least one Baseband PCB [110] via connecting blocks [126]. The at least one PAAM [106] is further thermally coupled to the at least one
10

dissipation plate [112] and the one or more dissipation tubes [114] provided on the at least
one dissipation plate [112]. In an embodiment, a thermal grease is applied between the at
least one PAAM [106] and the at least one dissipation plate [112] to facilitate effective
thermal conduction therebetween. In an alternate embodiment, the one or more PAAMs
5 [106] is integrated on a side of the one or more heat dissipation plates [112], and the one or
more heat dissipation plates [112] is further connected to the one or more bottom heat sinks [104].
[0046] At least one Baseband Printed Circuit Board (PCB) [110]: The at least one
10 baseband PCB [110] is located within the communication device [102]. Specifically, the at
least one baseband PCB [110] housed within the mechanical housing [120] of the
communication device [102]. The at least one baseband PCB [110] is adapted to electrically
and/or communicably couple different components of the communication device [102] to
facilitate operation of the communication device [102], as known to a person skilled in the
15 art.
[0047] Mechanical Housing [120]: The mechanical housing [120] is made of a lightweight, strong material, such as plastics, metal, alloys, and combinations thereof. In an embodiment, the mechanical housing [120] is made of a material that does not affect the
20 signal transmission characteristics of the communication device [102]. In a preferred
embodiment, the mechanical housing [120] is made of a plastic material, such as, without limitations, polycarbonate (PC), acrylonitrile-butadiene-styrene (ABS), acrylic-styrene-acrylonitrile copolymer (ASA), polyvinyl chloride (PVC), etc. The mechanical housing [120] is adapted to at least partially enclose the components of the communication device
25 [102] including the one or more bottom sinks [104], the at least one baseband PCB [110],
the at least one PAAM [106], and the at least one heat dissipation plate assembly [108]. In an embodiment, the mechanical housing [120] is open towards a top side, to allow easy and convenient access to the components of the communication device [102]. In an embodiment, the top side of the mechanical housing [120] is coverable by a top cover [122].
30 In an embodiment, the top cover [122] is adapted to be removably coupled to the top side
of the mechanical housing [120]. In an embodiment, the top cover [122] is adapted to be secured to the mechanical housing [120] via one or more fasteners. In an embodiment, the fasteners are selected from a group consisting of screws, bolts, rivets, clips and combinations thereof. In an embodiment, the top cover [122] is made of a lightweight,
11

strong material, such as plastics, metal, alloys, and combinations thereof. In an
embodiment, the top cover [122] is made of a material that does not affect the signal
transmission characteristics of the communication device [102]. In a preferred
embodiment, the top cover [122] is made of a plastic material, such as, without limitations,
5 PC, ABS, ASA, PVC, etc.
[0048] In an exemplary implementation, the communication device [102] is secured to a
standing structure [128], such as a pillar (as shown in FIG. 5), and the communication
device [102] is generally exposed to the ambient. In an embodiment, when the top cover
10 [122] is secured to the mechanical housing [120], the mechanical housing [120] and the top
cover [122] together are adapted to restrict entry of dust and moisture therein. In an exemplary embodiment, the mechanical housing [120] and the top cover [122] secured to it has a rating of IP65.
15 [0049] With continued reference to FIGs. 1 to 5, during operation of the communication
device [102], during operation of the communication device [102], heat is generated. Specifically, during operation of the one or more PAAMs [106], the RF Front End Antenna generates heat. At least a part of the heat generated by the PAAMs [106] is absorbed by the one or more dissipation tubes [114], and at least a part of the heat generated by the PAAMs
20 [106] is absorbed by the at least one dissipation plate [112]. The heat absorbed is transferred
by conduction towards the first section of the at least one heat dissipation plate [112]. From the first section of the at least one heat dissipation plate [112], the heat is transmitted to the one or more bottom heat sinks [104] via the one or more pedestals [116].
25 [0050] As is evident from the above description, the present invention provides a heat
dissipating assembly [100] for a communication device [102] that can be implemented using a single heat dissipating plate assembly [108]. The heat dissipating plate assembly [108] comprises heat dissipation plates [112], and heat dissipation tubes [114] provided on the heat dissipation plates [112] that effectively transmit heat generated by the PAAMs
30 [106] to the bottom heat sinks [104] via thermal conduction. As a result, the process is
passive, and no energy consuming element, such as a fan, is required to facilitate heat transfer. As a result, effective heat dissipation occurs in the communication device [102] without requirement of additional energy. Further, the implementation of the communication device [102] with a single heat dissipation plate assembly [108] also
12

demonstrates that effective heat dissipation can occur without requirement of additional material, thereby resulting in a communication device [102] that is lightweight and cost-effective.
5 [0051] While considerable emphasis has been placed herein on the disclosed
implementations, it will be appreciated that many implementations can be made and that
many changes can be made to the implementations without departing from the principles
of the present disclosure. These and other changes in the implementations of the present
disclosure will be apparent to those skilled in the art, whereby it is to be understood that
10 the foregoing descriptive matter to be implemented is illustrative and non-limiting.
13

We Claim:
1. A heat dissipation assembly (100) for a communication device (102), comprising:
- one or more bottom heat sinks (104);
- one or more Phased Array Antenna module (PAAM) (106); and
- at least one heat dissipation plate assembly (108) in connection with at least one baseband printed circuit board (PCB) (110) of the communication device (102), wherein the at least one heat dissipation plate assembly (108) comprises:
▪ one or more heat dissipation plates (112);
▪ one or more heat dissipation tubes (114), and
▪ one or more pedestals (116).
2. The heat dissipation assembly (100) as claimed in claim 1, wherein the at least one heat dissipation plate assembly (108) is configured to conduct a heat generated by the one or more PAAMs (106) to the one or more bottom heat sinks (104).
3. The heat dissipation assembly (100) as claimed in claim 1, wherein each of the one or more bottom heat sinks (104) is configured to dissipate heat associated with the at least one baseband PCB (110) and the one or more PAAMs (106).
4. The heat dissipation assembly (100) as claimed in claim 1, wherein the one or more pedestals (116) is configured to facilitate a predetermined space between the at least one heat dissipation plate assembly (108) and the at least one baseband PCB (110).
5. The heat dissipation assembly (100) as claimed in claim 1, wherein the one or more PAAMs (106) is integrated on a side of the one or more heat dissipation plates (112), and wherein the one or more heat dissipation plates (112) is further connected to the one or more bottom heat sinks (104).
6. The heat dissipation assembly (100) as claimed in claim 1, wherein the one or more heat dissipation plates (112) is mounted on the one or more bottom heat sinks (104) via one or more spacers (118).

7. The heat dissipation assembly (100) as claimed in claim 1, wherein the one or more heat dissipation tubes (114) are embedded in the one or more heat dissipation plates (112).