FORM 2
THE PATENTS ACT, 1970 (39 of 1970) THE PATENTS RULES, 2003
COMPLETE SPECIFICATION
(See section 10; rule 13)
TITLE OF THE INVENTION
MULTI-ACCESS EDGE COMPUTING SERVER RACK
APPLICANT
JIO PLATFORMS LIMITED
of Office-101, Saffron, Nr. Centre Point, Panchwati 5 Rasta, Ambawadi, Ahmedabad -
380006, Gujarat, India; Nationality : India
The following specification particularly describes
the invention and the manner in which
it is to be performed

FIELD OF INVENTION
[0001] The present disclosure relates to a field of data center infrastructure and
thermal management systems. In particular, the present disclosure pertains to a
thermally efficient server rack designed for Multi-access Edge Computing (MEC)
units.
BACKGROUND
[0002] Conventionally, when multiple servers are placed inside a server room or a chamber, then the particular server room or the chamber becomes hot, which leads to several issues. Further, when a fault occurs in the servers, a fault detection system or a separate system may be used to detect the fault in the servers during maintenance. Such fault detection due to inefficient cooling systems are time and space consuming.
[0003] Conventional systems may reduce heat in the chamber, or the server room including multiple servers and facilitate easier detection of the fault; however, they are not easily deployed. Further, such conventional systems may not be thermally efficient for particular use cases or types of the servers, such as, but not limited to, Multi-access Edge Computing (MEC) servers.
[0004] In current telecom infrastructure, the servers need large capex in terms of server installation, efficient running of the servers in a controlled environment with proper air conditioning, and so forth. Furthermore, air filtering procedures are also complex, emits carbon and results in air related problems, thereby hampers global warming.
[0005] Thus, there is a need for an easily deployable solution that reduces the heat in a server rack.

OBJECTS OF THE PRESENT DISCLOSURE
[0006] Some of the objects of the present disclosure, which at least one
embodiment herein satisfies are as listed herein below.
[0007] An object of the present disclosure is to reduce heat in a server room or a chamber including multiple MEC servers.
[0008] An object of the present disclosure is to monitor, detect and minimize fault occurring in MEC servers due to inefficient cooling systems.
[0009] An object of the present disclosure is to enhance performance of MEC servers in a MEC server rack.
[0010] An object of the present disclosure is to protect electronic components of corresponding MEC servers in the MEC server rack due to rise in ambient temperature.
[0011] An object of the present disclosure is to provide an efficient means for dissipation of heat that is generated from a MEC server rack.
SUMMARY
[0012] In an exemplary embodiment, the present disclosure discloses a Multi-Access Edge Computing (MEC) server rack. The server rack includes a plurality of slots provided at a left side and a right side of the server rack. The plurality of slots are adapted to receive MEC units. The server rack further includes an airflow vent located between the left side and the right side of the server rack. The server rack further includes a plurality of fin structures on a top surface of each of the MEC units. The ambient air is flowing through the plurality of fin structures to absorb heat generated by the MEC units and direct the heated air towards the airflow vent. The server rack further includes one or more exhaust fans positioned on a top portion of the server rack. The one or more exhaust fans are adapted to create a

negative pressure within the airflow vent to draw the heated air from the server rack through the airflow vent.
[0013] In an embodiment, the server rack includes a base provided at a bottom of the server rack to position the server rack securely and vertically on a flat surface.
[0014] In an embodiment, the one or more exhaust fans are covered by an enclosure.
[0015] In an embodiment, the airflow vent serves as a duct to direct a flow of the heated air from the plurality of fin structures towards the one or more exhaust fans.
[0016] In an embodiment, the plurality of the fin structures are arranged horizontally along a length of the MEC units.
[0017] In an embodiment, the MEC units are adapted to be arranged on either an inner side or an outer side of the server rack based on cooling requirements.
[0018] In an embodiment, an axis of rotation of the one or more exhaust fans is parallel to the airflow vent and aligned in a vertical direction.
[0019] In an embodiment, the server rack is provided with a Top of Rack (TOR) switch provided on the left side and the right side of the MEC server rack.
[0020] In an embodiment, the ambient air is flowing horizontally through the plurality of fin structures.
[0021] In an embodiment, the heated air is drawn out from the server rack in a vertical direction.

BRIEF DESCRIPTION OF DRAWINGS
[0022] The accompanying drawings, which are incorporated herein, and constitute a part of this disclosure, illustrate exemplary embodiments of the disclosed methods and systems in which like reference numerals refer to the same parts throughout the different drawings. Components in the drawings are not necessarily to scale, emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Some drawings may indicate the components using block diagrams and may not represent the internal circuitry of each component. It will be appreciated by those skilled in the art that disclosure of such drawings includes the disclosure of electrical components, electronic components or circuitry commonly used to implement such components.
[0023] FIG. 1A illustrates an exemplary left view of a MEC server rack, in accordance with an embodiment of the present disclosure;
[0024] FIG. 1B illustrates an exemplary right view of the MEC server rack, in accordance with an embodiment of the present disclosure;
[0025] FIG. 1C illustrates an exemplary front view of the MEC server rack, in accordance with an embodiment of the present disclosure;
[0026] FIG. 1D illustrates an exemplary back view of the MEC server rack, in accordance with an embodiment of the present disclosure;
[0027] FIG. 1E illustrates an exemplary perspective view of the MEC server rack, in accordance with an embodiment of the present disclosure;
[0028] FIG. 1F illustrates an exemplary top view of the MEC server rack (100), in accordance with an embodiment of the present disclosure;

[0029] FIG. 1G illustrates the exemplary top view of the MEC server rack (100), in accordance with another embodiment of the present disclosure;
[0030] FIG. 1H illustrates an exemplary bottom view of the MEC server rack, in accordance with an embodiment of the present disclosure;
[0031] FIG. 1I illustrates an exemplary sectional view of the MEC server rack, in accordance with an embodiment of the present disclosure;
[0032] FIG. 2 illustrates an exemplary schematic view depicting a comparison between existing data centers with air-conditioned rooms and the proposed MEC server rack in an unconditioned air, in accordance with an embodiment of the present disclosure; and
[0033] FIG. 3 illustrates a flowchart of a method of dissipating heat from server rooms by using a MEC server rack, in accordance with an embodiment of the present disclosure.
[0034] The foregoing shall be more apparent from the following more detailed description of the disclosure.
LIST OF REFERENCE NUMERALS
100 - MEC server rack
102 - MEC units
104 - Slots
106 - Left side of the MEC server rack
108 - Right side of the MEC server rack
110 - Airflow vent

112 - Top of Rack (TOR) switch
114 - Fin structures associated with MEC units
116 - Exhaust Fans
118 - Enclosure
120 - Base
200 - Schematic View
202 - Existing Data Centers
300 - Method
DETAILED DESCRIPTION OF DISCLOSURE
[0035] In the following description, for the purposes of explanation, various specific details are set forth in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent, however, that embodiments of the present disclosure may be practiced without these specific details. Several features described hereafter can each be used independently of one another or with any combination of other features. An individual feature may not address all of the problems discussed above or might address only some of the problems discussed above. Some of the problems discussed above might not be fully addressed by any of the features described herein.
[0036] The ensuing description provides exemplary embodiments only, and is not intended to limit the scope, applicability, or configuration of the disclosure. Rather, the ensuing description of the exemplary embodiments will provide those skilled in the art with an enabling description for implementing an exemplary embodiment. It should be understood that various changes may be made in the function and arrangement of elements without departing from the spirit and scope of the disclosure as set forth.

[0037] Specific details are given in the following description to provide a thorough understanding of the embodiments. However, it will be understood by one of ordinary skill in the art that the embodiments may be practiced without these specific details. For example, circuits, systems, networks, processes, and other components may be shown as components in block diagram form in order not to obscure the embodiments in unnecessary detail. In other instances, well-known circuits, processes, algorithms, structures, and techniques may be shown without unnecessary detail in order to avoid obscuring the embodiments.
[0038] Also, it is noted that individual embodiments may be described as a process which is depicted as a flowchart, a flow diagram, a data flow diagram, a structure diagram, or a block diagram. Although a flowchart may describe the operations as a sequential process, many of the operations can be performed in parallel or concurrently. In addition, the order of the operations may be re-arranged. A process is terminated when its operations are completed but could have additional steps not included in a figure. A process may correspond to a method, a function, a procedure, a subroutine, a subprogram, etc. When a process corresponds to a function, its termination can correspond to a return of the function to the calling function or the main function.
[0039] The word “exemplary” and/or “demonstrative” is used herein to mean serving as an example, instance, or illustration. For the avoidance of doubt, the subject matter disclosed herein is not limited by such examples. In addition, any aspect or design described herein as “exemplary” and/or “demonstrative” is not necessarily to be construed as preferred or advantageous over other aspects or designs, nor is it meant to preclude equivalent exemplary structures and techniques known to those of ordinary skill in the art. Furthermore, to the extent that the terms “includes,” “has,” “contains,” and other similar words are used in either the detailed description or the claims, such terms are intended to be inclusive—in a manner similar to the term “comprising” as an open transition word—without precluding any additional or other elements.

[0040] Reference throughout this specification to “one embodiment” or “an embodiment” or “an instance” or “one instance” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. Thus, the appearances of the phrases “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
[0041] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
[0042] The present disclosure generally relates to a data center infrastructure and thermal management systems. In particular, the present disclosure pertains to a thermally efficient Multi-Access Edge Computing (MEC) server rack that may be designed to detect and reduce heat in server rooms or chambers having multiple servers. The present disclosure may also monitor, detect and minimize fault occurring in the servers in an efficient manner. The present disclosure may enhance a performance of the servers.
[0043] The various embodiments throughout the disclosure will be explained in more detail with reference to FIGs. 1-3.

[0044] FIG. 1A illustrates an exemplary left view of a MEC server rack (100), in accordance with an embodiment of the present disclosure. In an embodiment, the MEC server rack (100) may be designed to house and manage MEC units (102-1, 102-2….102-N) (hereinafter collectively referred to as the MEC units (102) and individually referred to as the MEC units (102)). In an embodiment, the MEC server rack (100) may be scalable, easy to install or uninstall as a single unit, and easy to mantle and dismantle as parts. This scalability may be achieved through a use of interlocking components, tool-less design elements, or quick-release mechanisms.
[0045] In an exemplary embodiment, the MEC server rack (100) may be designed to be fitted at a remote location, in case of communication system needs, i.e. a disaster location, temporary crowd locations and so forth. Further, in an embodiment, the MEC server rack (100) may be designed to be deployable in a variety of environments, such as, but not limited to, indoor and outdoor settings. In an embodiment, material and construction of the MEC server rack (100) may be adapted to withstand various environmental conditions such as moisture, dust, extreme temperatures, and so forth.
[0046] In an aspect, the MEC server rack (100) may be made up of a material such as, but not limited to, steel (i.e. cold-rolled for strength and durability), aluminium (lightweight and good thermal conductivity), stainless steel, and so forth. In an exemplary embodiment, the MEC server rack (100) may be designed to be robust and durable, and capable of supporting a weight of multiple MEC units (102). The MEC server rack (100) may be capable to withstand thermal stresses associated with high-performance computing.
[0047] In an embodiment, the MEC server rack (100) may be designed to be positioned in a vertical orientation for operational use. In an embodiment, the MEC server rack (100) may include a plurality of slots (104-1,104-2….104-N) (hereinafter collectively referred to as the slots (104) and individually referred to as

the slot (104)). In such embodiment, each of the slots (104) may be capable to receive the corresponding MEC units (102). In an embodiment, the MEC units (102) may be arranged in an inner side or an outer side of the MEC server rack (100) based on a specific thermal management need of an installation of the MEC 5 server rack (100). In an embodiment, the slots (104) may be arranged on two opposite sides such as, a left side (106) and a right side (108) of the MEC server rack (100).
[0048] In an embodiment, the MEC server rack (100) may further comprise an
10 airflow vent (110) that may be positioned in between the MEC units (102) placed on the left side (106) and the right side (108) of the MEC server rack (100). In an exemplary embodiment, the airflow vent (110) may be disposed longitudinally between the MEC units (102) placed on the left side (106) and the right side (108) of the MEC server rack (100), serving as a conduit for air movement. In an
15 embodiment, the airflow vent (110) may be designed to span an entire height of the MEC server rack (100), providing a channel through which the air can circulate. In an embodiment, the airflow vent (110) may function as a duct, guiding hot air from a plurality of fin structures (114) (as shown in FIG. 1E) towards one or more exhaust fans (116) (As shown in FIG. 1F).
20
[0049] FIG. 1B illustrates an exemplary right view of the MEC server rack (100), in accordance with an embodiment of the present disclosure. In an embodiment, the MEC server rack (100) may be responsible for providing power, cooling, and connectivity to the MEC units (102). In an exemplary embodiment,
25 power distribution units (not shown) may be provided to manage power supply of each of the MEC units (102). In an exemplary embodiment, the MEC server rack (100) may be designed to incorporate a cable management system to organize, secure and facilitate a maintenance of power, network and peripheral cables. In an exemplary embodiment, the MEC server rack (100) may also be designed to
30 incorporate connectivity ports for connecting the MEC units (102) to a network.
11

[0050] In an embodiment, the MEC server rack (100) may include a Top of Rack (TOR) switch (112) that may be provided at a top of the MEC server rack (100). In another embodiment, the TOR switch (112) may be provided at a middle of the MEC server rack (100). In yet another embodiment, the TOR switch (112) 5 may be provided at a bottom of the MEC server rack (100). In an embodiment, the TOR switch (112) may be provided on the left side (106) and the right side (108) of the MEC server rack (100). In an exemplary embodiment, the TOR switch (112) may be directly connected to the MEC units (102) within the MEC server rack (100), offering high-speed data transfer and low latency communication. Further, 10 the TOR switch (112) provides multiple communication ports to connect each MEC unit (102) in the MEC server rack (100). In an aspect, the TOR switch (112) may also aid in the cable management.
[0051] FIG. 1C illustrates an exemplary front view of the MEC server rack
15 (100), in accordance with an embodiment of the present invention. In an
embodiment, the front view of the MEC server rack (100) may represent the left
side (106) of the MEC server rack (100). The left side (106) of the MEC server rack
(100) may include a first series of the slots (104) that may be designed to house the
MEC units (102). In an exemplary embodiment, the left side (106) of the MEC
20 server rack (100) may include 5 slots, each capable of holding one MEC unit (102).
In an embodiment, the first series of the slots (104) may be vertically aligned on the
left side (106) of the MEC server rack (100) and numbered for easy identification
and installation. In an embodiment, each of the first series of the slots (104) on the
left side (106) may be equipped with mounting rails and brackets to ensure that the
25 MEC units (102) are securely fastened and properly aligned. In an embodiment, the
first series of the slots (104) may be designed to allow for easy insertion and
removal of the MEC units (102).
[0052] FIG. 1D illustrates an exemplary back view of the MEC server rack
30 (100), in accordance with an embodiment of the present invention. In an
embodiment, the back view of the MEC server rack (100) may represent the right
12

side (108) of the MEC server rack (100). The right side (108) of the MEC server rack (100) may include a second series of the slots (104) that may be designed to house the MEC units (102). In an exemplary embodiment, the right side (108) of the MEC server rack (100) may include 5 slots, each capable of holding one MEC 5 unit (102). In an embodiment, the second series of the slots (104) may be vertically aligned on the right side (108) of the MEC server rack (100) and numbered for easy identification and installation. In an embodiment, each of the slots (104) on the right side (108) may be equipped with the mounting rails and the brackets to ensure the MEC units (102) are securely fastened and properly aligned.
10
[0053] FIG. 1E illustrates an exemplary perspective view of the MEC server rack (100), in accordance with an embodiment of the present disclosure. The MEC server rack (100) may comprise a plurality of fin structures (114) positioned horizontally on a top surface of each of the MEC units (102), to enhance heat
15 dissipation and improve thermal efficiency. In an embodiment, the fin structures (114) may be already associated with the corresponding MEC units (102). In another embodiment, the fin structures (114) may be positioned by a user on the top surface of the corresponding MEC units (102).
20 [0054] In an embodiment, each of the fin structures (114) may include a series of thin, elongated fins that may be arranged horizontally along a length of the corresponding MEC units (102). These fin structures (114) may be designed to promote horizontal airflow through the MEC units (102) and into the airflow vent (110).
25
[0055] In an embodiment, the fin structures (114) may be designed to enhance the airflow around the MEC units (102). In an example, the MEC units (102) may generate heat during operation, that may be transferred to the fin structures (114). As the air flows through the fin structures (114), the fin structures (114) absorb the 30 heat and directed the heated airflow towards the airflow vent (110) that acts as a
13

pathway for the heated air to exit the MEC server rack (100). Further, in an embodiment, a covering may be provided over the fin structures (114) to ensure proper airflow through the fins (114).
5 [0056] FIG. 1F illustrates a top view of the MEC server rack (100), in accordance with an embodiment of the present disclosure. In an embodiment, the MEC server rack (100) may be provided with one or more exhaust fans (116) that may be positioned at a top portion of the MEC server rack (100) to enhance a cooling efficiency and ensure effective heat dissipation from the MEC units (102).
10 In an embodiment, an axis of rotation of the corresponding exhaust fans (116) may be parallel to the airflow vent (110) (as shown in the FIG. 1A) and aligned in a vertical direction. The exhaust fans (116) may be activated by a power supply to create a negative pressure inside the airflow vent (110) that actively draws the hot air out of the top of the MEC server rack (100), thereby mitigating a thermal load
15 on the MEC units (102). In an exemplary embodiment, the exhaust fans (116) may facilitate a consistent and directed airflow through the MEC server rack (100). In an embodiment, the exhaust fans (116) may work in conjunction with the airflow vent (110) and the fin structures (114) to optimize a heat dissipation process.
20 [0057] FIG. 1G illustrates the exemplary top view of the MEC server rack (100), in accordance with another embodiment of the present disclosure. In an embodiment, the MEC server rack (100) may further comprise an enclosure (118) that may be provided at the top of the MEC server rack (100) to cover the exhaust fans (116). In an embodiment, the enclosure (118) may be, but not limited to, a
25 cover, a shade, a sheet, a chimney, and so forth. The enclosure (118) may serve to protect the exhaust fans (116) from environmental elements and to direct the airflow in a manner that optimizes a removal of the heated air from the MEC server rack (100).
30 [0058] FIG. 1H illustrates an exemplary bottom view of the MEC server rack (100), in accordance with an embodiment of the present disclosure. In an
14

embodiment, the MEC server rack (100) may be designed with a sturdy base (120) at its bottom side to rest the MEC server rack (100) securely and vertically on a flat surface. The base (120) may be capable to provide stable and secure placement of the MEC server rack (100) on the flat surface and supports an entire structure and 5 components of the MEC server rack (100).
[0059] FIG. 1I illustrates an exemplary sectional view of the MEC server rack (100), in accordance with an embodiment of the present disclosure. Referring to the FIG. 1I, ambient air may enter the MEC server rack (100) from the right side (108)
10 and flows horizontally through the fin structures (114) on the top surface of the MEC units (102). The ambient air passing through the fin structures (114) may pick up the heat dissipated by the corresponding MEC units (102) and transfers the heat to the air, where the heated air continues to flow horizontally along the length of the MEC units (102) towards the airflow vent (110). The exhaust fans (116) may
15 create the negative pressure inside the airflow vent (110) to pullout the heated air upward through the airflow vent (110) from the MEC server rack (100). It may be noted that the air flow horizontally through the fin structures (114), as the fin structures (114) are arranged horizontally. Also, the exit of the hot air is in the vertical direction, as the exhaust fans (116) are oriented to push the air in the vertical
20 direction.
[0060] FIG. 2 illustrates a schematic view (200) depicting a comparison between existing data centers (202) with air-conditioned rooms and the proposed MEC server rack (100) in an unconditioned air, in accordance with an embodiment
25 of the present disclosure. In an embodiment, the existing data centers (202) may rely on energy intensive air conditioning systems to maintain optimal operating temperatures, leading to high energy consumption, infrastructure requirements, large carbon footprint. On other side, the proposed MEC server rack (100) may utilize a thermally efficient design without air conditioning. The MEC server rack
30 (100) utilizes natural airflow and the exhaust fans (116) to dissipate the heat. Simple infrastructure of the MEC server rooms may lower installation and maintenance
15

costs. In an embodiment, multiple MEC server racks (100) of different configuration may be placed in the MEC server room. In another embodiment, multiple MEC server racks (100) of same configuration may be placed in the MEC server room. In yet another embodiment, a single MEC server rack (100) may be 5 available in the MEC server room.
[0061] FIG. 3 illustrates a flowchart of a method (300) of dissipating heat from server rooms by using a MEC server rack (100), in accordance with an embodiment of the present disclosure. 10
[0062] Step (302) includes enabling ambient air to enter into the MEC server rack (100) from the left side (106) and the right side (108).
[0063] Step (304) includes allowing the air to flow horizontally through the fin 15 structures (114) provided on the top surface of the corresponding MEC units (102).
[0064] Step (306) includes absorbing heat generated by the MEC units (102) by the air that is flowing through the fin structures (114).
20 [0065] Step (308) includes enabling the heated air to flow towards the airflow vent (110).
[0066] Step (310) includes pulling out the heated air from a top of the MEC server rack (100) due to a negative pressure created by the exhaust fans (116) inside 25 the airflow vent (110).
[0067] In alternative embodiments, the MEC server rack (100) may include additional features such as adjustable slots (104) to accommodate MEC units (102) of varying sizes, or inclusion of additional airflow vents (110) positioned on other
16

sides of the MEC server rack (100) to further enhance cooling efficiency. In another alternative embodiment, exhaust fans (116) may be variably controlled to adjust the airflow based on a thermal load or may be equipped with sensors to automatically regulate their speed. 5
[0068] Furthermore, the MEC server rack (100) may include a system for monitoring and detecting faults within the MEC units (102). This system may utilize sensors and a diagnostic software to identify and report issues, potentially integrating with remote management platforms for real-time monitoring and alerts.
10
[0069] While considerable emphasis has been placed herein on the preferred embodiments, it will be appreciated that many embodiments can be made and that many changes can be made in the preferred embodiments without departing from the principles of the disclosure. These and other changes in the preferred
15 embodiments of the disclosure will be apparent to those skilled in the art from the disclosure herein, whereby it is to be distinctly understood that the foregoing descriptive matter to be implemented merely as illustrative of the disclosure and not as limitation.
20 ADVANTAGES OF THE PRESENT DISCLOSURE
[0070] The present disclosure deploys a thermally efficient MEC server rack to detect and reduce heat in a room or a chamber including multiple servers effectively.
25 [0071] The present disclosure monitors, detects and minimizes fault occurring in MEC servers due to inefficient cooling systems.
[0072] The present disclosure enhances performance of MEC servers in a MEC server rack. 30
17

[0073] The present disclosure deploys a thermally efficient MEC server rack which is scalable, easy to install and uninstall as a single unit, and easy to mantle and dismantle as parts.
[0074] The present disclosure deploys a thermally efficient MEC server rack 5 which can be installed with similar repetitive assembly processes to give form of large data center as per requirement.
[0075] The present disclosure discloses a thermally efficient MEC server rack that do not require conditioned air and large installation capex. 10
[0076] The present disclosure protects electronic components of corresponding MEC servers in the MEC server rack due to rise in ambient temperature.
[0077] The present disclosure provides an efficient means for dissipation of 15 heat that is generated from a MEC server rack.
18

We claim:
1. A Multi-Access Edge Computing (MEC) server rack (100), wherein the MEC server rack (100) comprising:
a plurality of slots (104) provided at a left side (106) and a right side (108) of the MEC server rack (100), wherein the plurality of slots (104) are adapted to receive MEC units (102);
an airflow vent (110) located between the left side (106) and the right side (108) of the MEC server rack (100);
a plurality of fin structures (114) on a top surface of each of the MEC units (102), wherein an ambient air is flowing through the plurality of fin structures (114) to absorb heat generated by the MEC units (102) and direct heated air towards the airflow vent (110); and
one or more exhaust fans (116) positioned on a top portion of the MEC server rack (100), wherein the one or more exhaust fans (116) are adapted to create a negative pressure within the airflow vent (110) to draw the heated air from the MEC server rack (100) through the airflow vent (110).
2. The MEC server rack (100) as claimed in claim 1, comprising a base (120) provided at a bottom of the MEC server rack (100) to position the MEC server rack (100) securely and vertically on a flat surface.
3. The MEC server rack (100) as claimed in claim 1, wherein the one or more exhaust fans (116) are covered by an enclosure (118).
4. The MEC server rack (100) as claimed in claim 1, wherein the airflow vent (110) serves as a duct to direct a flow of the heated air from the plurality of fin structures (114) towards the one or more exhaust fans (116).

5. The MEC server rack (100) as claimed in claim 1, wherein the plurality of fin structures (114) are arranged horizontally along a length of the MEC units (102).
6. The MEC server rack (100) as claimed in claim 1, wherein the MEC units (102) are adapted to be arranged on at least one of, an inner side or an outer side of the MEC server rack (100) based on cooling requirements.
7. The MEC server rack (100) as claimed in claim 1, wherein an axis of rotation of the one or more exhaust fans (116) is parallel to the airflow vent (110) and aligned in a vertical direction.
8. The MEC server rack (100) as claimed in claim 1, comprising a Top of Rack (TOR) switch (112) provided on the left side (106) and the right side (108) of the MEC server rack (100).
9. The MEC server rack (100) as claimed in claim 1, wherein the ambient air is flowing horizontally through the plurality of fin structures (114).
10. The MEC server rack (100) as claimed in claim 1, wherein the heated air is drawn out from the MEC server rack (100) in a vertical direction.