FORM 2
THE PATENTS ACT, 1970 (39 OF 1970) & THE PATENT RULES, 2003
COMPLETE SPECIFICATION
(See section 10 and rule 13)
“LOW BAND THERMALLY EFFICIENT RADIO UNIT AND HOUSING ARRANGEMENT THEREOF”
We, Jio Platforms Limited, an Indian National, of Office - 101, Saffron, Nr. Centre Point, Panchwati 5 Rasta, Ambawadi, Ahmedabad - 380006, Gujarat, India.
The following specification particularly describes the invention and the manner in which it is to be performed.

LOW BAND THERMALLY EFFICIENT RADIO UNIT AND HOUSING
ARRANGEMENT THEREOF
FIELD OF THE DISCLOSURE
[0001] The present disclosure relates generally to the field of wireless communication systems. More particularly, the present disclosure relates to low band thermally efficient radio unit and housing arrangement thereof.
BACKGROUND
[0002] The following description of related art is intended to provide background information pertaining to the field of the disclosure. This section may include certain aspects of the art that may be related to various features of the present disclosure. However, it should be appreciated that this section be used only to enhance the understanding of the reader with respect to the present disclosure, and not as admissions of prior art.
[0003] Wireless communication technology has rapidly evolved over the past few decades, with each generation bringing significant improvements and advancements. The first generation of wireless communication technology was based on analog technology and offered only voice services. However, with the advent of the second-generation (2G) technology, digital communication and data services became possible, and text messaging was introduced. 3G technology marked the introduction of high-speed internet access, mobile video calling, and location-based services. The fourth-generation (4G) technology revolutionized wireless communication with faster data speeds, better network coverage, and improved security. Currently, the fifth-generation (5G) technology is being deployed, promising even faster data speeds, low latency, and the ability to connect multiple devices simultaneously. With each generation, wireless communication

technology has become more advanced, sophisticated, and capable of delivering more services to its users.
[0004] In the current existing solutions, there are several problems associated with the thermal management of radio units (RUs) used in 5G networks, especially in the low band frequency range such as 700 MHz. One of the primary issues is the inefficient heat dissipation from the components of the radio unit, which can lead to overheating and reduced performance. The conventional straight fin designs used in heat sinks are not optimal for all airflow conditions, particularly in practical situations where the airflow direction can be uncertain due to environmental factors such as wind and turbulence at high altitudes. Another problem is the lack of effective thermal isolation between different sections of the radio unit, such as the RF board and the baseband board. This can result in heat transfer from one section to another, further exacerbating thermal management issues. Additionally, the use of straight fins in conventional heat sinks does not provide the best thermal margins, as they are not optimized for maximum heat transfer under varying airflow conditions. Furthermore, the existing solutions often involve bulky and heavy heat sinks, which can make the radio units difficult to install and manage, especially in remote or challenging locations. This can also limit the deployment options for the radio units and increase the overall operational costs.
[0005] Thus, there exists an imperative need in the art to provide low band thermally efficient radio unit and housing arrangement thereof.
OBJECTS OF THE INVENTION
[0006] Some of the objects of the present disclosure, which at least one embodiment disclosed herein satisfies are listed herein below.

[0007] It is an object of the present disclosure to provide a low band thermally efficient radio unit and housing arrangement thereof.
[0008] It is another object of the present disclosure to provide a low band thermally efficient radio unit and housing arrangement thereof that enhances air flow and heat transfer through the use of an optimized inverted-V fin shape.
[0009] It is another object of the present disclosure to provide a low band thermally efficient radio unit and housing arrangement thereof that features horizontal splits to disengage heat between the RF board and the baseband board, improving heat dissipation capabilities.
[0010] It is another object of the present disclosure to provide a low band thermally efficient radio unit and housing arrangement thereof that incorporates a vertical split to allow hot air to pass, which is caused by buoyant forces from the heated heat sink surface.
[0011] It is another object of the present disclosure to provide a low band thermally efficient radio unit and housing arrangement thereof that optimizes the angle of the inverted-V fins to allow maximum heat transfer from the components of both boards, ensuring the best thermal margins.
[0012] It is another object of the present disclosure to provide a low band thermally efficient radio unit and housing arrangement thereof that optimizes fin thickness and pitch in the heat sink for proper thermal heat dissipation, while reducing the product weight.
[0013] It is another object of the present disclosure to provide a low band thermally efficient radio unit and housing arrangement thereof that implements advanced heat pipe technology to address localized hot spots generated by the network processor,

FPGA/ASIC used for the baseband transceiver, optimizing the overall cost, and reducing the weight and volume of the product.
[0014] It is yet another object of the present disclosure to provide a low band thermally efficient radio unit and housing arrangement thereof that reduces the localized air temperature near the processors and ASICs in the baseband board using this innovative design and keeps the air temperature from the RF board within the thermal limit.
SUMMARY
[0015] This section is provided to introduce certain aspects of the present disclosure in a simplified form that are further described below in the detailed description. This summary is not intended to identify the key features or the scope of the claimed subject matter.
[0016] According to an aspect of the present disclosure, a housing arrangement for a radio unit, the housing arrangement adapted to dissipate heat from the radio unit is disclosed. The housing arrangement includes: a base member defining a base surface having a first longitudinal section, a second longitudinal section, and an intermediate longitudinal section therebetween. The housing arrangement further includes a first array of fins extending laterally from the first longitudinal section of the base surface. The housing arrangement further includes a second array of fins extending laterally from the second longitudinal section on the base surface of the base member, wherein the first array of fins forms a predetermined angle with respect to a bottom edge of the base member, while the second array of fins is in a laterally inverted orientation with respect to the first array set of fins.
[0017] In an exemplary aspect of the present disclosure, the base surface is substantially rectangular in shape.

[0018] In an exemplary aspect of the present disclosure, the first array of fins and the second array of fins are arranged, to route air received therein towards the intermediate longitudinal section to be vent therefrom in a vertical direction.
[0019] In an exemplary aspect of the present disclosure, the base surface further defines a first horizontal section, a second horizontal section, and an intermediate horizontal section, each including at least a portion of the first, intermediate, and second longitudinal sections.
[0020] In an exemplary aspect of the present disclosure, the first array of fins comprises a first set of fins and a second set of fins extending laterally from the first horizontal section and the second horizontal section, respectively, while the second array of fins comprises a third set of fins and a fourth set of fins from the first horizontal section and the second horizontal section, respectively.
[0021] In an exemplary aspect of the present disclosure, the base member defines an inner surface including: at least an RF holding section for receiving RF unit therein; and a baseband holding section for receiving baseband unit therein, such that the RF holding section is in juxtaposition with the first and third set of fins of the first and second array of fins, respectively, and the baseband holding section is in juxtaposition with the second and fourth set of fins of first and second array of fins, respectively.
[0022] In an exemplary aspect of the present disclosure, the intermediate horizontal section of the base surface is adapted to thermally insulate the RF holding section of the base member from the baseband section of the base member.
[0023] In an exemplary aspect of the present disclosure, at least one heat pipe to evenly distribute heat emitted from each of the receiving RF unit and the receiving baseband unit.

[0024] In an exemplary aspect of the present disclosure, the predetermined angle is in a range of 30 degree to 60 degree.
[0025] In an exemplary aspect of the present disclosure, a radio unit comprising: a housing arrangement including a base member and a top member, defining a hollow region therebetween; an RF unit; and a baseband unit, wherein each of the RF unit and the baseband unit are housed and supported within the hollow region of the housing arrangement, such that the housing arrangement is adapted to facilitate even distribution of heat emitted from each of the RF unit and the baseband unit, therethrough.
BRIEF DESCRIPTION OF DRAWINGS
[0026] The accompanying drawings, which are incorporated herein, and constitute a part of this disclosure, illustrate exemplary embodiments of the disclosed methods and systems in which like reference numerals refer to the same parts throughout the different drawings. Components in the drawings are not necessarily to scale, emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Some drawings may indicate the components using block diagrams and may not represent the internal circuitry of each component. It will be appreciated by those skilled in the art that disclosure of such drawings includes disclosure of electrical components, electronic components or circuitry commonly used to implement such components.
[0027] FIG. 1A illustrates a housing arrangement for a radio unit adapted to dissipate heat from the radio unit, in accordance with exemplary embodiments of the present disclosure.
[0028] FIG. 1B illustrates a housing arrangement of a prior art with vertical fins.

[0029] FIGs. 2A to 2C illustrate perspective views of a housing arrangement for a radio unit adapted to dissipate heat from the radio unit, in accordance with an embodiment of the present disclosure. 5
[0030] FIGs. 3A to 3C illustrate front and side views of a housing arrangement for a radio unit adapted to dissipate heat from the radio unit, in accordance with an embodiment of the present disclosure.
10 [0031] FIGs. 4A to 4B illustrate top and bottom views of a housing arrangement
for a radio unit adapted to dissipate heat from the radio unit, in accordance with an embodiment of the present disclosure.
[0032] FIG. 5 illustrates an exemplary example of Heat Pipe of a housing
15 arrangement for a radio unit adapted to dissipate heat from the radio unit, in
accordance with exemplary embodiments of the present disclosure.
[0033] FIG. 6A illustrates an exemplary simulated Air temperature results on a
housing of the baseband holding section in Vertical Air flow movement, in
20 accordance with exemplary embodiments of the present disclosure.
[0034] FIG. 6B illustrates an exemplary Simulated Air temperature results on a housing of the baseband holding section in Vertical Air flow movement for a prior art. 25
[0035] FIG. 7A illustrates an exemplary simulated Air temperature results on a housing of the RF holding section in Vertical Air flow movement, in accordance with exemplary embodiments of the present disclosure.
8

[0036] FIG. 7B illustrates an exemplary Simulated Air temperature results on a housing of the RF holding section in Vertical Air flow movement for a prior art.
[0037] The foregoing shall be more apparent from the following more detailed
5 description of the disclosure.
DETAILED DESCRIPTION
[0038] In the following description, for the purposes of explanation, various
10 specific details are set forth in order to provide a thorough understanding of
embodiments of the present disclosure. It will be apparent, however, that
embodiments of the present disclosure may be practiced without these specific
details. Several features described hereafter can each be used independently of one
another or with any combination of other features. An individual feature may not
15 address any of the problems discussed above or might address only some of the
problems discussed above. Some of the problems discussed above might not be
fully addressed by any of the features described herein. Example embodiments of
the present disclosure are described below, as illustrated in various drawings in
which like reference numerals refer to the same parts throughout the different
20 drawings.
[0039] The ensuing description provides exemplary embodiments only, and is not
intended to limit the scope, applicability, or configuration of the disclosure. Rather,
the ensuing description of the exemplary embodiments will provide those skilled in
25 the art with an enabling description for implementing an exemplary embodiment.
It should be understood that various changes may be made in the function and arrangement of elements without departing from the spirit and scope of the disclosure as set forth.
9

[0040] It should be noted that the terms "mobile device", "user equipment", "user
device", “communication device”, “device” and similar terms are used
interchangeably for the purpose of describing the invention. These terms are not
intended to limit the scope of the invention or imply any specific functionality or
5 limitations on the described embodiments. The use of these terms is solely for
convenience and clarity of description. The invention is not limited to any particular type of device or equipment, and it should be understood that other equivalent terms or variations thereof may be used interchangeably without departing from the scope of the invention as defined herein.
10
[0041] Specific details are given in the following description to provide a thorough understanding of the embodiments. However, it will be understood by one of ordinary skill in the art that the embodiments may be practiced without these specific details. For example, circuits, systems, networks, processes, and other
15 components may be shown as components in block diagram form in order not to
obscure the embodiments in unnecessary detail. In other instances, well-known circuits, processes, algorithms, structures, and techniques may be shown without unnecessary detail in order to avoid obscuring the embodiments.
20 [0042] Also, it is noted that individual embodiments may be described as a process
which is depicted as a flowchart, a flow diagram, a data flow diagram, a structure diagram, or a block diagram. Although a flowchart may describe the operations as a sequential process, many of the operations can be performed in parallel or concurrently. In addition, the order of the operations may be re-arranged. A process
25 is terminated when its operations are completed but could have additional steps not
included in a figure.
[0043] The word “exemplary” and/or “demonstrative” is used herein to mean
serving as an example, instance, or illustration. For the avoidance of doubt, the
30 subject matter disclosed herein is not limited by such examples. In addition, any
10

aspect or design described herein as “exemplary” and/or “demonstrative” is not
necessarily to be construed as preferred or advantageous over other aspects or
designs, nor is it meant to preclude equivalent exemplary structures and techniques
known to those of ordinary skill in the art. Furthermore, to the extent that the terms
5 “includes,” “has,” “contains,” and other similar words are used in either the detailed
description or the claims, such terms are intended to be inclusive—in a manner similar to the term “comprising” as an open transition word—without precluding any additional or other elements.
10 [0044] As used herein, an “electronic device”, or “portable electronic device”, or
“user device” or “communication device” or “user equipment” or “device” refers to any electrical, electronic, electromechanical, and computing device. The user device is capable of receiving and/or transmitting one or parameters, performing function/s, communicating with other user devices and transmitting data to the
15 other user devices. The user equipment may have a processor, a display, a memory,
a battery, and an input-means such as a hard keypad and/or a soft keypad. The user equipment may be capable of operating on any radio access technology including but not limited to IP-enabled communication, Zig Bee, Bluetooth, Bluetooth Low Energy, Near Field Communication, Z-Wave, Wi-Fi, Wi-Fi direct, etc. For
20 instance, the user equipment may include, but not limited to, a mobile phone,
smartphone, virtual reality (VR) devices, augmented reality (AR) devices, laptop, a general-purpose computer, desktop, personal digital assistant, tablet computer, mainframe computer, or any other device as may be obvious to a person skilled in the art for implementation of the features of the present disclosure.
25
[0045] Further, the user device may also comprise a “processor” or “processing unit” includes processing unit, wherein processor refers to any logic circuitry for processing instructions. The processor may be a general-purpose processor, a special purpose processor, a conventional processor, a digital signal processor, a
30 plurality of microprocessors, one or more microprocessors in association with a
11

DSP core, a controller, a microcontroller, Application Specific Integrated Circuits,
Field Programmable Gate Array circuits, any other type of integrated circuits, etc.
The processor may perform signal coding data processing, input/output processing,
and/or any other functionality that enables the working of the system according to
5 the present disclosure. More specifically, the processor is a hardware processor.
[0046] As portable electronic devices and wireless technologies continue to improve and grow in popularity, the advancing wireless technologies for data transfer are also expected to evolve and replace the older generations of
10 technologies. In the field of wireless data communications, the dynamic
advancement of various generations of cellular technology are also seen. The development, in this respect, has been incremental in the order of second generation (2G), third generation (3G), fourth generation (4G), and now fifth generation (5G), and more such generations are expected to continue in the forthcoming time.
15
[0047] Radio Access Technology (RAT) refers to the technology used by mobile devices/ user equipment (UE) to connect to a cellular network. It refers to the specific protocol and standards that govern the way devices communicate with base stations, which are responsible for providing the wireless connection. Further, each
20 RAT has its own set of protocols and standards for communication, which define
the frequency bands, modulation techniques, and other parameters used for transmitting and receiving data. Examples of RATs include GSM (Global System for Mobile Communications), CDMA (Code Division Multiple Access), UMTS (Universal Mobile Telecommunications System), LTE (Long-Term Evolution),
25 and 5G. The choice of RAT depends on a variety of factors, including the network
infrastructure, the available spectrum, and the mobile device's/device's capabilities. Mobile devices often support multiple RATs, allowing them to connect to different types of networks and provide optimal performance based on the available network resources.
30
12

[0048] The term ‘housing arrangement’ refers to structure designed to encase or contain the components of a radio unit.
[0049] The term ‘Radio unit’ is a device capable of sending or receiving radio
5 signals.
[0050] The term ‘Base surface’ is the main body or frame of the housing arrangement.
10 [0051] The term ‘Longitudinal section’ is a portion of the base that extends
lengthwise.
[0052] The term ‘Array of fins’ is a group of thin, elongated protrusions designed to increase surface area for heat dissipation.
15
[0053] The term ‘Laterally inverted orientation’ is the second array of fins is oriented in the opposite direction to the first array. This means that the orientation of an object is flipped horizontally. The first and second modules are arranged in a laterally inverted orientation, ensuring symmetrical operation on either side of the
20 central axis.
[0054] The term ‘Integration’ is the act of combining or merging separate parts into a unified whole.
25 [0055] The term ‘Thermally insulate’ used to prevent or reduce the transfer of heat.
[0056] The term RF (Radio Frequency) unit is a component of the radio unit responsible for transmitting or receiving radio signals.
13

[0057] The term ‘Baseband unit’ is a component of the radio unit responsible for processing signals before modulation or after demodulation.
[0058] The term ‘Juxtaposition’ is the act of placing two or more things close
5 together for comparison or contrast.
[0059] The term ‘Heat pipe’ is a heat transfer device that transports heat from one location to another through the evaporation and condensation of a working fluid.
10 [0060] Buoyant forces: The upward force exerted on an object immersed in or
floating on a fluid (in this case, air) due to the difference in density between the object and the fluid.
[0061] Thermal margins: The difference between the operating temperature of a
15 component and its maximum allowable temperature, indicating the degree of safety
or performance margin.
[0062] Thermal heat dissipation: The process of transferring heat away from a source to maintain a lower temperature. 20
[0063] Network processor: A specialized processor designed to handle network-related tasks, such as data packet routing and processing.
[0064] FPGA/ASIC: Field-Programmable Gate Array (FPGA) or Application-
25 Specific Integrated Circuit (ASIC), both of which are types of integrated circuits
used for custom digital circuitry.
[0065] Baseband transceiver: A device that combines both transmitter and receiver
functions for communication within a specific frequency band, typically used in
30 wireless communication systems.
14

[0066] As discussed in the background section, in the current existing solutions,
there are several problems associated with the thermal management of radio units
(RUs) used in 5G networks, especially in the low band frequency range such as 700
5 MHz. One of the primary issues is the inefficient heat dissipation from the
components of the radio unit, which can lead to overheating and reduced performance. The conventional straight fin designs used in heat sinks are not optimal for all airflow conditions, particularly in practical situations where the airflow direction can be uncertain due to environmental factors such as wind and
10 turbulence at high altitudes. Another problem is the lack of effective thermal
isolation between different sections of the radio unit, such as the RF board and the baseband board. This can result in heat transfer from one section to another, further exacerbating thermal management issues. Additionally, the use of straight fins in conventional heat sinks does not provide the best thermal margins, as they are not
15 optimized for maximum heat transfer under varying airflow conditions.
Furthermore, the existing solutions often involve bulky and heavy heat sinks, which can make the radio units difficult to install and manage, especially in remote or challenging locations. This can also limit the deployment options for the radio units and increase the overall operational costs.
20
[0067] To overcome these and other inherent problems in the art, the present disclosure proposes a solution of an advanced thermal management system for Low Band 700MHz Radio Units (RUs). The invention introduces an optimized heat sink design that significantly deviates from traditional straight fin structures. By
25 implementing inverted-V shaped fins (these are fins that are shaped like an upside-
down letter "V". This includes a plurality of inverted-V shaped fins positioned on the outer surface to enhance aerodynamic stability), the design adapts to the unpredictable nature of airflow, particularly at heights where wind conditions are variable and often turbulent. This new fin shape ensures efficient heat transfer
30 regardless of air direction, providing a solution to the previously unaddressed issue
15

of airflow uncertainty. Moreover, the invention incorporates horizontal and vertical
splits within the heat sink. These splits serve two crucial functions: they disengage
the heat transfer between the RF board and the Baseband Board—critical for
preventing overheating—and facilitate the escape of hot air via buoyancy forces.
5 Such a feature directly addresses the problem of thermal crossover between
components, a common issue in conventional designs that can lead to system inefficiencies. The heat sink's fin angles, thickness, and pitch are meticulously optimized to ensure the best thermal margins, thus enabling maximum heat transfer and effective thermal dissipation. This optimization contributes to a lighter product,
10 aiding in the ease of installation and maintenance. To target the problem of localized
heating, especially around high-power components such as Network processors and FPGA/ASICs, the invention integrates advanced heat pipe technology. These heat pipes are renowned for their superior thermal conductivity and are strategically embedded within the heat sink to spread heat uniformly. This feature not only
15 lowers the risk of hotspots but also reduces the overall volume and weight of the
unit, thereby tackling the issues of bulky heat sinks that hamper installation and transportation.
[0068] It would be appreciated by the person skilled in the art that the combined
20 effect of these innovations results in a thermally efficient mechanical housing that
not only maintains the operational temperatures within safe limits but also contributes to a reduction in operational costs due to its low-weight, compact form factor, and improved power efficiency.
25 [0069] Hereinafter, exemplary embodiments of the present disclosure will be
described with reference to the accompanying drawings.
[0070] Referring to FIG. 1A, FIG. 1A illustrates a housing arrangement [100A] for
a radio unit adapted to dissipate heat from the radio unit, in accordance with
30 exemplary embodiments of the present disclosure. The housing arrangement
16

[100A] is adapted to dissipate heat from the radio unit. The housing arrangement
includes a base member defining a base surface having a first longitudinal section
[102], a second longitudinal section [104], and an intermediate longitudinal section
[106] therebetween. The base surface is a substantially rectangular in shape. The
5 base further defines a first horizontal section [110A], a second horizontal section
[110B], and an intermediate horizontal section [110], each including at least a portion of the first, intermediate, and second longitudinal sections.
[0071] The first array of fins and the second array of fins are arranged, to route air
10 received therein towards the intermediate longitudinal section [106] to be vent
therefrom in a vertical direction. The first array of fins and the second array of fins are strategically arranged to direct the incoming air towards the intermediate longitudinal section [106]. The proposed first array of fins and the second array of fins ensures that the air is channelled efficiently through the fins, leveraging their
15 orientation to enhance airflow. Once the air reaches the intermediate longitudinal
section, it is vented out in a vertical direction. It would be appreciated by the person skilled in the art that the configuration not only optimizes the cooling process by promoting effective heat dissipation but also maintains a streamlined air circulation pattern, contributing to the overall thermal management of the radio unit.
20
[0072] Further, the housing arrangement [100A] includes a first array [102A] of fins extending laterally from the first longitudinal section [102] on the base surface of the base member. The housing arrangement further comprises a second array [104A] of fins extending laterally from the second longitudinal section [104] on the
25 base surface of the base member. The first array [102A] of fins forms a
predetermined angle with respect to an edge of the base surface, while the second array [104A] of fins is in laterally inverted orientation with respect to the first set of fins.
17

[0073] The housing arrangement for a radio unit is generally described with a
substantially rectangular or rectangular shaped base surface. However, it would be
apparent to the person skilled in the art that the invention is not limited to this
specific shape. Other shapes of the base surface may also be applicable and can be
5 utilized without deviating from the core principles and intended functionality of the
invention. This includes, but is not limited to, alternative geometric configurations that still enable efficient heat dissipation and structural integrity.
[0074] The predetermined angle is in a range of 30 degree to 60 degree. Further,
10 the first array [102A] of fins comprises a first set [114] of fins and a second set
[116] of fins extending laterally from the first horizontal section [110A] and the
second horizontal section [110B], respectively, while the second array [104A] of
fins comprises a third set [112] of fins and a fourth set [108] of fins extending
laterally from the first horizontal section [110A] and the second horizontal section
15 [110B], respectively. The housing arrangement [100A] designed to encase a radio
unit while efficiently dissipating heat generated by its components. The housing
arrangement [100A] consists of a rectangular base surface with three longitudinal
sections. Two arrays of fins extend laterally from the base surface, forming a
predetermined angle and inverted orientation to route hot air. The design ensures
20 effective heat dissipation to prevent overheating of the radio unit.
[0075] In an exemplary aspect of the present disclosure, base surface of the housing arrangement [100A] defines a first horizontal section [110A], a second horizontal section [110B], and an intermediate horizontal section [110] therebetween. Further,
25 the first set [114] of fins of the first array [102A] of fins and the third set [112] of
fins of the second array [104A] of fins are horizontally arranged with respect to the first horizontal section [110A] of the base surface, while the second set [116] of fins of the first array [102A] of fins and the fourth set [108] of fins of the second array [104A] of fins are horizontally arranged with respect to the second horizontal
30 section [110B] of the base surface, such that the intermediate horizontal section
18

[110] is adapted to horizontally route hot air from the radio unit. The housing arrangement's [100A] design facilitates horizontal routing of hot air, ensuring uniform heat dissipation across the radio unit's components.
5 [0076] In an exemplary aspect of the present disclosure, the base member of the
housing arrangement [100A] defines an inner surface including at least an RF
holding section for receiving RF unit therein, and a baseband holding section for
receiving baseband unit therein, such that the RF holding section is in juxtaposition
with the first set [114] and third set [112] of fins of the first array [102A] and second
10 array [104A] of fins, respectively, and the baseband holding section is in
juxtaposition with the second set [116] and fourth set [108] of fins of first array [102A] and second array [104A] of fins, respectively.
[0077] The housing arrangement's [100A] functionality, which includes sections
15 for housing the RF unit and baseband unit, ensuring efficient heat dissipation and
thermal management. The RF holding section is positioned in juxtaposition to the
first set [114] and third set [112] of fins of the first array [102A] and second array
[104A] of fins, respectively. The RF holding section is placed directly adjacent to
these sets of fins, allowing for optimal thermal contact and heat dissipation. In this
20 arrangement, the first set [114] and third set [112] of fins of the first array [102A]
and second array [104A] of fins are able to efficiently draw heat away from the RF
unit, ensuring that it operates within safe temperature limits. By placing the RF
holding section adjacent to the first set [114] and third set [112] of fins of the first
array [102A] and second array [104A] of fins ensures that heat generated by the RF
25 components is effectively transferred to the fins and then dissipated into the
surrounding air, promoting efficient cooling and enhancing the overall thermal
efficiency of the housing arrangement.
[0078] For example, the RF holding section is in juxtaposition to the power supply
30 module, facilitating efficient signal transmission.
19

[0079] In an aspect, the intermediate horizontal section [110] of the base surface is adapted to thermally insulate the RF holding section of the base member from the baseband section of the base member. 5
[0080] In an aspect, a vertical split is also introduced to allow the hot air to pass that is caused by the buoyant forces from the heated heat sink surface. The angle of Inverted-V fins may be optimized to allow maximum heat transfer from the components of both boards, and thereby may give the best thermal margins.
10
[0081] In an exemplary aspect of the present disclosure, the fin thickness and pitch in heat sink for proper thermal heat dissipation by reducing the product weight. Also, implementation of advanced heat pipe technology to address localized hot spots generated by the Network processor, FPGA/ASIC used for baseband
15 transceiver. The novel approach optimizes the overall cost and reduces the weight
and volume of the product. Thereby, localized air temperature near the processors and ASICs in the baseband board may be reduced using this innovative design and keeping the air temperature from the RF board within the thermal limit.
20 [0082] In an exemplary aspect of the present disclosure, a radio unit comprising a
housing arrangement [100A] including a base member and a top member, defining a hollow region therebetween. The radio unit further comprising an RF unit and a baseband unit. In an exemplary aspect, each of the RF unit and the baseband unit are housed and supported within the hollow region of the housing arrangement
25 [100A], such that the housing arrangement [100A] is adapted to facilitate even
distribution of heat emitted from each of the RF unit and the baseband unit, therethrough.
[0083] Further, the radio unit comprises at least one heat pipe positioned inside the
30 housing arrangement [100A], wherein the at least one heat pipe is adapted to evenly
20

distribute heat emitted from each of the RF unit and the baseband unit. The integration of heat pipes within the housing arrangement [100A] to ensure even distribution of heat emitted by the RF and baseband units.
5 [0084] The housing arrangement [100A] for the radio unit is adapted to dissipate
heat from the radio unit, the housing arrangement [100A] includes a base surface having a first longitudinal section [102], a second longitudinal section [104], and an intermediate longitudinal section [106] therebetween, wherein the base surface is a substantially rectangular in shape.
10
[0085] Further, the radio unit includes a first array [102A] of fins extending laterally from the first longitudinal section [102] of the base surface of the base member and a second array [104A] of fins extending laterally from the second longitudinal section [104] of the base surface of the base member. The first array
15 [102A] of fins forms a predetermined angle with respect to an edge of the base
surface, while the second array [104A] of fins is in laterally inverted orientation with respect to the first set of fins. In an exemplary aspect, the first array of fins and the second array of fins are arranged, to route air received therein towards the intermediate longitudinal section [106] to be vent therefrom in a vertical direction.
20
[0086] The predetermined angle is in a range of 30 degree to 60 degree. Further, the first array [102A] of fins comprises a first set [114] of fins and a second set [116] of fins arranged along a length of the first longitudinal section [102], while the second array [104A] of fins comprises a third set [112] of fins and a fourth set
25 [108] of fins arranged along a length of the second longitudinal section [104].
[0087] In an exemplary aspect of the present disclosure, base surface of the radio
unit defines a first horizontal section [110A], a second horizontal section [110B],
and an intermediate horizontal section [110] therebetween. Further, the first set
30 [114] of fins of the first array [102A] of fins and the third set [112] of fins of the
21

second array [104A] of fins are horizontally arranged with respect to the first
horizontal section [110A] of the base surface, while the second set [116] of fins of
the first array [102A] of fins and the fourth set [108] of fins of the second array
[104A] of fins are horizontally arranged with respect to the second horizontal
5 section [110B] of the base surface, such that the intermediate horizontal section
[110] is adapted to horizontally route hot air from the radio unit. The housing arrangement's [100A] design facilitates horizontal routing of hot air, ensuring uniform heat dissipation across the radio unit's components.
10 [0088] In an exemplary aspect of the present disclosure, the base member of radio
unit includes at least an RF holding section for receiving RF unit therein and a baseband holding section for receiving baseband unit therein, such that the RF holding section is in juxtaposition with the first set [114] and third set [112] of fins of the first array [102A] and second array [104A] of fins, respectively, and the
15 baseband holding section is in juxtaposition with the second set [116] and fourth
set [108] of fins of first array [102A] and second array [104A] of fins, respectively. The housing arrangement's [100A] functionality, which includes sections for housing the RF unit and baseband unit, ensuring efficient heat dissipation and thermal management.
20
[0089] In an exemplary aspect of the present disclosure, in radio unit, the intermediate horizontal section [110] of the base surface is adapted to thermally insulate the RF holding section of the base member from the baseband section of the base member. Further, the housing arrangement [100A] includes at least one
25 heat pipe to evenly distribute heat emitted from each of the receiving RF unit and
the receiving baseband unit. The intermediate horizontal section of the housing arrangement [100A] provides thermal insulation between the RF and baseband sections, preventing heat transfer between them and the inclusion of heat pipes within the housing arrangement [100A] to evenly distribute heat emitted by the RF
30 and baseband units, enhancing overall thermal management.
22

[0090] In an aspect, a vertical split is also introduced to allow the hot air to pass
that is caused by the buoyant forces from the heated heat sink surface. The angle of
Inverted-V fins may be optimized to allow maximum heat transfer from the
5 components of both boards, and thereby may give the best thermal margins.
[0091] In an exemplary aspect of the present disclosure, the fin thickness and pitch in heat sink for proper thermal heat dissipation by reducing the product weight. Also, implementation of advanced heat pipe technology to address localized hot
10 spots generated by the Network processor, FPGA/ASIC used for baseband
transceiver. The novel approach optimizes the overall cost and reduces the weight and volume of the product. Thereby, localized air temperature near the processors and ASICs in the baseband board may be reduced using this innovative design and keeping the air temperature from the RF board within the thermal limit.
15
[0092] Additionally, the fin pitch is at least 13 mm and fin thickness is at least 1.5mm but the present disclosure is not limited thereto. The fin tip may also be optimized to enhance flow and heat transfer. Not only the above-mentioned facts, but the component placement also plays a very significant role in the heat transfer
20 effectiveness through fin design. Since in the radio unit (such as RU700 product)
few heat dissipating components (power section) are on the vertical edge, thereby the Inverted-V fin design increased the heat transfer rate enabling lower temperature airstream to enter and travel the fin passages when air comes at an angle. Thus, the total product’s airflow resistance is reduced irrespective of air input
25 direction and Inverted-V fin design was opted over conventional straight fins for
radio unit (such as RU700 product).
[0093] FIG. 1B illustrates a prior art housing arrangement [100B] with vertical fins
(such as fins are aligned straight). As illustrated, the prior art housing arrangement
30 [104B] includes vertical fins.
23

[0094] FIGs. 2A to 2C illustrate perspective views of a housing arrangement [100A] for a radio unit adapted to dissipate heat from the radio unit, in accordance with an embodiment of the present disclosure.
5 [0095] FIG. 2A discloses a bottom perspective, showcasing the base of the housing
arrangement [100A] with its connectors and interfaces. This base likely serves as the foundation to which other components are attached and also might include conduits for cabling and air flow.
10 [0096] FIG. 2B discloses a top perspective view that highlights the housing’s lid or
cover, which is removed to reveal the interior where the heat-generating components would be housed. The lid or cover may act as an additional layer of protection against environmental elements while also contributing to heat dissipation.
15
[0097] FIG. 2C illustrates the housing from a side perspective with the lid or cover attached. The fins are key to the housing arrangement’s [100A] ability to dissipate heat, increasing the surface area through which heat can be transferred to the surrounding air.
20
[0098] FIGs. 3A to 3C illustrate front and side views of a housing arrangement [100A] for a radio unit adapted to dissipate heat from the radio unit, in accordance with an embodiment of the present disclosure.
25 [0099] FIG. 3A discloses the front view of the housing arrangement [100A],
providing a clear representation of the fin arrangement on the heat sink. The varying angles and lengths of the fins suggest that they have been meticulously configured to guide air flow and enhance heat dissipation, potentially corresponding to the unique inverted-V shape described in the patent.
30
24

[0100] FIG. 3B and FIG. 3C discloses side views from two different angles, giving
us a look at the housing's profile and depth. The perspectives reveal the thickness
of the fins and their relative orientation, which contributes to the overall
effectiveness of the heat sink. The images indicate the fins’ tiered or staggered
5 arrangement, which may aid in managing airflow and ensuring that heat is carried
away from the heat-generating components within the housing.
[0101] FIGs. 4A to 4B illustrate top and bottom views of a housing arrangement
[100A] for a radio unit adapted to dissipate heat from the radio unit, in accordance
10 with an embodiment of the present disclosure.
[0102] FIG. 4A discloses a view from above the housing, showcasing the interface
panel where various connections are made. Elements such as power supply inputs,
optical interfaces, and cooling fans for active thermal management are visible in the
15 FIG. 4A.
[0103] FIG. 4B discloses the bottom perspective of the same housing, highlighting
the extended fins that run along the underside of the unit. This view underscores the
extensive surface area provided by the fins, which is essential for effective passive
20 cooling.
[0104] Referring to FIG. 5, FIG. 5 illustrates an exemplary example of Heat Pipe
of a housing arrangement [100A] for a radio unit adapted to dissipate heat from the
radio unit, in accordance with exemplary embodiments of the present disclosure.
25 The Low Band RU incorporates highly efficient heat pipes with superior thermal
conductivity to effectively distribute localized heat of Network processor and field-programmable gate array (FPGA)/ application-specific integrated circuit (ASIC) across the heat sink. By integrating heat pipes into the fin heat sink, the overall product size and weight are reduced, resulting in a compact and low weight solution
25

within 20kg. The compact design not only saves space but also ensures optimal power efficiency.
[0105] The heat pipes are arranged to spread across various parts of the heat sink,
5 which would presumably be in contact with these heat-generating components. The
goal of this design is to efficiently transfer heat from these components to the heat sink, from where it can be dissipated into the environment, thus preventing the buildup of excess heat within the unit. By utilizing heat pipes with superior thermal conductivity, the design effectively spreads localized heat, allowing for a more
10 uniform temperature distribution across the heat sink. This helps to maintain the
electronic components at optimal temperatures, enhancing performance and longevity. The integration of heat pipes into the heat sink design is said to contribute to a reduction in the overall size and weight of the product, targeting a weight below 20kg. Such a lightweight and compact solution not only facilitates easier
15 installation and handling but also potentially improves the power efficiency of the
unit.
[0106] In an exemplary aspect of the present disclosure, in housing arrangement [100A], the intermediate horizontal section [110] of the base surface is adapted to
20 thermally insulate the RF holding section of the base member from the baseband
section of the base member. Further, the housing arrangement [100A] includes at least one heat pipe to evenly distribute heat emitted from each of the receiving RF unit and the receiving baseband unit. The intermediate horizontal section [110] of the housing arrangement [100A] provides thermal insulation between the RF and
25 baseband sections, preventing heat transfer between them and the inclusion of heat
pipes within the housing arrangement [100A] to evenly distribute heat emitted by the RF and baseband units, enhancing overall thermal management.
[0107] FIG. 6A illustrates the simulated air temperature results on the innovative
30 housing design for the baseband holding section when subjected to vertical airflow.
26

The colour gradient on the simulation indicates the temperature distribution across the housing, with red representing higher temperatures and blue representing lower temperatures. The optimized design, presumably with inverted-V shaped fins and integrated heat pipes, shows how this novel configuration manages heat dissipation. 5
[0108] It is particularly noteworthy that the hottest areas are located at the centre
where the heat sources (like the Network processor and FPGA/ASIC) are likely to
be situated, with the heat being drawn away efficiently towards the edges,
illustrated by the transition from red to yellow and green colours. The housing
10 arrangement [100A] illustrates better heat distribution.
[0109] FIG. 6B, contrastingly, illustrate a conventional design from prior art, with
traditional straight-fin heat sinks, under the same vertical airflow conditions. As
illustrated, shows a less efficient heat distribution, potentially with more red areas
15 indicating higher temperatures not being dissipated as effectively, illustrating the
limitations of the prior art.
[0110] In comparison, the novel housing design detailed in FIG. 6A is aimed at solving the problems associated with the prior art by providing more effective heat
20 distribution and dissipation. This is achieved by a combination of the optimized fin
design that works under various airflow conditions, the separation of heat zones via horizontal splits, and the use of heat pipes to manage localized hotspots. These design improvements lead to lower localized temperatures near critical components, maintaining the air temperature within operational limits and
25 enhancing the overall thermal performance of the radio unit.
[0111] The images FIG. 7A and FIG. 7B present comparative thermal simulations of a radio unit housing, specifically focusing on the RF holding section and its thermal management in response to vertical air flow. 30
27

[0112] FIG. 7A discloses the thermal performance of the housing arrangement
[100A] of the radio unit. The optimized inverted-V fin design of the housing
arrangement [100A]. The colour gradients represent temperature variations across
the housing, with the cooler areas shown in blue and the warmer areas in red. This
5 suggests that the novel design effectively channels the heat away from critical
components, maintaining a more uniform and cooler operating environment for the RF unit. The housing arrangement [100A] shows better heat distribution.
[0113] FIG. 7B probably shows the thermal performance of a conventional RF
10 holding section housing design under the same vertical airflow conditions. While
the actual image is not displayed, it can be surmised that the colour gradient would indicate a less efficient heat distribution, perhaps with a larger area of red indicating higher temperatures, reflecting the less effective heat dissipation capabilities of traditional straight-fin heat sinks. 15
[0114] It would be appreciated by the person skilled in the art that the improved
design of the housing arrangement [100A] detailed in FIG. 7A is intended to address
the specific challenges presented by the high-power components used in 5G NR
Low Band Radio Units. The use of advanced heat pipes and optimized fin shapes
20 contributes to a cooler operating temperature, which is crucial for the reliability and
performance of the RF components, especially given the stringent thermal management requirements for 5G technologies.
[0115] As is evident from the above, the present disclosure provides a technically
25 advanced solution that ensures innovative heat sink fin design that is different from
conventional straight fin design. The complete product airflow resistance may be
decreased regardless of air input direction. Also, that enables the maximum transfer
of heat with its excellent effectiveness. Further, it has low power consumption and
is thermally handled properly by the IP65 ingress protected Mechanical housing
30 and has low weight and compact form factor.
28

[0116] Further, in accordance with the present disclosure, it is to be acknowledged that the functionality described for the various components/units can be implemented interchangeably. While specific embodiments may disclose a particular functionality of these units for clarity, it is recognized that various configurations and combinations thereof are within the scope of the disclosure. The functionality of specific units, as disclosed in the disclosure, should not be construed as limiting the scope of the present disclosure. Consequently, alternative arrangements and substitutions of units, provided they achieve the intended functionality described herein, are considered to be encompassed within the scope of the present disclosure.
[0117] While considerable emphasis has been placed herein on the disclosed embodiments, it will be appreciated that many embodiments can be made and that many changes can be made to the embodiments without departing from the principles of the present disclosure. These and other changes in the embodiments of the present disclosure will be apparent to those skilled in the art, whereby it is to be understood that the foregoing descriptive matter to be implemented is illustrative and non-limiting.

We Claim:
1. A housing arrangement [100A] for a radio unit, the housing arrangement
[100A] adapted to dissipate heat from the radio unit, the housing arrangement
[100A] comprising:
a base member defining a base surface having a first longitudinal section [102], a second longitudinal section [104], and an intermediate longitudinal section [106] there between;
a first array [102A] of fins extending laterally from the first longitudinal section [102] on the base surface of the base member; and
a second array [104A] of fins extending laterally from the second longitudinal section [104] on the base surface of the base member,
wherein the first array [102A] of fins forms a predetermined angle with respect to a bottom edge of the base member, while the second array [104A] of fins is in a laterally inverted orientation with respect to the first array [102A] of fins.
2. The housing arrangement [100A] as claimed in claim 1, wherein the base surface is substantially rectangular in shape.
3. The housing arrangement [100A] as claimed in claim 1, the first array of fins and the second array of fins are arranged, to route air received therein towards the intermediate longitudinal section [106] to be vent therefrom in a vertical direction.
4. The housing arrangement [100A] as claimed in claim 1, wherein the base surface further defines a first horizontal section [110A], a second horizontal section [110B], and an intermediate horizontal section [110], each including at least a portion of the first, intermediate, and second longitudinal sections.

5. The housing arrangement [100A] as claimed in claims 1 or 4, wherein the first array [102A] of fins comprises a first set [114] of fins and a second set [116] of fins extending laterally from the first horizontal section [110A] and the second horizontal section [110B], respectively, while the second array [104A] of fins comprises a third set [112] of fins and a fourth set [108] of fins extending laterally from the first horizontal section [110A] and the second horizontal section [110B], respectively.
6. The housing arrangement [100A] as claimed in claims 1 to 5, wherein the base member defines an inner surface including:

- at least an RF holding section for receiving RF unit therein; and
- a baseband holding section for receiving baseband unit therein,
such that the RF holding section is in juxtaposition with the first set [114] and
third set [112] of fins of the first array [102A] and second array [104A] of fins,
respectively, and
the baseband holding section is in juxtaposition with the second set [116] and
fourth set [108] of fins of first array[102A] and second array [104A] of fins,
respectively.
7. The housing arrangement [100A] as claimed in claims 1, 4 or 6, wherein the intermediate horizontal section [110] of the base surface is adapted to thermally insulate the RF holding section of the base member from the baseband holding section of the base member.
8. The housing arrangement [100A] as claimed in claim 6, further comprises at least one heat pipe, to evenly distribute heat emitted from each of the receiving RF unit and the receiving baseband unit.

9. The housing arrangement [100A] as claimed in claim 1, wherein the predetermined angle is in a range of 30 degree to 60 degree.
10. A radio unit comprising:

- a housing arrangement [100A] including a base member and a top member, defining a hollow region there between;
- an RF unit; and
- a baseband unit,
wherein each of the RF unit and the baseband unit are housed and supported within the hollow region of the housing arrangement [100A], such that the housing arrangement [100A] is adapted to facilitate even distribution of heat emitted from each of the RF unit and the baseband unit, therethrough.
11. The radio unit as claimed in claim 10, comprises at least one heat pipe positioned inside the housing arrangement [100A], wherein the at least one heat pipe is adapted to evenly distribute heat emitted from each of the RF unit and the baseband unit.
12. The radio unit as claimed in claim 10, wherein the housing arrangement [100A] for the radio unit is adapted to dissipate heat from the radio unit, the housing arrangement [100A] comprising:

- the base member defining a base surface having a first longitudinal section [102], a second longitudinal section [104], and an intermediate longitudinal section [106] therebetween;
- a first array [102A] of fins extending laterally from the first longitudinal section [102] on the base surface of the base member; and
- a second array [104A] of fins extending laterally from the second longitudinal section [104] on the base surface of the base member,

wherein the first array [102A] of fins forms a predetermined angle with respect to a bottom edge of the base member, while the second array [104A] of fins is in laterally inverted orientation with respect to the first array [102A] of fins.
13. The radio unit as claimed in claim 12, wherein the base surface is a substantially rectangular in shape.
14. The radio unit as claimed in claim 12, the first array of fins and the second array of fins are arranged, to route air received therein towards the intermediate longitudinal section [106] to be vent therefrom in a vertical direction.
15. The radio unit as claimed in claim 12, wherein the base surface further defines a first horizontal section [110A], a second horizontal section [110B], and an intermediate horizontal section [110], each including at least a portion of the first, intermediate, and second longitudinal sections.
16. The radio unit as claimed in claims 12 or 15, wherein the first array [102A] of fins comprises a first set [114] of fins and a second set [116] of fins, extending laterally from the first horizontal section [110A] and the second horizontal section [110B], respectively, while the second array [104A] of fins comprises a third set [112] of fins and a fourth set [108] of fins from the first horizontal section [110a] and the second horizontal section [110a], respectively.
17. The radio unit as claimed in claims 12 to 16, wherein the base member defines an inner surface including:

- at least an RF holding section for receiving RF unit therein; and
- a baseband holding section for receiving baseband unit therein,
such that the RF holding section is in juxtaposition with the first set [114] and third set [112] of fins of the first array [102A] and second array [104A] of fins, respectively, and

the baseband holding section is in juxtaposition with the second set [116] and fourth set [108] of fins of first array [102A] and second array [104A] of fins, respectively.
18. The radio unit as claimed in claims 12, 15 or 16, wherein the intermediate horizontal section [110] of the base surface is adapted to thermally insulate the RF holding section of the base member from the baseband holding section of the base member.
19. The radio unit as claimed in claim 17, further comprises at least one heat pipe to evenly distribute heat emitted from each of the receiving RF unit and the receiving baseband unit.
20. The radio unit as claimed in claim 12, wherein the predetermined angle is in a range of 30 degree to 60 degree.