FORM 2
THE PATENTSACT 1970
39 OF 1970
&
THE PATENT RULES 2003
COMPLETE SPECIFICATION
(SEE SECTIONS 10 & RULE 13)
1. TITLE OF THE INVENTION
"AN INTEGRATED TELEMATICS AND INSTRUMENT CLUSTER DEVICE"
2. APPLICANTS (S)
(a) Name: Varroc Engineering Limited
(b) Nationality: Indian
(c) Address: L-4, Industrial Area,
Waluj MIDC, Aurangabad-431136, Maharashtra, India
3. PREAMBLE TO THE DESCRIPTION
COMPLETE SPECIFICATION
The following specification describes the invention.

AN INTEGRATED TELEMATICS AND INSTRUMENT CLUSTER DEVICE
TECHNOLOGICAL FIELD
[0001] The presently disclosed subject matter relates to instrument clusters of vehicles, and more particularly to a device that is to be installed at a vehicle and has an integrated telematics and instrument cluster.
BACKGROUND
[0002] With the ever-increasing consumer demand for advanced features in vehicle communication systems, automobile manufacturers continue to provide enhanced functions in vehicles beyond transportation. For instance, a large number of vehicles are provided with entertainment, navigation assistance, and other non-traditional automotive functions. As an example, telematics systems provide the functions associated with wireless voice and data communications and a global positioning system (GPS). In a conventional vehicular telematics system, a GPS receiver uses a GPS antenna to track GPS satellite signals to ascertain the location of the vehicle. Further, vehicles also include instrument clusters along with such telematics systems.
[0003] In the current two-wheeler automotive market, instrument clusters and telematics systems/control units are separate parts in the vehicle. Furthermore, in case of modern digital instruments clusters that employ display technologies like thin film transistor (TFT) liquid-crystal display (LCD), majority of the graphics processing units are placed outside of the instrument cluster. Therefore, communication between 1) telematics and the instrument cluster to display relevant information like maps and location, other notifications, and 2) the display module and graphics processing unit require wired connections that adds cost in terms of components and assembly process.

[0004] Accordingly, there is a need to provide a system and method to overcome at least the aforementioned issues.
SUMMARY
[0005] According to an embodiment, a device configured to be installed at a vehicle is described. The device comprises a common assembly for a telematics unit and an instrument cluster. The common assembly includes a thin film transistor (TFT) display unit ("a display unit") configured to display a plurality of parameters associated with vehicle. The plurality of parameters comprising a first set of parameters associated with the instrument cluster and a second set of parameters associated with the telematics unit. The common assembly further comprises a first printed circuit board (PCB) communicatively coupled to the TFT display unit, the first PCB being configured to generate the first set of parameters associated with the instrument cluster. The common assembly further comprises a second PCB assembly communicatively coupled to the first PCB, the second PCB being configured to generate the second set of parameters associated with the telematics unit. The first PCB is disposed closer to the TFT display unit than the second PCB. A component count value of the second PCB is lesser than a component count value of the first PCB. In an embodiment, the second PCB (210) is disposed to at least partially overlap the first PCB (218), thereby providing an overlapping portion and a non-overlapping portion associated with the first PCB (208).
[0006] In an embodiment, the common assembly comprises one or more heated components associated with the first PCB and the second PCB. The common assembly comprises a heat sink coupled to the one or more heated components, the heat sink being configured to absorb heat from the one or more heated components.

[0007] In an embodiment, the common assembly further comprises a thermal interface material disposed between the one or more heated components and the heat sink. The thermal interface material is configured to facilitate heat transfer from the one or more heated components to the heat sink. In an embodiment, the thermal interface material is disposed to align with the non-overlapping portion associated with the first PCB.
[0008] In an embodiment, the common assembly comprises an Electromagnetic Interference-shield sheet disposed between the first PCB and the second PCB. The Electromagnetic Interference-shield sheet is configured to block Electromagnetic Interference between the first PCB and the second PCB and wherein the electromagnetic interference shield sheet is disposed to at least partially overlap the first PCB.
[0009] In an embodiment, the common assembly comprises a top cover and a bottom cover coupled to the top cover, wherein the top cover and the bottom cover, when coupled, enclose the first PCB and the second PCB.
[0010] In an embodiment, the heat sink is integrally molded with the bottom cover. The heat sink is coupled to the first PCB and the second PCB.
[0011] In an embodiment, the common assembly comprises a first antenna and a second antenna configured to communicate with a remote server. Each of the first antenna and the second antenna being disposed on the bottom cover.
[0012] In an embodiment, the TFT display unit is formed of metal, the bottom cover is formed of plastic, and each of the first antenna and the second antenna is disposed offset from the TFT display unit (104) such that the first antenna (220) is sky facing without any metal obstruction.
BRIEF DESCRIPTION OF DRAWINGS

[0013] In order to better understand the subject matter that is disclosed herein and to exemplify how it may be carried out in practice, embodiments will now be described, by way of non-limiting example only, with reference to the accompanying drawings, in which:
[0014] FIG. 1A illustrates a perspective view of the device, in accordance with an example of the presently disclosed subject matter.
[0015] FIG. 1B illustrates a top view of the device, in accordance with an example of the presently disclosed subject matter.
[0016] FIG. 2A illustrates a cross-sectional view of the device, the cross-section being taken along the line A-A in FIGS. 1A-1B, in accordance with an example of the presently disclosed subject matter.
[0017] FIG. 2B illustrates a cross-sectional view of the device, the cross-section being taken along the line B-B in FIGS. 1A-1B, in accordance with an example of the presently disclosed subject matter.
[0018] FIGS. 3A-3B illustrate exploded view of the device, in accordance with an example of the presently disclosed subject matter.
[0019] FIG. 4 illustrates a close-up cross-sectional view of the area X in FIG. 2A, in accordance with an example of the presently disclosed subject matter.
[0020] FIG. 5 illustrates a close-up cross-sectional view of the area Y in FIG. 2A, in accordance with an example of the presently disclosed subject matter.
DETAILED DESCRIPTION

[0021] Reference now will be made in detail to various examples of the present disclosure, one or more examples of which are illustrated in the accompanying drawings. Each example is provided by way of explanation of the present disclosure, and not as a limitation of the present disclosure. In fact, it will be apparent to those skilled in the art that modifications and variations can be made to the subject matter disclosed herein without departing from the scope of the present disclosure. For instance, features illustrated or described as part of one example may be used with another example to yield a still further example.
[0022] Attention is directed to FIG. 1A and FIG. 1B which illustrates a device 100 configured to be installed at a vehicle, in accordance with an embodiment of the present disclosure. FIG. 1A illustrates a perspective view of the device 100 while FIG. 1B illustrates a top view of the device 100. The device 100 may be a display device, in that, the device 100 may be configured to display one or more parameters thereon. The one or more parameters may be associated with the vehicle (not shown) where the device 100 may be installed.
[0023] In some embodiments, the vehicle may include a two-wheeled vehicle such as a scooter, a bike, a motorcycle, and the like. As seen in FIG. 1, the device 100 is a singular device which may be installed as a whole at an appropriate location on the vehicle. For instance, the device 100 may be installed so as to be within a field of view of a user riding the vehicle. The device 100 may include a common assembly 102 which includes all the components associated with the device 100, thereby providing the device 100 with a singular configuration. That is, the common assembly 102 may be associated with a telematics unit as well as an instrument cluster of the vehicle, thereby providing functionalities of both the telematics unit and the instrument cluster through the singular device 100.
[0024] In some embodiments, the one or more parameters associated with the vehicle may include a first set of parameters and a second set of parameters. The first set of parameters may be associated with the instrument cluster. In some embodiments, the first set of parameters may include one or more of display speed, odometer, battery

charge, fuel level, tell-tales (for instance, turn indications, engine overheat, motor overheat, traction control, call notifications, etc.), lightbar section to highlight indications (for instances, call notifications, charge level, revolutions per minute (RPM), Bluetooth pairing, etc.)) drive mode, map and navigation display, and the like.
[0025] The second set of parameters may be associated with the telematics unit. In some embodiments, the first set of parameters may include one or more of location, global positioning system (GPS) navigation, blue-tooth connectivity, wireless connectivity, and the like.
[0026] As seen in FIGS. 1A-1B, the device 100 comprises the common assembly 102. The common assembly 102 may include a thin film transistor (TFT) display unit 104 ("the display unit (104") can be a segmented liquid crystal display (LCD) type, organic light-emitting diode (OLED) type and the like), a top cover 106, and a bottom cover 108. The TFT display unit 104 may be configured to display the plurality of parameters, i.e., both the first set of parameters associated with instrument cluster and the second set of parameters associated with the telematics unit. The TFT display unit 104 may be within a field of view of a user riding the vehicle such that the user may view the plurality of parameters being displayed on the TFT display unit 104.
[0027] The top cover 106 and the bottom cover 108 may be configured to be coupled to each other by means of a glue and/or a sealant adhesive or by any mechanical fastening means. The top cover 106 and the bottom cover 108 may define a housing to enclose a majority of components of the device 100. In some embodiments, the top cover 106 and the bottom cover 108 may be detachably coupled so as to allow maintenance and repair of the enclosed components as and when required.
[0028] Reference is made to FIGS. 2A and 2B which illustrate cross-sectional view of the device 100. FIG. 2A illustrates a cross-sectional view of the device 100, the cross-section being taken along the line A-A in FIGS. 1A-1B. FIG. 2B illustrates a cross-sectional view of the device 100, the cross-section being taken along the line B-B in FIGS. 1A-1B.

[0029] The TFT display unit 104 may comprise a cover glass 202 and a TFT module 204. The cover glass 202 and the TFT module 204 may form a single subassembly, i.e., the TFT display unit 104. The TFT display unit 104 may be connected to the top cover 106 by means of an adhesive.
[0030] The common assembly 102 may further comprise a first printed circuit board (PCB) 208 and a second PCB 210. The first PCB 208 may be configured to generate the first set of parameters associated with the instrument cluster. The second PCB 210 may be configured to generate the second set of parameters associated with the telematics unit. Each of the first PCB and the second PCB may comprise corresponding electronic components that allow generation of the first set of parameters and the second set of parameters, respectively. With separate PCBs for instrument cluster and telematics unit, a more effective power management and debugging strategies can be implemented.
[0031] In some embodiments, the first PCB 208 may be coupled to the TFT display unit 104. In some embodiments, the second PCB 210 may be coupled to the first PCB 208. In some embodiments, the first PCB may include a cluster microprocessor (not shown) configured to cause display of the plurality of parameters on the TFT display unit 104. In some embodiments, the cluster microprocessor may be configured to generate the first set of parameters associated with the instrument cluster and provide the first set of parameters to the TFT display unit 104. In some embodiments, the cluster microprocessor may be configured to receive the second set of parameters associated with the telematics unit from the second PCB 210 and provide the second set of parameters to the TFT display unit 104. It is appreciated that details with respect to the working of the first PCB and the second PCB is not being described for sake of brevity.
[0032] As seen in FIGS. 2A-2B, the first PCB 208 is disposed above the second PCB 210, i.e., relative to the TFT display unit 104, the first PCB 208 is closer to the TFT display unit 104 than the second PCB 210. Further, the first PCB 208 and the second PCB 210 may each be associated with a corresponding component count value. The component count value of the second PCB 210 may be lesser that the component count

value of the first PCB. In other words, the first PCB 208 may be larger in size than the second PCB 210, and further, the first PCB 208 may comprise a greater number of electronic components than the second PCB 210. Accordingly, a compact form factor is achieved, i.e., a thin/compact design is achieved, which allows the device 100 to be installed at a vehicle while taking up minimum space.
[0033] In some embodiments, the top cover 106 and the bottom cover 108, when coupled, enclose the first PCB 208 and the second PCB 210. As a result, the device 100 as a single unit can be installed at the vehicle and both the functionalities of the instrument cluster and telematics unit can be provided through the single unit. In some embodiments, the common assembly may comprise a main connector 211A configured to facilitate transmitting and receiving of power and communication signals by the first PCB 208 and the second PCB 210. In some embodiments, the first PCB 208 may be connected to the second PCB 210 by means of a secondary connector 211B, such as, a board-to-board connector.
[0034] The common assembly 102 may further comprise an electromagnetic interference (EMI) shield sheet 212 disposed between the first PCB 208 and the second PCB 210. The EMI shield sheet 212 may be configured to block interference (EMI) between the first PCB 208 and the second PCB 210. The EMI shield sheet 212 may be configured to prevent interference produced from electronic components associated with the first and second PCBs, such as, digital clocks, harmonics, oscillators, and the like. An electromagnetic isolation of the first PCB 208 and the second PCB 210 may thus be achieved and the electronic components do not cause interference in the respective functionalities. The EMI shield sheet 212 can be any electromagnetic shield (such as Faraday cage which can be mounted on a individual components or a EMI shielding sheet which can be mounted over the PCB) which prevents interference of electromagnetic signals.
[0035] The common assembly 102 may comprise a set of electronic components (E-components) 214 which may get heated during operation of the device 100. The E-components 214 may be associated with one or both of the first PCB 208 and the second PCB 210. The E-components 214 may include, for instance, microprocessors,

graphical processing units, power management components, light emitting diodes (LEDs), and the like. The E-components 214 may thus emit heat during the operation thereof.
[0036] In order to extract the heat being emitted by the E-components 214, the common assembly 102 may comprise a heat sink 216 configured to absorb the heat from the E-components 214 and facilitate dissipation of the heat to external environment, i.e., external to the device 100.
[0037] The heat sink 216 may thus be configured to dissipate heat from the E-components 214 and ensure efficient operation of the E-components. The functionality of heat sink 216 avoids buildup of heat within the common assembly 102, particularly as the device 100 includes high heat generating components disposed within the common assembly 102.
[0038] In some embodiments, the common assembly comprises a thermal interface material (TIM) 218 disposed between the E-components 214 and the heat sink 216. The TIM 218 may be configured to facilitate heat transfer from the heated E-components 214 to the heat sink 216, thereby facilitating efficient heat dissipation to colder ambient environment outside the device 100. In some embodiments, the TIM 218 may eliminate air gaps and ensure high rate of heat transfer from the heated E-components 214 to the heat sink 216.
[0039] In some embodiments, the heat sink 216 may be integrally molded with the bottom cover 108 in a compact form. In some embodiments, the heat sink 216 may be coupled to the first PCB 208 and the second PCB 210. As seen in FIGS. 2A and 2B, the heat sink 216 may extend towards the first PCB 208 to contact the heated E-components 214. In some embodiments, the second PCB 210 may be shaped to extend around the heat sink 216, thus not only allowing heat dissipation from the heated E-components 214 but also effectively consuming space within the common assembly 102 without taking upon more depth. A thin and compact configuration of the device 100 can thus be maintained.

[0040] In some embodiments, the heat sink 216 may be formed for aluminum and an anodized coating. In some embodiments, the TFT module 204 may be formed of a metal material that provides structural stability to the device 100. For instance, the metal material may be steel sheet metal. In some embodiments, the TFT module 204 may be of a length of 7 inches. In some embodiments, the bottom cover 108 may be formed of a plastic material. For instance, the plastic material may be thermoplastic such as ABS, ASA, PP, AES, ABS-PC, or thermosets such as epoxy resins.
[0041] The common assembly 102 may comprise a first antenna 220 and a second antenna 222, as seen in FIG. 2B. The first antenna 220 and the second antenna 222 may be independent modules disposed on the bottom cover 108. That is, the first antenna 220 and the second antenna 222 may be provided separately from the second PCB 210 and may be coupled to the second PCB 210 by means of UFL connectors (not shown).
[0042] In some embodiments, the first antenna 220 may be a global system for mobile communication (GSM) antenna and the second antenna 222 may be a global positioning system (GPS) antenna. The second antenna 222 may be a passive antenna which may be cost-effective. In some embodiments, the first antenna 220 and the second antenna 222 may be configured to communicate with remote servers, such as, communication network servers. In some embodiments, one or more of the first antenna 220 and the second antenna 222 may be configured to communicate with a device associated with a user of the vehicle, such as, a smartphone.
[0043] As seen in FIG. 2B, the first antenna 220 and the second antenna 222 may be disposed on the bottom cover 108 so as be sky-facing and offset from the TFT display unit, which may be formed of metal. By virtue of the positioning of the first antenna 220 and the second antenna 222, proper signal reception is ensured as well as a thin bezel design of the device 100 is preserved. The signal reception is not impeded by metal since the antennas are positioned offset from the metal TFT display unit 104. Thus, signal shielding is eliminated.
[0044] Referring to FIGS. 3A and 3B, exploded views of the device 100 are illustrated. FIG. 3A illustrates an exploded view depicting the cover glass 202, the TFT

module 204, the top cover 106, the first PCB 208, the second PCB 210, the EMI shield sheet 212, the bottom cover 108, the heat sink 216, and the TIM 218. FIG. 3B illustrates an exploded view depicting the second PCB 210, the bottom cover 108, the heat sink 216, the TIM 218, the first antenna 220, and the second antenna 222.
[0045] As seen in FIG. 3A, the first PCB 208 may be larger in size than the second PCB 210. The first PCB 208 and the second PCB 210 may be mechanically fastened to the top cover 106 and the TFT module 204 by means of set of screws 300. Further, the details regarding the cover glass 202, the TFT module 204, the top cover 106, the first PCB 208, the second PCB 210, the EMI shield sheet 212, the bottom cover 108, the heat sink 216, and the TIM 218 have been described above with respect to FIGS. 2A-2B and the details are not repeated herein for sake of brevity.
[0046] As seen in FIG. 3B, the first antenna 220 and the second antenna 222 are provided separately from the second PCB 210. Further, the second PCB 210 is shaped to extend around the heat sink 216, the heat sink 216 being integrated to the bottom cover 108. Further, the details regarding the second PCB 210, the bottom cover 108, the heat sink 216, the TIM 218, the first antenna 220, and the second antenna 222 have been described above with respect to FIGS. 2A-2B and the details are not repeated herein for sake of brevity.
[0047] FIG. 4 illustrates a close-up cross-sectional view of the area X in FIG. 2A. As seen in FIG. 4, the TIM 218 may be disposed between the E-components 214 and the heat sink 216. As described above, the TIM 218 eliminates air gaps and ensure high rate of heat transfer from the heated E-components 214 to the heat sink 216.
[0048] As seen in FIG. 4, the heat sink 216 may have a finned configuration. That is, the heat sink 216 may comprise a plurality of fins or pins 402 to facilitate efficient heat dissipation to the ambient environment. In some embodiments, the plurality of fins 402 may have a rectangular cross-section, circular cross-section, or a square cross-section.
[0049] FIG. 5 illustrates a close-up cross-sectional view of the area Y in FIG. 2A. As seen in FIG. 5, the bottom cover 108 may be connected to the top cover 106 by

means of a sealant adhesive 502. In some embodiments, the bottom cover 108 may be connected to the top cover 106 by means of mechanical snap features. Further, the cover glass 202 and the TFT module 204 may be joined to the top cover 106 by means of a glue 504.
[0050] A device that combines the instrument cluster and the telematics cluster is this provided. The device comprises the common assembly and all essential components for the instrument cluster and the telematics cluster are provided in the common assembly. Thus, the need for adding long connections is eliminated, thereby not only reducing cost but also removing lags in display. The heat sink dissipates the heat that may be generated by the electronic components within the common assembly. The heat sink may be integrated with the plastic bottom cover. Further, signal shielding is eliminated as the antennas are positioned offset from metal components and disposed at plastic bottom cover. Furthermore, interference between PCBs is eliminated by use of the EMI shield sheet.
[0051] As used herein, the singular form "a", "an" and "the" include plural
references unless the context clearly dictates otherwise. It is appreciated that certain features of the subject matter, which are, for clarity, described in the context of separate examples, may also be provided in combination in a single example. Conversely, various features of the subject matter, which are, for brevity, described in the context of a single example, may also be provided separately or in any suitable sub¬combination or as suitable in any other described example of the subject matter. Certain features described in the context of various examples are not to be considered essential features of those examples, unless the example is inoperative without those elements.

WE CLAIM:
1. A device (100) configured to be installed at a vehicle, the device (100)
comprising:
a common assembly (102) for a telematics unit and an instrument cluster, the common assembly (102) including:
a display unit (104) configured to display a plurality of parameters associated with vehicle, the plurality of parameters comprising a first set of parameters associated with the instrument cluster and a second set of parameters associated with the telematics unit;
a first printed circuit board (PCB) assembly (208) communicatively coupled to the display unit (104), the first PCB (208) being configured to generate the first set of parameters associated with the instrument cluster; and
a second PCB assembly (210) communicatively coupled to the first PCB (208), the second PCB (210) being configured to generate the second set of parameters associated with the telematics unit, wherein the first PCB (208) is disposed closer to the display unit (104) than the second PCB (210), and wherein a component count value of the second PCB (210) is lesser than a component count value of the first PCB (208).
2. The device (100) as claimed in claim 1, wherein the second PCB (210) is disposed to at least partially overlap the first PCB (218), thereby providing an overlapping portion and a non-overlapping portion associated with the first PCB (208).
3. The device (100) as claimed in claim 1, wherein the common assembly (102) comprises an electromagnetic interference-shield sheet (212) disposed between the first PCB (208) and the second PCB (210), the electromagnetic interference-shield sheet (212) being configured to block electromagnetic interference between the first PCB (208) and the second PCB (210) , and wherein the electromagnetic interference-shield sheet (212) is disposed to at least partially overlap the first PCB (208).

4. The device (100) as claimed in claim 1, wherein the common assembly (102)
comprises:
one or more heated components (214) associated with the first PCB (208) and the second PCB (210); and
a heat sink (216) coupled to the one or more heated components (214), the heat sink (216) being configured to absorb heat from the one or more heated components (214).
5. The device (100) as claimed in claim 4, wherein the common assembly (102) further comprises a thermal interface material (218) disposed between the one or more heated components (214) and the heat sink (216), the thermal interface material (218) being configured to facilitate heat transfer from the one or more heated components (214) to the heat sink (216).
6. The device (100) as claimed in claim 5, wherein the thermal interface material (218) is disposed to align with the non-overlapping portion associated with the first PCB (208).
7. The device (100) as claimed in claim 4, wherein the common assembly (102) comprises a top cover (106) and a bottom cover (108) coupled to the top cover (106), wherein the top cover (106) and the bottom cover (108), when coupled, enclose the first PCB (208) and the second PCB (210).
8. The device (100) as claimed in claim 7, wherein the heat sink (216) is integrally molded with the bottom cover (108), and wherein the heat sink (216) is coupled to the first PCB (208) and the second PCB (210).
9. The device (100) as claimed in claim 7, wherein the common assembly (102) comprises a first antenna (220) and a second antenna (222) configured to communicate with a remote server, each of the first antenna (220) and the second antenna (222) being disposed on the bottom cover (108).

10. The device (100) as claimed in claim 9, wherein the display unit (104) is formed of metal, wherein the bottom cover (108) is formed of plastic, and wherein each of the first antenna (220) and the second antenna (222) is disposed offset from the display unit (104) such that the first antenna (220) is sky facing without any metal obstruction