Description:FORM 2

THE PATENTS ACT, 1970
(39 of 1970)
&
The Patents Rules, 2003

COMPLETE SPECIFICATION
(See Section 10 and Rule 13)

A THERMAL MANAGEMENT ASSEMBLY

APPLICANT:

TVS MOTOR COMPANY LIMITED, an Indian Company at: “Chaitanya”, No.12 Khader Nawaz Khan Road, Nungambakkam, Chennai 600 006.

The following specification particularly describes the invention and the manner in which it is to be performed.

TECHNICAL FIELD
The present subject matter relates generally to a thermal management assembly. More particularly but not exclusively, the present subject matter relates to a thermal management assembly for a plurality of electronic devices.

BACKGROUND
[0001] Power management systems in various electronic appliances, machines, computers and electric vehicles employ plurality of electronic devices which are primarily made up of semiconductors. For example, processors, chips, transistors like metal-oxide-semiconductor field-effect transistor (MOSFET), integrated gate bipolar transistor (IGBT) etc. These electronic devices release heat during their operation. The amount of heat can be enormous if these electronic devices are operating to the fullest potential. An increase in voltage or current and sudden power fluctuation through these electronic devices can lead to an upsurge in the temperature at which these electronic devices are functioning.
[0002] In order to ensure that the rise in the temperature do not impact the functioning of the electronic devices, a heat sink is thermally coupled with such electronic devices. The heat sinks are passive heat exchanger which transfer the heat generated by an electronic or a mechanical device to a medium, often air or a liquid coolant, where the heat is dissipated away from the electronic device, thereby allowing regulation of the electronic device's temperature.
[0003] However, when more than one electronic devices are involved, a single heat sink is not sufficient for dissipating the heat away from the electronic devices. One known solution is to provide separate heat sinks for each electronic device. However, this approach will result in increase in part count and consumption of space. This may be disadvantageous for various applications where the electronic devices are proposed to be used. For example, in vehicles, especially two wheeled vehicles, one of the most important challenge is to efficiently accommodate the various components while making best use of the constrained space without compromising with effective thermal management of the electronic devices.
[0004] Another challenge in thermal management of such electronic devices is the accumulation of heat. This heat released from electronic devices is not evenly received by the heat sink resulting in unsteady and non-uniform dissipation. The heat sink is incapable of adequately distributing the heat from all the electronic devices at a uniform rate. A variety of cooling devices may also be provided for forced cooling of electronic devices. However, the cooling devices can only dissipate heat received from those electronic devices which are in the proximity of cooling device. This eventually leads to uneven heat distribution as electronic devices distant to cooling device are unable to dissipate heat. Further, the rate of cooling deteriorates if maximum utilization of the surface of the heat sink is not made for receiving heat from the electronic devices and transferring the heat to the medium. Such excessive heat can lead to temporary or permanent damage to equipment and in worse cases, cause unwanted explosion which may cause irreparable injury and/or damage to life and surrounding components of the vehicle.
[0005] Thus, to prevent any catastrophic failure of electronic devices during their operation and overcome the above-mentioned drawbacks of conventional heat sinks, the present invention proposes a novel thermal management assembly for a plurality of electronic devices. The present disclosed thermal management assembly prevents accumulation of heat in the vicinity of electronic devices. The present invention enables the heat sink to evenly receive the heat and dissipate the heat steadily by making maximum utilization of surface of the heat sink. Further, the proposed thermal management assembly enables a single heat sink to regulate the temperature of multiple electronic devices in an efficient manner.

BRIEF DESCRIPTION OF THE DRAWINGS
[0006] The details are described with reference to an embodiment of a thermal management assembly. The same numbers are used throughout the drawings to refer similar features and components.
[0007] Figure 1 illustrates a perspective view of a thermal management assembly when a first cover is removed.
[0008] Figure 2 illustrates a perspective view of a thermal management assembly when the first cover placed over the thermal management assembly.
[0009] Figure 3 illustrates an exploded view of a thermal management assembly.
[0010] Figure 4 illustrates a perspective view of a first surface of the heat exchanger.
[0011] Figure 5 illustrates a perspective view of a second surface of the heat exchanger.
[0012] Figure 6 illustrates an orthographic view of a second surface of the heat exchanger.

SUMMARY OF THE INVENTION
[0013] The present subject matter relates generally to a thermal management assembly for a plurality of electronic devices. The thermal management assembly comprises a plurality of electronic devices, a heat exchanger and a heat distribution member. The plurality of electronic devices generate heat during an operation of the plurality of electronic devices. The heat exchanger is configured to receive the heat from the plurality of electronic devices and transfer the heat to a medium. The heat distribution member is disposed between the plurality of electronic devices and the heat exchanger. The heat distribution member is thermally coupled to the plurality of electronic devices and the heat exchanger. The heat distribution member is configured to uniformly distribute the heat across the heat exchanger and to evenly transfer the heat to the heat exchanger.
[0014] The present subject matter also relates to an electronic power converter. The electronic power converter comprises a plurality of electronic devices, a heat exchanger and a heat distribution member. The plurality of electronic devices is configured to switch an electric power between AC and DC. The plurality of electronic devices generate heat during an operation of the plurality of electronic devices. The heat exchanger is configured to receive the heat from the plurality of electronic devices and transfer the heat to a medium. The heat distribution member is disposed between the plurality of electronic devices and the heat exchanger. The heat distribution member is thermally coupled to the plurality of electronic devices and the heat exchanger. The heat distribution member is configured to uniformly distribute the heat across the heat exchanger and to evenly transfer the heat to the heat exchanger.

DETAILED DESCRIPTION
[0015] In order to overcome one or more of the above-mentioned challenges, the present invention provides a thermal management assembly for a plurality of electronic devices and an electronic power converter.
[0016] One embodiment of the invention relates to a thermal management assembly for a plurality of electronic devices. The thermal management assembly comprises a plurality of electronic devices, a heat exchanger and a heat distribution member. The plurality of electronic devices generate heat during an operation of the plurality of electronic devices. The heat exchanger is configured to receive the heat from the plurality of electronic devices and transfer the heat to a medium. The heat distribution member is disposed between the plurality of electronic devices and the heat exchanger. The heat distribution member is thermally coupled to the plurality of electronic devices and the heat exchanger. The heat distribution member is configured to uniformly distribute the heat across the heat exchanger and to evenly transfer the heat to the heat exchanger.
[0017] As per one embodiment of the invention, the plurality of electronic devices is a plurality of Insulated Gate Bipolar Transistors of a power converter.
[0018] As per one embodiment of the invention, the plurality of electronic devices is disposed at an equidistant position from each other.
[0019] As per one embodiment of the invention, the plurality of electronic devices is attached to a first side of the heat distribution member by at least one attachment member. The at least one attachment member is selected from a group comprising a snap-fit attachment member and a clamping attachment member.
[0020] As per one embodiment of the invention, the heat distribution member is attached to a first surface of the heat exchanger by at least one coupling member. The at least one coupling member is selected from a group comprising fasteners and an adhesive.
[0021] As per one embodiment of the invention, the heat distribution member is provided with an expanse. The expanse is equivalent to an area of the first surface of the heat exchanger for uniform distribution of heat and maximized transfer of the heat to the heat exchanger.
[0022] As per one embodiment of the invention, the heat distribution member is made up of a copper sheet. A thickness of the copper sheet is in a range of 0.3 millimetres to 0.6 millimetres.
[0023] As per one embodiment of the invention, the heat distribution member is made up of a graphite sheet. The thickness of the graphite sheet is 0.25 millimeter.
[0024] As per one embodiment of the invention, a first cover is provided to cover the plurality of electronic devices.
[0025] As per one embodiment of the invention, the first cover is disposed upon a first side of the heat distribution member.
[0026] As per one embodiment of the invention, a second cover is provided to cover a second surface of the heat exchanger.
[0027] As per one embodiment of the invention, the second surface of the heat exchanger is provided with a plurality of protruding members thereby increasing a surface area of the second surface of the heat exchanger.
[0028] As per one embodiment of the invention, the second cover is provided with at least one device in order to channelize the medium through a plurality of vents, across the plurality of protruding members thereby transferring the heat to the medium.
[0029] As per one embodiment of the invention, the at least one device is a fan and the medium is an air medium.
[0030] As per one embodiment of the invention, the plurality of protruding members is arranged in a concentric profile on the second surface of the heat exchanger for a uniform flow of the medium in motion.
[0031] Another embodiment of the invention relates to an electronic power converter. The electronic power converter comprises a plurality of electronic devices, a heat exchanger and a heat distribution member. The plurality of electronic devices, being a plurality of electronic devices is configured to switch an electric power between AC and DC. The plurality of electronic devices generates heat during an operation of the plurality of electronic devices. The heat exchanger is configured to receive the heat and transfer the heat to a medium. The heat distribution member is disposed between the plurality of electronic devices and the heat exchanger. The heat distribution member is thermally coupled to the plurality of electronic devices and the heat exchanger. The heat distribution member is configured to uniformly distribute the heat across the heat exchanger and to evenly transfer the heat to the heat exchanger.
[0032] The embodiments of the present invention will now be described in detail with reference to an embodiment of a thermal management assembly, along with the accompanying drawings. However, the disclosed invention is not limited to the present embodiments.
[0033] The embodiments shown in Figure 1, Figure 2 and Figure 3 are taken together for discussion. Figure 1 illustrates a perspective view of a thermal management assembly (200) when a first cover (204a) is removed from the thermal management assembly (200). Figure 2 illustrates a perspective view of a thermal management assembly (200) when a first cover (204a) is placed over the thermal management assembly (200). Figure 3 illustrates an exploded view of a thermal management assembly (200). In this embodiment shown in the figures, the thermal management assembly (200) illustrates Insulated Gate Bipolar Transistors (IGBT) as a plurality of electronic devices (201). However, the disclosed invention is not limited to IGBTs only. The plurality of electronic devices (201) can be any number or types of electronic devices known in the art. Thus, the present thermal management assembly (200) can also be used for with the other electronic devices that tend to generate heat during their operation.
[0034] The thermal management assembly (200) comprises a plurality of electronic devices (201), a heat exchanger (203) and a heat distribution member (202). The plurality of electronic devices (201) generate heat during an operation of the plurality of electronic devices (201). The heat exchanger (203) is configured to receive the heat from the plurality of electronic devices (201) and transfer the heat to a medium. The heat distribution member (202) is disposed between the plurality of electronic devices (201) and the heat exchanger (203). The heat distribution member (202) is thermally coupled to the plurality of electronic devices (201) and the heat exchanger (203). The heat distribution member (202) is configured to uniformly distribute the heat across the heat exchanger (203) and to evenly transfer the heat to the heat exchanger (203).
[0035] The present invention provides for a heat distribution member (202) which is configured to uniformly distribute the heat across the heat exchanger (203) and to evenly transfer the heat to the heat exchanger (203). The heat distribution member (202) prevents accumulation of heat in the vicinity of the plurality of electronic devices (201). Further, the heat distribution member (202) enables the heat exchanger (203) to evenly receive the heat from the plurality of electronic devices (201) and dissipate the heat steadily to the medium used in thermal management assembly (200). In the present embodiment, the hear distribution member (202) is shown as a substantially rectangular shaped plate type member. However, depending on the configuration and the components and the application of the plurality of electronic devices (201) for example, power generation, motor control, vehicle control or other types of applications, the shape and profile of the heat distribution member (202) can be altered or adjusted. Present invention allows the plurality of electronic devices (201) to effectively and efficiently dissipate heat thereby enabling the plurality of electronic devices (201) to function at maximum efficiency without any break down. This helps in avoiding any catastrophic failure of the plurality of electronic devices (201) when there is an increase in voltage or current and sudden power fluctuation. Furthermore, the heat distribution member (202) enables a single heat exchanger (203) to regulate temperature of the plurality of electronic devices (201). Therefore, a requirement of separate heat exchanger (203) for every single electronic device (201) is eliminated resulting in optimum utilisation of available space. This particularly forms an important advantage for vehicular applications where, due to the space constraints, a compact and a less-voluminous thermal management system (200) holds a paramount importance.
[0036] The plurality of electronic devices (201) is a plurality of Insulated Gate Bipolar Transistors (IGBT) of a power converter. The IGBT is a semiconductor device used for switching related applications. Applications of IGBT are vast in electronics field. Due to low on resistance, very high current rating, high switching speed, zero gate drive, IGBTs are used in high power motor control, inverters, switched mode power supply with high frequency converting areas.
[0037] In the present invention, the plurality of electronic devices (201) is disposed at an equidistant position from each other. When the plurality of electronic devices (201) is positioned in pattern in which they are equidistant to each other, the distribution of heat is even. In one of the embodiments, the plurality of electronic devices (201) is disposed in a linear pattern equidistant to each other. The equidistant placement of the plurality of electronic devices (201) also aids in the even distribution of heat.
[0038] The heat distribution member (202) has a first side (202a) and a second side (not shown). While in the present embodiment of figures, the first side (202a) can be the upper facing side where the plurality of electronic devices (201) is installed. In another configuration or embodiment, the first side (202a) can be the down facing side while the position of other components can be changed accordingly. The plurality of electronic devices (201) is attached to a first side (202a) of heat distribution member (202) by at least one attachment member. The at least one attachment member being selected from a group comprising a snap-fit attachment member and a clamping attachment member.
[0039] The heat distribution member (202) is provided with an expanse. The expanse is equivalent to an area of the first surface (203a) of the heat exchanger (203). This increases the surface area of the contact between the heat distribution member (202) and the heat exchanger (203) for uniform distribution of heat and maximized transfer of the heat to the heat exchanger (203). Therefore, the rate at which dissipation of heat takes place also increases.
[0040] In one embodiment, the heat distribution member (202) is made up of a copper sheet. Copper possesses considerably high thermal conductivity and malleability compared to other metals making it a suitable material for making the heat distribution member (202). Further, copper is resistant to corrosion, biofouling, stress and thermal expansion. A thickness of the copper sheet is in a range of 0.3 millimeters - 0.6 millimeters in one embodiment.
[0041] In another embodiment, the heat distribution member (202) can also be made up of a graphite sheet. Thermal conductivity of graphite can be compared with its metallic alternatives. However, the graphite being lighter in weight becomes suitable for manufacturing of the heat distribution member (202). A thickness of the graphite sheet is 0.25 millimetre in one embodiment.
[0042] A first cover (204a) is provided to cover the plurality of electronic devices (201). The first cover (204a) is disposed upon a first side (202a) of the heat distribution member (202). The second cover (204b) is provided to cover a second surface (203b) of the heat exchanger (203) (as shown in figure 5) of the heat exchanger (203). The first cover (204a) and the second cover (204b) are made up of material selected from a group consisting resin, plastic and Acrylonitrile butadiene styrene (ABS).
[0043] As per another embodiment, the first cover (204a) is a lid. The first cover (204a) is configured to cover the second cover (204b) by aligning with an outer periphery of the second cover (204b). This configuration allows the first cover (204a) to tightly affix to the second cover (204b) for securing and covering the plurality of electronic devices (201).
[0044] As per another embodiment, the first cover (204a) is attached to the outer periphery of the second cover (204b) through adhesives or fasteners.
[0045] The second cover (204b) is provided with at least one device (not shown) in order to channelize the medium through a plurality of vents (204v), across the plurality of protruding members (203p) of the heat exchanger (203) thereby transferring the heat to the medium in motion.
[0046] In one of the embodiments of the invention, the at least one device used is a fan (not shown). In a preferred embodiment of the present invention an axial fan is used. The preferred medium is an air medium. However, the present invention can also be worked with liquid coolants. When any liquid coolant is used as a medium then a pump can be employed as the at least one device (not shown) to channelize the liquid medium through a plurality of vents (204v), across the plurality of protruding members (203p) of the heat exchanger (203).
[0047] In another embodiment, the electronic power converter comprises a plurality of electronic devices (201), a heat exchanger (203) and a heat distribution member (202). The plurality of electronic devices (201), being a plurality of electronic devices (201), is configured to switch an electric power between AC and DC. The plurality of electronic devices (201) generates a heat during an operation of the plurality of electronic devices (201). The heat exchanger (203) is configured to receive the heat and transfer the heat to the medium. The heat distribution member (202) is disposed between the plurality of electronic devices (201) and the heat exchanger (203). The heat distribution member (202) is thermally coupled to the plurality of electronic devices (201) and the heat exchanger (203). The heat distribution member (202) is configured to uniformly distribute the heat across the heat exchanger (203) and to evenly transfer the heat to the heat exchanger (203).
[0048] The embodiments shown in Figure 4, Figure 5 and Figure 6 are taken together for discussion. Figure 4 illustrates a perspective view of a first surface (203a) of the heat exchanger (203). Figure 5 illustrates a perspective view of a second surface (203b) of the heat exchanger (203). Figure 6 illustrates an orthographic view of a second surface (203b) of the heat exchanger (203).
[0049] In a preferred embodiment of the present invention, the heat exchanger (203) can be a heat sink with a first surface (203a) and a second surface (203b). The first surface (203a) of the heat exchanger (203) is configured to receive heat from the heat distribution member (202) and the second surface (203b) of the heat exchanger (203) is configured to dissipate the heat to the medium in motion.
[0050] The heat distribution member (202) is attached to a first surface (203a) of the heat exchanger (203) by at least one coupling member. The at least one coupling member being selected from a group comprising fasteners and an adhesive.
[0051] The second surface (203b) of the heat exchanger (203) is provided with a plurality of protruding members (203p) thereby increasing a surface area of the second surface (203b) of the heat exchanger (203). The shape of the plurality of protruding members (203p) and their positional placement is such that the movement of the medium is not hindered. In an embodiment of present invention, the plurality of protruding members (203p) is arranged in a concentric circular profile for uniform flow of the medium in motion.
[0052] The proposed thermal management assembly (200) provides multitudes of benefits. The heat exchanger (203) is enabled to uniformly receive the heat from the plurality of electronic devices (201) and dissipate the heat steadily to the medium used. This prevents the accumulation of heat in the vicinity of the plurality of electronic devices (201). The area of surface in contact between the heat distribution member (202) and the heat exchanger (203) is maximized to increase the rate at which cooling takes place. These feature help in achieving peak performance of the plurality of electronic devices (201) without any break down or catastrophic failure during their operation.
[0053] Further, the heat distribution member (202) enables a single heat exchanger (203) to regulate temperature of the plurality of electronic devices (201). Therefore, a requirement of separate heat exchanger (203) for every single electronic device (201) is eliminated resulting in optimum utilisation of available space and cost reduction.
[0054] The thermal management assembly (200) illustrates IGBT as a plurality of electronic devices (201). However, the disclosed invention is not limited to IGBT only. The present invention can also be worked upon with the other electronic devices that tend to generate heat during their operation. For example, as used in this specification and the appended claims, the singular forms “a,” “an” and “they” can include plural referents unless the content clearly indicates otherwise. Further, when introducing elements/components/etc. of the assembly/system described and/or illustrated herein, the articles “a”, “an”, “the”, and “said” are intended to mean that there is one or more of the element(s)/component(s)/etc. The terms “comprising”, “including”, and “having” are intended to be inclusive and mean that there may be additional element(s)/component(s)/etc. other than the listed element(s)/component(s)/etc.
[0055] This written description uses examples to provide details on the disclosure, including the best mode, and also to enable any person skilled in the art to practice the disclosure, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the disclosure is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal language of the claims.
[0056] It is to be understood that the aspects of the embodiments are not necessarily limited to the features described herein. Many modifications and variations of the present subject matter are possible in the light of above disclosure.

LIST OF REFERENCE NUMERALS

200 Thermal management assembly
201 A plurality of electronic devices
202
202a Heat distribution member
First side of heat distribution member
203
203a
203b Heat exchanger
First surface of the heat exchanger
Second surface of the heat exchanger
203p A plurality of protruding members
204a A first cover
204b A second cover
204v A plurality of vents

, Claims:We Claim:

1. A thermal management assembly (200) for a plurality of electronic devices (201), the thermal management assembly (200) comprising:
a plurality of electronic devices (201), the plurality of electronic devices (201) generating heat during an operation of the plurality of electronic devices (201);
a heat exchanger (203), the heat exchanger (203) being configured to receive the heat from the plurality of electronic devices (201) and transfer the heat to a medium; and
a heat distribution member (202), the heat distribution member (202) being disposed between the plurality of electronic devices (201) and the heat exchanger (203), the heat distribution member (202) being thermally coupled to the plurality of electronic devices (201) and the heat exchanger (203), and the heat distribution member (202) being configured to uniformly distribute the heat across the heat exchanger (203) and to evenly transfer the heat to the heat exchanger (203).

2. The thermal management assembly (200) for the plurality of electronic devices (201) as claimed in claim 1, wherein the plurality of electronic devices (201) being a plurality of Insulated Gate Bipolar Transistors of a power converter.

3. The thermal management assembly (200) for the plurality of electronic devices (201) as claimed in claim 1, wherein the plurality of electronic devices (201) being disposed at an equidistant position from each other.

4. The thermal management assembly (200) for the plurality of electronic devices (201) as claimed in claim 1, wherein the plurality of electronic devices (201) being attached to a first side (202a) of the heat distribution member (202) by at least one attachment member, the at least one attachment member being selected from a group comprising a snap-fit attachment member and a clamping attachment member.
5. The thermal management assembly (200) for the plurality of electronic devices (201) as claimed in claim 1, wherein the heat distribution member (202) being attached to a first surface (203a) of the heat exchanger (203) by at least one coupling member, the at least one coupling member being selected from a group comprising fasteners and an adhesive.
6. The thermal management assembly (200) for the plurality of electronic devices (201) as claimed in claim 5, wherein the heat distribution member (202) being provided with an expanse, the expanse being equivalent to an area of the first surface (203a) of the heat exchanger (203) for uniform distribution of heat and maximized transfer of the heat to the heat exchanger (203).
7. The thermal management assembly (200) for the plurality of electronic devices (201) as claimed in claim 1, wherein the heat distribution member (202) being made up of a copper sheet, a thickness of the copper sheet being in a range of 0.3 millimeters - 0.6 millimeters.
8. The thermal management assembly (200) for the plurality of electronic devices (201) as claimed in claim 1, wherein the heat distribution member (202) being made up of a graphite sheet, a thickness of the graphite sheet being 0.25 millimeters.
9. The thermal management assembly (200) for the plurality of electronic devices (201) as claimed in claim 1, wherein the thermal management assembly (200) including a first cover (204a), the first cover (204a) being configured to cover the plurality of electronic devices (201).
10. The thermal management assembly (200) for the plurality of electronic devices (201) as claimed in claim 9, wherein the first cover (204a) being disposed upon a first side (202a) of the heat distribution member (202).
11. The thermal management assembly (200) for the plurality of electronic devices (201) as claimed in claim 1, wherein a second cover (204b) being provided to cover a second surface (203b) of the heat exchanger (203).
12. The thermal management assembly (200) for the plurality of electronic devices (201) as claimed in claim 11, wherein the second surface (203b) of the heat exchanger (203) being provided with a plurality of protruding members (203p) thereby increasing a surface area of the second surface (203b) of the heat exchanger (203).
13. The thermal management assembly (200) for the plurality of electronic devices (201) as claimed in claim 12, wherein the second cover (204b) being provided with at least one device in order to channelize the medium through a plurality of vents (204v), across the plurality of protruding members (203p) thereby transferring the heat to the medium.
14. The thermal management assembly (200) for the plurality of electronic devices (201) as claimed in claim 13, wherein the at least one device being a fan and the medium being an air medium.
15. The thermal management assembly (200) for the plurality of electronic devices (201) as claimed in claim 13, wherein the plurality of protruding members (203p) being arranged in a concentric profile on the second surface (203b) of the heat exchanger (203) for a uniform flow of the medium in motion.

16. An electronic power converter, the electronic power converter comprising:
a plurality of electronic devices (201), the plurality of electronic devices (201), being configured to switch an electric power between AC and DC, and the plurality of electronic devices (201) generating heat during an operation of the plurality of electronic devices (201);
a heat exchanger (203), the heat exchanger (203) being configured to receive the heat and transfer the heat to a medium; and
a heat distribution member (202), the heat distribution member (202) being disposed between the plurality of electronic devices (201) and the heat exchanger (203), the heat distribution member (202) being thermally coupled to the plurality of electronic devices (201) and the heat exchanger (203), and the heat distribution member (202) being configured to uniformly distribute the heat across the heat exchanger (203) and to evenly transfer the heat to the heat exchanger (203)

Dated this 26th day of July, 2023

(Digitally Signed)
Sudarshan Singh Shekhawat
IN/PA-1611
Agent for the Applicant