A Cooling Apparatus For Regulating Temperature Of An Electronic Component Enclosure And A Method Thereof

Abstract: The present disclosure discloses a cooling apparatus (100) for regulating temperature of an electronic component enclosure (12) and a method (300) thereof. The at least one actuator (4) is configured to direct ambient air into a first chamber (2) defined with a heat exchanger (5) and a second chamber (3) defined with an evaporator (6) simultaneously for cooling. The control unit (11) determines condition for cooling of the electronic component enclosure (12) based on comparing at least one cooling parameter from one or more sensors (10) with a predetermined set of values. The control unit (11) is configured to regulate the pump (9) and at least one actuator (4) of the cooling apparatus (100) to direct the ambient air towards the electronic component enclosure (12). With such configuration, the cooling apparatus (100) may be cost-effective and may eliminate or reduce damage to the electronic component due to evaporative cooling. [FIG.1]

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