Description:
FORM – 2

THE PATENTS ACT, 1970
(39 of 1970)
&
THE PATENTS RULES, 2003

COMPLETE SPECIFICATION
(SEE SECTION 10, RULE 13)

“SYSTEM FOR ELIMINATING ELECTROMAGNETIC (EM) WAVE PROPAGATION”

BHARAT ELECTRONICS LIMITED, WHOSE ADDRESS IS OUTER RING ROAD, NAGAVARA, BANGALORE – 560045, KARNATAKA, INDIA

THE FOLLOWING SPECIFICATION PARTICULARLY DESCRIBES THE INVENTION AND THE MANNER IN WHICH IT IS TO BE PERFORMED.

TECHNICAL FIELD OF THE INVENTION
[0001] The present disclosure relates in general to an electrical device for wideband communications, and more particularly, relates to a system including the electrical device i.e., integrated filter assembly (e.g., band pass filter (BPF)) and process to use in any millimeter (mm)-wave band receiver applications for eliminating electromagnetic (EM) wave propagation.
BACKGROUND OF THE INVENTION
[0002] In general, Millimeter (mm) wave filter assembly (e.g., bandpass filters (BPFs)) with ultra-wide stopband plays an important role in mm-wave communication as well as receiver/exciter applications to remove any unwanted spurious, images, harmonics, and sub-harmonics components. Typically, the aforementioned filters may be made as hermetically sealed components and integrated with a main receiver or exciters. As a result, the rejection skirt in the transition as well as the stop band of these filters provide prominent results i.e., out-of-band spur characteristics at the output of mm-wave receivers.
[0003] One such example of filter assembly and process relates to interference mitigation techniques for mm-wave directional beam forming networks. In this example, a repeater for beam forming receives a radio frequency signal via one or more scan angles or beam forming directions and then retransmits and beam forming the transmitted signal via one or more different scan angles or beam forming directions. Further, stage-by-stage signal processing is carried out by a dedicated processing chain with various filters to reject unwanted signals. Thus, interference mitigation is carried out by using sharp rejection filters used in different places of the infrared (IF) stage. However, the assembly discussed in this example, does not use group of filters to improve filter skirt. Further, mitigation technique has been applied is in higher frequencies (>15GHz), and cavity effects are more prominent as frequency of interest is Ka band.
[0004] Another example relates to the film bulk acoustic resonator fabrication method with frequency tuning and trimming (or rejection skirt improvement) based on electric measurement by cavity etch. In this example, tuning and frequency trimming or changing the filter skirt are carried out by successive trimming of the front side and back side etch cavities of the filter. However, this method involves numerous techniques to be implemented such as etching for improving rejection of filter stop band. Further, correction is carried out after filter assembly i.e., into the main housing, unlike the development of the filter itself.
[0005] Another example relates to the rejection enhancement technique of a narrowband acoustic wave filter. Here, the acoustic filter is made of a series of acoustic resonators and shunt acoustic resonators that operate together to create a nominal pass band. The acoustic filter also has one extra capacitive element in parallel with one of the series acoustic resonators as well as shunt acoustic resonators of each of the acoustic resonator pair. Thereby, rejection enhancement or sharpening of the filter skirt at the lower and upper edges has been performed. However, the filter uses shunt capacitors to improve the filter skirt in the rejection band.
[0006] Another example relates to Element Removal Design (ERD) technique in microwave filters for narrowband applications by using a computerized filter optimizer (program). This optimization technique utilizes several traditional computer optimization methods to enable the improved optimization of more complex circuits in the initial design. Also, this optimization technique results in a final filter circuit design with a reduced number of elements, while simultaneously improving the frequency response in the pass and stop bands respectively. However, this optimization technique involves complex software programs. This implies that the optimization technique is performed outside of the surface of the filter.
[0007] Another example relates to a tunable notch filter used for harmonics rejection. The tunable notch filter may include a series LC circuit in parallel with a tunable impedance circuit, and the tunable notch filter is in a radio frequency signal path associated with a common port of a multi-throw radio frequency switch. The tunable notch filter can provide rejection at a second harmonic of a carrier.
[0008] However, the above-disclosed techniques and filter assembly, in general, involve limitations such as imperfect grounding due to the mechanical tolerance of the cavity which makes the assembly integration process easy while compromising electrical performance. The magnitude of cavity tolerance is inversely proportional between the ease of the assembly process and final electrical performance. Thus, various post-fabrication techniques must be applied to improve filter rejection skirts.
[0009] Therefore, there is a need for techniques for addressing the above-mentioned problems, in addition to providing other technical advantages.
OBJECTIVE OF THE INVENTION
[0010] The main objective of the present invention is to improve the rejection level of filter assembly by partially blocking electromagnetic (EM) waves.
SUMMARY OF THE INVENTION
[0011] An aspect of the present invention is to address at least the above-mentioned problems and/or disadvantages and to provide at least the advantages described below.
[0012] Accordingly, in one aspect of the present disclosure, a system is disclosed. The system is configured to perform radio frequency (RF) energy transmission while ensuring maximum rejection for electromagnetic (EM) waves. The system includes a main enclosure. The main enclosure includes an input cavity, an output cavity, and a filter cavity. The input cavity and the output cavity are configured to receive an input substrate and an output substrate, respectively. The system further includes a filter assembly. The filter assembly is positioned in the filter cavity of the main enclosure. The filter assembly includes a top enclosure and a bottom enclosure. The bottom enclosure allows a substrate to be attached thereto. The bottom enclosure is configured with a first slot and a second slot for receiving a portion of signal coupling pins. The top enclosure and the bottom enclosure are seamlessly coupled together due to a snap-fit arrangement configured in the top and bottom enclosures. Further, a conductive adhesive and metallic strips filled beneath the signal coupling pins, and air channels between the filter assembly and outer walls of the filter cavity. The combination of the conductive adhesive and the metallic strips is configured to partially attenuate the propagation of waveguide and surface mode EM waves through air gaps and the air channels.
[0013] Accordingly, in one aspect of the present disclosure, a process for assembling a filter assembly in a system is disclosed. The process includes the step of assembling the filter assembly by stacking of a substrate onto a bottom enclosure such that a portion of signal coupling pins of the filter assembly is secured in corresponding first slot and second slot of the bottom enclosure. The process includes the step of stacking a top enclosure onto the substrate, thus forming a metal-substrate-metal architecture due to the substrate being sandwiched between the top enclosure and the bottom enclosure. Further, the process includes the step of mixing positive and negative parts of conductive adhesive and allowing for amalgamation of silver particles onto the conductive adhesive. The process further includes the step of assembling the filter assembly into a filter cavity of the system. The process includes the step of attaching a remaining portion of the signal couplings pins onto an input substrate and an output substrate via soldering technique. The process includes the step of aligning metallic strips within air channels and beneath the remaining portions of the signal coupling pins and applying the conductive adhesive therein. Further, the process includes the step of performing visual inspection of the filter assembly stacked within a main enclosure upon alignment of the metallic strips and applying the conductive adhesive. The process includes the step of allowing thermal curing of the filter assembly stacked within the main enclosure at a temperature of for about 45 minutes. The process further includes the step of conducting an inspection of the filter assembly stacked within the main enclosure using an X-Ray scanning technique.
BRIEF DESCRIPTION OF ACCOMPANYING DRAWINGS
[0014] The detailed description is described with reference to the accompanying figures. In the figures, the left-most digit(s) of a reference number identifies the figure in which the reference number first appears. The same numbers are used throughout the drawings to reference features and modules.
[0015] FIG. 1 is a sectional view of a system, in accordance with an embodiment of the present disclosure;
[0016] FIG. 2 illustrates a metal-substrate-metal (MSM) stacking arrangement of the filter assembly with input and output signal connectivity, in accordance with an embodiment of the present disclosure;
[0017] FIG. 3 is a sectional view illustrating a filter cavity of the system to accommodate the filter assembly, in accordance with an embodiment of the present disclosure;
[0018] FIG. 4 illustrates an assembly technique of the filter assembly over an input substrate and an output substrate, in accordance with an embodiment of the present disclosure;
[0019] FIG. 5 illustrates a sectional view of the system filled with conductive adhesive and metallic strips, in accordance with an embodiment of the present disclosure;
[0020] FIGS. 6A and 6B, collectively, illustrate a method flow for assembling the filter assembly to the main enclosure of the system, in accordance with another embodiment of the present disclosure;
[0021] FIG. 7 illustrates a graphical representation of the standalone response of the filter assembly in blocking the EM wave propagation, in accordance with an embodiment of the present disclosure;
[0022] FIG. 8 illustrates a graphical representation depicting measured response of the filter assembly when integrated into the main enclosure of the system, in accordance with an embodiment of the present disclosure; and
[0023] FIG. 9 illustrates a graphical representation depicting integrated filter assembly response with the system after applying mitigation technique of arresting partial propagation of waveguide and surface mode EM waves, in accordance with an embodiment of the present disclosure.
[0024] It should be appreciated by those skilled in the art that any block diagrams herein represent conceptual views of illustrative methods embodying the principles of the present disclosure. Similarly, it will be appreciated that any flow charts, flow diagrams, and the like represent various processes that may be substantially represented in computer-readable medium and so executed by a computer or processor, whether or not such computer or processor is explicitly shown.
DETAILED DESCRIPTION
[0025] In the following description, for the purpose of explanation, specific details are set forth in order to provide an understanding of the present disclosure. It will be apparent, however, to one skilled in the art that the present disclosure may be practiced without these details. One skilled in the art will recognize that embodiments of the present disclosure, some of which are described below, may be incorporated into several systems.
[0026] The terms and words used in the following description and claims are not limited to the bibliographical meanings but are merely used by the inventor to enable a clear and consistent understanding of the invention. It is to be understood that the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise.
[0027] References in the specification to “one embodiment” or “an embodiment” mean that a particular feature, structure, characteristic, or function described in connection with the embodiment is included in at least one embodiment of the invention. The appearances of the phrase “in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment.
[0028] It should be noted that the description merely illustrates the principles of the present invention. It will thus be appreciated that those skilled in the art will be able to devise various arrangements that, although not explicitly described herein, embody the principles of the present invention. Furthermore, all examples recited herein are principally intended expressly to be only for explanatory purposes to help the reader in understanding the principles of the invention and the concepts contributed by the inventor to furthering the art and are to be construed as being without limitation to such specifically recited examples and conditions. Moreover, all statements herein reciting principles, aspects, and embodiments of the invention, as well as specific examples thereof, are intended to encompass equivalents thereof.
[0029] In an embodiment, ultra-wideband rejection level improvement of filter assembly (e.g., millimeter (mm)-wave bandpass filter (BPF)) by blocking partial waveguide and surface mode electromagnetic (EM) propagation has been disclosed. It is performed after integration of the filter with the rest of the system. Waveguide and surface mode EM fields can generate and propagate due to imperfect grounding within and around the filter assembly with respect to the system. Further, conductive glue with highly conductive metallic strips is filled within air channels and air gaps to ensure perfect grounding of the filter assembly from all the sides to improve the rejection skirt in the stop band frequency spectrum.
[0030] Various embodiments of the present disclosure are further described with reference to FIG. 1 to FIG. 9.
[0031] FIG. 1 is a sectional view of a system (100), in accordance with an embodiment of the present disclosure. It should be understood that the system (100) as illustrated and hereinafter described is merely illustrative, therefore it should not be taken to limit the scope of the present disclosure. Further, the components of the system (100) provided herein may not be exhaustive, and the system (100) may include more or fewer components than that depicted in FIG. 1. Furthermore, two or more components may be embodied in one single component, and/or one component may be configured using multiple sub-components to perform the desired functionalities. The system (100) is configured to perform in-band millimeter (mm)-wave radio frequency (RF) energy transmission while ensuring maximum rejection for electromagnetic (EM) waves which is explained further in detail.
[0032] The system (100) includes a main enclosure (120). The main enclosure (120) includes an input cavity (122), an output cavity (125), and a filter cavity 124 (as shown in FIG. 3). The input cavity (122) and the output cavity (125) are configured to receive an input substrate (150a) and an output substrate (150b), respectively. Further, the system (100) includes a filter assembly (110) positioned in the filter cavity 124 of the main enclosure (120). For example, the filter assembly (110) is an ultra-wide stop band millimeter (mm)-wave band pass filter (BPF).
[0033] Referring to FIG. 2 in conjunction with FIG. 1, the filter assembly (110) includes a top enclosure (114) and a bottom enclosure (112). The bottom enclosure (112) is configured with a first slot and a second slot for receiving a portion of signal coupling pins (115a, 115b). In particular, each of the signal coupling pins (115a, 115b) includes an inner part, an outer part, and a body. The body of the signal coupling pins (115a, 115b) snuggly fit to the first and second slots configured in the bottom enclosure (112), thereby enabling mounting of the signal coupling pins (115a, 115b) to the bottom enclosure (112). It is to be noted that the outer part of the signal coupling pins (115a, 115b) are exposed outside the bottom enclosure (112). The top enclosure (114) and the bottom enclosure (112) are seamlessly coupled together due to a snap-fit arrangement configured in the top and bottom enclosures (114, 112). More specifically, the top and bottom enclosures (114, 112) are dimensioned in conformity to each other such that they form a snap-fit arrangement, thus enabling seamless coupling of the top and bottom enclosures (114, 112). Further, the filter assembly (110) includes a substrate of negligible thickness. The substrate is sandwiched between the top and bottom enclosures (114, 112).
[0034] It is to be noted that the top and bottom enclosures (114, 112) are made of metallic materials. Further, the substrate sandwiched between the top and bottom enclosures (114, 112) correspond to a metal-substrate-metal architecture. The substrate sandwiched between the top and bottom enclosures (114, 112) is configured to perform filtering action, for ensuring maximum RF energy transfer within the metal-substrate-metal (MSM) architecture.
[0035] In particular, the system (100) performs in-band mm-wave RF energy transmission from the input to the output port and ensures maximum rejection for out-of-band signals. In particular, the filter assembly (110) receives an RF signal from input substrate (150a) through the input pin of a signal coupling pin (115a) and transmits power to the output substrate (150b) through the output pin of a signal coupling pin 115b and directly connected to the main enclosure (120) via the bottom enclosure (112).
[0036] In an embodiment, the filter assembly (110) must ensure perfect grounding across its outer as well as inner surfaces respectively to sustain seamless filtering action. To that effect, the input cavity (122) and the output cavity (125) of the main enclosure (120) are partially dielectric filled. It is to be noted that the input cavity (122) and the output cavity (125) are thin enough thereby its cavity resonance does not disturb filtering action up to 40GHz, but the filter cavity (124) generates cavity resonance at around 16GHz (as shown in FIG. 8).
[0037] Further, thin air channels (140a, 140b) persist between the filter assembly (110) and the main enclosure (120) (as shown in FIG. 1). Specifically, the air channels 140a, and 104b exist between the filter assembly (110), and outer walls of the filter cavity (124). In general, the air channels 140a, and 140b are inevitable for two parts (tolerance of the mechanical part) assembly, thus resulting in a leakage of EM waves from the input port to the output port. Ideally, the air channels (140a, 140b) must be zero or there must be some mechanism to contact the outer surface of the filter assembly (110) and the main enclosure (120) thus, impedance of the air channels (140a, 140b) becomes zero instead of the intrinsic impedance of the medium.
[0038] In addition, due to the MSM architecture of the top and bottom enclosures (114, 112), air gaps (116) across the interfaces between (112 and 114) are formed. This further results in a negligible portion of the RF energy leaking within the substrate and propagating through the air channels (140a, 140b) around the filter assembly (110).
[0039] In order to mitigate leakage of the EM waves, a conductive adhesive and metallic strips are filled beneath the signal coupling pins (115a, 115b), and air channels (140a, 140b) between the filter assembly (110) and outer walls of the filter cavity (124). The conductive adhesive includes a positive part and a negative part. In an embodiment, the conductive adhesive is made of silver (Ag), and the metallic strips are made of Aluminum (Al). The combination of the conductive adhesive and the metallic strips is configured to partially block the propagation of waveguide and surface mode EM waves through the air gaps (116) and the air channels (140a, 140b).
[0040] Referring to FIG. 4, the assembly technique of the filter assembly (110) over the input substrate (150a) and the output substrate (150b) is shown, in accordance with an embodiment of the present disclosure. It is to be noted that the height ‘H’ (represented as (210a) and (210b)) between inner part of the signal coupling pins 115a and 115b and the input substrate (150a) and the output substrate (150b) respectively should be as minimum as possible but cannot be zero for smooth assembly. Further, lower height (210a, 210b) avoid unwanted radiations which will conduct as surface waveguide or radiate as EM waves (i.e., tangential components of EM field) at outer part of the signal coupling pin 115b when the incident angle (?) of the EM wave is within the range of 0 degree and 90 degrees.
[0041] Referring to FIG. 5 in conjunction with FIG. 2, the air channels (140a, 140b) and beneath the outer part of the signal coupling pins 115a and 115b are filled with electrically conductive silver (Ag) filled glue (i.e., the conductive adhesive) and highly conductive low-cost metallic strips. The combination of the conductive adhesive and the metallic strips ensure the grounding of the filter, thereby facilitating rejection skirt in the stop band frequency spectrum and enabling seamless filtering action associated with the substrate. Further, the combination of the conductive adhesive and metallic strips reduces the impedance of the air channels (140a, 140b). In other words, the electrically conductive adhesive and highly conductive metal strips arrangement reduces impedances of the air channels (140a, 140b) from intrinsic impedance of medium to apparently zero ohm. Furthermore, the conductive adhesive and metallic strips arrangement reduces the potential difference between the top enclosure (114) and the main enclosure (120).
[0042] It is to be noted that the whole arrangement (i.e., the filter assembly (110) secured in the main enclosure (120) needs to undergo temperature curing at 85°C for 45 minutes. This ensures the rigidity of the conductive adhesive and stops any movement of the metallic strips secured thereto. Further, the thermal hardening facilitates the conductive adhesive and the metallic strips to be intact over mechanical vibration. This mechanism apparently ensures zero impedance of the air channels (140a, 140b). It also ensures same characteristic impedance between the tip of the input substrate (150a) and the signal coupling pins (115a and 115b) respectively. As a result, only partial propagation of waveguide as well as surface mode EM waves are pertinent.
[0043] FIGS. 6A and 6B, collectively, illustrate a process (600) for assembling the filter assembly (110) to the main enclosure (120) of the system (100), in accordance with an embodiment of the present disclosure. The process starts at step (602).
[0044] At (602), the filter assembly (110) is assembled by stacking substrate onto the top enclosure (114) and attachment of the signal coupling pins 115a and 115b and then stacking onto the bottom enclosure (112). In particular, the substrate is initially stacked onto the top enclosure (114). Thereafter, the body of the signal coupling pins 115a and 115b are attached within the top enclosure (114) and the inner part of the signal coupling pins 115a and 115b are attached onto the substrate. Further, the 114 onto the substrate and attached with 112.
[0045] At (604), mixing of positive and negative part of the conductive glue and thereafter amalgamation of the conductive glue is carried out. Upon mixing, the conductive glue is kept for conditioning for a preset time to amalgamate silver particles in the liquidizer.
[0046] At (606), the filter assembly (110) is placed into the filter cavity (124) of the main enclosure (120) and thereafter the outer part of the signal coupling pins (115a, 115b) is attached onto the input substrate (150a) and the output substrate (150b), respectively. Further, a remaining portion (i.e., outer part) of the signal coupling pins (115a, 115b) implies lead, and they are attached onto the respective input substrate and output substrate (150b) by soldering.
[0047] At (608), align the metallic strips in the air channels (140a, 140b) and beneath the outer part of the signal coupling pins (115a, 115b).
[0048] At (610), apply the mixed and conditioned conductive adhesive within the metallic strips aligned in the air channels (140a, 140b) and beneath the outer part of the signal coupling pins (115a, 115b).
[0049] At (612), visual inspection is carried out to ensure the conductive adhesive has been applied properly and there is no strain of the conductive adhesive onto the input substrate (150a) and the output substrate (150b). In one scenario, if the visual inspection is satisfactory then step (614) is performed.
[0050] At (614), the whole arrangement (100) (i.e., the filter assembly (110) secured to the main enclosure (120)) is subjected to thermal curing at 85°C for 45 minutes. Temperature and duration of thermal curing may vary from system to system as well as requirement thus it is not fixed and is requirement dependent. In another scenario, if the visual inspection is not satisfactory, then step (606) is performed.
[0051] At (616), the filter assembly (110) and the main enclosure (120) arrangement (i.e., the system (100)) is subjected to X-Ray scan to qualify void test. In one scenario, if the X-Ray scan is satisfactory then the system (100) undergoes for final testing (see, 618). In another scenario, if X-Ray scan inspection is not satisfactory then, step (606) is performed.
[0052] FIG. 7 illustrates a graphical representation (700) of the standalone response of the filter assembly (110) in blocking the EM wave propagation, in accordance with an embodiment of the present disclosure. As shown, the graphical representation (700) depicts transmission characteristics (see, (710)) and reflection characteristics (see, (720)) of the filter assembly (110). The characteristics (710) and (720) are desirable before integration of the filter assembly (110) in the system (100). It is apparent that the response from the characteristics (710) and (720) are clean because input output connectors perfectly touch the filter assembly (110) and there is no possibility to form gaps (210a and 210b) between connector and input output pins (or the signal coupling pins 115a and 115b). As a result, waveguide and surface mode EM waves do not exist in the measurement arrangement.
[0053] FIG. 8 illustrates a graphical representation (800) depicting measured response of the filter assembly (110) when integrated to the main enclosure (120) of the system (100), in accordance with an embodiment of the present disclosure. As shown, the graphical representation 800 depicts transmission characteristics (see, (810)) and reflection characteristics (see, (820)) of the filter assembly (110) when integrated to the main enclosure (120) of the system (100). The response of the filter assembly (110) shown in the characteristics (810 and 820) is due to presence of thin air channels (140a, 140b) through which partial waveguide and surface mode EM waves are getting leaked at the output port.
[0054] FIG. 9 illustrates a graphical representation (900) depicting integrated filter assembly (110) response with the system (100) after applying mitigation technique of arresting partial propagation of waveguide and surface mode EM waves, in accordance with an embodiment of the present disclosure. As shown, the graphical representation depicts transmission characteristics (see, (910)) and reflection characteristics (see, (920)) of the filter assembly (110). Thus, it is evident that the combination of the conductive adhesive and conductive metallic strips block/reflect partial propagation of waveguide and surface mode EM waves. To that effect, rejection response may be improved by more than 20dB.
ADVANTAGES
[0055] This mechanism is a low-cost solution for filter rejection improvement, gives flexibility in mechanical fabrication as well as in part assembly, easy to implement, and ease of integration assembly.
[0056] The various embodiments described above are specific examples of a single broader invention. Any modifications, alterations or the equivalents of the above-mentioned embodiments pertain to the same invention as long as they are not falling beyond the scope of the invention as defined by the appended claims. It will be apparent to a skilled person that the embodiments described above are specific examples of a single broader invention which may have greater scope than any of the singular descriptions taught. There may be many alterations made in the invention without departing from the spirit and scope of the invention.
[0057] In the foregoing detailed description of embodiments of the invention, various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments of the invention require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter lies in less than all features of a single disclosed embodiment. Thus, the following claims are hereby incorporated into the detailed description of embodiments of the invention, with each claim standing on its own as a separate embodiment.
[0058] It is understood that the above description is intended to be illustrative, and not restrictive. It is intended to cover all alternatives, modifications and equivalents as may be included within the scope of the invention as defined in the appended claims. Many other embodiments will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein,” respectively.
, Claims:
1. A system (100) configured to perform radio frequency (RF) energy transmission, the system comprising:
a main enclosure (120) comprising an input cavity (122), an output cavity (125), and a filter cavity (124), wherein the input cavity (122) and the output cavity (125) are configured to receive an input substrate (150a) and an output substrate (150b), respectively;
a filter assembly (110) positioned in the filter cavity (124) of the main enclosure (120), the filter assembly (110) comprising:
a top enclosure (114), and
a bottom enclosure (112), wherein the top enclosure (114) and the bottom enclosure (112) are seamlessly coupled together due to a snap-fit arrangement configured in the top enclosure (114) and the bottom enclosure (112), allows a substrate to be attached thereto, wherein the bottom enclosure (112) is configured with a first slot and a second slot for receiving a portion of signal coupling pins (115a, 115b), respectively; and
a conductive adhesive and metallic strips filled beneath the signal coupling pins (115a, 115b), and air channels (140a, 140b) between the filter assembly (110) and outer walls of the filter cavity (124), wherein the combination of the conductive adhesive and the metallic strips is configured to partially attenuate the propagation of waveguide and surface mode EM waves through air gaps (116) and the air channels (140a and 140b) while transmission of the radio frequency (RF) energy in the system (100).

2. The system (100) as claimed in claim 1, wherein the top and bottom enclosures (114, 112) are made of metallic materials, the filter assembly (110) corresponds to a metal-substrate-metal architecture due to the substrate being sandwiched between the top and bottom enclosures (114, 112) of the filter assembly (110), wherein this combination arrests modal propagation beyond 40GHz.

3. The system (100) as claimed in claim -1, wherein the air channels (140a, 140b) and beneath the signal coupling pins (115a, 115b) are filled with conductive adhesive and the metallic strips, for ensuring maximum RF energy transfer within the metal-substrate-metal architecture.

4. The system (100) as claimed in claim 1, wherein the combination of the conductive adhesive and the metallic strips is further configured to at least:
ensure the grounding of the filter assembly (110), thereby facilitating rejection skirt in the stop band frequency spectrum, and enabling seamless filtering action associated with the substrate, and
reduce the impedance associated with the air channels (140a, 140b).

5. The system (100) as claimed in claim 4, wherein the combination of the conductive adhesive and the metallic strips is further configured to at least reduce the potential difference between the top enclosure (114) and the main enclosure (120).

6. The system (100) as claimed in claim 1, wherein the conductive adhesive comprises a positive part and a negative part, and wherein the conductive adhesive is made of silver (Ag), and the metallic strips are made of Aluminum (Al).

7. The system (100) as claimed in claim 1, wherein the filter assembly (110) positioned in the filter cavity (124) is subjected to thermal curing at 85 degrees Celsius for a predefined time, thereby ensuring rigidity of the conductive adhesive and preventing movement of the metallic strips filled in the air channels (140a, 140b) and the air gaps.

8. The system (100) as claimed in claim 1, wherein the combination of the conductive adhesive and metallic strips of the filter assembly (110) attenuates the propagation of waveguide and surface mode EM waves by more than 20 decibels (dB).

9. The system (100) as claimed in claim 1, wherein the filter assembly (110) corresponds to an ultra-wide stop band millimeter (mm)-wave band pass filter (BPF).

10. A process (600) for assembling a filter assembly (110) in a system (100), the process (600) comprising the steps of:
assembling (602) the filter assembly (112) by stacking of a substrate onto a bottom enclosure (112) such that a portion of signal coupling pins (115a, 115b) of the filter assembly (112) is secured in corresponding first slot and second slot of the bottom enclosure (112);
stacking (602) a top enclosure (114) onto the substrate, thus forming a metal-substrate-metal architecture due to the substrate being sandwiched between the top enclosure (114) and the bottom enclosure (112);
mixing (604) positive and negative parts of conductive adhesive and allowing for amalgamation of silver particles onto the conductive adhesive;
assembling (606) the filter assembly (110) into a filter cavity (124) of the system (100);
attaching (606) a remaining portion of the signal couplings pins (115a, 115b) onto an input substrate (150a) and an output substrate (150b) via soldering technique;
aligning (608; 610) metallic strips within air channels (140a, 140b) and beneath the remaining portions of the signal coupling pins (115a, 115b) and applying the conductive adhesive therein;
performing (612) visual inspection of the filter assembly (110) stacked within a main enclosure (120) upon alignment of the metallic strips and applying the conductive adhesive;
allowing (614) thermal curing of the filter assembly (110) stacked within the main enclosure (120) at a temperature of for about 45 minutes;
upon completion of the thermal curing, conducting (616) an inspection of the filter assembly (110) stacked within the main enclosure (120) using an X-Ray scanning technique.