Description:BACKGROUND
Technical Field
[0001] The embodiments herein generally relate to a 360 degree image capturing and processing techniques, more particularly to a combined CMOS sensor in single chip and method thereof.
Description of the Related Art
[0002] Traditionally for capturing a 360 degree image, a device with four different CMOS sensors having four different periscope lens are used. The four different CMOS sensors occupies more space in a semiconductor chip and the sensors are expensive.
[0003] Accordingly, there remains a need for a combined CMOS sensor in a single chip and method thereof.
SUMMARY
[0004] Accordingly, the embodiments herein provide a combined complementary metal-oxide semiconductor (CMOS) sensor in a single chip. Characterised in that the chip includes a four angle periscope lens, and an image processor. The four angle periscope lens are integrated into the CMOS sensor. The four angle periscope lens includes a series of lenses and mirrors to create a folded optical path, enabling the light to be redirected within the chip to achieve 360 degree image capturing. The CMOS sensor converts the image captured from the four angle periscope lens into digital values through an image processor. The image conversion module is configured to convert the digital values into an image format file.
[0005] In some embodiments, the chip provides higher levels of optical zoom while capturing the image.
[0006] In some embodiments, the chip processes four views from the four angle periscope lens parallelly to obtain the 360 degree image.
[0007] In an aspect the embodiments herein further provides a method for providing a combined complementary metal-oxide semiconductor (CMOS) sensor in a single chip. Characterised in that the method includes integrating, by the chip, a four angle periscope lens into the CMOS sensor. The four angle periscope lens comprises a series of lenses and mirrors to create a folded optical path, enabling the light to be redirected within the chip to achieve 360 degree image capturing. The CMOS sensor converts the image captured from the four angle periscope lens into digital values through an image processor. The method further includes converting, by the chip, the digital values into an image format file.
[0008] In some embodiments, the chip provides higher levels of optical zoom while capturing the image.
[0009] In some embodiments, the chip processes four views from the four angle periscope lens parallelly to obtain the 360 degree image.
[00010] These and other aspects of the embodiments herein will be better appreciated and understood when considered in conjunction with the following description and the accompanying drawings. It should be understood, however, that the following descriptions, while indicating at least one embodiment and numerous specific details thereof, are given by way of illustration and not of limitation. Many changes and modifications may be made within the scope of the embodiments herein without departing from the spirit thereof, and the embodiments herein include all such modifications.
BRIEF DESCRIPTION OF THE DRAWINGS
[00011] The embodiments herein will be better understood from the following detailed description with reference to the drawings, in which:
[00012] FIG. 1 illustrates a block diagram of a combined CMOS sensor in a single chip, according to some embodiments as disclosed herein;
[00013] FIG. 2 illustrates a side view with cross section of periscope and lenses of a CMOS sensor, according to some embodiments as disclosed herein;
[00014] FIG. 3 illustrates a top view of the periscope lenses, according to some embodiments as disclosed herein;
[00015] FIG. 4 illustrates the combined CMOS sensor in the single chip, according to some embodiments as disclosed herein; and
[00016] FIG. 5 illustrates a method for providing a combined complementary metal-oxide semiconductor (CMOS) sensor in a single chip, according to some embodiments as disclosed herein.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[00017] The embodiments herein and the various features and advantageous details thereof are explained more fully with reference to the non-limiting embodiments that are illustrated in the accompanying drawings and detailed in the following description. Descriptions of well-known components and processing techniques are omitted so as to not unnecessarily obscure the embodiments herein. Also, the various embodiments described herein are not necessarily mutually exclusive, as some embodiments can be combined with one or more other embodiments to form new embodiments. The term “or” as used herein, refers to a non-exclusive or, unless otherwise indicated. The examples used herein are intended merely to facilitate an understanding of ways in which the embodiments herein can be practiced and to further enable those skilled in the art to practice the embodiments herein. Accordingly, the examples should not be construed as limiting the scope of the embodiments herein.
[00018] The accompanying drawings are used to help easily understand various technical features and it should be understood that the embodiments presented herein are not limited by the accompanying drawings. As such, the present disclosure should be construed to extend to any alterations, equivalents, and substitutes in addition to those which are particularly set out in the accompanying drawings. Although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are generally only used to distinguish one element from another.
[00019] As mentioned, there remains a need for a combined CMOS sensor in single chip and method thereof. The embodiments herein achieve this by embedding the four angle periscope lens into the CMOS sensor. Referring now to the drawings, and more particularly to FIGS. 1 to 5 where similar reference characters denote corresponding features consistently throughout the figures, there are shown preferred embodiments.
[00020] FIG. 1 illustrates a block diagram of a combined CMOS sensor in single chip 100, according to some embodiments as disclosed herein. The chip 100 includes a four angle periscope lens 104, and an image processor 106. The four angle periscope lens 104 is integrated into the CMOS sensor 102. The four angle periscope lens 104 includes a series of lenses and mirrors to create a folded optical path, enabling the light to be redirected within the chip to achieve 360 degree image capturing. The CMOS sensor 102 converts the image captured from the four angle periscope lens into digital values through an image processor 106. The image conversion module 108 is configured to convert the digital values into an image format file.
[00021] In some embodiments, the chip 100 provides higher levels of optical zoom while capturing the image. The chip 100 processes four views from the four angle periscope lens parallelly to obtain the 360 degree image.
[00022] Further, the image processor 106 is configured to execute instructions stored in the memory and to perform various processes. The memory also stores instructions to be executed by the processor 106. The memory may include non-volatile storage elements. Examples of such non-volatile storage elements may include magnetic hard discs, optical discs, floppy discs, flash memories, or forms of electrically programmable memories (EPROM) or electrically erasable and programmable (EEPROM) memories. In addition, the memory may, in some examples, be considered a non-transitory storage medium. The term “non-transitory” may indicate that the storage medium is not embodied in a carrier wave or a propagated signal. However, the term “non-transitory” should not be interpreted that the memory 504 is non-movable. In certain examples, a non-transitory storage medium may store data that can, over time, change (e.g., in Random Access Memory (RAM) or cache).
[00023] At least one of the plurality of modules may be implemented through the AI model. A function associated with AI may be performed through the non-volatile memory, the volatile memory, and the processor 106. The processor 106 may include one or a plurality of processors. The one or a plurality of processors may be a general-purpose processor, such as a central processing unit (CPU), an application processor (AP), or the like, a graphics-only processing unit such as a graphics processing unit (GPU), a visual processing unit (VPU), and/or an AI-dedicated processor such as a neural processing unit (NPU).
[00024] The one or a plurality of processors control the processing of the input data in accordance with a predefined operating rule or artificial intelligence (AI) model stored in the non-volatile memory and the volatile memory. The predefined operating rule or artificial intelligence model is provided through training or learning.
[00025] In some embodiments, system 100 include learning means that a predefined operating rule or AI model of a desired characteristic is made by applying a learning algorithm to a plurality of learning data. The learning may be performed in a device itself in which AI according to an embodiment is performed, and/or may be implemented through a separate server/system.
[00026] The AI model may include a plurality of neural network layers. Each layer has a plurality of weight values and performs a layer operation through calculation of a previous layer and an operation of a plurality of weights. Examples of neural networks include, but are not limited to, convolutional neural network (CNN), deep neural network (DNN), recurrent neural network (RNN), restricted Boltzmann Machine (RBM), deep belief network (DBN), bidirectional recurrent deep neural network (BRDNN), generative adversarial networks (GAN), and deep Q-networks.
[00027] The learning algorithm is a method for training a predetermined target device (for example, a robot) using a plurality of learning data to cause, allow, or control the target device to decide or prediction. Examples of learning algorithms include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning.
[00028] Although the FIG. 1 shows various hardware components of the chip 100 but it is to be understood that other embodiments are not limited thereon. In other embodiments, the chip 100 may include less or a greater number of components. Further, the labels or names of the components are used only for illustrative purpose and does not limit the scope of the invention. One or more components can be combined together to perform same or substantially similar function in the chip 100.
[00029] FIG. 2 illustrates a side view with cross section of periscope and lenses of a CMOS sensor, according to some embodiments as disclosed herein. A total dimension of joined integrated CMOS sensor is 13.72 mm x 10.84 mm.
[00030] FIG. 3 illustrates a top view of the periscope lenses, according to some embodiments as disclosed herein. The chip 100 with the four periscope lenses to capture the 360 degree image is shown.
[00031] FIG. 4 illustrates the combined CMOS sensor in the single chip, according to some embodiments as disclosed herein. The CMOS sensor includes the four angle periscope lenses 104.
[00032] FIG. 5 illustrates a method 500 for providing a combined complementary metal-oxide semiconductor (CMOS) sensor in a single chip, according to some embodiments as disclosed herein. At step 502, the method 500 includes integrating a four angle periscope lens into the CMOS sensor. The four angle periscope lens comprises a series of lenses and mirrors to create a folded optical path, enabling the light to be redirected within the chip to achieve 360 degree image capturing. At step 504, the method 500 further includes converting the image captured from the four angle periscope lens into digital values through image processor 106. At step 506, the method 500 further includes converting the digital values into an image format file through the image conversion module 108.
[00033] The various actions in method 500 may be performed in the order presented, in a different order or simultaneously. Further, in some embodiments, some actions listed in FIG. 5 may be omitted.
[00034] The embodiments disclosed herein can be implemented through at least one software program running on at least one hardware device and performing network management functions to control the elements. The elements can be at least one of a hardware device, or a combination of hardware device and software module.
[00035] The foregoing description of the specific embodiments will so fully reveal the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the scope of the embodiments as described herein.
, Claims:We claim:
1. A combined complementary metal-oxide semiconductor (CMOS) sensor (102) in a single chip (100), characterised in that the chip (100) comprising:
a four angle periscope lens (104) that is integrated into the CMOS sensor (102),
wherein the four angle periscope lens (104) comprises a series of lenses and mirrors to create a folded optical path, enabling the light to be redirected within the chip to achieve 360 degree image capturing,
wherein the CMOS sensor (102) converts the image captured from the four angle periscope lens into digital values through an image processor (106); and
an image conversion module (108) that is configured to convert the digital values into an image format file.
2. The chip (100) as claimed in claim 1, wherein chip (100) provides higher levels of optical zoom while capturing the image.
3. The chip (100) as claimed in claim 1, wherein chip (100) processes four views from the four angle periscope lens parallelly to obtain the 360 degree image.
4. A method for providing a combined complementary metal-oxide semiconductor (CMOS) sensor in a single chip (100), characterised in that the method comprising:
integrating, by the chip (100), a four angle periscope lens (104) into the CMOS sensor (102),
wherein the four angle periscope lens (104) comprises a series of lenses and mirrors to create a folded optical path, enabling the light to be redirected within the chip to achieve 360 degree image capturing,
converting the image captured from the four angle periscope lens (104) into digital values through image processor (106); and
converting the digital values into an image format file through an image conversion module (108).
5. The method as claimed in claim 4, wherein the chip (100) provides higher levels of optical zoom while capturing the image.
6. The method as claimed in claim 4, wherein the chip (100) processes four views from the four angle periscope lens parallelly to obtain the 360 degree image.