DESC:FIELD OF DISCLOSURE
The present disclosure relates to additive manufacturing systems, and more particularly to a thermally adaptive induction heating bed, system, and method thereof.
BACKGROUND
The present disclosure relates to the field of additive manufacturing, particularly to 3D printing systems and methods for controlling the temperature of the print bed. 3D printing, further known as additive manufacturing, is a process of creating three-dimensional objects by depositing materials layer by layer based on a digital model. 3D printing has gained significant popularity in recent years due to its ability to produce complex geometries, customized parts, and rapid prototyping capabilities.
Conventional 3D printing systems typically employ a heated print bed to ensure proper adhesion of the printed material to the build platform and to prevent warping or deformation of the printed object. The print bed is usually heated using a heating element attached below the surface of the bed, which heats the entire bed surface uniformly before the printing process begins. However, this approach has several limitations and drawbacks. Firstly, heating the entire print bed consumes a significant amount of energy, especially when trying to reach higher temperatures for printing high-performance materials. Secondly, the time required for the print bed to reach the desired temperature, known as the temperature ramp-up time, can be substantial, leading to longer overall print times. Additionally, conventional print beds are limited to having only one temperature zone, restricting the ability to print materials with different thermal properties simultaneously.
Moreover, existing 3D printing systems lack the capability to intelligently control the temperature of specific regions on the print bed based on the geometry and requirements of the object being printed. This limitation results in inefficient energy usage and potential safety concerns, such as fire hazards, due to the conventional heat ramp-up methods. Furthermore, the inability to create distinct temperature zones on the print bed hinders the flexibility and versatility of the 3D printing process, as it prevents the simultaneous printing of materials with varying thermal properties.
Therefore, there exists a need for a technical solution that solves the aforementioned problems of conventional print beds used in 3D printing applications.
SUMMARY
This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
In an aspect of the present disclosure, an induction heating setup is disclosed. The induction heating setup includes an induction heated bed comprising a plurality of induction coils arranged in a matrix configuration on the induction heated bed, each induction coil configured to generate heat, and a plurality of temperature sensors positioned proximate to the plurality of induction coils. The induction heating setup further includes a heated bed controller operatively coupled to the plurality of induction coils, the heated bed controller configured to independently control a temperature of each induction coil of the plurality of induction coils based on a temperature feedback received from a corresponding temperature sensor of the plurality of temperature sensors.
In some aspects of the present disclosure, the plurality of induction coils are arranged in a grid pattern on the induction heated bed forming a NxN matrix. The induction heating setup further comprises a plurality of connectors, each connector configured to electrically couple a respective induction coil to the heated bed controller. The heated bed controller is configured to regulate power supplied to each induction coil to create distinct temperature regions on a surface of the induction heated bed. The distinct temperature regions are adapted to suit specific requirements of a 3D printing application.
In another aspect of the present disclosure, a thermally adaptive induction heating system for a 3D printer is disclosed. The system includes an induction heating setup comprising an induction heated bed with a plurality of induction coils arranged in a matrix configuration, each induction coil configured to generate heat, and a plurality of temperature sensors positioned proximate to the plurality of induction coils. The system further includes a heated bed controller operatively coupled to the plurality of induction coils, the heated bed controller configured to independently control a temperature of each induction coil based on a temperature feedback received from a corresponding temperature sensor. The system further includes a power supply operatively coupled to the induction heating setup and configured to supply power to the plurality of induction coils.
In some aspects of the present disclosure, the plurality of induction coils are arranged in a grid pattern on the induction heated bed forming a NxN matrix. The heated bed controller is further configured to create distinct temperature regions on a surface of the induction heated bed by independently controlling the temperature of each coil in the NxN matrix. The system further comprises a 3D printer mainboard operatively coupled to the heated bed controller, the 3D printer mainboard configured to send control signals to the heated bed controller to coordinate a heating operation of the induction heated bed with a 3D printing process, and receive status information from the heated bed controller regarding the heating operation of the induction heated bed.
In yet another aspect of the present disclosure, a method for controlling a thermally adaptive induction heating system for a 3D printer is disclosed. The method includes receiving, by a heated bed controller (112), a target temperature signal from a 3D printer mainboard of the thermally adaptive induction heating system. The method includes receiving, by the heated bed controller, a temperature feedback from each of a plurality of temperature sensors, each temperature sensor positioned proximate to a corresponding induction coil arranged in a matrix configuration on an induction heated bed. The method further includes determining, by the heated bed controller, a temperature of each cell in the matrix configuration based on the temperature feedback, and independently controlling, by the heated bed controller, a temperature of each cell by regulating power supplied to each corresponding induction coil based on the determined temperature and a target temperature for each cell.
In some aspects of the present disclosure, the method further includes receiving, by the heated bed controller, a control signal from a 3D printer mainboard, the control signal indicating the target temperature for each cell, and coordinating, by the heated bed controller, the independent temperature control of each cell with a 3D printing process based on the received control signal. The method further includes creating distinct temperature regions on a surface of the induction heated bed by independently controlling the temperature of each cell in the NxN matrix, and sending, by the heated bed controller, status information to the 3D printer mainboard regarding the distinct temperature regions on the surface of the induction heated bed.
The foregoing general description of the illustrative aspects and the following detailed description thereof are merely exemplary aspects of the teachings of this disclosure and are not restrictive.
BRIEF DESCRIPTION OF FIGURES
The following detailed description of the preferred aspects of the present disclosure will be better understood when read in conjunction with the appended drawings. The present disclosure is illustrated by way of example, and not limited by the accompanying figures, in which like references indicate similar elements.
FIG. 1 illustrates a block diagram of a thermally adaptive induction heating system, according to aspects of the present disclosure;
FIG. 2 illustrates a diagram of an induction heating setup of the thermally adaptive induction heating system, according to aspects of the present disclosure; and
FIG. 3 illustrates a flowchart for a method of controlling a thermally adaptive induction heating system, according to aspects of the present disclosure.

DETAILED DESCRIPTION
The following description sets forth exemplary aspects of the present disclosure. It should be recognized, however, that such description is not intended as a limitation on the scope of the present disclosure. Rather, the description further encompasses combinations and modifications to those exemplary aspects described herein.
The present disclosure provides a thermally adaptive induction heating system for additive manufacturing or 3D printing. The system includes an induction heated bed with a matrix of induction coils and temperature sensors. The induction coils, arranged in a specific configuration, are capable of generating heat, while the temperature sensors are strategically positioned near the induction coils. The system further includes a heated bed controller that is operatively coupled to the induction coils. The controller is designed to independently control the temperature of each induction coil based on temperature feedback received from the corresponding temperature sensor.
This unique configuration allows for precise control of localized heating zones on the print bed, enabling efficient heat distribution across the bed. The system can dynamically manage temperature profiles across the bed surface, optimizing efficiency and minimizing power consumption. The induction heating system can adapt to the specific requirements of the 3D model being printed, intelligently heating only the necessary areas of the print bed. This not only reduces the heat ramp-up time but further significantly decreases energy consumption.
Furthermore, the system is capable of creating multiple thermal zones on the print bed, allowing for the simultaneous printing of materials with varying thermal properties. This adds a level of versatility and customization to the 3D printing process, enabling the creation of highly adaptable products. The system further offers potential for an improved inductive auto-leveling setup by utilizing the printer bed as both the heat source and sensor, thereby reducing the mass and complexity of the printhead assembly.
In addition to the above, the system further addresses safety concerns associated with conventional heat ramp-up methods. The induction coils heat up the surface of the heated bed directly, significantly reducing the risk of fire mishaps.
The thermally adaptive induction heating system disclosed herein provides a novel and efficient solution to the challenges faced in the field of additive manufacturing, particularly in relation to print bed temperature control, energy consumption, and safety.
FIG. 1 illustrates a block diagram of a thermally adaptive induction heating system 100. The system 100 may include an induction heating setup 102 having an induction heated bed 104 and a heated bed controller 112. The system 100 may further include a power supply 114, and a 3D printer mainboard/controller 116.
The induction heating setup 102 may be configured to generate heat in the induction heated bed 104 by inducing eddy currents in induction coils 108 of the induction heated bed 104. The induction heating setup 102 may be further configured to sense temperatures at various locations on the induction heated bed 104 using a plurality of temperature sensors 110. Examples of the induction heating setup 102 may include, but are not limited to, an induction heater, an induction cooker, an induction furnace, or any other induction heating apparatus. Aspects of the present disclosure are intended to include and/or otherwise cover any type of induction heating setup 102 known to a person having ordinary skill in the art, without deviating from the scope of the present disclosure.
The induction heated bed 104 may be configured to provide a surface for 3D printing. The induction heated bed 104 may have an NxN matrix configuration, where each cell of the matrix represents a heating zone. In the example shown in FIG. 1, a 3x3 matrix is depicted with cells labeled as first cell 106a, second cell 106b, third cell 106c, fourth cell 106d, fifth cell 106e, sixth cell 106f, seventh cell 106g, eighth cell 106h, and ninth cell 106i. Each cell 106a-106i of the matrix 106 may include an induction coil 108a-108i from the plurality of coils 108 and a temperature sensor 110a-110i from the plurality of temperature sensors 110. The induction coils 108a-108i may be configured to generate heat when supplied with power, while the temperature sensors 110a-110i may be configured to sense the temperature at their respective locations and provide temperature feedback. Such arrangement allows for precise temperature control of individual heating zones on the induction heated bed 104.
In some aspects of the present disclosure, the induction coils 108a-108i may be surrounded by a high thermal resistance material to prevent heat from traveling from one coil to adjacent coils. Similarly, a high thermally resistive material may be used on the heating surface in a grid pattern corresponding to the matrix configuration. This minimizes heat transfer between different elements and ensures low power consumption. Aspects of the present disclosure are intended to include and/or otherwise cover any type of high thermally resistive material known to a person having ordinary skill in the art, without deviating from the scope of the present disclosure.
The induction heated bed 104 may be made of a material with good thermal conductivity and magnetic permeability to facilitate efficient induction heating. Examples of the induction heated bed 104 may include, but are not limited to, a metal plate, a ceramic plate with embedded susceptors, a polymer-matrix composite, or any other material suitable for induction heating. Aspects of the present disclosure are intended to include and/or otherwise cover any type of induction heated bed 104 known to a person having ordinary skill in the art, without deviating from the scope of the present disclosure.
The heated bed controller 112 may include suitable logic, circuitry, interfaces, and/or code that may be configured to independently control the temperature of each induction coil 108a-108i based on the temperature feedback received from the corresponding temperature sensor 110a-110i. The heated bed controller 112 may be operatively coupled to the plurality of induction coils 108 and may regulate the power supplied to each coil to create distinct temperature regions on the surface of the induction heated bed 104. These distinct temperature regions may be adapted to suit specific requirements of the 3D printing application.
In some aspects of the present disclosure, the heated bed controller 112 may be further configured to create distinct temperature regions on a surface of the induction heated bed 104 by independently controlling the temperature of each coil 108a-108i in the NxN matrix 106.
The heated bed controller 112 may communicate with the 3D printer mainboard 116 to coordinate the heating operation with the overall 3D printing process. The print bed may adapt using a hybrid closed-loop feedback mechanism that accepts both computer-generated signals from the 3D printer mainboard 116 and human-induced parameters to control the printer bed matrix, manipulating the temperature of one or more elements with the help of PID control and temperature sensors. The human induced parameter may include one or more inputs provided by a user. In some embodiments of the present disclosure, the one or more inputs may include, but not limited to, G-codes. Aspects of the present disclosures are intended to include or otherwise cover inputs in any form without deviating from the scope of the present disclosure.
Examples of the heated bed controller 112 may include, but are not limited to, a microcontroller, a PID controller, a programmable logic controller (PLC), or any other control device capable of regulating temperature. Aspects of the present disclosure are intended to include and/or otherwise cover any type of heated bed controller 112 known to a person having ordinary skill in the art, without deviating from the scope of the present disclosure.
The power supply 114 may be configured to provide electrical power to the various components of the system 100, particularly the induction heating setup 102. The power supply 114 may be operatively coupled to the induction heating setup 102 and may supply the necessary power to the plurality of induction coils 108 for generating heat. Examples of the power supply 114 may include, but are not limited to, an AC power supply, a DC power supply, a switched-mode power supply (SMPS), or any other type of electrical power source. Aspects of the present disclosure are intended to include and/or otherwise cover any type of power supply 114 known to a person having ordinary skill in the art, without deviating from the scope of the present disclosure.
The 3D printer mainboard 116 may include suitable logic, circuitry, interfaces, and/or code that may be configured to control the overall operation of the 3D printer. The 3D printer mainboard 116 may be operatively coupled to the heated bed controller 112 and may send control signals to coordinate the heating operation of the induction heated bed 104 with the 3D printing process. The 3D printer mainboard 116 may further receive status information from the heated bed controller 112 regarding the heating operation. Examples of the 3D printer mainboard 116 may include, but are not limited to, a microcontroller board, a single-board computer, or any other control board used in 3D printers. Aspects of the present disclosure are intended to include and/or otherwise cover any type of 3D printer mainboard 116 known to a person having ordinary skill in the art, without deviating from the scope of the present disclosure.
In operation, the system 100 enables precise temperature control of individual heating zones on the induction heated bed 104 by independently regulating the power supplied to each induction coil 108a-108i based on the temperature feedback from the corresponding temperature sensor 110a-110i and the one or more inputs provided by the user. The heated bed controller 112 manages the operation of the heating zones and communicates with the 3D printer mainboard 116 to coordinate the heating with the overall 3D printing process. The power supply 114 provides the necessary electrical power to the induction heating setup 102 for generating heat in the induction coils 108.
The thermally adaptive induction heating system 100 allows for efficient and targeted heating of the print bed, optimizing the 3D printing process and enabling the creation of objects with varying thermal properties. The invention provides several advantages, such as reduced heat ramp-up time, improved power efficiency, intelligent heating based on the surface requirement of the 3D model, and a safer method of heating. This potentially decreases print preparation time, improves PID control of the heated bed, and further decreases heating time through intelligent heating of coils. The ability to simultaneously use various materials with distinct thermal properties offers versatility and customization possibilities, resulting in highly adaptable products. Furthermore, the system 100 may provide a competitive advantage to businesses in the metal 3D printing industry through improved efficiency, lower costs, and higher-quality prints.
FIG. 2 illustrates a diagram of an induction heating setup of the thermally adaptive induction heating system, according to aspects of the present disclosure. The induction heated bed 104 may include a NxN matrix of induction coils labeled first coil 108a through ninth coil 108i. Each coil 108a-108i is connected to the heated bed controller 112 via a corresponding connector, labeled first connector 200a through ninth connector 200i.
The plurality of connectors 200 may be configured to electrically couple the induction coils 108 to the heated bed controller 112. Each connector 200a-200i may be associated with a respective induction coil 108a-108i and may facilitate the supply of power to the coil and the transmission of temperature feedback from the corresponding temperature sensor. In some aspects of the present disclosure, the plurality of connectors 200, e.g., each connector 200a-200i may be configured to electrically couple a respective induction coil 108a-108i to the heated bed controller 112. The connectors 200 may be designed to handle the required current and voltage levels for the induction heating operation. Examples of the connectors 200 may include, but are not limited to, screw terminals, soldered connections, plug-and-socket connectors, or any other type of electrical connector suitable for the application. Aspects of the present disclosure are intended to include and/or otherwise cover any type of connector 200 known to a person having ordinary skill in the art, without deviating from the scope of the present disclosure.
The coils 108a-108i are arranged in a grid pattern on the induction heated bed 104, forming a 3x3 matrix. The first coil 108a is located in the top left corner, followed by the second coil 108b and third coil 108c in the top row. The fourth coil 108d, fifth coil 108e, and sixth coil 108f are positioned in the middle row. The seventh coil 108g, eighth coil 108h, and ninth coil 108i are situated in the bottom row. This matrix arrangement allows for the creation of distinct temperature regions on the surface of the induction heated bed 104 by independently controlling the temperature of each coil. The heated bed controller 112 is connected to each coil through its respective connector, enabling individual regulation of the power supplied to each coil based on the temperature feedback from the corresponding temperature sensor. This configuration provides flexibility in adapting the heating profile to suit specific requirements of the 3D printing application.
In some aspects of the present disclosure, the plurality of induction coils 108 may be arranged in a grid pattern on the induction heated bed 104 forming an NxN matrix 106.
The induction heating setup 102 may further have the potential to provide anadaptive auto bed leveling feature by using the inductive coils 108 that create a magnetic field. The magnetic field can be received by a fixed or moving inductive probe, which can effectively and accurately calculate the distance error from the extruder nozzle or probe to the print bed and calibrate the coordinate system or z-axis actuation based on this information. This setup reduces the mass and complexity of the printhead assembly while enhancing the auto bed leveling functionality.
FIG. 3 illustrates a flowchart for a method 300 of controlling a thermally adaptive induction heating system 100 for a 3D printer.
At step 302, the heated bed controller 112 receives a target temperature signal from the 3D printer mainboard 116. The target temperature signal indicates the desired temperature for each cell 106a-106i in the matrix configuration of the induction heated bed 104.
At step 304, the heated bed controller 112 receives temperature feedback from each of the plurality of temperature sensors 110a-110i. Each temperature sensor 110a-110i is positioned proximate to a corresponding induction coil 108a-108i arranged in the matrix configuration on the induction heated bed 104.
At step 306, the heated bed controller 112 determines the temperature of each cell 106a-106i in the matrix configuration based on the temperature feedback received from the corresponding temperature sensor 110a-110i.
At step 308, the heated bed controller 112 independently controls the temperature of each cell 106a-106i by regulating the power supplied to each corresponding induction coil 108a-108i. The power regulation is based on the determined temperature of the cell and the target temperature received from the 3D printer mainboard 116. In some embodiments of the present disclosure, the target temperature received from the 3D printer mainboard 116 may be provided by the user.
At step 310, the heated bed controller 112 receives a control signal from the 3D printer mainboard 116. The control signal provides instructions for coordinating the heating operation of the induction heated bed 104 with the overall 3D printing process.
At step 312, the heated bed controller 112 coordinates the independent temperature control of each cell 106a-106i with the 3D printing process based on the received control signal from the 3D printer mainboard 116.
At step 314, the heated bed controller 112 creates distinct temperature regions on the surface of the induction heated bed 104 by independently controlling the temperature of each cell 106a-106i in the matrix. The temperature regions are adapted to suit the specific requirements of the 3D printing application.
At step 316, the heated bed controller 112 sends status information to the 3D printer mainboard 116 regarding the distinct temperature regions created on the surface of the induction heated bed 104. This allows the 3D printer mainboard 116 to monitor and adjust the printing process based on the thermal conditions of the print bed.
The method 300 enables precise temperature control of individual cells in the matrix configuration of the induction heated bed 104 based on temperature feedback from the sensors and target temperatures received from the 3D printer mainboard 116. By coordinating the temperature control with the 3D printing process and creating distinct temperature regions on the bed surface, the method 300 provides a flexible and adaptive approach to heating the print bed, optimizing the 3D printing process and enabling the creation of objects with varying thermal properties.
Thus, the system 100, the setup 102, and the method 300 provide several technical advantages. Firstly, they enable precise temperature control of individual heating zones on the induction heated bed 104, allowing for efficient and targeted heating based on the specific requirements of the 3D model being printed. Secondly, the system can dynamically manage temperature profiles across the bed surface, optimizing efficiency and minimizing power consumption. Thirdly, the induction heating system significantly reduces the heat ramp-up time and energy consumption by intelligently heating only the necessary areas of the print bed. Fourthly, the system is capable of creating multiple thermal zones on the print bed, enabling the simultaneous printing of materials with varying thermal properties, which adds versatility and customization possibilities to the 3D printing process. Lastly, the direct heating method employed by the induction coils minimizes the risk of fire mishaps associated with conventional heat ramp-up methods, enhancing the overall safety of the 3D printing process.
Aspects of the present disclosure are discussed here with reference to flowchart illustrations and block diagrams that depict methods, systems, and apparatus in accordance with various aspects of the present disclosure. Each block within these flowcharts and diagrams, as well as combinations of these blocks, can be executed by computer-readable program instructions. The various logical blocks, modules, circuits, and algorithm steps described in connection with the disclosed aspects may be implemented through electronic hardware, software, or a combination of both. To emphasize the interchangeability of hardware and software, the various components, blocks, modules, circuits, and steps are described generally in terms of their functionality. The decision to implement such functionality in hardware or software is dependent on the specific application and design constraints imposed on the overall system. Person having ordinary skill in the art can implement the described functionality in different ways depending on the particular application, without deviating from the scope of the present disclosure.
The flowcharts and block diagrams presented in the figures depict the architecture, functionality, and operation of potential implementations of systems, methods, and apparatus according to different aspects of the present disclosure. Each block in the flowcharts or diagrams may represent an engine, segment, or portion of instructions comprising one or more executable instructions to perform the specified logical function(s). In some alternative implementations, the order of functions within the blocks may differ from what is depicted. For instance, two blocks shown in sequence may be executed concurrently or in reverse order, depending on the required functionality. Each block, and combinations of blocks, can further be implemented using special-purpose hardware-based systems that perform the specified functions or tasks, or through a combination of specialized hardware and software instructions.
Although the preferred aspects have been detailed here, it should be apparent to those skilled in the relevant field that various modifications, additions, and substitutions can be made without departing from the scope of the disclosure. These variations are thus considered to be within the scope of the disclosure as defined in the following claims.
Features or functionalities described in certain example aspects may be combined and re-combined in or with other example aspects. Additionally, different aspects and elements of the disclosed example aspects may be similarly combined and re-combined. Further, some example aspects, individually or collectively, may form components of a larger system where other processes may take precedence or modify their application. Moreover, certain steps may be required before, after, or concurrently with the example aspects disclosed herein. It should be noted that any and all methods and processes disclosed herein can be performed in whole or in part by one or more entities or actors in any manner.
Although terms like "first," "second," etc., are used to describe various elements, components, regions, layers, and sections, these terms should not necessarily be interpreted as limiting. They are used solely to distinguish one element, component, region, layer, or section from another. For example, a "first" element discussed here could be referred to as a "second" element without departing from the teachings of the present disclosure.
The terminology used here is intended to describe specific example aspects and should not be considered as limiting the disclosure. The singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "includes," "comprising," and "including," as used herein, indicate the presence of stated features, steps, elements, or components, but do not exclude the presence or addition of other features, steps, elements, or components.
As used herein, the term "or" is intended to be inclusive, meaning that "X employs A or B" would be satisfied by X employing A, B, or both A and B. Unless specified otherwise or clearly understood from the context, this inclusive meaning applies to the term "or."
Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the relevant art. Terms should be interpreted consistently with their common usage in the context of the relevant art and should not be construed in an idealized or overly formal sense unless expressly defined here.
The terms "about" and "substantially," as used herein, refer to a variation of plus or minus 10% from the nominal value. This variation is always included in any given measure.
In cases where other disclosures are incorporated by reference and there is a conflict with the present disclosure, the present disclosure takes precedence to the extent of the conflict, or to provide a broader disclosure or definition of terms. If two disclosures conflict, the later-dated disclosure will take precedence.
The use of examples or exemplary language (such as "for example") is intended to illustrate aspects of the invention and should not be seen as limiting the scope unless otherwise claimed. No language in the specification should be interpreted as implying that any non-claimed element is essential to the practice of the invention.
While many alterations and modifications of the present invention will likely become apparent to those skilled in the art after reading this description, the specific aspects shown and described by way of illustration are not intended to be limiting in any way.
A number of implementations have been described. Nevertheless, it will be understood that various modifications may be made without departing from the scope of the disclosure. Accordingly, other implementations are within the scope of the following claims. ,CLAIMS:1. An induction heating setup (102) comprising:
an induction heated bed (104) comprising:
a plurality of induction coils (108) arranged in a matrix configuration on the induction heated bed (104) such that each induction coil (108a-108i) of the plurality of induction coils (108) configured to generate heat; and
a plurality of temperature sensors (110) positioned proximate to the plurality of induction coils (108); and
a heated bed controller (112) operatively coupled to the plurality of induction coils (108) such that the heated bed controller (112) is configured to independently control a temperature of each induction coil (108a-108i) of the plurality of induction coils (108) based on a temperature feedback received from a corresponding temperature sensor (110a-110i) of the plurality of temperature sensors (110).

2. The induction heating setup (102) as claimed in claim 1, wherein the plurality of induction coils (108) are arranged in a grid pattern on the induction heated bed (104) to form an NxN matrix.

3. The induction heating setup (102) as claimed in claim 1, further comprising a plurality of connectors (200) such that each connector (200a-200i) of the plurality of connectors (200) is configured to electrically couple a respective induction coil (108a-108i) to the heated bed controller (112).

4. The induction heating setup (102) as claimed in claim 1, wherein the heated bed controller (112) is configured to regulate power supplied to each induction coil (108a-108i) of the plurality of induction coils (108) to create distinct temperature regions on a surface of the induction heated bed (104).
5. The induction heating setup (102) as claimed in claim 1, wherein each induction coil (108a-108i) of the plurality of induction coils (108) are surrounded by a high thermal resistance material to prevent heat from traveling from one coil to adjacent coils.

6. A thermally adaptive induction heating system (100) for a 3D printer, the system (100) comprising:
an induction heating setup (102) including:
an induction heated bed (104) comprising:
a plurality of induction coils (108) arranged in a matrix configuration on the induction heated bed (104), each induction coil (108a-108i) of a plurality of induction coils (108) is configured to generate heat; and
a plurality of temperature sensors (110) positioned proximate to the plurality of induction coils (108); and
a heated bed controller (112) operatively coupled to the plurality of induction coils (108) such that the heated bed controller (112) is configured to independently control a temperature of each induction coil (108a-108i) of the plurality of induction coils (108) based on a temperature feedback received from a corresponding temperature sensor (110a-110i) of the plurality of temperature sensors (110); and
a power supply (114) operatively coupled to the induction heating setup (102) and configured to supply power to the plurality of induction coils (108).

7. The thermally adaptive induction heating system (100) as claimed in claim 6, wherein the plurality of induction coils (108) are arranged in a grid pattern on the induction heated bed (104) to form an NxN matrix such that the NxN matrix represents a matrix having N number of rows and N number of columns.

8. The thermally adaptive induction heating system (100) as claimed in claim 6, wherein the heated bed controller (112) is further configured to regulate the power supply to each induction coil (108a-108i) of the plurality of induction coils (108) to create distinct temperature regions on a surface of the induction heated bed (104).

9. The thermally adaptive induction heating system (100) as claimed in claim 6, wherein each of the induction coils (108) are surrounded by a high thermal resistance material to prevent heat from traveling from one coil to adjacent coils.

10. The thermally adaptive induction heating system (100) as claimed in claim 7, further comprising a 3D printer mainboard (116) operatively coupled to the heated bed controller (112) wherein the 3D printer mainboard (116) is configured to:
send control signals to the heated bed controller (112) to coordinate a heating operation of the induction heated bed (104) with a 3D printing process; and
receive status information from the heated bed controller (112) regarding the heating operation of the induction heated bed (104).

11. A method (300) for controlling a thermally adaptive induction heating system (100) for a 3D printer, the method (300) comprising:
receiving (302), by way of a heated bed controller (112), a target temperature signal from a 3D printer mainboard (116) of the thermally adaptive induction heating system (100);
receiving (304), by way of the heated bed controller (112), a temperature feedback from each temperature sensor (110a-110i) of a plurality of temperature sensors (110a-110i) wherein each temperature sensor (110a-110i) of the plurality of temperature sensors (110) is positioned proximate to each induction coil (108a-108i) of the plurality of induction coils (108) arranged in a matrix configuration on an induction heated bed (104);
determining (306), by way of the heated bed controller (112), a temperature of each cell of a plurality of cells (106a-106i) in the matrix configuration based on the temperature feedback; and
independently controlling (308), by way of the heated bed controller (112), a temperature of each cell of the plurality of cells (106a-106i) by regulating power supplied to each induction coil (108a-108i) of the plurality of induction coils (108) based on the determined temperature and a target temperature for each cell of the plurality of cells (106a-106i).

12. The method (300) as claimed in claim 12, further comprising:
receiving (310), by way of the heated bed controller (112), a control signal from a 3D printer mainboard (116) wherein the control signal indicates the target temperature for each cell of the plurality of cells (106a-106i); and
coordinating (312), by way of the heated bed controller (112), the independent temperature control of each cell of the plurality of cells (106a-106i) with a 3D printing process based on the received control signal.

13. The method (300) as claimed in claim 12, further comprising:
creating (314), by way of the heated bed controller (112), distinct temperature regions on a surface of the induction heated bed (104) by independently controlling the temperature of each cell of the plurality of cells (106a-106i) in the matrix configuration; and
sending (316), by way of the heated bed controller (112), status information to the 3D printer mainboard (116) regarding the distinct temperature regions on the surface of the induction heated bed (104).