Description:FIELD OF THE INVENTION
[001] The present invention relates to a control unit. More particularly, the present invention relates to a cooling system for a control unit.

BACKGROUND OF THE INVENTION
[002] Control units find applications in almost all industries today. For example, control unit in a vehicle is responsible for performing various functions of the vehicle. Similarly, critical industrial processes are controlled using control units. Proper functioning of control units is, therefore, of utmost importance. One of the reasons for inefficient working of a control unit is improper dissipation of heat generated by the electronic components in the control unit. The electronic components responsible for generating heat include resistors, capacitors, inductors, transformers, semiconductors, integrated circuits (ICs), etc.
[003] In order to dissipate heat from the control unit, one or more air cooling fans are generally used in the control unit. However, the cooling fans are large in size and leads to difficulty in assembly and packaging of the control unit in various applications. Further, the cooling fans can also recirculate hot air inside the control unit which defeats the purpose of a cooling fan for cooling the control unit. Moreover, the cooling fans only cool certain areas of the control unit which are in proximity with the fins of the cooling fan and do not cool the control unit uniformly. This can lead to improper cooling and decreased efficiency of the control unit, which is undesirable.
[004] In view of the foregoing, it is desirable to overcome at least the above-mentioned disadvantages mentioned in the prior art.

SUMMARY OF THE INVENTION
[005] The present invention discloses a cooling system for a control unit. The control system comprises one or more electronic components and a cooling system. The cooling system comprises a heat sink in contact with the one or more electronic components. The heat sink is adapted to receive one or more heat transfer pipes containing a fluid capable of absorbing heat in a hot region of the heat sink and dissipating the absorbed heat in a cold region of the control unit.
[006] In an embodiment, the heat sink comprises a body and one or more channels. The one or more channels extend through the body of the heat sink. The one or more channels extend at least partially along at least one of a length and a breadth of the body of the heat sink. The one or more heat transfer pipes are received in the one or more channels.
[007] In an embodiment, shape and profile of the one or more channels confirms to shape and profile of the one or more heat transfer pipes.
[008] In an embodiment, the one or more heat transfer pipe and the channels are provided below the one or more electronic components of the control unit.
[009] In an embodiment, the hot region of the control unit is proximate to the one or more electronic components and the cold region of the control unit is distal from the one or more electronic components. The hot region and the cold region are opposite to each other.
[010] In an embodiment, the plurality of heat transfer pipes is located at an equal distance from each other.
[011] In an embodiment, the fluid is a phase change material such as, not being limited to, liquid paraffin.
[012] In an embodiment, the cold region of the heat sink is provided with one or more first cooling fins. The one or more cooling fins can also be provided in a region proximate to the cold region of the control unit.

BRIEF DESCRIPTION OF THE DRAWINGS
[013] Reference will be made to embodiments of the invention, examples of which may be illustrated in accompanying figures. These figures are intended to be illustrative, not limiting. Although the invention is generally described in context of these embodiments, it should be understood that it is not intended to limit the scope of the invention to these particular embodiments.
Figure 1 and Figure 2 illustrate a perspective view of a cooling system of a control unit, in accordance with an embodiment of the present invention.
Figure 3 and Figure 4 illustrate a top view of the cooling system of the control unit, in accordance with the embodiment of the present invention.
Figure 5 illustrates a front view of the cooling system of the control unit, in accordance with an embodiment of the present invention.
Figure 6 illustrates a rear view of the cooling system of the control unit, in accordance with an embodiment of the present invention.
Figure 7 illustrates a sectional view of the cooling system of the control unit cut along line A-A of Figure 5, in accordance with an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION
[014] Various features and embodiments of the present invention here will be discernible from the following further description thereof, set out hereunder.
[015] Figure 1 and Figure 2 illustrate a perspective view of a cooling system of a control unit 100, in accordance with an embodiment of the present invention.
[016] The control unit 100 comprises one or more electronic components 102 and a cooling system. The cooling system comprises a heat sink 104 in contact with one or more electronic components 102 of the control unit 100. The heat sink 104 is adapted to receive one or more heat transfer pipes 106. The heat transfer pipes 106 contain a fluid capable of absorbing heat in a hot region HR of the heat sink 104 and dissipating the absorbed heat in a cold region CR of the heat sink 104.
[017] In an embodiment, as shown in Figure 1 and Figure 2, the heat sink 104 comprises a body 104a and one or more channels 104b extending at least partially through the body 104a. In a non-limiting example, the channels 104b extend at least partially along a length L of the body 104a. In a non-limiting example, as shown in Figure 1 and Figure 2, the channels 104b extend at least partially along a breadth B of the body 104a. In a non-limiting examples, the channels 104b extend at least partially along a length L as well as breadth B of the body 104a. The one or more channels 104b are adapted to receive the one or more heat transfer pipes 106. In a non-limiting example, the one or more heat transfer pipes 106 are snugly received in the one or more channels 104b. The term “snugly fit” in the context of the present invention refers to zero allowance between the channels 104b and the heat transfer pipes 106. The heat transfer pipes 106 show least vibrations in the channels with this type of fit. As can be clearly seen in the Figure 2, the shape and profile of the one or more channels 104b confirm to the shape and profile of the one or more heat transfer pipes 106. In a non-limiting example, the shape of channel 104b and the heat transfer pipe 106 is a square shape. In a non-limiting example, the shape of channel 104b and heat transfer pipe 106 is a rectangular shape. In a non-limiting example, the shape of channel 104b and heat transfer pipe 106 is an oval shape. In a non-limiting example, the shape of channel 104b and heat transfer pipe 106 is a circular shape. However, the defined shapes of the channels 104b and the heat transfer pipes 106 in above-mentioned examples should not be construed as limiting and the other regular or irregular shapes of the channels 104b and the heat transfer pipes 106 are well within the scope of the present invention.
[018] In an embodiment, the heat transfer pipe 106 is a heat transfer device using phase-change of the fluid to dissipate heat absorbed in the hot region HR of the heat sink 104 to a cold region CR of the heat sink 104. The simplest type of heat transfer pipe 106 comprises two basic parts, a hermetically sealed container (not shown) having a fluid as a working medium.
[019] In a non-limiting example, the heat transfer pipe 106 comprises an evaporator section (not shown) and a condensation section (not shown). The section of the heat pipe 106 between the evaporator section and the condensation section is an adiabatic section (not shown) i.e., a section which does not allow heat transfer in or out of the heat transfer pipe. In the evaporator section, the heat generated by the one or more electronic components 102 is absorbed by the fluid (which is in a liquid state) and turns the fluid from the liquid state to a vapor state. The fluid in the vapor state flows to the condensation section. In the condensation section, the heat is dissipated and the fluid changes from the vapor state to the liquid state. The movement of fluid from the condensation section to the evaporator section and vice versa is either achieved by means of a wick or using the principle of gravity. However, this construction of the heat transfer pipe 106 should not be construed as limiting and now known or later developed construction of heat transfer pipes 106 are well within the scope of the present invention.
[020] In a non-limiting example, the fluid is a phase change material such as, not being limited to, liquid paraffin. However, other type of now known or later developed condensate fluids are also within the scope of the present invention.
[021] Figure 3 and Figure 4 illustrate a top view of the cooling system of the control unit 100, in accordance with the embodiment of the present invention. Figure 5 illustrates a front view of the cooling system of the control unit 100, in accordance with the embodiment of the present invention. Figure 6 illustrates a rear view of the cooling system of the control unit 100, in accordance with an embodiment of the present invention. Figure 7 illustrates a sectional view of the cooling system of the control unit 100 cut along line A-A of Figure 5, in accordance with an embodiment of the present invention.
[022] As shown, the one or more heat transfer pipes 106 and the channels 104b are provided below the one or more electronic components 102 of the control unit 100. This will ensure that cooling is not localized to one area of the control unit 100 and result in uniform cooling of the control unit 100. Also, as shown in Figure 4, the hot region HR of the heat sink 104 is proximate to the one or more electronic components 102 and the cold region CR of the heat sink 104 is distal from the one or more electronic components 102. The hot region HR and the cold region CR of the heat sink 104 are opposite to each other. It is to be understood that evaporator sections of the heat transfer pipes 106 are in the hot region HR of the heat sink 104 and the condensation sections of the heat transfer pipes 106 are in the cold region CR of the heat sink 104. In an embodiment, the plurality of heat transfer pipes 106 are located at an equal distance from each other. To further facilitate the cooling of the control unit 100, one or more cooling fins (not shown) may be provided in the cold region CR of the control unit 100 or in a region proximate to the cold region CR of the control unit 100
[023] The claimed features/method steps of the present invention as discussed above are not routine, conventional, or well understood in the art, as the claimed features/steps enable the following solutions to the existing problems in conventional technologies. Specifically, the technical problem of effectively cooling the control unit is being solved by the present invention.
[024] The cooling system of the present invention results in uniform as well as efficient cooling of the control unit. The one or more heat transfer pipes are located below the one or more electronic components for uniform cooling of the control unit. The heat transfer pipes containing the fluid capable of absorbing heat in the hot region of the heat sink and dissipating the absorbed heat in a cold region of the heat sink results in effective cooling of the control unit.
[025] The cooling system of the present invention performs cooling operation without creating any noise.
[026] The cooling system of the present invention does not require additional space as the channels for receiving the heat transfer pipes are formed in the heat sink. The present invention, therefore, results in a compact cooling system/control unit which makes it useful for applications having a space constraint.
[027] The heat transfer pipes of the cooling system are easy to replace, which reduces the maintenance costs associated with the control unit.
[028] While the present invention has been described with respect to certain embodiments, it will be apparent to those skilled in the art that various changes and modification may be made without departing from the scope of the invention as defined in the following claims.

List of Reference Numerals
100- control unit
102- electronic components
104- heat sink
104a- body
104b- channels
106- heat transfer pipes
HR- hot region of the control unit
CR- cold region of the control unit
L- length of the heat sink
B-Breadth of the heat sink
, Claims:1. A cooling system for a control unit (100), the cooling system comprising:
- a heat sink (104) in contact with one or more electronic components (102), the heat sink (104) adapted to receive one or more heat transfer pipes (106) containing a fluid capable of absorbing heat in a hot region (HR) of the heat sink (100) and dissipating the absorbed heat in a cold region (CR) of the heat sink (100).

2. The cooling system as claimed in claim 1, wherein the heat sink (104) comprises a body (104a) and one or more channels (104b) extending through the body (104a), the one or more channels (104b) extending at least partially along at least one of a length (L) and a breadth (B) of the body (104a).

3. The cooling system as claimed in claim 2, wherein the one or more heat transfer pipes (106) being received in the one or more channels (104b).

4. The cooling system as claimed in claim 3, wherein shape and profile of the one or more channels (104b) confirms to the shape and profile of the one or more heat transfer pipes (106).
5. The cooling system as claimed in claim 1, wherein the one or more heat transfer pipes (106) and the channels (104b) being provided below the one or more electronic components (102) of the control unit (100).

6. The cooling system as claimed in claim 1, wherein the hot region (HR) of the control unit (100) being proximate to the one or more electronic components (102) and the cold region (CR) of the control unit (100) being distal from the one or more electronic components (102), and wherein the hot region and the cold region being opposite to each other.

7. The cooling system as claimed in claim 1, wherein the plurality of heat transfer pipes (106) being located at an equal distance from each other.

8. The cooling system as claimed in claim 1, wherein the fluid being a phase change material including liquid paraffin.

9. The cooling system as claimed in claim 1, wherein the cold region of the heat sink being provided with one or more cooling fins.