DESC:FORM 2
The Patents Act 1970
(39 of 1970)
&
The Patent Rules 2003
COMPLETE SPECIFICATION
(See Section 10 and rule 13)
1. TITLE: SMART HEADGEAR WITH ELECTROMAGNETIC (EMF) AND RADIO FREQUENCY (RF) SHIELDING AND VARIABLE FREQUENCY ATTENUATION
2. APPLICANT:
2. APPLICANT(S)
Name in Full Nationality Address of the Applicant
Pulkit Ahuja India House No. F 101, Grand Arch, Golf Course Extension Road, Sector 58, Gurgaon, Haryana 122102, India
Street
City
State
Country
Pin code
Deeksha Raheja India House No. F 101, Grand Arch, Golf Course Extension Road, Sector 58, Gurgaon, Haryana 122102, India
Street
City
State
Country
Pin code

3. PREAMBLE OF THE DESCRIPTION: The following COMPLETE specification particularly describes the invention and the manner in which it is performed.

FIELD OF THE EMBODIMENTS
The present invention relates to the field of personal protective equipment (PPE). More particularly, the present disclosure pertains to a multi-layered smart headgear equipped with an electromagnetic field (EMF) and radio frequency (RF) shielding structure to protect the wearer’s head from continuously generated electromagnetic waves and radio frequency waves that are transmitted in all directions in case of a smart helmet or smart protective headgear while the headgear device is in close proximity to the rider/wearer’s head and is trying to maintain a seamless connectivity for embedded communication of its sensor modules and other connectivity protocols.
BACKGROUND OF THE EMBODIMENTS
In recent years, there has been a significant proliferation of Internet of Things (IoT) devices, portable electronics, and smart wearables, which have become integral to personal convenience, communication, and workplace safety. Devices such as Wi-Fi routers, Bluetooth-enabled modules, mobile phones, and health monitoring sensors emit electromagnetic radiation (EMR) and radio frequencies (RF) to facilitate their functionalities. However, the growing presence of such devices, particularly in close proximity to the human body, has raised concerns regarding prolonged exposure to EMF and RF radiation, especially with respect to their potential neurological and physiological effects.
The issue becomes critical in case such EMR-emitting modules are embedded within headgear or helmets—devices intended to physically protect the user’s head. In such cases, the headgear itself may become a source of continuous radiation exposure, converting a protective device into a long-term health hazard. This challenge has sparked interest in the development of EMF-shielded headgear.
One of the most rudimentary approaches found in prior art is the use of “tin foil hats,” constructed with layers of tin or aluminium foil. While these are known to block or reflect certain EM waves, they are uncomfortable, lack structural integrity, and are incompatible with modern smart headgear. Such conductive layers, when integrated near smart circuitry, may interfere with the functioning of printed circuit boards (PCBs), sensors, and communication modules, resulting in unwanted signal loss, current leakage, heating and performance degradation.
Further developments introduced head protectors comprising shielded fabrics, particularly in the form of cap and ear protectors with fine wire filaments. These designs often provide partial shielding, focusing on the auditory region, and are difficult to integrate with embedded electronics. Other prior art discloses helmet covers or patches sprayed with attenuating materials or constructed from shielding fabrics with varying concentrations. However, such mechanisms are susceptible to physical wear, have low durability, and are inconvenient to use on a daily basis due to the repeated attachment/detachment of components.
In more advanced headgear designs, multiple EMR-protective layers are embedded within the helmet shell. While this offers some protection, these layers are prone to external damage (e.g., scratches, abrasion), and some variants include additional structural components such as rubber interlayers to provide mechanical integrity. These methods often result in increased weight and reduced wearer comfort, limiting long-term usability.
However, most currently existing conventional headgear protection systems fail to distinguish between the zones requiring shielding (i.e., regions adjacent to the human head) and zones requiring signal transparency (i.e., antenna regions). Without this separation, attempts to shield EMF often result in blocked signals, poor connectivity, or internal electromagnetic feedback, and reduced efficiency of the core product due to limited real time connectivity thereby compromising the smart functionality of the smart headgears.
Another drawback in existing technologies is the absence of quantitative, experimentally validated performance data. Many designs claim EM shielding capability but do not offer measured evidence of attenuation effectiveness, signal preservation, or thermal stability in practical use cases involving active sensor modules and real time connectivity in industrial settings.
Critically, many existing EMF shielding techniques either fail to provide full-head protection, interfere with the connectivity of smart modules, or introduce mechanical and ergonomic drawbacks. They do not adequately resolve the trade-off between radiation protection and wireless smart functionality.
Conventionally, there is a patented prior art that discloses an optically transmissive Faraday cage using thin conductive coatings for shielding electronic equipment enclosures from electromagnetic interference. While such a system demonstrates that a single skin-depth of conductive material may attenuate EM fields by approximately 87%, application thereof is limited to stationary electronic devices such as monitors or consoles. The structure does not address the practical and physiological requirements of wearable headgear, such as lightweight structure, flexibility, comfort, and long-duration use in dynamic environments across very varying temperature ranges. More importantly, the prior art lacks any consideration of human anatomy- particularly sensitive brain regions such as the frontal lobe, temporal lobes, cerebrum surface, and upper brainstem, which are directly adjacent to the helmet cavity in real-world usage. Additionally, such a prior art does not consider selective shielding architecture. Applying such shielding uniformly across a wearable helmet may result in signal blockage, preventing sensors or communication modules from interacting with external systems thereby leading to delays in AI inputs and real time measures based on live and connected IoT Smart Helmets and Headgears. Thus, while the prior art offers theoretical value in EM attenuation through conductive films, it fails to address the practical challenges of a smart helmet that must simultaneously protect neurological regions of the head from self-generated EM radiation while maintaining unhindered antenna-based communication.
Accordingly, there remains a need for developing a lightweight, durable, and structurally integrated smart headgear that provides a reliable attenuation of internally generated EMF and RF radiation while maintaining the structural protection against external wear and tear, and non-interference with antenna-based communication, and allowing seamless connectivity while ensuring user safety.
OBJECT OF THE EMBODIMENTS
An object of the present disclosure is to provide a multi-layered smart headgear with an integrated Electro-Magnetic Field (EMF) and Radio Frequency (RF) shield, which offers enhanced protection against EM radiation emitted from embedded antennas, sensors, circuitry and communication modules.
Another object of the present disclosure is to provide a headgear with structural robustness, wherein the shielding layer is resistant to external damages such as scratches, abrasions, corrosion, collisions, high weight impacts and general wear during prolonged field use.
Another objective of the present disclosure is to provide a lightweight, durable, and ergonomically designed headgear, ensuring wearer comfort even during extended use in industrial, defense, or outdoor environments.
Another objective of the present disclosure is to create a multi-zone conformal “Faraday cap” that mirrors the brain/skull shape. For example, a dome-like or segmented shield covering specific lobes with varying mesh densities which are denser over the brainstem/CNS, and coarser elsewhere. This is augmented by graphene or conductive-polymer coating on inner padding provides ultra-thin yet broad-band blocking.
Another objective of the present disclosure is to ensure that the EMF and RF shielding does not interfere with the operation of smart modules and communication antennas, thus preserving seamless signal transmission and device functionality.
Another objective of the present disclosure is to provide a zone-separated structure within the helmet, wherein shielded compartments and antenna compartments are isolated from one another to allow selective EMR attenuation without disrupting data transmission.
Another objective of the present disclosure is to embed frequency-selective surfaces (FSS) or metamaterial patches within the shield layer. Such surfaces may be tuned to block harmful RF bands (e.g. cell or Wi-Fi frequencies) while allowing pass-through of desired mission frequencies (e.g. specific 5G mm Wave channels). This would create uniquely configured “notched” or band-pass shields.
Another objective of the present disclosure is to provide active cancellation or tunable shielding. For instance, printed circuit elements generate counter-phase fields, or switchable material properties which are implemented in high end variants.
Another objective of the present disclosure is to demonstrate the use of impact-absorbing, flame-retardant composites for shells (bonded with the shield), and the inclusion of padding or multi-layer cushioning in the shield for crash protection. A gasketed, waterproof seal between compartments alluded to by our seals ensures reliability in harsh environments.
Yet another objective of the present disclosure is to provide a headgear design whose shielding effectiveness is experimentally validated, including demonstrable attenuation of EM field intensity within the helmet and measurable improvements in user safety.
Another objective of the present disclosure is to enable safe integration of high-frequency communication protocols (e.g., Bluetooth, Wi-Fi, 4G/5G) in smart headgear without compromising EMR shielding performance.
The present disclosure also aims to enable modular attachment points for new sensor or comm modules, allowing easy upgrade to 6G/defense-band hardware. In one of the embodiments, a slide-in “communications board” in the second compartment or a replaceable visor with embedded antennas and solar cells is used thereby ensuring enhanced compatibility with 5G/6G FR1 and FR2 bands.
Another objective of the present disclosure is to enable dedicated antenna mounting (e.g. an integrated dipole or patch antenna in the brim) coupled with ground planes or electromagnetic chokes that confine radiation away from the head. A waveguide collar directs signals outward from the module compartment.
SUMMARY OF THE EMBODIMENTS
The present disclosure provides a multi-layered headgear equipped with an electromagnetic field (EMF) and radio frequency (RF) shielding system. The headgear comprises an outer shell and an inner shell joined together to form a sealed structure, with two internal compartments defined between them. A first compartment is positioned adjacent to the wearer’s head and contains a conductive shielding layer that aligns with the cranial region. A second compartment, located above the first, houses communication and electrical assemblies for wireless data transmission. A non-conductive spacing layer is positioned between the first and second compartments to prevent electromagnetic interference and conductive coupling, while enabling outward signal transmission without obstruction. The shielding layer is formed using conductive material having a thickness equal to or greater than one skin depth at the operating frequency of the communication assemblies, thereby attenuating radiation before it reaches the inner shell. The overall structure minimizes EMF/RF exposure to the head while allowing effective operation of smart features.
The disclosure further provides a method for constructing and operating the headgear. The method includes forming the outer and inner shells from durable, impact-resistant materials; defining the first and second compartments between the shells; placing the shielding layer within the first compartment; installing the spacing layer to separate the compartments; and positioning the communication assemblies within the second compartment. Upon operation, the shielding layer attenuates radiation directed toward the wearer’s head, and the spacing layer ensures that signal transmission from the assemblies remains unimpeded and free from electromagnetic interference. The method enables safe, durable, and functional integration of smart communication systems within protective headgear.
The present disclosure creates a multi-zone conformal “Faraday cap” that mirrors the brain/skull shape. For example, a dome-like or segmented shield covering specific lobes with varying mesh densities which are denser over the brainstem/CNS, and coarser elsewhere. This is augmented by graphene or conductive-polymer coating on inner padding provides ultra-thin yet broad-band blocking.
BRIEF DESCRIPTION OF THE DRAWINGS OF THE EMBODIMENTS
Other objects, features, and advantages of the embodiment will be apparent from the following description when read with reference to the accompanying drawings. In the drawings, wherein like reference numerals denote corresponding parts throughout the several views:
Referring to Figure 1A, illustrates a schematic view of an EMF protective headgear (100), in accordance with an illustrated embodiment of a present disclosure;
Referring to Figure 1B, illustrates a schematic view of internal components of the EMF protective headgear (100), in accordance with the illustrated embodiment of a present disclosure;
Referring to Figure 2, discloses a flowchart depicting steps of a method (200) for attenuating EMF and RF in the headgear (100), in accordance with another illustrative embodiment of the present disclosure; and
Referring to Figures 3A and 3B, illustrates graph showing EM field strength inside the EMF protective headgear (100), in accordance with the illustrated embodiment of a present disclosure
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The embodiments herein and the various features and advantageous details thereof are explained more fully with reference to the non-limiting embodiments that are illustrated in the accompanying drawings and detailed in the following description. Descriptions of well-known components and processing techniques are omitted so as to not unnecessarily obscure the embodiments herein. The examples used herein are intended merely to facilitate an understanding of ways in which the embodiments herein may be practiced and to further enable those of skill in the art to practice the embodiments herein. Accordingly, the examples should not be construed as limiting the scope of the embodiments herein.
Figure 1 illustrates a multi-layered headgear (100) equipped with an electromagnetic field (EMF) and radio frequency (RF) shielding system. The headgear (100) comprises an outer shell (102) and an inner shell (104), both constructed from durable materials such as Acrylonitrile Butadiene Styrene (ABS), Polyethylene (PE), Polyethylene terephthalate (PET), or Kevlar, commonly used for impact-resistant headgear. The inner shell (104) is shaped to accommodate the cranial region of a human head. The outer shell (102) and inner shell (104) are fastened along their edges, forming an airtight and waterproof enclosure.
A first compartment (106) is positioned adjacent to the inner shell (104), and a second compartment (108) is positioned above the first compartment (106), closer to the outer shell (102). A spacing layer (112), composed of a non-conductive material such as foam, dielectric polymer, or molded plastic, separates the first compartment (106) from the second compartment (108). The spacing layer (112) electrically and electromagnetically isolates the two compartments and may include features for ventilation or thermal regulation.
The first compartment (106) houses a conductive shielding layer (110), which extends along its internal perimeter and aligns with cranial regions including the frontal lobes, temporal lobes, parietal lobes, occipital lobes, cerebral cortex, and brainstem. The shielding layer (110) comprises conductive materials such as copper-nickel mesh, metallized textile, or conductive polymer composites. The thickness of the shielding layer (110) is maintained at or above one electromagnetic skin depth relative to the operating frequency of the communication and electrical assemblies (114) housed in the second compartment (108). This structural configuration attenuates electromagnetic radiation directed toward the inner shell (104), without interfering with external signal transmission.
The second compartment (108) houses communication and electrical assemblies (114), which may include Wi-Fi modules, Bluetooth transceivers, GPS antennas, or cellular radios. The spacing layer (112) prevents electromagnetic interference and conductive coupling between the assemblies (114) and the shielding layer (110), allowing outward signal transmission to remain unimpeded.
The shielding layer (110) may be implemented in formats such as flexible mesh, gel pads, hexagonal honeycomb structures, or layered fabric, offering enhanced mechanical durability and impact absorption without adding significant weight. The shielding material resists corrosion, abrasion, and deformation. The outer shell (102) and inner shell (104) may optionally include ribs, foam liners, or soft internal padding to enhance mechanical safety and wearer comfort. The multi-layered architecture provides full-head protection against both physical impact and EMF/RF radiation exposure while preserving the operability of wireless communication systems.
As shown in Figure 2, the method (200) for attenuating EMF and RF in headgear (100) involves forming the outer shell (102) and inner shell (104), fastening the edges to create sealed compartments, installing the shielding layer (110) within the first compartment (106), placing the spacing layer (112) between the two compartments, positioning communication and electrical assemblies (114) within the second compartment (108), and sealing the structure. During operation, the assemblies (114) transmit signals while minimizing EM exposure to the wearer’s head through structural and material isolation.
Experimental validation was conducted using a prototype comprising an ABS outer shell, a mid-layer of copper-nickel mesh (0.1 mm), and a foam-lined inner shell. A dummy head embedded with electromagnetic sensors was used for detection. The headgear (100) was tested using a spectrum analyzer and near-field probe.
Results Summary:
Test Condition Avg. EM Field Strength Inside Helmet (V/m) Signal Attenuation (%) Max Penetration Depth (cm)
No Shielding 3.2 V/m 0% >3 cm
With Faraday Layer 0.4 V/m 87.5% <0.5 cm
Control Helmet 0.2 V/m — —
It may be concluded that thermal rise inside the helmet remained negligible (<0.3°C). No measurable signal interference with data transmission outside the helmet was detected (i.e., sensors still functional for external logging).
In unshielded mode, an average EM field strength of 3.2 V/m was recorded with a penetration depth of over 3 cm. With the shielding layer installed, the EM field strength reduced to 0.4 V/m, offering 87.5% attenuation and limiting penetration to less than 0.5 cm. External signal transmission from the assemblies remained unaffected, and the temperature increase during operation was under 0.3°C. These results confirm that the shielding configuration effectively protects the wearer’s cranial regions from internal EMF/RF exposure while maintaining communication performance. As shown in Figures 3A and 3B, Inclusion of the conductive shielding layer (Faraday cage) in the headgear (100) significantly reduces EM field penetration towards the wearer’s head. The attenuation was >85% across relevant frequencies. This confirms the helmet’s ability to isolate the user’s head from signals emitted by onboard sensors, thereby enhancing safety in environments with high RF exposure or critical sensor use. Figure 3B shows the percentage of EM signal blocked by the conductive layer (87.5%), compared to no shielding and a standard helmet
In another embodiment, a multi-zone conformal “Faraday cap” that mirrors the brain/skull shape is formed wherein a dome-like or segmented shield covering specific lobes with varying mesh densities which are denser over the brainstem/CNS, and coarser elsewhere. This is augmented by graphene or conductive-polymer coating on inner padding provides ultra-thin yet broad-band blocking.
In another embodiment, the headgear supports modular attachment points for new sensor or comm modules, allowing easy upgrade to 6G/defense-band hardware. In one of the embodiments, a slide-in “communications board” in the second compartment or a replaceable visor with embedded antennas and solar cells is used thereby ensuring enhanced compatibility with 5G/6G FR1 and FR2 bands.
Another embodiment enables dedicated antenna mounting (e.g. an integrated dipole or patch antenna in the brim) coupled with ground planes or electromagnetic chokes that confine radiation away from the head. A waveguide collar directs signals outward from the module compartment.
Another embodiment uses impact-absorbing, flame-retardant composites for shells (bonded with the shield), and the inclusion of padding or multi-layer cushioning in the shield for crash protection. A gasketed, waterproof seal between compartments alluded to by our seals ensures reliability in harsh environments.

Another embodiment of the above arrangement embeds frequency-selective surfaces (FSS) or metamaterial patches within the shield layer. These surfaces are tuned to block harmful RF bands (e.g. cell or Wi-Fi frequencies) while allowing pass-through of desired mission frequencies (e.g. specific 5G mmWave channels). This creates uniquely configured “notched” or band-pass shields in a headgear.

Another embodiment of the present disclosure provides active cancellation or tunable shielding. For instance, printed circuit elements generate counter-phase fields, or switchable material properties which are implemented in high end variants.

The foregoing descriptions of exemplary embodiments of the present disclosure have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the disclosure to the precise forms disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to best explain the principles of the disclosure and its practical application, to thereby enable others skilled in the art to best utilize the disclosure and various embodiments with various modifications as are suited to the particular use contemplated.
,CLAIMS:We claim
1. A headgear (100) equipped with an Electro-Magnetic Field (EMF) and Radio Frequency (RF) shielding system, the headgear (100) comprising:
an outer shell (102);
an inner shell (104) configured to accommodate the wearer’s head;
a first compartment (106) and a second compartment (108) interposed between the outer shell (102) and the inner shell (104), wherein the first compartment (106) lies toward the wearer’s head and is positioned beneath the second compartment (108);
a spacing layer (112) separating the first compartment (106) from the second compartment (108);
a conductive shielding layer (110) disposed within the first compartment (106), the shielding layer (110) extending along the internal perimeter in alignment with the cranial region of the wearer’s head;
and communication and electrical assemblies (114) housed within the second compartment (108);
wherein the shielding layer (110) is formed of a conductive material having a thickness of at least one skin depth relative to the operating frequency of the assemblies (114), and the spacing layer (112) is non-conductive to electrically and electromagnetically isolate the second compartment (108) from the first compartment (106), thereby enabling outward signal transmission from the assemblies (114) without conductive coupling or electromagnetic interference toward the inner shell (104).
2. The headgear (100) as claimed in claim 1, wherein the conductive shielding layer (110) is selected from one or more of a copper-nickel mesh, a metallized fabric, or a conductive polymer composite in alone or in combination.
3. The headgear (100) as claimed in claim 1, wherein the shielding layer (110) is positioned to cover at least the frontal, temporal, parietal, and occipital regions adjacent to the wearer’s cranial surface.
4. The headgear (100) as claimed in claim 1, wherein the conductive shielding layer (110) comprising an impact-absorbing liner positioned along an inner surface of the first compartment (106).
5. The headgear (100) as claimed in claim 1, wherein the spacing layer (112) comprises at least one or more of non-conductive foam, plastic, or air gap in alone or in combination to provide dielectric isolation between the first and second compartments (106, 108).
6. The headgear (100) as claimed in claim 1, wherein the communication and electrical assemblies (114) include at least one of a Bluetooth module, a Wi-Fi transceiver, a GPS antenna, or a 4G/5G module.
7. The headgear (100) as claimed in claim 1, wherein the second compartment (108) is located in a region of the headgear (100) away from direct alignment with the cranial region of the wearer.
8. The headgear (100) as claimed in claim 1, wherein the shielding layer (110) has a thickness ranging from one to five times the electromagnetic skin depth for the frequency of operation.
9. The headgear (100) as claimed in claim 1, wherein the headgear (100) comprises ventilation ports positioned away from the shielding layer (110) to maintain comfort without compromising electromagnetic isolation.
10. The headgear (100) as claimed in claim 1, wherein the outer shell (102) and inner shell (104) are formed of lightweight impact-resistant polymers.
11. The headgear (100) as claimed in claim 1, wherein the conductive shielding layer (110) comprises a woven mesh formed of copper-nickel alloy threads embedded in a flexible substrate.
12. The headgear (100) as claimed in claim 1, wherein the non-conductive spacing layer (112) includes a molded dielectric insert having cavities for thermal ventilation.
13. The headgear (100) as claimed in claim 1, wherein the shielding layer (110) is shaped such as to follow the curvature of the inner shell (104), forming a partial or full dome covering the cerebrum and brainstem zones.

14. The headgear (100) as claimed in claim 1, wherein the shielding layer (110) comprises multiple sub-layers having varied conductivities or thicknesses to optimize attenuation across multiple frequency bands.
15. The headgear (100) as claimed in claim 1, wherein the communication and electrical assemblies (114) are positioned asymmetrically within the second compartment (108) to reduce direct alignment with the wearer’s brain.
16. The headgear (100) as claimed in claim 1, wherein the outer shell (102) comprises a recess (116) for accommodating the antenna assembly to direct signal transmission laterally or upward, away from the cranial region.
17. The headgear (100) as claimed in claim 1, wherein the second compartment (108) includes a modular interface configured to accommodate detachable communication assemblies (114) and visor-integrated systems (114A) comprising embedded solar cells and signal transmission modules.
18. The headgear (100) as claimed in claim 1, wherein the shielding layer (110) comprises a conformal multi-zone mesh with variable mesh densities, with denser regions aligned over the brainstem and central nervous system (CNS), and is optionally coated with a conductive nanomaterial selected from graphene, carbon nanotube ink, or conductive polymer for broadband electromagnetic attenuation.
19. The headgear (100) as claimed in claim 1, wherein the shielding layer (110) comprises at least one feature selected from:
(a) an embedded frequency-selective surface (FSS) or engineered metamaterial to block predefined frequency bands;
(b) printed circuits or tunable materials configured to generate counter-phase electromagnetic fields for active attenuation; and
(c) antenna (114A) structures in the second compartment (108) coupled with an electromagnetic choke, waveguide collar, or grounded reflector configured to direct signal transmission outward and away from the shielding layer (110).
20. A method (200) for attenuating electromagnetic field (EMF) and radio frequency (RF) shielding in a headgear (100), the method (200) comprising:
forming an outer shell (102) and an inner shell (104) such that the inner shell (104) is adapted to accommodate the wearer’s head;
defining a first compartment (106) and a second compartment (108) between the outer shell (102) and the inner shell (104), wherein the first compartment (106) is positioned closer to the inner shell (104) and the second compartment (108) is located above the first compartment (106);
placing a conductive shielding layer (110) within the first compartment (106), the shielding layer (110) extending along the internal perimeter in alignment with the cranial region of the wearer’s head;
forming a non-conductive spacing layer (112) between the first compartment (106) and the second compartment (108);
installing one or more communication and electrical assemblies (114) within the second compartment (108);
wherein the conductive shielding layer (110) is formed of a material having a thickness of at least one skin depth relative to the operating frequency of the assemblies (114), and the spacing layer (112) prevents conductive coupling and electromagnetic interference between the shielding layer (110) and the assemblies (114), while enabling outward signal transmission.

Date: 17th of July, 2025

Neha Goyal
IN/PA-4398
(Agent of the Applicant)