Description:BACKGROUND
Exemplary embodiments pertain to the art of heat exchangers, and more
particularly to heat exchangers for cooling power electronics.
Power electronics devices such as motor drives generate waste heat 5
during operation of the device. Additionally, when the power electronics devices heat
up, the operational efficiency of the devices can degrade adding to the amount of heat
generated. When utilized in a refrigeration system to drive, for example, a compressor
of the refrigeration system, effective thermal integration of these devices can be
important aspect to the system’s overall efficiency and reliability. Consequently, a goal 10
of the system integrator is to maintain these components within a range of operating
temperatures which will maximize the system efficiency. Accordingly, there remains a
need in the art for heat exchangers configured to closely integrate with power electronic
devices which can maintain optimal temperatures for these components under a variety
of load conditions. 15
BRIEF DESCRIPTION
According to an embodiment, a cooling system for cooling at least one
heat-generating electronic device includes a heat removal device having a surface that
is thermally couplable to the at least one heat-generating electronic device. The heat
removal device includes an inlet area and at least one jet impingement feature fluidly 20
coupled to the inlet area. The at least one jet impingement feature is positioned to direct
a primary cooling fluid toward the surface that is thermally coupled to the at least one
heat-generating electronic device.
In addition to one or more of the features described herein, or as an
alternative, in further embodiments the heat removal device includes a heat exchanger 25
having an outlet header and the surface that is thermally coupled to the at least one heatgenerating
electronic device is arranged within the outlet header. The primary cooling
2
fluid and a secondary cooling fluid are arranged in a heat transfer relationship within
the at least one heat exchanger.
In addition to one or more of the features described herein, or as an
alternative, in further embodiments the heat exchanger includes an inlet header and a
plurality of heat exchange tubes extending between the inlet header and the outlet 5
header. The at least one jet impingement feature is separate from and fluidly coupled to
the plurality of heat exchange tubes.
In addition to one or more of the features described herein, or as an
alternative, in further embodiments the heat exchanger further comprises an inlet header
and a plurality of heat exchange tubes extending between the inlet header and the outlet 10
header. The at least one jet impingement feature is integral with at least one of the
plurality of heat exchange tubes.
In addition to one or more of the features described herein, or as an
alternative, in further embodiments a fluid movement device is operable to move the
secondary cooling fluid through the heat removal device. 15
In addition to one or more of the features described herein, or as an
alternative, in further embodiments the fluid movement device is a fan and the
secondary cooling fluid is air.
In addition to one or more of the features described herein, or as an
alternative, in further embodiments the heat removal device includes a plurality of heat 20
exchangers. Each of the plurality of heat exchangers is located at and is thermally
coupled to a respective heat-generating electronic device.
In addition to one or more of the features described herein, or as an
alternative, in further embodiments at least some of the plurality of heat exchangers are
arranged in series relative to a flow of the primary cooling fluid. 25
In addition to one or more of the features described herein, or as an
alternative, in further embodiments at least some of the plurality of heat exchangers are
arranged in parallel relative to a flow of the primary cooling fluid.
3
In addition to one or more of the features described herein, or as an
alternative, in further embodiments the primary cooling fluid provided to the inlet area
is a two-phase liquid.
In addition to one or more of the features described herein, or as an
alternative, in further embodiments the primary cooling fluid provided to the heat 5
removal device is a single-phase liquid.
According to an embodiment, a method of cooling an assembly
including at least one heat-generating electronic device and at least one peripheral heatgenerating
device includes cooling a secondary cooling fluid via a primary cooling
fluid, flowing the cooled secondary cooling fluid over the at least one peripheral heat- 10
generating device, and expelling the primary cooling fluid at a surface of a heat removal
device thermally coupled to the at least one heat-generating electronic device via at
least one jet impingement feature to cool the at least one heat-generating electronic
device.
In addition to one or more of the features described herein, or as an 15
alternative, in further embodiments the heat removal device is a heat exchanger and
cooling the secondary cooling fluid via the primary cooling fluid occurs within a
plurality of heat exchanger tubes of the heat exchanger.
In addition to one or more of the features described herein, or as an
alternative, in further embodiments providing the secondary cooling fluid to the heat 20
exchanger via a fluid movement device.
In addition to one or more of the features described herein, or as an
alternative, in further embodiments providing the primary cooling fluid to another heat
removal device located at and thermally coupled to the at least one heat-generating
electronic device. The another heat removal device is arranged downstream from and 25
in series with the heat removal device relative to a flow of the primary cooling fluid.
In addition to one or more of the features described herein, or as an
alternative, in further embodiments providing the primary cooling fluid to another heat
4
removal device located at and thermally coupled to the at least one heat-generating
electronic device. The another heat removal device is arranged in parallel with the heat
removal device relative to a flow of the primary cooling fluid.
BRIEF DESCRIPTION OF THE DRAWINGS
The following descriptions should not be considered limiting in any 5
way. With reference to the accompanying drawings, like elements are numbered alike:
FIG. 1 is a schematic diagram of an example of a refrigeration system
according to an embodiment;
FIG. 2 is a schematic diagram of another example of a heating,
ventilation, air conditioning and refrigeration (HVAC&R) system according to an 10
embodiment;
FIG. 3 is an illustration of an embodiment of a cooling system for
cooling a heat-generating device according to an embodiment;
FIG. 4 is a cross-sectional view of a heat removal device of a cooling
system according to an embodiment; 15
FIG. 5 is a cross-sectional view of a heat removal device of a cooling
system according to another embodiment;
FIG. 6 is a perspective view of a prior art cooling system of a variable
frequency drive according to an embodiment.
DETAILED DESCRIPTION 20
A detailed description of one or more embodiments of the disclosed
apparatus and method are presented herein by way of exemplification and not limitation
with reference to the Figures.
Referring to FIG. 1, an example of a refrigeration system, such as a
heating, ventilation, air conditioning and refrigeration (HVAC&R) system 20 is 25
5
schematically illustrated. Exemplary refrigeration systems 20 include, but are not
limited to, residential, split, packaged, chiller, rooftop, supermarket, transport, and fuel
cell systems, for example. In the illustrated, non-limiting embodiment, the refrigeration
system 20 includes a refrigeration circuit 22 including a compressor 24, a condenser
26, an expansion device 28 and an evaporator 30 arranged in series and having a volume 5
of refrigeration fluid, such as refrigerant for example, flowing therethrough.
Another example of a refrigeration system 20 is illustrated in FIG. 2. In
addition to the compressor 24, condenser 26, expansion device 28, and evaporator 30
previously described the refrigeration circuit 22 includes an economizer heat exchanger
32. The economizer heat exchanger 32 may be positioned between the condenser 26 10
and the expansion device 28 relative to a flow of refrigeration fluid through the
refrigeration circuit 22. Although the economizer heat exchanger 32 is illustrated as
being located directly downstream from the outlet 34 of the condenser 26, it should be
understood that embodiments where one or more other components of the refrigeration
system 20 are located between the condenser 26 and an inlet of the economizer heat 15
exchanger 32 are also contemplated herein.
In an embodiment, the economizer heat exchanger 32 is a brazed plated
fin heat exchanger. However, other suitable types of heat exchangers are also within
the scope of the disclosure. Further, the economizer heat exchanger 32 is a refrigeration
fluid-refrigeration fluid heat exchanger and therefore has a plurality of distinct fluid 20
flow paths formed therein. In the illustrated, non-limiting embodiment, the economizer
heat exchanger 32 has a first flow path and a second flow path, respectively.
In the illustrated, non-limiting embodiment, the inlet 36 of the first flow
path of the economizer heat exchanger 32, also referred to herein as the “main flow
path,” is arranged in direct fluid communication with an outlet 34 of the condenser 26. 25
Alternatively, or in addition, the outlet 38 of the main flow path of the economizer heat
exchanger 32 may be arranged directly upstream from and in fluid communication with
an inlet of the expansion device 28.
6
In operation, a first portion R1 of the refrigeration fluid output from the
condenser 26 is provided to the main flow path of the economizer heat exchanger 32
via a main conduit 40. Although the main flow path is illustrated as a single pass through
the economizer heat exchanger 32, it should be understood that in other embodiments
the main flow path may include a plurality of passes through the economizer heat 5
exchanger 32. At the outlet 38 of the main flow path of the economizer heat exchanger
32, the first portion R1 of the refrigeration fluid is configured to flow to the expansion
device 28. From the expansion device 28, the refrigeration fluid is expanded within the
evaporator 30. The first portion R1 of refrigeration fluid output from the evaporator 30
is provided via a first compressor inlet path to a primary suction inlet 42 of the 10
compressor 24. Accordingly, the fluid loop of the first portion R1 of the refrigeration
fluid includes the compressor 24, condenser 26, main flow path of the economizer heat
exchanger 32, expansion device 28, and the evaporator 30.
An economizer expansion device 44 may be arranged within the
refrigeration circuit 22 in fluid communication with the condenser 26. The economizer 15
expansion device 44 is operable to expand and cool the refrigeration fluid provided
thereto. Although the economizer expansion device 44 is illustrated as being disposed
within an economizer conduit 45 fluidly coupled to an extending from the main conduit
40 at a location upstream from the first inlet 36, it should be understood that an
economizer conduit 45 fluidly connected to the outlet 34 of the condenser 26 in another 20
suitable manner is also contemplated herein.
Located downstream from the economizer expansion device 44 is the
inlet 46 of a second flow path of the economizer heat exchanger 32, also referred to
herein as the “economizer flow path.” Further, the outlet 48 of the second flow path of
the economizer heat exchanger 32 may but need not be directly connected to an 25
economizer inlet or port 50 of the compressor 24. In the illustrated, non-limiting
embodiment, the inlet 36 of the main flow path and the inlet 46 of the economizer flow
path are arranged at adjacent sides of the economizer heat exchanger 32. However, in
other embodiments, it should be understood that the inlets 36, 46 of both flow paths
could alternatively be arranged at the same side of the economizer heat exchanger 32 30
or at opposite sides thereof. Similarly, the outlets 38, 48 of both the main flow path and
7
the economizer flow path may be arranged at opposite sides, the same side, or adjacent
sides depending on the desired flow configuration of the economizer heat exchanger
32. Further, although the economizer flow path is illustrated as a single pass, it should
be understood that in some embodiments, the economizer flow path may include a
plurality of passes through the economizer heat exchanger 32. 5
Within the economizer flow path, a second portion R2 of the
refrigeration fluid is configured to absorb heat from the first portion R1 of the
refrigeration fluid within the main flow path, thereby cooling the first portion R1 of the
refrigeration fluid. As a result of this heat transfer, the second portion R2 of the
refrigeration fluid within the economizer flow path may become a vapor. From the 10
outlet 48 of the economizer flow path, the second portion R2 of the refrigeration fluid
is provided to the economizer suction inlet 50 located at an intermediate portion of the
compressor 24. Accordingly, the second portion R2 of the refrigeration fluid bypasses
the expansion device 28 and the evaporator 30 of the refrigeration circuit 22. Within
the compressor 24 the first portion R1 and the second portion R2 of refrigeration fluid 15
are mixed before being provided to the discharge port 52 to repeat the cycle.
Accordingly, the fluid loop of the second portion R2 of the refrigeration fluid includes
the compressor 24, condenser 26, economizer expansion device 44, and economizer
flow path of the economizer heat exchanger 32. It should be understood that the
refrigeration systems 20 illustrated and described herein are intended as an example 20
only, and that a refrigeration system 20 having another configuration is within the scope
of the disclosure.
With continued reference to both FIGS. 1 and 2, in an embodiment, the
refrigeration system 20 includes at least one cooling system 60 for cooling one or more
heat-generating devices 62. The term “heat-generating device” as used herein can refer 25
to any electronic component which generates heat during operation thereof. Examples
of a heat-generating device 62 include, but are not limited to a processor, power
electronic devices, or another device that can provide a controlled output power by
modulating and/or converting a supplied input power (e.g., a variable frequency drive,
power rectifier, power converter, and the like). Such a heat-generating device 62 can be 30
used to control the speed of a compressor and/or the speed of a fan associated with of a
8
refrigeration system based on various predetermined system conditions. In an
embodiment, the at least one heat-generating device 62 includes a variable frequency
drive operably coupled to the compressor 24 of the refrigeration system 20. As shown,
at least a portion R3 of the refrigerant output from an outlet of the condenser 26 may
be diverted towards the cooling system 60. Depending on the cooling demands to be 5
met by the cooling system 60, the portion R3 of the refrigerant may pass through an
expansion valve 54 or may bypass the expansion valve before reaching a heat removal
device 74 of the cooling system 60, to be described in more detail below.
In other embodiments, the cooling system 60 need not be integral with
or a part of the vapor compression cycle of a refrigeration system 20. Rather, the cooling 10
system 60 may be a separate fluid loop and may use any suitable cooling fluid therein.
In the illustrated, non-limiting embodiment of FIG. 3, the circuit of the cooling system
60 has a closed loop configuration and includes a pump 70 for moving a primary cooling
fluid C1 therethrough. A filter 72 may be located upstream from at least one heat
removal device 74 positioned to directly cool a corresponding heat-generating 15
electronic device, such as heat-generating device 62. Downstream from the one or more
heat removal devices 74 is a cooling heat exchanger 76 configured to remove heat from
the primary cooling fluid C1. The circuit may additionally include a reservoir or
accumulator 78 within which excess primary cooling fluid C1 is stored. As shown, the
circuit may include a plurality of valves, such as arranged directly upstream from the 20
heat removal device 74 (V1), directly downstream from the heat removal device 74
(V2), associated with a bypass conduit 80 for bypassing the cooling heat exchanger 76
(V3), and/or associated with another bypass conduit 82 for bypassing both the heat
removal device 74 and the cooling heat exchanger 76 (V4). Although the illustrated
non-limiting embodiment includes a single heat removal device 74 associated with a 25
single heat-generating device 62, it should be appreciated that embodiments including
a plurality of heat removal devices 74, operably coupled to one or more heat-generating
devices 62, may be arranged in series or in parallel relative to the flow of the primary
cooling fluid C1.
With reference now to FIG. 4, an example of at least a portion of a 30
cooling system 60 for cooling one or more heat-generating devices 62 is illustrated. As
9
shown in the FIG., the heat removal device 74 may be a heat exchanger, such as a
microchannel heat exchanger having a plurality of substantially parallel microchannel
heat exchanger tubes 100 extending between an inlet header 102 and an outlet header
104, each of the plurality of heat exchanger tubes 100 defining a plurality of fluid flow
paths (not shown). However, examples of other types of heat exchangers that may be 5
used, include, but are not limited to, microtube, double pipe, shell and tube, tube and
fin, plate, plate and shell, adiabatic shell, plate fin, pillow plate, and fluid heat
exchangers. The type of heat exchanger 74 selected may depend at least in part based
on the type of fluids being provided thereto.
A primary cooling fluid C1 and a secondary cooling fluid C2 are 10
arranged in a heat transfer relationship at the heat exchanger 74. In the non-limiting
embodiment illustrated in FIG. 4, the heat exchanger 74 has a single pass configuration
for both the primary cooling fluid C1 and the secondary cooling fluid C2. However, in
other embodiments, at least one of the primary and secondary cooling fluids C1, C2
may make multiple passes through the heat exchanger 74. Further, the primary and 15
secondary cooling fluids C1, C2 may be arranged in any suitable flow configuration at
the heat exchanger, such as a cross-flow, a parallel flow, a counter-flow, or any
combination thereof.
In an embodiment, at least one jet impingement feature, such as a nozzle,
jet, or orifice, hole, or opening formed in a plate 110, and in some embodiments a 20
plurality of jet impingement features 110 are arranged within the outlet header 104,
such as within an inlet area of the outlet header 104. Each jet impingement features 110
is fluidly coupled to at least one fluid flow path of one or more heat exchanger tubes
100. An outlet end of the jet impingement features 110 may be aimed at a surface of the
outlet header 104 thermally coupled to at least one selected heat-generating device 62, 25
such as a bottom surface of the outlet header 104 for example. Although the one or
more jet impingement features 110 are illustrated and described herein as being separate
from the heat exchange tubes 100, in an embodiment, an outlet end of the heat exchange
tubes 100 may be contoured such that one or more jet impingement features 110 are
integral therewith. The jet impingement features 110 may be configured as a free 30
surface type or submerged type or confined-submerged type. Furthermore, the jet or
10
flow expelled from the jet impingement features 110 may be of any geometrical shape
in the cross-section such as circular, polygonal, star-shaped etc.
In some embodiments, the heat exchanger 74 is directly coupled to a
surface of the at least one selected heat-generating device 62. In such a direct
connection, a thermal interface material may, but need not be arranged between a 5
surface 112 of the at least one selected heat-generating electronic device 62 and an
adjacent surface 114 of the heat removal device 74 to facilitate the transfer of heat from
the at least one selected heat-generating device 62 to the heat removal device 74.
The inlet header 102 of the heat exchanger 74 may be fluidly connected
to a first fluid inlet 120 and the outlet header 104 may be fluidly connected to a first 10
fluid outlet 122 to form a first flow path of the primary cooling fluid C1. In operation,
the primary cooling fluid C1, such as a refrigerant for example, is provided from the
first fluid inlet 120 into the inlet header 102 of the heat exchanger 74. The primary
cooling fluid C1 provided to the inlet header 102 may be a single phase, such as a cool
or cold liquid for example, or may be two-phase (i.e., a combination of liquid and 15
vapor). From the inlet header 102, the primary cooling fluid C1 flows through the
plurality of heat exchange tubes 100 of the heat exchanger 74 toward the outlet header
104.
The secondary cooling fluid C2 is configured to flow through the gaps
106 defined between adjacent heat exchanger tubes 100. In the illustrated, non-limiting 20
embodiment, the secondary cooling fluid C2 is a flow of air moved (in a direction
extending into the plane of the page) by the at least one fluid movement device, such as
fan 31. In an embodiment, the is associated with at least one of a condenser 26 or
evaporator 30 of the refrigeration system 20. However, it should be understood that any
fluid, including a liquid, may be used as the secondary cooling fluid C2. In the 25
illustrated, non-limiting embodiment, a plurality of fins 126 is arranged within the gaps
106 defined between adjacent heat exchanger tubes 100; however, embodiments that
do not include such fins are also contemplated herein. Within the plurality of passages
of the heat exchange tubes 100, heat from the secondary cooling fluid C2 is transferred
to the primary cooling fluid C1. The resulting cooled secondary cooling fluid C2 30
11
provided at an outlet of the heat exchanger 74 may be configured to flow over the
neighboring or peripheral heat-generating devices, such as within the variable
frequency drive for example.
At least a portion of the now slightly warmer primary cooling fluid C1
is output from the plurality of heat exchange tubes 100 to the one or more jet 5
impingement features 110 arranged within the outlet header 104. Within the jet
impingement features 110, the flow rate of the primary cooling fluid C1 is increased
such that the primary cooling fluid C1 is expelled from an outlet of the jet impingement
features at a surface of the outlet header 104 vertically aligned with the selected heatgenerating
device 62. 10
At least a portion of the heat from the at least one selected heatgenerating
device 62 is transferred from the heat-generating device 62 to the primary
cooling fluid C1. The continuous impingement of the primary cooling fluid C1 on the
surface of the outlet header 104 thermally coupled to the heat-generating device 62
transfers heat from the surface of the outlet header 104 to the primary cooling fluid C1, 15
thereby cooling the at least one selected heat-generating device 62.
Depending on the temperature of the secondary cooling fluid C2, the
primary cooling fluid C1 may partially evaporate or may remain in a liquid state as it
flows through the plurality of heat exchange tubes 100 of the heat exchanger 74 toward
the outlet header 104. If the primary cooling fluid C1 is partially evaporated, the 20
velocity of the primary cooling fluid C1 expelled from the one or more jet impingement
features 110, which will enhance the heat transfer that occurs from the surface of the
outlet header 104 to the primary cooling fluid C1. In an embodiment, after impinging
on the surface 114, the primary cooling fluid C1 is configured to start boiling or
evaporating , and in some embodiments, is in a completely vapor state. After contacting 25
the surface of the outlet header 104, the resulting warm, superheated vaporprimary
cooling fluid C1 then exits the outlet header 104 of the heat exchanger 74 and flows
toward the first fluid outlet 122.
12
With reference now to FIG. 5, another example of a heat removal device
74 suitable for use in a cooling system 60 is illustrated. The heat removal device 74
may be similar to that described above with respect to FIG. 4. However, in the
illustrated, non-limiting embodiment, the heat removal device does not include the heat
exchanger portion for receiving the secondary cooling fluid C2. As shown, the heat 5
removal device 74 includes an inlet area 200 and at least one jet impingement feature
210, and in some embodiments a plurality of jet impingement features 210, fluidly
coupled to the inlet area 200. Similar to the heat exchanger previously described herein,
the outlet end of the jet impingement features 210 is aimed at a surface of the heat
removal device 74 thermally coupled to at least one selected heat-generating electronic 10
device 62, such as a bottom surface 202 of the heat removal device 74 for example.
In each of the configurations disclosed in FIGS. 4 and 5, at least one
valve may be arranged within the first fluid inlet 120 and/or the first fluid outlet 122 to
control the flow of the primary cooling fluid C1 to and from the heat exchanger 74. In
an embodiment, the position of the one or more flow control valve(s) V and therefore 15
the flow through the heat exchanger 74, is actively managed based on a one or more
conditions, for example indicative of the thermal load, at the heat exchanger 74. The
thermal load may be determined using information collected by one or more sensors,
represented schematically at T and P. In the illustrated, non-limiting embodiment, a first
sensor T is operable to monitor the temperature of the heat-generating device 62, and a 20
second sensor T is operable to monitor the temperature of the primary cooling fluid C1
in conjunction with a pressure sensor P at the outlet header 104. The combination of a
temperature sensor and a pressure sensor will allow determination of a degree of
superheat of the exiting primary cooling fluid C1. The flow control valve V can be
adjustable to increase or decrease the flow rate based on the degree of superheat of the 25
primary cooling fluid C1 determined. The at least one sensor T or P may be operable to
measure temperature and/or pressure directly or may be configured to monitor another
parameter that correlates to or can be used to derive temperature and/or pressure
therefrom.
FIG. 6 illustrates and existing cooling system for cooling one or more 30
heat-generating component of the variable frequency drive (VFD). As shown, the
13
cooling system includes two cold plates to which the heat-generating device(s) 62 that
require the most cooling are mounted. In addition, an air-cooled heat exchanger is used
to cool peripheral components, such as those that are not mounted to the cold plates. If
the heat removal device 74 is integrated into the cooling system of the VFD, the separate
air-cooled heat exchanger can be eliminated because the heat exchangers will be 5
mounted directly to the heat-generating components that are also mounted to the cold
plates. Such a combination results in a more compact, low cost and efficient cooling
system. Elimination of the separate air-cooled heat exchanger results in significant cost
savings.
The term “about” is intended to include the degree of error associated 10
with measurement of the particular quantity based upon the equipment available at the
time of filing the application.
The terminology used herein is for the purpose of describing particular
embodiments only and is not intended to be limiting of the present disclosure. As used
herein, the singular forms “a,” “an” and “the” are intended to include the plural forms 15
as well, unless the context clearly indicates otherwise. It will be further understood that
the terms “comprises” and/or “comprising,” when used in this specification, specify the
presence of stated features, integers, steps, operations, elements, and/or components,
but do not preclude the presence or addition of one or more other features, integers,
steps, operations, element components, and/or groups thereof. 20
While the present disclosure has been described with reference to an
exemplary embodiment or embodiments, it will be understood by those skilled in the
art that various changes may be made and equivalents may be substituted for elements
thereof without departing from the scope of the present disclosure. In addition, many
modifications may be made to adapt a particular situation or material to the teachings 25
of the present disclosure without departing from the essential scope thereof. Therefore,
it is intended that the present disclosure not be limited to the particular embodiment
disclosed as the best mode contemplated for carrying out this present disclosure, but
that the present disclosure will include all embodiments falling within the scope of the
claims. 30 , Claims:14
We Claim:
1. A cooling system for cooling at least one heat-generating electronic
device, the cooling system comprising:
a heat removal device including a surface that is thermally couplable to the at
least one heat-generating electronic device, the heat removal device including an inlet 5
area and at least one jet impingement feature fluidly coupled to the inlet area, wherein
the at least one jet impingement feature is positioned to direct a primary cooling fluid
toward the surface that is thermally coupled to the at least one heat-generating electronic
device.
2. The cooling system of claim 1, wherein the heat removal device includes 10
a heat exchanger having an outlet header, the surface that is thermally coupled to the at
least one heat-generating electronic device being arranged within the outlet header,
wherein the primary cooling fluid and a secondary cooling fluid are arranged in a heat
transfer relationship within the at least one heat exchanger.
3. The cooling system of claim 2 wherein the heat exchanger further 15
comprises:
an inlet header, the inlet area being defined by the inlet header; and
a plurality of heat exchange tubes extending between the inlet header and the
outlet header, the at least one jet impingement feature being separate from and fluidly
coupled to the plurality of heat exchange tubes. 20
4. The cooling system of claim 2, wherein the heat exchanger further
comprises:
an inlet header, the inlet area being defined by the inlet header; and
a plurality of heat exchange tubes extending between the inlet header and the
outlet header, the at least one jet impingement feature being integral with at least one 25
of the plurality of heat exchange tubes.
15
5. The cooling system of any of the preceding claims, further comprising a
fluid movement device operable to move the secondary cooling fluid through the heat
removal device.
6. The cooling system of claim 5, wherein the fluid movement device is a
fan and the secondary cooling fluid is air. 5
7. The cooling system of any of the preceding claims, wherein the heat
removal device further comprises a plurality of heat exchangers, each of the plurality
of heat exchangers being located at and thermally coupled to a respective heatgenerating
electronic device.
8. The cooling system of claim 7, wherein at least some of the plurality of 10
heat exchangers are arranged in series relative to a flow of the primary cooling fluid.
9. The cooling system of claim 7, wherein at least some of the plurality of
heat exchangers are arranged in parallel relative to a flow of the primary cooling fluid.
10. The cooling system of claim 1, wherein the primary cooling fluid
provided to the inlet area is a two-phase liquid. 15
11. The cooling system of claim 1, wherein the primary cooling fluid
provided to the heat removal device is a single-phase liquid.
12. A method of cooling an assembly including at least one heat-generating
electronic device and at least one peripheral heat-generating device, the method
comprising: 20
cooling a secondary cooling fluid via a primary cooling fluid;
flowing the cooled secondary cooling fluid over the at least one
peripheral heat-generating device; and
expelling the primary cooling fluid at a surface of a heat removal device
thermally coupled to the at least one heat-generating electronic device via at 25
16
least one jet impingement feature to cool the at least one heat-generating
electronic device.
13. The method of claim 12, wherein the heat removal device is a heat
exchanger and cooling the secondary cooling fluid via the primary cooling fluid occurs
within a plurality of heat exchanger tubes of the heat exchanger. 5
14. The method of claim 13, further comprising providing the secondary
cooling fluid to the heat exchanger via a fluid movement device.
15. The method of any claims 12-14, further comprising providing the
primary cooling fluid to another heat removal device located at and thermally coupled
to the at least one heat-generating electronic device, the another heat removal device 10
being arranged downstream from and in series with the heat removal device relative to
a flow of the primary cooling fluid.
16. The method of any of claims 12-14, further comprising providing the
primary cooling fluid to another heat removal device located at and thermally coupled
to the at least one heat-generating electronic device, the another heat removal device 15
being arranged in parallel with the heat removal device relative to a flow of the primary
cooling fluid.