Abstract: A method of cooling an assembly including at least one heat-generating electronic device and at least one peripheral heat-generating device encapsulated within a container includes cooling the at least one peripheral heat-generating device with a first cooling medium, cooling the at least one heat-generating electronic device with a cold plate having an internal fluid circuit configured to receive a second cooling medium, and cooling the first cooling medium via the heat sink.
Description:-As Attached- , Claims:-As Attached-
| # | Name | Date |
|---|---|---|
| 1 | 202414047341-STATEMENT OF UNDERTAKING (FORM 3) [20-06-2024(online)].pdf | 2024-06-20 |
| 2 | 202414047341-REQUEST FOR EXAMINATION (FORM-18) [20-06-2024(online)].pdf | 2024-06-20 |
| 3 | 202414047341-POWER OF AUTHORITY [20-06-2024(online)].pdf | 2024-06-20 |
| 4 | 202414047341-FORM 18 [20-06-2024(online)].pdf | 2024-06-20 |
| 5 | 202414047341-FORM 1 [20-06-2024(online)].pdf | 2024-06-20 |
| 6 | 202414047341-DRAWINGS [20-06-2024(online)].pdf | 2024-06-20 |
| 7 | 202414047341-DECLARATION OF INVENTORSHIP (FORM 5) [20-06-2024(online)].pdf | 2024-06-20 |
| 8 | 202414047341-Correspondence-Letter [20-06-2024(online)].pdf | 2024-06-20 |
| 9 | 202414047341-COMPLETE SPECIFICATION [20-06-2024(online)].pdf | 2024-06-20 |
| 10 | 202414047341-FORM-26 [21-06-2024(online)].pdf | 2024-06-21 |
| 11 | 202414047341-GPA-100724.pdf | 2024-07-12 |
| 12 | 202414047341-Correspondence-100724.pdf | 2024-07-12 |
| 13 | 202414047341-FORM 3 [18-12-2024(online)].pdf | 2024-12-18 |
| 14 | 202414047341-Form-4 u-r 138 [20-12-2024(online)].pdf | 2024-12-20 |