Through Via Substrate, Mounting Substrate, And Method For Manufacturing Through Via Substrate

Abstract: This through-vise substrate comprises: a substrate that includes a first surface and a second surface and is provided with a through-via including a wall surface extending from the first surface to the second surface; and a through-electrode that is located in the through-via and extends from the first surface to the second surface. The through-via comprises: a seed layer located on the wall surface, the seed layer extending along the wall surface from the first surface to the second surface; a first portion covering the seed layer; and a second portion in contact with the first portion at an interface traversing the through-via.

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