Cured Film Forming Method, Method For Manufacturing Substrate For Imprint Mold, Method For Manufacturing Imprint Mold, Method For Manufacturing Uneven Structure, Pattern Forming Method, Hard Mask Forming Method, Insulating Film Forming Method, And Method For Manufacturing Semiconductor Device

Abstract: The purpose of the present invention is to provide a cured film forming method by which a cured film that can be used as a protective film or the like can be formed in a simpler manner. Said method comprises: a step (fig. 1A) for supplying, to a substrate (3), a curable resin (2) which contains a polymerizable compound having a siloxane bond in a molecule and having at least one polymerizable functional group, a polymerization initiator, and a reactive crosslinking agent; a step (fig. 1B) for curing the curable resin; and a step (fig. 1D) for forming a cured film (1) by subjecting the cured curable resin to a plasma treatment or an oxidation treatment, decomposing organic components contained in the curable resin, and allowing a siloxane polymerization part to remain.

Patent Information

Applicants

Inventors

Specification

Documents

Application Documents