DESC:METHOD FOR MANUFACTURING OF AN ACTIVE-COOLED HEATSINK
CROSS REFERENCE TO RELATED APPLICATIONS
The present application claims priority from Indian Provisional Patent Application No. 202421046303 filed on 15/06/2024, the entirety of which is incorporated herein by a reference.
TECHNICAL FIELD
Generally, the present disclosure relates to heatsink(s). Particularly, the present disclosure relates to a method for manufacturing an active-cooled heatsink(s).
BACKGROUND
Efficient thermal regulation is critical in a wide range of applications, particularly in electronic systems, power modules, and other heat-intensive assemblies. As power densities and compactness of devices continue to increase, the need for reliable, compact, and high-performance cooling solutions becomes more vital. Active-cooled heatsinks, which incorporate flowing coolant to enhance heat removal, serve as an essential thermal management solution in such systems.
Traditionally, the heatsinks have relied on passive convection or extrusion-based liquid cooling channels integrated into metal bodies. Traditional heatsinks utilize passive convection or integrate liquid cooling channels formed through extrusion processes within thermally conductive metal bodies. Further, the manufacturing of the channels typically involves subtractive techniques such as computer numerical control (CNC) milling, drilling, or broaching, which remove material to define the channel geometry. In addition to subtractive methods, casting processes involving molten metal are employed to mold channels into predefined shapes, and extrusion techniques force heated metal through shaped dies to produce linear channel profiles. The manufacturing processes generally produce uniform cross-sectional geometries but are constrained in terms of channel complexity, dimensional tolerance, and material grain continuity. Post-processing steps such as sealing, welding, or machining may also be necessary to finalize the cooling system structure.
However, there are certain problems associated with the existing or above-mentioned mechanism of regulating heat dissipation via heatsinks. The problems primarily include inefficient thermal transfer due to poor grain continuity, high pressure drop across the coolant path, and limited design flexibility. In particular, conventional machining or extrusion methods do not allow precise grain manipulation or integration of complex internal geometries without compromising the structural integrity of the heatsink. The above-mentioned issues lead to higher operating temperatures, reduced performance of heat-generating components, and limited adaptability in modern compact electronic designs.
Therefore, there exists a need for a mechanism for regulating heat dissipation via a heatsink that is efficient, accurate, and overcomes one or more problems as mentioned above.
SUMMARY
An object of the present disclosure is to provide an active-cooled heatsink for regulating heat dissipation.
Another object of the present disclosure is to provide an active-cooled heatsink with integrally formed cooling channels using plastic deformation.
In accordance with an aspect of the present disclosure, there is provided an active-cooled heatsink for regulating heat dissipation, the heatsink comprises:
- a thermally conductive body comprising at least one surface interfacing with a heat-generating component;
- at least one cooling channel formed on the at least one surface; and
- a coolant inlet end and a coolant outlet end disposed on opposing lateral faces of the thermally conductive body,
wherein the at least one cooling channel is formed by plastic deformation of the thermally conductive body via a rotary tool.
The active-cooled heatsink for regulating heat dissipation, as described in the present disclosure, is advantageous in terms of compact design, higher cooling efficiency, and compatibility with heat-generating components across various applications. Specifically, utilizing plastic deformation through a rotary tool to form internal cooling channels enables the creation of complex channel geometries without removing material, thereby maintaining the integrity of the base material. Further, the process leads to the formation of a refined grain structure around the channel, resulting in improved thermal conductivity and mechanical strength. Additionally, as no material is removed, the manufacturing process is more material-efficient and environmentally sustainable compared to traditional milling or extrusion-based techniques. Furthermore, the placement of the coolant inlet and outlet on opposing lateral faces, adjacent to a common edge, enables streamlined coolant flow along the length of the cooling channel, contributing to minimized temperature gradients and uniform heat dissipation across the heatsink surface.
In accordance with another aspect of the present disclosure, there is provided a method for manufacturing an active-cooled heatsink for regulating heat dissipation, the method comprises:
- rotating a rotary tool about a longitudinal axis;
- traversing the rotary tool along a predefined linear path on at least one surface of a thermally conductive body;
- directing the flow of coolant along the length of the thermally conductive body via a uniform cross-sectional profile;
- deforming the thermally conductive body along the predefined path via the rotary tool; and
- displacing the substrate of the thermally conductive body along a predefined path.
Additional aspects, advantages, features, and objects of the present disclosure would be made apparent from the drawings and the detailed description of the illustrative embodiments constructed in conjunction with the appended claims that follow.
It will be appreciated that features of the present disclosure are susceptible to being combined in various combinations without departing from the scope of the present disclosure as defined by the appended claims.
BRIEF DESCRIPTION OF DRAWINGS
The summary above, as well as the following detailed description of illustrative embodiments, is better understood when read in conjunction with the appended drawings. For the purpose of illustrating the present disclosure, exemplary constructions of the disclosure are shown in the drawings. However, the present disclosure is not limited to specific methods and instrumentalities disclosed herein. Moreover, those in the art will understand that the drawings are not to scale. Wherever possible, like elements have been indicated by identical numbers.
Embodiments of the present disclosure will now be described, by way of example only, with reference to the following diagrams wherein:
Figure 1 illustrates an active-cooled heatsink for regulating heat dissipation, in accordance with an embodiment of the present disclosure.
Figure 2 illustrates a flow chart for manufacturing an active-cooled heatsink for regulating heat dissipation, in accordance with another embodiment of the present disclosure.
In the accompanying drawings, an underlined number is employed to represent an item over which the underlined number is positioned or an item to which the underlined number is adjacent. A non-underlined number relates to an item identified by a line linking the non-underlined number to the item. When a number is non-underlined and accompanied by an associated arrow, the non-underlined number is used to identify a general item at which the arrow is pointing.
DETAILED DESCRIPTION
The following detailed description illustrates embodiments of the present disclosure and ways in which they can be implemented. Although some modes of carrying out the present disclosure have been disclosed, those skilled in the art would recognize that other embodiments for carrying out or practicing the present disclosure are also possible.
As used herein, the terms “active-cooled heatsink” and “heatsink” are used interchangeably and refer to a thermal component designed to dissipate heat from electronic or mechanical assemblies through the integration of internal passages that allow coolant flow. The active-cooled heatsinks use forced liquid or gas flow to enhance thermal transfer. The components of a heatsink consist of a thermally conductive body, such as but not limited to aluminium or copper, with internal cooling channels or passages that direct coolant across or within surfaces interfacing with heat-generating components. The types of active-cooled heatsinks include straight-channel, serpentine, and multi-path configurations, and vary in body shape, such as rectangular, square, or contoured geometries to suit specific assemblies. The techniques for manufacturing an active-cooled heatsink utilize plastic deformation techniques, particularly friction stir channelling, wherein a rotary tool equipped with protruding pins is rotated about a longitudinal axis while being traversed along a predefined path on a solid metal plate. The procedure forms internal cooling channels without removing material or requiring additional machining, thereby eliminating the need for extrusion, welding, or brazing. The formed channels allow controlled coolant flow from a coolant inlet end to an outlet end. The technique is also considered environmentally sustainable, as it operates in the solid state without emitting fumes or consuming consumables, resulting in a high-integrity, leak-resistant heatsink structure.
As used herein, the term “heat dissipation” refers to a process of transferring thermal energy generated during the operation of a device to the surroundings in order to maintain safe and functional operating temperatures. Heat dissipation is essential in preventing overheating, preserving the device’s reliability, and ensuring long-term performance. The passive dissipation methods rely on natural conduction, convection, and radiation by using metal fins, thermal spreaders, or enclosures to disperse heat without any mechanical assistance. Further, active heat dissipation employs mechanical or electrical components such as, but not limited to, fans, pumps, or thermoelectric modules to accelerate the removal of heat. The above-mentioned approaches are selected based on the device thermal load, compactness, and operating conditions. Furthermore, the techniques used for heat dissipation vary widely and include conduction through thermally conductive materials such as aluminium or copper. In systems requiring high-efficiency cooling, such as electric vehicles, power electronics, or high-performance processors, active cooling solutions are integrated with internal channels or heat exchangers that circulate a coolant. The active cooling solutions are designed to ensure efficient thermal contact, controlled flow dynamics, and minimal resistance to heat transfer.
As used herein, the terms “thermally conductive body” and “body” are used interchangeably and refer to a solid material or structure that possesses the ability to efficiently transfer heat through the body volume via thermal conduction. The bodies are made from metals or metal-based composites, such as, but not limited aluminium, copper, or graphite-infused materials, which have high thermal conductivity values. The thermally conductive body facilitates the movement of heat from a heat-generating source to a dissipation interface, such as a cooling surface or a fluid-cooled pathway. The thermally conductive bodies are categorized based on material composition (metallic and non-metallic), geometry (flat plates, finned surfaces, and embedded structures), and integration (standalone components and embedded cooling features). Further, for simple geometries, extrusion, casting, or machining are used, and advanced designs utilize additive manufacturing or plastic deformation techniques, such as, but not limited to, friction stir processing to embed internal passages or channels. The internal structures enhance the functionality of the thermally conductive body by enabling active fluid flow, thus coupling conductive and convective cooling in a single integrated component.
As used herein, the terms “heat-generating component” and “component” are used interchangeably and refer to any element or device within a device that produces thermal energy during operation due to electrical, mechanical, or chemical activity. The components include processors, power modules, batteries, motors, transformers, or any circuit elements with energy conversion or resistance, causing a rise in temperature. The amount and rate of heat generation depend on the power input, efficiency, and duty cycle of the component. The effective thermal management of such components is essential to prevent performance degradation, ensure reliability, and avoid thermal failure or safety risks. The heat-generating components are categorized by function (electronic, electrochemical, and electromechanical), power rating (low, medium, or high wattage), or operating environment (automotive, industrial, aerospace, and consumer electronics). The procedures of addressing heat generation include direct attachment to thermally conductive bodies, use of thermal interface materials, and integration with active or passive cooling systems, such as, but not limited to heatsinks, cold plates, or phase-change materials. In other arrangements, cooling channels are embedded within structures interfacing with the heat source, allowing for localized heat extraction through conduction and convective flow of coolant.
As used herein, the terms “cooling channel”, “channel”, and “cooling path” are used interchangeably and refer to a predefined internal or surface-integrated passage designed to direct the flow of a coolant for the purpose of absorbing and removing heat from adjacent structures. The channels are typically embedded within or formed on thermally conductive bodies such as, but not limited to, heatsinks, cold plates, or engine blocks. The cooling channels enable active thermal regulation by allowing a fluid, such as, but not limited to, water, oil, or refrigerant to circulate through the component, thereby enhancing heat transfer from heat-generating elements to the coolant medium. The design of the channel plays a critical role in controlling thermal gradients, pressure drops, and overall cooling efficiency. The cooling channels are classified based on geometry (straight, serpentine, spiral, or branched), integration method (surface-etched, machined, extruded, or plastically deformed), and fluid flow characteristics (single-phase or two-phase flow).
As used herein, the terms “coolant inlet end” and “inlet end” are used interchangeably and refer to the designated entry point through which a cooling fluid, such as water, oil, or refrigerant, is introduced into a thermal management structure. The coolant inlet end serves as the initial interface between the external coolant supply and the internal cooling channel network within a thermally conductive component, such as a heatsink or cold plate. The inlet is typically located at a strategic position on the component to initiate optimal fluid distribution and ensure effective thermal absorption as the coolant flows through the system. The geometry, orientation, and connection type of the coolant inlet end are critical to maintaining system pressure, minimizing turbulence, and achieving uniform heat extraction. The types of coolant inlet ends vary based on design integration and functional requirements. The common types include threaded ports, barbed hose fittings, quick-connect couplings, and integrated manifolds. The coolant inlet end is positioned on flat or lateral surfaces of the component, depending on the internal channel layout and the overall system packaging. The technique of incorporating the coolant inlet end involves precise machining, forming, or additive processing, followed by sealing or joining techniques to ensure leak-proof operation. In advanced manufacturing approaches such as friction stir channelling, the inlet is integrated at the start of the channel path, aligned to support continuous coolant flow under controlled pressure for efficient thermal regulation.
As used herein, the terms “coolant outlet end” and “outlet end” are used interchangeably and refer to the exit point of a thermal management arrangement, with the heated coolant, after absorbing thermal energy from a heat-generating component, exits the internal cooling channel or passage. The coolant outlet end plays a crucial role in maintaining the circulation of coolant through the system by allowing continuous flow and pressure balance. The coolant outlet end is located strategically opposite to the coolant inlet end, either diagonally or on a parallel face. The outlet placement and design directly affect temperature gradient management and overall cooling efficiency. The types of coolant outlet ends include similar configurations to inlet ends, such as, but not limited to, threaded connectors, push-fit couplings, hose barbs, or integrated port fittings. The outlets are embedded into the body surface or machined into the edge or side of the thermally conductive structure. The technique of forming the outlet depends on the manufacturing process of the cooling channels. In subtractive manufacturing, the outlet is drilled or cut at the terminal point of the channel. In advanced methods such as, friction stir channelling, the outlet end is formed as part of the channel path and is precisely aligned to exit the body at a designated face. Further, sealing, threading, or connector integration is then performed to enable coupling with an external coolant discharge or return line.
As used herein, the terms “rotary tool” and “rotation tool” are used interchangeably and refer to a mechanical device used in manufacturing processes that involves rotation about a central axis to perform material deformation, cutting, or shaping operations. specifically, the rotary tool is designed to create internal cooling channels within a thermally conductive body by plastically deforming the material. The tool typically comprises a rotating pin or set of pins protruding from the surface, which stir, displace, and shape the substrate as the tool rotates and moves along a predetermined path. The pins allow the formation of seamless, enclosed channels without removing material, preserving the integrity and strength of the component. The types of rotary tools vary depending on the application and material properties, including friction stir welding tools, milling cutters, grinding tools, and specialized pin tools designed for friction stir processing. The technique of using a rotary tool in cooling channel formation generally involves aligning the tool with the starting point on the thermally conductive body, rotating the tool at a controlled speed about the longitudinal axis, and traversing it along a predefined path that corresponds to the desired cooling channel geometry. The pins on the tool mechanically displace the substrate material by stirring it in a solid state, creating a continuous internal passage. The above-mentioned procedure is energy-efficient, environmentally friendly, and eliminates the need for additional machining or assembly steps.
As used herein, the terms “flat surface” and “surface” are used interchangeably and refer to a planar and even exterior face or region of a solid body that provides a uniform and smooth contact area. In thermal management components such as heatsinks, the flat surface is critical for ensuring effective thermal coupling with heat-generating devices by maximizing the contact interface and minimizing air gaps that can reduce heat transfer efficiency. The flatness of the surface is controlled within specific tolerances to enable precise alignment, stable mounting, and reliable performance under operational conditions. The types of flat surfaces vary based on the intended function and manufacturing methods, including milled flat surfaces, ground surfaces, lapped surfaces, and polished surfaces. Each type presents different levels of flatness and surface finish suitable for various thermal and mechanical requirements. The procedure of producing a flat surface generally involves mechanical processes such as, but not limited to, milling, grinding, or polishing after the primary shaping of the thermally conductive body. In some advanced manufacturing techniques, the flat surface is also formed or preserved during plastic deformation processes to ensure the surface remains suitable for interfacing with other components.
As used herein, the term “coolant” refers to a fluid medium used to absorb and transfer heat away from heat-generating components to maintain optimal operating temperatures and prevent overheating. The coolants are generally liquids, gases, or phase-change materials, selected based on the thermal conductivity, specific heat capacity, chemical stability, and compatibility with the materials of the cooling system. Common coolants include, but not limited to, water, ethylene glycol mixtures, oils, refrigerants, and specialized dielectric fluids. The primary function of the coolant is to flow through internal channels or passages within a thermal management structure, carrying away heat to an external heat exchanger or radiator. The types of coolants vary widely according to the application and operating conditions. For instance, liquid coolants such as water or water-glycol mixtures are prevalent in automotive and electronic cooling due to the high thermal capacity and ease of circulation. Further, oil-based coolants are used for electrical insulation or higher temperature tolerance. The technique of using a coolant involves pumping or flowing the fluid through cooling channels formed in or on the thermally conductive body. The coolant inlet and outlet ends regulate the entry and exit points, ensuring continuous circulation and efficient heat exchange. Therefore, the proper selection and management of coolant properties are essential for system reliability, efficiency, and longevity.
As used herein, the term “uniform cross-sectional profile” refers to a geometric characteristic of a channel, passage, or structural feature wherein the shape and dimensions of the cross-section remain consistent along the entire length of the feature. Specifically, in the cooling channels within a thermal component, a uniform cross-sectional profile refers to the width, height, and overall shape of the channel do not vary as the coolant flows through the profile. The above-mentioned uniformity ensures predictable fluid dynamics, consistent pressure drops, and stable thermal performance, facilitating efficient heat transfer and reliable coolant flow behavior throughout the channel length. Types of uniform cross-sectional profiles include simple geometric shapes such as circular, rectangular, square, or elliptical cross-sections, each selected based on thermal, mechanical, and manufacturing considerations. The procedure of creating a uniform cross-sectional profile typically involves controlled manufacturing processes such as precision machining, extrusion, or plastic deformation using tools that maintain consistent contact and shaping along the channel path. For example, in friction stir channelling, a rotary tool with a fixed pin geometry moves along a predetermined path to plastically deform the material, thereby forming a cooling channel with a consistent cross-sectional shape.
As used herein, the terms “external pump” and “external input” are used interchangeably and refer to a mechanical device located outside a thermal component or system, designed to circulate coolant or fluid through cooling channels or passages to facilitate heat transfer and maintain desired operating temperatures. The external pump provides the required pressure and flow rate to drive the coolant through the cooling circuit, overcoming flow resistance and ensuring continuous circulation for efficient thermal regulation. The types of external pumps vary depending on the application and fluid type, including centrifugal pumps, positive displacement pumps (such as gear, diaphragm, or piston pumps), and axial flow pumps. The selection depends on factors like required flow rate, pressure head, fluid viscosity, and system configuration. The technique of using an external pump involves connecting the pump to the cooling system through inlet and outlet conduits, initiating coolant flow by powering the pump motor or actuator, and regulating the flow rate to optimize heat dissipation. Further, the external pumps allow flexible system design, easy maintenance, and scalability of cooling capacity, making them widely used in active cooling solutions.
As used herein, the term “return reservoir” refers to a component in a cooling system that collects and temporarily stores coolant returning from the cooling channels or circuits after absorbing heat from the thermal component. The reservoir acts as a buffer or holding tank, ensuring a steady supply of coolant to be recirculated by the pump back into the cooling channels. The return reservoir accommodate variations in coolant volume due to thermal expansion, prevents air entrainment, and facilitates the removal of trapped gases or impurities, thereby maintaining stable and efficient coolant flow within the system. The types of return reservoirs vary based on size, shape, material, and integration level within the cooling system. The return reservoirs are simple open tanks, pressurized closed containers, or integrated with filtration and deaeration functions. Further, common materials include plastics, metals, or composites selected for chemical compatibility and durability. The procedure of using a return reservoir involves placing the return reservoirs downstream of the cooling channels, with the heated coolant flowing into the reservoir.
As used herein, the terms “rotating pin” and “pins” are used interchangeably and refer to a cylindrical-shaped protrusion attached to a rotary tool used in manufacturing processes such as friction stir processing or friction stir welding. The rotating pin plays a critical role in generating localized plastic deformation and stirring of the material surface by rotating about the tool’s axis while moving along a predetermined path. The action refines the grain structure, modifies material properties, and creates features such as internal passages or cooling channels without melting the base material. The pin’s design, including the length, diameter, and surface texture, directly influences the quality and consistency of the processed area. The types of rotating pins vary according to shape, size, and application. Further, common shapes include cylindrical, tapered, threaded, or fluted pins, each designed to optimize stirring, material flow, and heat generation for specific materials and processing conditions. The technique of using a rotating pin involves mounting pins securely on a rotary tool, rotating the tool at a controlled speed while traversing it along a defined path on the thermally conductive body. The rotating pin plastically deforms the material beneath it, displacing and mixing the material to form a uniform and controlled internal channel or surface modification.
As used herein, the term “substrate” refers to a foundational material or layer on which other materials, coatings, or components are applied, processed, or built during manufacturing or assembly. In thermal management and heatsink applications, the substrate typically serves as the base thermally conductive body that supports heat-generating components and facilitates heat transfer. The substrate occupy appropriate mechanical strength, thermal conductivity, and compatibility with the materials and processes used in the manufacturing of cooling features such as channels or fins. The substrate provides the structural integrity and thermal pathway essential for efficient heat dissipation from the device or system. The types of substrates vary widely depending on the application and required properties, including metals such as aluminium, copper, or alloys; ceramics; composites; and semiconductor wafers in electronics. The choice of substrate depends on factors such as thermal conductivity, electrical insulation, weight, and cost. The technique involving substrates typically includes preparation steps such as cutting, machining, or surface finishing to meet design specifications, followed by processes like friction stir channelling, coating, or bonding to add cooling features or attach other components.
As used herein, the term “predefined path” refers to a specifically determined and programmed trajectory or route that a tool, such as a rotary tool, follows during a manufacturing or processing operation. The path is established based on design requirements and thermal management objectives to create features like cooling channels within a thermally conductive body. The predefined path ensures precise control over the tool’s movement, allowing consistent formation of internal passages with desired shapes, depths, and lengths. The predefined path enables repeatability and accuracy in manufacturing, minimizing defects and optimizing the performance of the final component. The types of predefined paths vary depending on the geometry and complexity of the cooling channels or other features to be formed. The geometry includes linear, curved, spiral, or branched paths, programmed using computer numerical control (CNC) or other automated guidance systems. The technique of using a predefined path involves designing the path based on thermal simulation or functional requirements, inputting the path coordinates into the control system of the processing machine, and guiding the rotary tool along the path during operation. Adherence to the predefined path ensures uniform plastic deformation, efficient coolant flow, and optimal heat dissipation in the manufactured heatsink or thermal component.
As used herein, the term “longitudinal axis” refers to an imaginary straight line that runs lengthwise through an object, typically aligned with the longest dimension. In the rotary tools, the longitudinal axis is the central axis around which the tool rotates. The axis provides a reference for rotational motion and directional movement, ensuring that the tool’s operation is controlled and precise. The alignment of the rotary tool’s longitudinal axis relative to the workpiece is critical for accurate formation of features such as cooling channels through plastic deformation, maintaining consistent contact and uniform material processing along the path. The types of longitudinal axes depend on the shape and orientation of the tool or component. For cylindrical rotary tools, the longitudinal axis is the central axis passing through the length of the cylinder. In other shapes, the axis corresponds to the principal axis along which rotation or translation occurs. The technique involving the longitudinal axis includes aligning the rotary tool such that the axis is parallel or at a defined angle to the surface or body to be processed. During operation, the tool is rotated about the longitudinal axis while being traversed along the workpiece, enabling controlled plastic deformation and formation of internal passages or surface modifications essential for thermal management applications.
As used herein, the term “grain structure” refers to the arrangement, size, shape, and orientation of the individual crystalline grains within a polycrystalline material, such as metals and alloys. Further, each grain is a small crystal with a specific lattice orientation, and the boundaries between grains, known as grain boundaries, influence the material’s mechanical, thermal, and electrical properties. The grain structure plays a crucial role in determining characteristics such as strength, toughness, corrosion resistance, and thermal conductivity. In manufacturing processes such as friction stir processing, the grain structure is deliberately modified to refine and homogenize the grains, resulting in improved performance of the final component. The types of grain structures based on grain size and morphology include coarse grains, fine grains, equiaxed grains (approximately equal dimensions in all directions), and elongated grains. The technique to modify or control grain structure involves techniques such as thermal treatment, mechanical working, and plastic deformation processes such as friction stir processing. In such processes, the material is plastically deformed without melting, causing dynamic recrystallization that refines the grain size and alters the orientation. The recrystallization leads to enhanced mechanical strength and improved thermal properties, which are essential for applications in active-cooled heatsinks and other thermal components.
As used herein, the term “thermally enhanced zone” refers to a localized region within a thermally conductive material or component with thermal properties such as heat transfer efficiency, conductivity, or dissipation capacity have been improved or optimized. The enhancement results from material modifications, structural changes, or manufacturing processes that alter the microstructure or geometry to promote better heat flow. In applications such as active-cooled heatsinks, the thermally enhanced zone typically surrounds areas subjected to intense heat generation, enabling more efficient heat removal and improved overall thermal management performance of the component. The types of thermally enhanced zones vary based on the techniques used to create them and the specific characteristics. For instance, zones with refined grain structure through processes such as friction stir processing, regions with embedded cooling channels formed by plastic deformation, or areas treated with coatings or surface modifications to increase thermal conductivity. The technique of creating a thermally enhanced zone generally involves controlled manufacturing processes such as localized plastic deformation, thermal treatments, or additive manufacturing, which modify the material’s microstructure or introduce internal features. The above-mentioned approaches aim to reduce thermal resistance, facilitate coolant flow, and maintain structural integrity, thereby enhancing the efficiency and durability of thermal components under operational conditions.
In accordance with an aspect of the present disclosure, there is provided an active-cooled heatsink for regulating heat dissipation, the heatsink comprises:
- a thermally conductive body comprising at least one surface interfacing with a heat-generating component;
- at least one cooling channel formed on the at least one surface; and
- a coolant inlet end and a coolant outlet end disposed on opposing lateral faces of the thermally conductive body,
wherein the at least one cooling channel is formed by plastic deformation of the thermally conductive body via a rotary tool.

Referring to figure 1, in accordance with an embodiment, there is described an active-cooled heatsink 100 for regulating heat dissipation. The heatsink 100 comprises a thermally conductive body 102 comprising at least one surface 104 interfacing with a heat-generating component, at least one cooling channel 106 formed on the at least one surface 104, and a coolant inlet end 108 and a coolant outlet end 110 disposed on opposing lateral faces of the thermally conductive body. Further, the at least one cooling channel 106 is formed by plastic deformation of the thermally conductive body 102 via a rotary tool.
The active-cooled heatsink 100 is designed to regulate heat dissipation by incorporating an internal cooling mechanism directly into the thermally conductive body 102. The body 102 includes a surface 104 that interfaces with a heat-generating component such as, but not limited to, a processor, power module, or battery pack. Further, on the surface 104, one or more cooling channels 106 are formed to accommodate the controlled flow of coolant. The channels 106 guide the coolant to extract heat from the body 102, thus maintaining optimal operating temperatures. Furthermore, the inlet 108 and outlet 110 ends are strategically positioned on opposing lateral faces of the body 102 to support the continuous flow of coolant across the thermal gradient. The cooling channels 106 are created by a technique of plastic deformation using a rotary tool. The rotary tool, typically consisting of a rotating pin, is applied to the top surface of the thermally conductive body 102 while rotating about the longitudinal axis and traversing along a predefined linear or curved path. The friction and mechanical stirring caused by the rotating pin plastically deform the metal substrate beneath the surface without melting, allowing a subsurface passage to be created. The technique is precise and eliminates the need for post-machining or sealing, as the material is only displaced and not removed. As a result, the structural integrity of the body 102 is preserved while incorporating an internal channel system. Advantageously, the direct formation of channels 106 within the heatsink body 102 ensures maximum thermal contact between the coolant and the surrounding metal, leading to efficient heat transfer. Furthermore, the manner of plastic deformation modifies the grain structure around the channels 106, forming a thermally enhanced zone that further improves heat conduction. Additionally, the positioning of the coolant inlet 108 and outlet 110 on opposing lateral faces facilitates a steady, laminar flow path, minimizing pressure drop and maintaining a consistent coolant velocity. The consistent coolant velocity ensures uniform temperature distribution, prolonging the life and reliability of the associated heat-generating components.
In an embodiment, the thermally conductive body 102 is rectangular in shape and comprises at least one flat surface configured to enable precise alignment of the at least one cooling channel 106 with the rotary tool. The thermally conductive body 102, being rectangular in shape and incorporating at least one flat surface, is specifically designed to facilitate high-precision manufacturing of internal cooling features. Further, the flat surface acts as a stable reference plane that allows accurate alignment of the rotary tool during the formation of the cooling channel 102. The geometric configuration ensures consistent contact between the rotary tool and the body 102 throughout the tool's path, reducing variability and ensuring dimensional accuracy of the channel. The rectangular geometry also simplifies fixturing during manufacturing and promotes uniform tool traversal, whether the cooling channel follows a linear or curved path. The flat surface helps to eliminate angular misalignment. The procedure of forming the cooling channel 106 using a rotary tool, particularly one with a rotating pin on the flat surface, leads to a controlled plastic deformation process. Furthermore, as the tool moves along a predefined path, material in the path is plastically stirred and displaced without removing it, resulting in an embedded channel within the thermally conductive body 102. The friction-based solid-state process improves the local grain structure of the material surrounding the channel 106, producing a thermally enhanced zone with superior mechanical and thermal properties. Therefore, improved thermal contact between the heatsink 100 and the heat-generating component is achieved with minimized defects or voids in the cooling channel, and enhanced coolant flow dynamics. Advantageously, the flat surface allows efficient heat extraction, simplifies manufacturing by avoiding subtractive or casting processes, and ensures structural robustness of the component due to grain refinement and defect minimization.
In an embodiment, the cooling channel 106 is configured to direct the flow of coolant along the length of the thermally conductive body 102 via a uniform cross-sectional profile. The cooling channel 106 is precisely configured to direct the flow of coolant along the length of the thermally conductive body 102 through a uniform cross-sectional profile. The uniformity in the channel’s 106 geometry ensures that the flow characteristics, such as velocity, pressure distribution, and turbulence, remain consistent throughout the length of the channel 106. Further, the channel 106 is formed through a plastic deformation process using a rotary tool, which plastically stirs the material along a predefined path, displacing the material to create a seamless passage within the solid body. The above-mentioned technique avoids material removal and instead reshapes the internal structure of the body 102, leading to a smooth, continuous channel without joints or abrupt changes in diameter. The uniform cross-sectional design minimizes flow disruptions and pressure drop, ensuring efficient transport of coolant from the inlet 108 to the outlet 110. The uniform coolant flow prevents localized hot spots and enables effective dissipation of heat from the interfacing surface of the thermally conductive body. The effective dissipation improves the overall thermal performance of the heatsink 100 and prolongs the operational lifespan of any attached heat-generating components. Moreover, the use of plastic deformation machining results in a refined grain structure around the channel, increasing both thermal conductivity and mechanical integrity.
In an embodiment, the coolant inlet end 108 is configured to receive pressurized coolant via an external pump, and wherein the coolant outlet end 110 is configured to discharge heated coolant to a return reservoir. The coolant inlet end 108 is designed to interface with an external pump that delivers pressurized coolant into the internal cooling channel system of the heatsink. The inlet end 108 is typically positioned on one lateral face of the thermally conductive body 102 and aligned with the beginning of the cooling channel 106. The pressurized coolant is introduced into the channel through the inlet 108, ensuring a controlled and steady flow across the length of the channel. Further, as the coolant moves through the channel 106, the channel 106 absorbs thermal energy from the body 102, which is heated due to contact with a heat-generating component. Furthermore, at the opposite end of the flow path, the coolant outlet end 110 is strategically located to allow smooth exit of the heated coolant from the cooling channel 106. The outlet 110 connects to a return reservoir that collects and stores the coolant for recirculation or heat dissipation. The integration of an external pump with the coolant inlet end 108 ensures that the coolant enters with sufficient pressure to maintain laminar or controlled turbulent flow, which enhances thermal energy absorption efficiency. The outlet end 110, leading to a return reservoir, enables continuous heat removal from the system and supports closed-loop or semi-open-loop cooling configurations. The advantages of the above-mentioned configuration include reduced thermal gradients within the conductive body, prevention of fluid stagnation, compatibility with various pump and reservoir systems, and scalable cooling capacity based on arrangement requirements.
In an embodiment, the coolant inlet end 108 and the coolant outlet end 110 are each positioned adjacent to a common edge of the at least one surface comprising the at least one cooling channel 106. The coolant inlet end 108 and the coolant outlet end 110 are strategically positioned adjacent to a common edge of the surface on which the cooling channel 106 is formed. The configuration allows both the entry and exit points of the coolant to be accessible from the same general side of the heatsink 100, simplifying plumbing and integration with external coolant circulation systems. Further, during operation, coolant enters the inlet end 108, flows along the predefined path of the cooling channel 106, and exits through the outlet end located nearby but on an opposing lateral face. The flow pattern ensures a guided and efficient transfer of thermal energy from the body to the coolant and keeps the overall coolant routing compact and maintenance-friendly. The arrangement minimizes the footprint of the inlet/outlet interface, facilitates faster installation in confined environments such as electric vehicle platforms or dense electronics, and reduces potential pressure losses by maintaining a consistent flow direction. Furthermore, the above-mentioned arrangement allows for easier routing of hoses or tubes for coolant circulation and minimizes the risk of flow disturbance. The advantages of the coolant inlet end 108 and the coolant outlet end 110 are each positioned adjacent to a common edge of the at least one surface 104 including streamlined system architecture, ease of assembly and service, optimized cooling efficiency due to consistent coolant flow paths, and better adaptability to varied component layouts.
In an embodiment, the rotary tool comprises a rotating pin configured to displace the substrate of the thermally conductive body 102 along a predefined path. The rotary tool incorporates a rotating pin that is specifically designed to engage the substrate of the thermally conductive body 102 and plastically displace it along a predefined path. Further, during operation, the pin rotates about the longitudinal axis and is simultaneously being traversed across the surface of the body 102. As the pin rotates, the pin generates frictional heat, softening the surrounding material without reaching the melting point. The softened substrate is stirred and displaced laterally and downward, allowing the formation of the cooling channel 106 within the solid body through a controlled plastic deformation process. The direction and geometry of the predefined path dictate the shape and route of the cooling channel 106. The above-mentioned technique enhances the mechanical integrity and thermal conductivity of the heatsink with no joints or added interfaces that introduce thermal resistance or mechanical weakness. Advantages of a rotating pin configured to displace the substrate of the thermally conductive body 102 include superior thermal performance due to uninterrupted material continuity, increased structural reliability, and precision channel shaping with minimal waste. Additionally, the friction stir channelling technique allows for flexibility in channel design, enabling complex paths and geometries that optimize coolant flow and thermal regulation across the device.
In an embodiment, the rotary tool is configured to simultaneously rotate about a longitudinal axis and traverse along a linear path over the thermally conductive body 102. Specifically, the rotary tool performs two synchronized motions during operation: rotation about the longitudinal axis and traversal along a linear path over the surface of the thermally conductive body 102. As the tool rotates and the protruding pin engages the surface substrate, generating localized frictional heat. The heat softens the material beneath and around the tool, facilitating plastic deformation without melting. Simultaneously, as the tool is moved linearly along the predetermined path, the softened material is stirred and displaced, creating an internal passage or channel within the body 102. The precise coordination between rotation and translation ensures continuous material flow and channel 106 formation along the desired route. The primary advantage is the ability to form cooling channels 106 within a solid body 102 without material removal, eliminating the need for welding, adhesives, or assembly. The advantages of the rotary tool is configured to simultaneously rotate about a longitudinal axis and traverse along a linear path, including reduced manufacturing complexity, improved dimensional accuracy, and flexibility to form channels 106 with varied paths and depths by simply altering the tool's traverse direction or speed. This enhances cooling performance and supports custom thermal management strategies in compact electronic systems.
In an embodiment, the plastic deformation alters the grain structure of the substrate of the thermally conductive body 102 and wherein the altered grain structure comprises elongated grains aligned along the direction of coolant flow. During the channel formation development, the rotary tool induces plastic deformation in the substrate of the thermally conductive body 102. The deformation occurs due to the intense mechanical stirring and frictional heat generated as the tool rotates and traverses along the predefined path. The plastic strain reorganizes the original grain structure of the metal substrate, transforming equiaxed grains into elongated grains that become directionally aligned along the flow path of the tool. The alignment coincides with the intended direction of coolant flow through the channel 106. The procedure effectively refines and orients the grain boundaries within the channel region, forming a thermally enhanced zone. The elongated grains aligned with coolant flow direction promote more efficient heat transfer, as thermal conduction is typically enhanced along the direction of grain elongation. Additionally, the refined microstructure increases resistance to fatigue and thermal cycling, making the component more robust under prolonged thermal loading. The grain alignment also reduces thermal resistance along the coolant path, enabling quicker heat extraction from interfacing components and improving overall thermal performance of the heatsink in high-demand applications.
In an embodiment, the altered grain structure extends laterally around the cooling channel 106 to form a thermally enhanced zone. The formation of the cooling channel 106 using a rotary tool induces localized plastic deformation. Further, as the rotating pin traverses the predefined path on the thermally conductive body 102, the substrate undergoes plastic strain due to mechanical stirring and generated frictional heat, resulting in the recrystallization and elongation of grains around the path of the tool. The altered grain structure extends laterally outward on either side, forming a distinct thermally enhanced zone. The region exhibits aligned and refined grains with superior directional thermal conductivity compared to the unaffected base material. The lateral extension of elongated grains increases the effective surface area for thermal conduction into the coolant path, enabling faster and more uniform heat dispersion from the surrounding body. The uniform heat dispersion reduces localized hotspots and helps maintain a stable thermal gradient across the heatsink 100. Furthermore, the structural refinement enhances mechanical durability, mitigating risks of microcracking or fatigue under cyclic thermal loads.
In accordance with a second aspect, there is described a method for manufacturing an active-cooled heatsink for regulating heat dissipation, the method comprises:
- rotating a rotary tool about a longitudinal axis;
- traversing the rotary tool along a predefined linear path on at least one surface of a thermally conductive body;
- directing the flow of coolant along the length of the thermally conductive body via a uniform cross-sectional profile;
- deforming the thermally conductive body along the predefined path via the rotary tool; and
- displacing the substrate of the thermally conductive body along a predefined path.
Figure 2 describes a method 200 for manufacturing an active-cooled heatsink for regulating heat dissipation. At the step 202, the method 200 comprises rotating a rotary tool about a longitudinal axis. At a step 204, traversing the rotary tool along a predefined linear path on at least one surface 104 of a thermally conductive body 102. At a step 206, the method 200 comprises directing the flow of coolant along the length of the thermally conductive body 102 via a uniform cross-sectional profile. At a step 208, the method 200 comprises deforming the thermally conductive body 102 along the predefined path via the rotary tool. At a step 210, the method 200 comprises displacing the substrate of the thermally conductive body 102 along a predefined path.
In an embodiment, the method 200 comprises rotating a rotary tool about a longitudinal axis. Further, the method 200 comprises traversing the rotary tool along a predefined linear path on at least one surface 104 of a thermally conductive body 102. Furthermore, the method 200 comprises directing the flow of coolant along the length of the thermally conductive body 102 via a uniform cross-sectional profile. Furthermore, the method 200 comprises deforming the thermally conductive body 102 along the predefined path via the rotary tool. Furthermore, the method 200 comprises displacing the substrate of the thermally conductive body 102 along a predefined path.
Based on the above-mentioned embodiments, the present disclosure provides significant advantages of compact design, higher cooling efficiency, and compatibility with heat-generating components across various applications. Specifically, utilizing plastic deformation through a rotary tool to form internal cooling channels enables the creation of complex channel geometries without removing material, thereby maintaining the integrity of the base material.
It would be appreciated that all the explanations and embodiments of the system 100 also apply mutatis-mutandis to the method 200.
In the description of the present invention, it is also to be noted that, unless otherwise explicitly specified or limited, the terms “disposed,” “mounted,” and “connected” are to be construed broadly, and may for example be fixedly connected, detachably connected, or integrally connected, either mechanically or electrically. They may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Modifications to embodiments and combinations of different embodiments of the present disclosure described in the foregoing are possible without departing from the scope of the present disclosure as defined by the accompanying claims. Expressions such as “including”, “comprising”, “incorporating”, “have”, and “is” used to describe and claim the present disclosure are intended to be construed in a non-exclusive manner, namely allowing for items, components or elements not explicitly described also to be present. Reference to the singular is also to be construed to relate to the plural where appropriate.
Although embodiments have been described with reference to a number of illustrative embodiments thereof, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this disclosure. More particularly, various variations and modifications are possible in the component parts and/or arrangements of the subject combination arrangement within the scope of the present disclosure, the drawings, and the appended claims. In addition to variations and modifications in the component parts and/or arrangements, alternative uses will also be apparent to those skilled in the art.
,CLAIMS:WE CLAIM:
1. An active-cooled heatsink (100) for regulating heat dissipation, the heatsink (100) comprises:
- a thermally conductive body (102) comprising at least one surface (104) interfacing with a heat-generating component;
- at least one cooling channel (106) formed on the at least one surface (104); and
- a coolant inlet end (108) and a coolant outlet end (110) disposed on opposing lateral faces of the thermally conductive body,
wherein the at least one cooling channel (106) is formed by plastic deformation of the thermally conductive body (102) via a rotary tool.

2. The heatsink (100) as claimed in claim 1, wherein the thermally conductive body (102) is rectangular in shape and comprises at least one flat surface configured to enable precise alignment of the at least one cooling channel (106) with the rotary tool.

3. The heatsink (100) as claimed in claim 1, wherein the cooling channel (106) is configured to direct the flow of coolant along the length of the thermally conductive body (102) via a uniform cross-sectional profile.

4. The heatsink (100) as claimed in claim 1, wherein the coolant inlet end (108) is configured to receive pressurized coolant via an external pump, and wherein the coolant outlet end (110) is configured to discharge heated coolant to a return reservoir.

5. The heatsink (100) as claimed in claim 1, wherein the coolant inlet end (108) and the coolant outlet end (110) are each positioned adjacent to a common edge of the at least one surface comprising the at least one cooling channel (106).

6. The heatsink (100) as claimed in claim 1, wherein the rotary tool comprises a rotating pin configured to displace the substrate of the thermally conductive body (102) along a predefined path.

7. The heatsink (100) as claimed in claim 1, wherein the rotary tool is configured to simultaneously rotate about a longitudinal axis and traverse along a linear path over the thermally conductive body (102).

8. The heatsink (100) as claimed in claim 1, wherein the plastic deformation alters grain structure of the substrate of the thermally conductive body (102) and wherein the altered grain structure comprises elongated grains aligned along the direction of coolant flow.

9. The heatsink (100) as claimed in claim 8, wherein the altered grain structure extends laterally around the cooling channel (106) to form a thermally enhanced zone.
10. A method (200) for manufacturing an active-cooled heatsink for regulating heat dissipation, the method (200) comprising:
- rotating a rotary tool about a longitudinal axis;
- traversing the rotary tool along a predefined linear path on at least one surface (104) of a thermally conductive body (102);
- directing the flow of coolant along the length of the thermally conductive body (102) via a uniform cross-sectional profile;
- deforming the thermally conductive body (102) along the predefined path via the rotary tool; and
- displacing the substrate of the thermally conductive body (102) along a predefined path.