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Jewelry Ring Resizing Device

Abstract: A jewelry ring resizing device, comprising a cuboidal housing 101 having a tray 102 installed in housing 101 via a slider 103 for enabling a user to input a ring into housing 101, a chamber 104 configured with heating elements 105, for heating ring, a platform 106 having an expansion assembly comprising a primary cylinder 107, incorporated on a primary sliding unit 108, multiple curved plates 109 via pneumatic pins 110, perform expansion of ring placed around primary cylinder 107, a reduction assembly having a secondary cylinder 111 disposed on a secondary sliding unit 112, multiple curved flaps 113 via pneumatic pushers 114, performs reduction of ring placed in secondary cylinder 111, an imaging unit 115, determine size and shape of ring, an L-shaped telescopic arm 118 having a motorised brush 119 at an end, attached in a cleaning receptacle 116 for scrubbing of the ring.

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Patent Information

Application #
Filing Date
01 December 2024
Publication Number
1/2025
Publication Type
INA
Invention Field
MECHANICAL ENGINEERING
Status
Email
Parent Application

Applicants

Marwadi University
Rajkot – Morbi Road, Rajkot 360003 Gujarat, India.

Inventors

1. Dr. Nikhilkumar Jagjivan Chotai
Department of Mechanical Engineering, Marwadi University, Rajkot – Morbi Road, Rajkot 360003 Gujarat, India.
2. Harsh Kamani
Department of Mechanical Engineering, Marwadi University, Rajkot – Morbi Road, Rajkot 360003 Gujarat, India.
3. Jaimin Dobariya
Department of Mechanical Engineering, Marwadi University, Rajkot – Morbi Road, Rajkot 360003 Gujarat, India.
4. Nandan Raiyani
Department of Mechanical Engineering, Marwadi University, Rajkot – Morbi Road, Rajkot 360003 Gujarat, India.
5. Jay Khoyani
Department of Mechanical Engineering, Marwadi University, Rajkot – Morbi Road, Rajkot 360003 Gujarat, India.
6. Dr. Karan Hiralal Motwani
Department of Mechanical Engineering, Marwadi University, Rajkot – Morbi Road, Rajkot 360003 Gujarat, India.

Specification

Description:FIELD OF THE INVENTION

[0001] The present invention relates to a jewelry ring resizing device that is designed for automatic resizing and cleaning of rings, by facilitating the process of expansion or reduction of the size of a ring to fit the user's requirements, thereby ensuring an accurate resizing of the ring without causing any damage to the ring.

BACKGROUND OF THE INVENTION

[0002] When a ring no longer fits properly, whether due to weight loss, weight gain, or being the wrong size from the start, resizing becomes necessary to ensure both comfort and appearance. Traditionally, resizing involves cutting the band, adjusting its size, and then rejoining the metal using tools like mandrels, pliers, and soldering equipment. This process requires a skilled jeweler to carefully stretch or shrink the metal, which might be time-consuming and delicate. However, the process carries risks. The ring may get damaged, especially if the ring has intricate designs or stones, and achieving a perfect fit may be challenging. Mistakes during resizing might result in a poor finish or a compromised ring, leading to additional work and cost to correct the issue.

[0003] Traditionally, people use a mandrel which is a tapered rod used for resizing rings. By placing the ring on the mandrel and hammering it gently, the jeweller increases the size. For shrinking, the jeweller would use pliers to gently squeeze the ring's band. However, this method is quite time-consuming and required careful skill. Excessive hammering may distort the shape of the ring or cause damage to delicate settings and stones. Additionally, sometimes resizing of ring become difficult to achieve a precise fit, especially for rings with intricate designs or those containing precious stones. So, for enlarging a ring, jewellers place the ring on a specialized stretcher that uses gradual pressure to stretch the band. But this method was particularly risky for rings with stones or intricate settings, as the pressure may loosen or dislodge gemstones, and the band gets weaken, making the ring prone to cracks. Additionally, the tool only be used for certain materials and sizes of bands, and the process cause slight distortions in the band’s shape.

[0004] US9775415B1 discloses about an invention that includes a ring re-sizing attachment is appended to the internal circumference of a ring band so that a ring band large enough to pass over a knuckle remains comfortably fit around the digital finger below the knuckle. The attachment includes two or more telescoping buttons joined to a base, with a conical spring urging the buttons away from the base. The spring is compressed and the buttons urged together to increase the space within the band to move the band beyond a knuckle. Once the band is beyond the knuckle, the spring urges the buttons away from the base to tighten the fit of the ring band around the finger.

[0005] US6748764B1 discloses about an invention that includes a self-adjusting finger ring size reducing mechanism has spring biased arms pivotally mounted in a slot in the lower shank portion of a ring. The arms are urged into the finger opening by the springs comprised in the slot by the arms and are retained in the slot by a bridge across the top of the slot intermediate its ends which engages the free ends of the arms to limit their movement out of the slot. The mechanism can be retrofitted to existing finger rings.

[0006] Conventionally, many devices have been developed that are capable of resizing of the jewelry like ring. However, these devices are incapable of carrying out precise expansion or reduction of the ring according to user-specified dimensions. Additionally, these existing devices also lack in heating the ring to the ideal temperature while resizing, which might damage the ring.

[0007] In order to overcome the aforementioned drawbacks, there exists a need in the art to develop a device that requires to be capable of automatically resizing a ring, in view of allowing for precise expansion or reduction of the ring according to user-specified dimensions. In addition, the developed device also needs to enable the heating and controlled adjustment of the ring's size, for ensuring that the material is heated to the ideal temperature for resizing, thereby prevents the ring from getting damage.

OBJECTS OF THE INVENTION

[0008] The principal object of the present invention is to overcome the disadvantages of the prior art.

[0009] An object of the present invention is to develop a device that is capable of automatically resizing a ring, in view of allowing precise expansion or reduction of the ring according to user-specified dimensions.

[0010] Another object of the present invention is to develop a device that enables heating and controlled adjustment of the ring's size, for ensuring that the material is heated to the ideal temperature for resizing, thereby preventing the ring from being damaged.

[0011] Yet another object of the present invention is to develop a device that facilitates cleaning of the resized ring by a means that uses temperature-controlled water to effectively clean the ring.

[0012] The foregoing and other objects, features, and advantages of the present invention will become readily apparent upon further review of the following detailed description of the preferred embodiment as illustrated in the accompanying drawings.

SUMMARY OF THE INVENTION

[0013] The present invention relates to a jewelry ring resizing device that is capable of facilitating automatic resizing of a ring to enable precise expansion or reduction based on user-specified dimensions, thereby reduces manual efforts as well as chances of human errors in the overall process.

[0014] According to an embodiment of the present invention, a jewelry ring resizing device, comprises of a cuboidal housing having a tray installed in the housing by means of a slider for enabling a user to input a ring into the housing, a microphone and a speaker are provided on the base, linked with the microcontroller to enable voice based interaction with the device, a telescopic gripper is provided on a dual axis lead screw mechanism incorporated on the base for transferring the ring as per requirement, a chamber incorporated within the housing, configured with heating elements, for heating the ring, a thermal conductivity sensor embedded in the housing detects thermal conductivity of the ring, actuation of the heating elements is regulated by temperature sensors embedded in the chamber to detect temperature of the ring, an artificial intelligence-based imaging unit, installed on the base and integrated with an ultrasonic sensor embedded in the platform, to determine size and shape of the ring, a wireless communication module, linked with the microcontroller, is provided on the base for enabling the user, by connecting with a computing unit, to input end dimensions of the ring.

[0015] According to another embodiment of the present invention, the proposed device further comprises of a platform positioned on a base of the housing, having an expansion assembly comprising a primary cylinder, incorporated on a primary sliding unit on the platform, the primary cylinder having plurality of curved plates attached along outer lateral surface of the primary cylinder by means of pneumatic pins, for an expansion of the ring placed around the primary cylinder, the plates, are configured with hinges, and are attached with the pins by means of primary ball and socket joints, to enable angular movement of the plates as per size of the ring, a reduction assembly having a secondary cylinder disposed on a secondary sliding unit located on the platform, the secondary cylinder having a plurality of curved flaps attached along inner lateral surface of the secondary cylinder by means of pneumatic pushers, for reduction of ring placed in the secondary cylinder, the flaps, are configured with pin joints, and are attached with the pushers by means of secondary ball and socket joints, to enable angular movement of the plates as per size of the ring, a cleaning receptacle, configured with a Peltier unit, disposed on the base, receives water from a water tank on the base via a conduit, for cleaning of the ring at a specific temperature, an L-shaped telescopic arm having a motorised brush at an end, attached in the receptacle by means of tertiary ball and socket joint for scrubbing of the ring.

[0016] While the invention has been described and shown with particular reference to the preferred embodiment, it will be apparent that variations might be possible that would fall within the scope of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

[0017] These and other features, aspects, and advantages of the present invention will become better understood with regard to the following description, appended claims, and accompanying drawings where:
Figure 1 illustrates a perspective view of a jewelry ring resizing device.

DETAILED DESCRIPTION OF THE INVENTION

[0018] The following description includes the preferred best mode of one embodiment of the present invention. It will be clear from this description of the invention that the invention is not limited to these illustrated embodiments but that the invention also includes a variety of modifications and embodiments thereto. Therefore, the present description should be seen as illustrative and not limiting. While the invention is susceptible to various modifications and alternative constructions, it should be understood, that there is no intention to limit the invention to the specific form disclosed, but, on the contrary, the invention is to cover all modifications, alternative constructions, and equivalents falling within the spirit and scope of the invention as defined in the claims.

[0019] In any embodiment described herein, the open-ended terms "comprising," "comprises,” and the like (which are synonymous with "including," "having” and "characterized by") may be replaced by the respective partially closed phrases "consisting essentially of," consists essentially of," and the like or the respective closed phrases "consisting of," "consists of, the like.

[0020] As used herein, the singular forms “a,” “an,” and “the” designate both the singular and the plural, unless expressly stated to designate the singular only.

[0021] The present invention relates to a jewelry ring resizing device that automatically enables resizing a ring to precisely expand or reduce its size based on user-defined dimensions. Additionally, the proposed device allows for controlled heating and adjustment of the ring’s size, in view of ensuring the material reaches the optimal temperature for resizing.

[0022] Referring to Figure 1, a perspective view of a jewelry ring resizing device is illustrated, respectively, comprising a cuboidal housing 101 having a tray 102 installed in the housing 101 by means of a slider 103, a chamber 104 incorporated within the housing 101, configured with heating elements 105, a platform 106 positioned on a base of the housing 101, having an expansion assembly comprising a primary cylinder 107, incorporated on a primary sliding unit 108 on the platform 106, the primary cylinder 107 having plurality of curved plates 109 attached along outer lateral surface of the primary cylinder 107 by means of pneumatic pins 110.

[0023] Figure 1 further illustrates a secondary cylinder 111 disposed on a secondary sliding unit 112 located on the platform 106, plurality of curved flaps 113 attached along inner lateral surface of the secondary cylinder 111 by means of pneumatic pushers 114, an artificial intelligence-based imaging unit 115, installed on the base, a cleaning receptacle 116, disposed on the base, a water tank 117 arranged on the base, an L-shaped telescopic arm 118 having a motorised brush 119 at an end, a telescopic gripper 120 is provided on a dual axis lead screw mechanism 121 incorporated on the base, a microphone 122 and a speaker 123 are provided on the base.

[0024] The device disclosed above comprising a cuboidal housing 101, designed to accommodate a tray 102 that is installed within the housing 101 via a slider 103. This configuration allows for the easy and controlled insertion of a ring into the housing 101 by the user. The housing 101 is typically constructed from durable materials such as high-grade metal, plastic, or composite materials, selected for their strength, resilience, and ability to maintain structural integrity over time.

[0025] The tray 102, which is mounted within the housing 101 using a smooth-operating slider 103, is typically made from materials such as stainless steel, aluminum, or durable plastic, ensuring both strength and ease of movement. The slider 103 is designed to facilitate the effortless and precise movement of the tray 102 within the housing 101, enabling the user to place the ring securely in position. The housing 101 and tray 102 arrangement is designed to ensure minimal friction during operation, while maintaining the precision and functionality required for the accurate handling of the ring.

[0026] The slider 103 works by enabling smooth, controlled movement of the tray 102 within the housing 101. The slider 103 mentioned above consists of a track or rail arrangement integrated into the housing 101, along which the tray 102 is mounted. The tray 102 is equipped with rollers/bearings that slide along the track, allowing the tray 102 to move in and out of the housing 101. When the user inputs a ring, the slider 103 allows the tray 102 to be positioned precisely for further operations.

[0027] A microphone 122 and a speaker 123 are integrated into the base of the housing 101, both being connected to the microcontroller to facilitate voice-based interaction with the device. The microphone 122 captures voice commands issued by the user, which are then processed by the microcontroller. Based on these commands, the microcontroller triggers appropriate actions within the device. The speaker 123 provides audio feedback to the user, confirming actions. This setup allows the user to control the device hands-free, enhancing user experience and making it more convenient for tasks that require minimal physical interaction.

[0028] The microphone 122 mentioned herein works as a transducer that converts sound waves into audio signal. The microphone 122 on receiving the input commands from the user converts the input signal into electrical signal and sends it to the microcontroller. The microcontroller processes the received signals in order to analyze the voice inputs of the user and upon analyzing the voice commands the microcontroller actuates the device and accordingly commands the device to carry out appropriate actions within the device.

[0029] The speaker 123 disclosed herein works by receiving signals from the microcontroller, converting them into sound waves through a diaphragm’s vibration, and producing audible sounds with the help of amplification and control circuitry in order to provide audio feedback to the user, confirming actions.

[0030] A telescopic gripper 120 is mounted on a dual-axis lead screw mechanism 121 integrated into the base. This dual-axis lead screw mechanism 121 is designed to facilitate precise movement and positioning of the gripper 120, allowing it to extend and retract along two axes. The gripper 120 is used to securely hold and transfer the ring as per the specific requirements of the operation. The lead screw mechanism 121 ensures smooth and controlled motion, enabling accurate handling of the ring without risk of damage.

[0031] The dual lead screw arrangement utilizes two lead screws to control the movement and positioning of gripper 120 in two axes. The dual axis lead screw arrangement comprises of a pair of lead screws both are positioned perpendicular each other. Each screws have its own dedicated lead screw and corresponding nut assembly. Each lead screw is driven by a motor, allowing individual control and movement of the gripper 120 to securely hold and transfer the ring as per the specific requirements of the operation.

[0032] The gripper 120 is pneumatically actuated, wherein the pneumatic arrangement of the gripper 120 comprises of a cylinder incorporated with an air piston and the air compressor, wherein the compressor controls discharging of compressed air into the cylinder via air valves which further leads to the extension/retraction of the piston. The piston is attached to the telescopic gripper 120, wherein the extension/retraction of the piston corresponds to the extension/retraction of the gripper 120. The actuated compressor allows extension of the gripper 120 to position the gripper 120 in a manner that the gripper 120 securely grip the ring and positions the ring as per requirement.

[0033] A chamber 104 is incorporated within the housing 101, wherein the gripper 120 securely places the griped ring within the chamber 104 for heating purposes. The chamber 104 is configured with strategically positioned heating elements 105 that are integrated within the chamber 104 structure. These heating elements 105 are designed to generate controlled thermal energy, thereby increasing the temperature of the chamber 104 and, consequently, the ring placed inside the chamber 104. The chamber 104 is typically made from heat-resistant materials, such as steel or aluminum, to ensure structural integrity under elevated temperatures. The design of the chamber 104 ensures uniform distribution of heat to the ring, facilitating the desired adjustment or resizing process by softening the material of the ring to a predefined temperature range.

[0034] Prior actuation of the heating elements 105, the microcontroller detects thermal conductivity of the ring by means of a thermal conductivity sensor. The thermal conductivity sensor consists of a sensor element placed in contact with the ring. The sensor generates a small heat source and monitors the rate at which heat is transferred through the ring. The faster the heat transfer, the higher the thermal conductivity of the ring. The sensor detects temperature changes across the ring and calculates the heat flow, providing a reading of its thermal conductivity.

[0035] In synchronization, the microcontroller actuates the heating elements 105. The heating elements 105 used herein is preferably a copper coil that generates heat when an electric current passes through the coil. When an electric current runs through a copper wire the electrons come across the resistive forces of the medium’s material, releasing energy that is expended in the form of heat energy. The copper coil is properly insulated to prevent any heat loss and also direct the generated heat toward the ring. The heating unit begins to generate heat and as the heating elements 105 warms up, the element heats the ring to a temperature as per the detected thermal conductivity.

[0036] The actuation of the heating elements 105 within the chamber 104 is regulated by temperature sensors (preferably 2 to 6 in numbers) embedded in the chamber 104, which continuously monitor the temperature of the ring. These sensors detect the current temperature of the ring and transmit the data to the microcontroller. Based on this information, the microcontroller adjusts the heating elements 105 to ensure that the ring is heated to the desired temperature. If the temperature of the ring falls below or exceeds the set threshold, the microcontroller activates or deactivates the heating elements 105 to maintain the ring's temperature within the required range, ensuring optimal heating for the resizing process.

[0037] The temperature sensor disclosed herein is equipped with two electrodes utilized to detect the rise in voltage across the electrodes due to heating of the ring. The detecting voltage is equivalent to the temperature that is sensed by the sensor. After then the sensor converts that detected temperature into electric signals and transmits that signal into the microcontroller. After that the microcontroller processes and analyze the signal to detect temperature of ring.

[0038] The base is installed with an artificial intelligence-based imaging unit 115 which works in synchronization with an ultrasonic sensor that is embedded in the platform 106 in order to determine size and shape of the ring. The imaging unit 115 disclosed herein comprises of an image capturing arrangement including a set of lenses that captures multiple images of the surroundings and the captured images are stored within memory of the imaging unit 115 in form of an optical data. The imaging unit 115 also comprises of the processor which processes the captured images.

[0039] This pre-processing involves tasks such as noise reduction, image stabilization, or color correction. The processed data is fed into AI protocols for analysis which utilizes machine learning techniques, such as deep learning neural networks, to extract meaningful information from the visual data which are processed by the microcontroller to determine size and shape of the ring.

[0040] Simultaneously, the ultrasonic sensor works by emitting ultrasonic waves and then measuring the time taken by these waves to bounce back after hitting the surface of the ring. The ultrasonic sensor includes two main parts viz. transmitter, and a receiver. The transmitter sends a short ultrasonic pulse towards the surface of ring which propagates through the air at the speed of sound and reflects back as an echo to the transmitter as the pulse hits the ring The transmitter then detects the reflected eco from the surface ring and calculations is performed by the sensor based on the time interval between the sending signal and receiving echo to determine size and shape of the ring.

[0041] A wireless communication module, connected to the microcontroller, is incorporated into the base to allow the user to remotely interact with the device. This module establishes a connection with a computing unit, enabling the user to input the desired end dimensions of the ring. Through this wireless interface, the user conveniently transmits the specified measurements to the microcontroller, which processes the input and activates the necessary components of the device to resize the ring accordingly.

[0042] The computing unit includes but not limited to a mobile and laptop that comprises a processor where the input received from the user is stored to process and retrieve the output data in order to display in the computing unit. The microcontroller is wirelessly linked with the computing unit via a communication module which includes but not limited to Wi-Fi (Wireless Fidelity) module, Bluetooth module. GSM (Global System for Mobile communication). The communication module acts as a medium between various electronic unit for establishing communication between the computing unit and device to process the input given by the user regarding desired end dimensions of the ring.

[0043] The communication module employed herein acts as an intermediate between various electronic components, wherein the module is used to establish the communication between the user’s computing unit and the microcontroller. The customized Global System for Mobile communication (GSM) module is designed for establishing a wireless connection between computing unit and the microcontroller. This module is able to receive serial data from radiation monitoring devices such as computing unit and transmit the data as text SMS to the microcontroller.

[0044] A platform 106 is mounted on the base of the housing 101 and is equipped with an expansion assembly that includes a primary cylinder 107. The primary cylinder 107 is integrated into a primary sliding unit 108, which is responsible for providing the necessary translation or movement to the cylinder. This sliding unit allows the cylinder to move along a specific axis.

[0045] The primary sliding unit 108 consists of a pair of sliding rails fabricated with grooves in which the wheel of a slider 103 is positioned that is further connected with a bi-directional motor via a shaft. The microcontroller actuates the bi-directional motor to rotate in clockwise and anti-clockwise direction that aids in rotation of shaft, wherein the shaft converts the electrical energy into rotational energy for allowing movement of the wheel to translate over the sliding rail by a firm grip on the grooves. The movement of the slider 103 results in translation of the cylinder as per the requirement.

[0046] The primary cylinder 107, positioned within the expansion assembly, is equipped with plurality of curved plates 109 (preferably 2 to 6 in numbers) that are securely affixed to the outer lateral surface of the cylinder. These curved plates 109 are attached using pneumatic pins 110 that are preferably 2 to 6 in numbers, which are designed to provide both secure attachment and adjustable positioning. The pneumatic pins 110 allow for controlled expansion and contraction of the curved plates 109 in response to air pressure, facilitating the gradual enlargement of the plates 109 when actuated.

[0047] The pneumatic pins 110 are designed to securely attach the curved plates 109 to the outer lateral surface of the primary cylinder 107. These pins 110 are actuated by controlled air pressure, allowing them to engage or disengage as needed. When air is supplied to the pins 110, these extends and lock the curved plates 109 in place, ensuring that these remain fixed during the resizing process. Conversely, when the air pressure is reduced, the pins 110 retract, releasing the curved plates 109, which then allow for adjustment. This dynamic control of the pins 110 enables precise expansion or contraction of the ring during resizing.

[0048] The curved plates 109 are configured with hinges and attached to the pneumatic pins 110 via a primary ball and socket joints. This arrangement allows the plates 109 to move angularly, adjusting their positions in accordance with the size of the ring being resized. The primary ball and socket joints enable the plates 109 to flex and align accurately around the ring, ensuring that the resizing process is performed with precision. As the pins 110 are actuated, the plates 109 that are integrated with hinges get expand or contract to accommodate the ring’s size, allowing the resizing mechanism to adapt seamlessly to different ring dimensions.

[0049] The hinges, affixed to the curved plates 109, allow the plates 109 to rotate around a fixed axis. This rotation enables the plates 109 to pivot in response to the changes in the size of the ring. As the resizing process progresses, the hinges facilitate controlled angular movement of the plates 109, enabling them to expand or contract according to the required dimensions. The flexibility of the hinges ensures smooth adjustments without compromising the structural integrity of the resizing mechanism, allowing for accurate resizing of the ring.

[0050] The primary ball and socket joints connect the curved plates 109 to the pneumatic pins 110, enabling multi-directional movement. The spherical shape of the ball allows the attached plates 109 to pivot in various directions, providing the necessary flexibility to adjust to the ring’s size. The ball and socket joints ensure smooth, precise angular movement of the plates 109, allowing for uniform resizing and ensuring that the plates 109 conform perfectly to the contours of the ring during the resizing process.

[0051] A reduction assembly, comprising a secondary cylinder 111, is arranged on a secondary sliding unit 112 positioned on the platform 106. The secondary cylinder 111 is designed to perform the reduction of the ring by applying specific forces or adjustments. The secondary sliding unit 112 allows for precise movement of the cylinder along the platform 106, ensuring that the reduction process carried out accurately according to the required specifications. By utilizing the secondary sliding unit 112, the cylinder is adjusted as needed for optimal operation during the reduction process. The secondary sliding unit 112 works in the similar manner as of primary sliding unit 108 and translates the secondary cylinder 111 as per requirement.

[0052] The secondary cylinder 111 is equipped with plurality of curved flaps 113 (preferably 2 to 6 in numbers), which are fixed along the inner lateral surface of the cylinder using pneumatic pushers 114. These flaps 113 are specifically designed to reduce the size of a ring placed within the secondary cylinder 111. When activated, the pneumatic pushers 114 exert force to move the curved flaps 113 inward, applying pressure on the ring. This inward movement of the flaps 113 facilitates the reduction process, gradually resizing the ring to the desired dimensions. The pneumatic pushers 114 ensure smooth and controlled operation, allowing precise adjustments for an accurate and consistent reduction of the ring.

[0053] The pneumatic pushers 114 operates by using compressed air to generate force that moves the curved flaps 113 inward. As activated, a compressed air flows into the pushers 114 chamber, causing a piston within the pushers 114 to expand. This expansion drives the connected flaps 113 toward the center of the secondary cylinder 111, applying pressure to the ring placed inside. The pneumatic pushers 114 force is adjustable, allowing for precise control over the amount of pressure applied, ensuring the ring is resized evenly and accurately. Once the desired size is achieved, the air pressure is released, returning the pushers 114 to their initial position.

[0054] The flaps 113 are configured with pin joints, allowing them to rotate around their axis when subjected to force. These flaps 113 are attached to the pneumatic pushers 114 by secondary ball and socket joints, which facilitate angular movement of the flaps 113 in response to the size of the ring being resized. The ball and socket joints allow the flaps 113 to pivot smoothly and adjust to the curvature of the ring as the resizing process occurs. This design ensures that the flaps 113 apply even and consistent pressure on the ring, enabling precise resizing while accommodating the specific dimensions of the ring.

[0055] The Pin joints mentioned above consists of a pin that fits through aligned holes in the flaps 113 and the corresponding attachment points on the pushers 114. This configuration allows the flaps 113 to rotate or pivot around the pin, enabling them to adjust their angle as the ring’s size changes. The pin joint’s simple design ensures smooth, controlled movement of the flaps 113, which is crucial for the precise resizing of the ring without distortion.

[0056] A cleaning receptacle 116, equipped with a Peltier unit, is positioned on the base of the housing 101 to facilitate the cleaning of the ring. The Peltier unit is thermoelectric and functions to regulate the temperature of the water received from the water tank 117, which is connected to the receptacle 116 through a conduit. The Peltier unit ensures that the water is maintained at a specific, predetermined temperature, ideal for cleaning the ring. By controlling the water's temperature, the device helps prevent any potential damage to the ring while ensuring effective cleaning.

[0057] The Peltier unit operates based on the principle of thermoelectric cooling. When an electric current passes through the unit, it causes heat to be absorbed at one side and released at the other, creating a temperature differential. One side of the Peltier unit becomes cold, while the other side becomes hot. In the context of the cleaning receptacle 116, the cold side is used to lower the temperature of the water, while the hot side dissipates the heat away. This process enables precise control over the water's temperature, ensuring it is maintained at an optimal level for effective cleaning of the ring.

[0058] An L-shaped telescopic arm 118, equipped with a motorized brush 119 at one end, is mounted within the cleaning receptacle 116 using a tertiary ball and socket joint. This configuration allows the arm 118 to move in multiple directions, ensuring flexibility and precision during operation. The telescopic arm 118 works in the similar manner as of gripper 120 mentioned above and as the arm 118 actuates the arm 118 enables adjustment in length, for allowing the brush 119 to reach various parts of the ring for thorough scrubbing.

[0059] The motorized brush 119 provides consistent movement, ensuring effective cleaning of the ring's surface. The tertiary ball and socket joint works in similar manner as of primary and secondary ball and socket joints and on actuation permits smooth, controlled movement, enhancing the efficiency of the scrubbing process.

[0060] The motorized brush 119 operates by using an electric motor to drive the bristles in a rotational motion. When activated, the motor powers the brush 119, causing it to rotate or oscillate, depending on the design. The movement of the bristles scrubs the surface of the ring, removing dirt, debris, or residues. The brush 119 is attached to a telescopic arm 118, which allows it to adjust its position for cleaning different parts of the ring effectively. The motorized brush 119 provides consistent pressure and speed, ensuring thorough cleaning while minimizing the risk of damage to the ring's surface.

[0061] Moreover, a battery is associated with the device for powering up electrical and electronically operated components associated with the device and supplying a voltage to the components. The battery used herein is preferably a Lithium-ion battery which is a rechargeable unit that demands power supply after getting drained. The battery stores the electric current derived from an external source in the form of chemical energy, which when required by the electronic component of the device, derives the required power from the battery for proper functioning of the device.

[0062] The present invention works best in the following manner, where the cuboidal housing 101 having the tray 102 installed in the housing 101 by means of the slider 103 for enabling the user to input the ring into the housing 101. Then the microphone 122 and the speaker 123 are provided on the base, linked with the microcontroller to enable voice-based interaction with the device. Thereafter the telescopic gripper 120 is provided on the dual axis lead screw mechanism 121 incorporated on the base for transferring the ring as per requirement. Now the chamber 104 incorporated within the housing 101, configured with heating elements 105, for heating the ring. Thereafter the thermal conductivity sensor embedded in the housing 101 detects thermal conductivity of the ring to trigger the microcontroller to actuate the heating elements 105 to heat the ring to the temperature as per the detected thermal conductivity. The actuation of the heating elements 105 is regulated by temperature sensors embedded in the chamber 104 to detect temperature of the ring. Afterwards the artificial intelligence-based imaging unit 115, installed on the base and integrated with the ultrasonic sensor embedded in the platform 106, to determine size and shape of the ring. Then the wireless communication module, linked with the microcontroller, is provided on the base for enabling the user to remotely trigger the microcontroller, by connecting with the computing unit, to input end dimensions of the ring. Now the platform 106 positioned on the base of the housing 101, having the expansion assembly comprising the primary cylinder 107, incorporated on the primary sliding unit 108 on the platform 106.

[0063] In continuation, then the primary cylinder 107 having plurality of curved plates 109 attached along outer lateral surface of the primary cylinder 107 by means of pneumatic pins 110, for the expansion of the ring placed around the primary cylinder 107. Also, the plates 109, are configured with hinges, and are attached with the pins 110 by means of primary ball and socket joints, to enable angular movement of the plates 109 as per size of the ring. Afterwards the reduction assembly having the secondary cylinder 111 disposed on the secondary sliding unit 112 located on the platform 106. Then the secondary cylinder 111 having the plurality of curved flaps 113 attached along inner lateral surface of the secondary cylinder 111 by means of pneumatic pushers 114, for reduction of ring placed in the secondary cylinder 111. Also, the flaps 113, are configured with pin joints, and are attached with the pushers 114 by means of secondary ball and socket joints, to enable angular movement of the plates 109 as per size of the ring. Further the cleaning receptacle 116, configured with the Peltier unit, disposed on the base, receives water from the water tank 117 on the base via the conduit, for cleaning of the ring at the specific temperature. Moreover, the L-shaped telescopic arm 118 having the motorised brush 119 at the end, attached in the receptacle 116 by means of tertiary ball and socket joint for scrubbing of the ring.

[0064] Although the field of the invention has been described herein with limited reference to specific embodiments, this description is not meant to be construed in a limiting sense. Various modifications of the disclosed embodiments, as well as alternate embodiments of the invention, will become apparent to persons skilled in the art upon reference to the description of the invention. , C , Claims:1) A jewelry ring resizing device, comprising:

i) a cuboidal housing 101 having a tray 102 installed in said housing 101 by means of a slider 103 for enabling a user to input a ring into said housing 101;

ii) a chamber 104 incorporated within said housing 101, configured with heating elements 105, for heating said ring, wherein a thermal conductivity sensor embedded in said housing 101 detects thermal conductivity of said ring to trigger a microcontroller to actuate said heating elements 105 to heat said ring to a temperature as per said detected thermal conductivity, wherein actuation of said heating elements 105 is regulated by temperature sensors embedded in said chamber 104 to detect temperature of said ring;

iii) a platform 106 positioned on a base of said housing 101, having an expansion assembly comprising a primary cylinder 107, incorporated on a primary sliding unit 108 on said platform 106, said primary cylinder 107 possesses a plurality of curved plates 109 attached along outer lateral surface of said primary cylinder 107 by means of pneumatic pins 110, for an expansion of said ring placed around said primary cylinder 107;

iv) a reduction assembly having a secondary cylinder 111 disposed on a secondary sliding unit 112 located on said platform 106, said secondary cylinder 111 having a plurality of curved flaps 113 attached along inner lateral surface of said secondary cylinder 111 by means of pneumatic pushers 114, for reduction of ring placed in said secondary cylinder 111;

v) an artificial intelligence-based imaging unit 115, installed on said base and integrated with a processor for recording and processing images in vicinity of said base, in synchronisation with an ultrasonic sensor embedded in said platform 106, to determine size and shape of said ring to trigger said microcontroller to actuate said expansion assembly and said reduction assembly as per input of said user; and

vi) a cleaning receptacle 116, configured with a Peltier unit, disposed on said base, receives water from a water tank 117 on said base via a conduit, for cleaning of said ring at a specific temperature, wherein an L-shaped telescopic arm 118 having a motorized brush 119 at an end, attached in said receptacle 116 by means of tertiary ball and socket joint for scrubbing of said ring.

2) The device as claimed in claim 1, wherein a telescopic gripper 120 is provided on a dual axis lead screw mechanism 121 incorporated on said base for transferring said ring onto said expansion assembly, said reduction assembly, said cleaning receptacle 116 and back to said tray 102 for access of said user.

3) The device as claimed in claim 1, wherein said plates 109, are configured with hinges, and are attached with said pins 110 by means of primary ball and socket joints, to enable angular movement of said plates 109 as per size of said ring.

4) The device as claimed in claim 1, wherein said flaps 113, are configured with pin joints, and are attached with said pushers 114 by means of secondary ball and socket joints, to enable angular movement of said plates 109 as per size of said ring.

5) The device as claimed in claim 1, wherein a wireless communication module, linked with said microcontroller, is provided on said base for enabling said user to remotely trigger said microcontroller, by connecting with a computing unit, to input end dimensions of said ring.

6) The device as claimed in claim 1, wherein a microphone 122 and a speaker 123 are provided on said base, linked with said microcontroller to enable voice-based interaction with said device.

Documents

Application Documents

# Name Date
1 202421094371-STATEMENT OF UNDERTAKING (FORM 3) [01-12-2024(online)].pdf 2024-12-01
2 202421094371-REQUEST FOR EXAMINATION (FORM-18) [01-12-2024(online)].pdf 2024-12-01
3 202421094371-REQUEST FOR EARLY PUBLICATION(FORM-9) [01-12-2024(online)].pdf 2024-12-01
4 202421094371-POWER OF AUTHORITY [01-12-2024(online)].pdf 2024-12-01
5 202421094371-FORM-9 [01-12-2024(online)].pdf 2024-12-01
6 202421094371-FORM FOR SMALL ENTITY(FORM-28) [01-12-2024(online)].pdf 2024-12-01
7 202421094371-FORM 18 [01-12-2024(online)].pdf 2024-12-01
8 202421094371-FORM 1 [01-12-2024(online)].pdf 2024-12-01
9 202421094371-FIGURE OF ABSTRACT [01-12-2024(online)].pdf 2024-12-01
10 202421094371-EVIDENCE FOR REGISTRATION UNDER SSI(FORM-28) [01-12-2024(online)].pdf 2024-12-01
11 202421094371-EVIDENCE FOR REGISTRATION UNDER SSI [01-12-2024(online)].pdf 2024-12-01
12 202421094371-EDUCATIONAL INSTITUTION(S) [01-12-2024(online)].pdf 2024-12-01
13 202421094371-DRAWINGS [01-12-2024(online)].pdf 2024-12-01
14 202421094371-DECLARATION OF INVENTORSHIP (FORM 5) [01-12-2024(online)].pdf 2024-12-01
15 202421094371-COMPLETE SPECIFICATION [01-12-2024(online)].pdf 2024-12-01
16 Abstract.jpg 2024-12-26
17 202421094371-FORM-26 [03-06-2025(online)].pdf 2025-06-03