Description:FIELD OF THE INVENTION

[0001] The present invention relates to a horizontal machining center (HMC) tracking device that is capable of providing a means to track a HMC by detecting position, performance, and machining parameters to evaluate faults, optimize machining speed, and provide automated adjustments to ensure greater precision and efficiency in the HMC operation.

BACKGROUND OF THE INVENTION

[0002] Tracking of a horizontal machining center (HMC) plays an important role in ensuring precision, efficiency, and safety during the machining process. By continuously monitoring the position and movement of the HMC, operators can ensure that the workpiece is being processed accurately according to the required specifications. Tracking helps in detecting any misalignments, deviations, or potential issues with the machine's performance, allowing for early intervention and minimizing the risk of errors or defects in the final product. It also aids in optimizing machine operation by providing data on machine wear, speed, and efficiency, which can be used for predictive maintenance, reducing downtime and extending the lifespan of the equipment. Additionally, effective tracking ensures that the HMC operates within safe limits, preventing accidents or damage to the machine or workpiece.

[0003] Traditionally, the tracking of a Horizontal Machining Center (HMC) is done manually by operators using visual inspections, measurement tools, and monitoring gauges. Operators monitor the machine's movement and positioning by reading scales, dials, or digital readouts on the machine's control panel. They may use tools like micrometres, calipers, or dial indicators to check the accuracy of the workpiece alignment and ensure it is within tolerances. If any issues are detected, adjustments are made manually to correct the position or operation of the HMC. This method, while effective finds to be time-consuming, prone to human error, and may not provide real-time or comprehensive data about the machine’s performance.

[0004] US20050085358A1 discloses a horizontal machining center has a table on a bed . An X-axis slidable surface is provided on the bed , and a column is driven by a servo motor . A spindle stock is supported on the column and is driven along a Y axis extending in a vertical direction. An automatic tool change unit replaces a tool on a spindle on the spindle stock with a tool in a tool magazine. An X-axis cover provided between the table and the column has a plate-like fixed cover and a pair of slidable covers . The fixed cover is disposed with one edge thereof passing through an opening formed in the middle of the tool magazine. Structured in this way, the horizontal machining center can have a reduced size.

[0005] US6877407B2 disclose a machine tool such as an NC lathe having a machine body is disclosed. The machine tool comprises a fixed bed, a machine body having a carriage with a tool post mounted thereon is provided on one side of the fixed bed nearer to an operator, and a headstock for loading a workpiece thereon is provided on another side of the fixed bed farther from the operator. The machine tool also includes a cover having a front wall and a side wall to cover at least a front face and a side wall of the machine body, respectively. The cover is provided so as to externally surround the machine tool, and wherein a portion of the side wall of the cover adjacent the tool post includes a door opening formed therein and a side door for opening and closing the door opening. Thus, the tool replacement work is facilitated and the overall workability of the machine tool can be improved.

[0006] Conventionally, many devices disclosed in prior art provides a way to track the Horizontal Machining Center (HMC) by using sensors like linear encoders, rotary sensors, and cameras to monitor the machine’s position and movement for accurate machining by tracking the axes and performance but lack in providing real-time guidance and support, often requiring manual intervention.

[0007] In order to overcome the aforementioned drawbacks, there exists a need in the art to develop a device that is capable of integrating advanced technologies to optimize the tracking and performance of the Horizontal Machining Center (HMC) by continuously carrying out, fault detection, and predictive maintenance, as well as providing real-time feedback through augmented projections, ensuring more precise, efficient, and adaptive machining.

OBJECTS OF THE INVENTION

[0008] The principal object of the present invention is to overcome the disadvantages of the prior art.

[0009] An object of the present invention is to develop a device that is capable of tracking the HMC by detecting position, performance, and machining parameters to evaluate faults, optimize machining speed, and provide automated adjustments to ensure greater precision and efficiency in the HMC operation.

[0010] Another object of the present invention is to develop a device that is capable of providing real-time analysis and feedback on the machining process by continuous monitoring of workpiece conditions, tool deviations, and optimize parameters for improved accuracy in the HMC operation.

[0011] Yet another object of the present invention is to develop a device that is capable of manipulating physical components of the Horizontal Machining Center (HMC) for operational and maintenance purposes.

[0012] The foregoing and other objects, features, and advantages of the present invention will become readily apparent upon further review of the following detailed description of the preferred embodiment as illustrated in the accompanying drawings.

SUMMARY OF THE INVENTION

[0013] The present invention relates to a horizontal machining center (HMC) tracking device that that is capable of tracking the Horizontal Machining Center (HMC) by continuously monitoring position, performance, and machining parameters and accordingly evaluating faults, deviations from required machining parameters, and optimize machining speed, to ensure automated adjustments to enhance efficiency in the HMC operation.

[0014] According to an embodiment of the present invention, a horizontal machining center (HMC) tracking device, comprises of a cuboidal housing having a pair of tracked wheels disposed underneath the housing for locomotion of the housing, an artificial intelligence-based imaging unit, installed on the housing to determine obstacle in path, an articulated L-shaped telescopic linked mounted on the housing having an inspection unit at and end comprises a cuboidal structure having an artificial intelligence-based camera installed on the structure synchronisation with a laser sensor embedded in the structure, to measure dimensions of a workpiece to be machined on an HMC, a laser induced breakdown spectroscopy (LIB) unit integrated in the structure to detect a material of constriction of the workpiece to determine an ideal machining speed, a rotational rate of a machining spindle of the HMC is monitored by an RPM (rotations per minute) sensor embedded in the structure and a feed rate of the workpiece is recorded by a laser sensor provided in the structure, to determine deviations from optimal machining parameters, an infrared thermal imaging unit disposed in the inspection unit to detect a temperature of the workpiece being machined, inadequate coolant flow detected by an optical flow sensor incorporated in the structure to detect flow rate of coolant onto workpiece, a holographic projection unit installed on the housing, to project images indicated parameters of the workpiece, a robotic arm mounted on the housing to manipulate physical components of the HMC for operational or maintenance purposes, a GPS (global positioning system) unit integrated in the housing, enable a tracking of location of the housing, a database is configured with G-codes, M-codes, received from a wireless communication unit provided in the housing, enabled to wirelessly connect with a computing unit of user, a robotic arm mounted on the housing to manipulate physical components of the HMC for operational or maintenance purposes and a battery associated with the device to supply power to all the components associated with the device to operate the device accordingly.

[0015] While the invention has been described and shown with particular reference to the preferred embodiment, it will be apparent that variations might be possible that would fall within the scope of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] These and other features, aspects, and advantages of the present invention will become better understood with regard to the following description, appended claims, and accompanying drawings where:
Figure 1 illustrates an isometric view of a horizontal machining center (HMC) tracking device.

DETAILED DESCRIPTION OF THE INVENTION

[0017] The following description includes the preferred best mode of one embodiment of the present invention. It will be clear from this description of the invention that the invention is not limited to these illustrated embodiments but that the invention also includes a variety of modifications and embodiments thereto. Therefore, the present description should be seen as illustrative and not limiting. While the invention is susceptible to various modifications and alternative constructions, it should be understood, that there is no intention to limit the invention to the specific form disclosed, but, on the contrary, the invention is to cover all modifications, alternative constructions, and equivalents falling within the spirit and scope of the invention as defined in the claims.

[0018] In any embodiment described herein, the open-ended terms "comprising," "comprises,” and the like (which are synonymous with "including," "having” and "characterized by") may be replaced by the respective partially closed phrases "consisting essentially of," consists essentially of," and the like or the respective closed phrases "consisting of," "consists of, the like.

[0019] As used herein, the singular forms “a,” “an,” and “the” designate both the singular and the plural, unless expressly stated to designate the singular only.

[0020] The present invention relates to a horizontal machining center (HMC) tracking device that is capable of continuously monitors position, performance, and machining parameters, evaluates faults, detects deviations, and optimizes machining speed to ensure automated adjustments and enhance operational efficiency in the HMC.

[0021] Referring to Figure 1, an isometric view of a horizontal machining center (HMC) tracking device is illustrated, comprising a cuboidal housing 101 having a pair of tracked wheels 102 disposed underneath the housing 101, an artificial intelligence-based imaging unit 103 installed on the housing 101, an articulated L-shaped telescopic linked 104 mounted on the housing 101 and having an inspection unit 105 at and end, the inspection unit 105 comprises a cuboidal structure 106 having an artificial intelligence-based camera 107, an infrared thermal imaging unit 108 disposed in the inspection unit 105, a holographic projection unit 109 installed on the housing 101, and a robotic arm 110 mounted on the housing 101.

[0022] The proposed device comprises of a cuboidal housing 101 encased with various components associated with the device arranged in sequential manner that aids in tracking a horizontal machining center (HMC). Upon securing the housing 101 over a surface, the user activates the device manually by pressing a switch button associated with the device and integrated with the housing 101. The button mentioned herein is a type of a switch that is internally connected with the device via multiple circuits that upon pressing by the user, the circuits get closed and starts conducting electricity that tends to activate the device and vice versa. After activation of the device by the user, a microcontroller associated with the device generates commands to operate the device accordingly.

[0023] After activating of the device, the microcontroller activates an imaging unit 103 installed on the housing 101 to detect obstacle in path of the housing 101. The imaging unit 103 mentioned herein comprises of comprises of a camera and processor that works in collaboration to capture and process the images of the surrounding of the housing 101. The camera firstly captures multiple images of the surrounding, wherein the camera comprises of a body, electronic shutter, lens, lens aperture, image sensor, and imaging processor that works in sequential manner to capture images of the surrounding.

[0024] After capturing of the images by the camera, the shutter is automatically open due to which the reflected beam of light coming from the surrounding due to light is directed towards the lens aperture. After that the reflected light beam passes through the image sensor. The image sensor now analyzes the beam to retrieve signal from the beams which is further calibrate by the sensor to capture images of the surrounding in electronic signal. Upon capturing images, the imaging processor processes the electronic signal into digital image. When the image capturing is done, the processor associated with the imaging unit 103 processes the captured images by using a protocol of artificial intelligence to retrieve data from the captured image in the form of digital signal.

[0025] The detected data in the form of digital signal is now transmitted to the linked microcontroller based on which the microcontroller acquires the data to detect the obstacles in path of the housing 101. Based on detecting the obstacles, the microcontroller actuates a pair of tracked wheels 102 integrated underneath the housing 101 for locomotion of the housing 101. The track wheels 102 work by utilizing a motor-driven mechanism that converts rotational motion into linear movement, allowing the housing 101 to navigate smoothly. Each wheel is powered by an individual motor, controlled by the microcontroller, which adjusts the speed and direction of the wheels 102 based on the detected obstacle to move the device accordingly towards the HMC.

[0026] Upon reaching of the housing 101 near the HMC, as detected by the microcontroller via the imaging unit 103, the microcontroller actuates articulated L-shaped telescopic linked 104 mounted on the housing 101 for moving a cuboidal structure 106 associated with an inspection unit 105 having an artificial intelligence-based camera 107 installed on the structure 106 in proximity of the HMC. The articulated L-shaped telescopic linked 104 works by using a series of motorized joints and extendable segments that enable precise movement and positioning of the cuboidal structure 106 that is controlled by the microcontroller, wherein articulated mechanism adjusts the angles and extends or retracts the telescopic sections of the arm to bring the cuboidal structure 106 into the desired proximity of the HMC. Herein, the motorized joints allow rotational and angular movements of the arms for ensuring linear extension for reaching the structure 106 in proximity of the HMC.

[0027] After reaching of the structure 106 in proximity of the HMC, the artificial intelligence-based camera 107 synced with a laser sensor embedded in the structure 106 measures dimensions of the workpiece to be machined on the HMC. The camera 107 captures and process the images of the workpiece based on that the microcontroller process and analyse the data to detect the workpiece. Simultaneously, the laser sensor detects the dimensions of the workpiece. The laser sensor operates by emitting a focused laser beam toward the workpiece and analysing the reflected light to determine the distance and dimensions with high precision. The laser sensor uses the principle of time-of-flight to calculate measurements. When the laser beam hits the surface of the workpiece, the sensor detects the reflected light's angle or time delay and processes this data to determine the dimensions of the workpiece.

[0028] Based on detecting the dimensions of the workpiece, the microcontroller compares with machining blueprints stored in a database linked with the microcontroller to determine machining parameters for optimum machining. Herein, the database is configured to store G-codes, M-codes, and other relevant data received from a wireless communication unit installed in the housing 101. G-codes and M-codes are standard programming commands used in CNC (Computer Numerical Control) machines to control machining processes. G-codes typically specify geometric movement commands, such as positioning, while M-codes manage machine functions like tool changes, coolant control, or start/stop operations.

[0029] The wireless communication unit allow transmission of the codes from the machine to the user’s computing unit without the need for physical connections. By wirelessly connecting to the user’s computer, the communication unit allows real-time monitoring and control of the machine's operations, transmitting G-codes and M-codes directly to the database. The wireless connectivity aids the user to access, store, and manage machine data efficiently, allowing for better workflow management, troubleshooting, and the ability to retrieve or modify machine commands remotely while operating the horizontal machining center.

[0030] While operating the horizontal machining center, a laser induced breakdown spectroscopy (LIB) unit integrated in the structure 106 to detect a material of the workpiece to determine an ideal machining speed. The LIB unit works by hitting a high-energy laser pulse onto the surface of the workpiece, which generates a micro plasma by rapidly heating and ionizing a tiny amount of the material. This micro plasma emits light containing spectral lines characteristic of the elements present in the material. The LIB unit then collects this emitted light using a spectrometer, which analyzes the spectral lines to identify the material's composition accurately.

[0031] By determining the elemental makeup of the workpiece, the LIB unit provides critical data to the microcontroller for detecting an ideal machining speed of the HMC. Herein, at the time of operating the HMC, the microcontroller uses the material composition data obtained from the LIB unit to adjust the machining parameters in real-time. Based on the detected material, the microcontroller calculates the optimal machining speed, tool pressure, and cutting strategy to ensure efficient and accurate processing to adapt to different materials by automatically selecting the ideal settings for the workpiece, minimizing tool wear, improving surface finish, and reducing processing time.

[0032] During operation of the HMC for processing the workpiece, an RPM (rotations per minute) sensor embedded in the structure 106 detects rotational rate of a machining spindle of the HMC. The RPM sensor works by using a magnetic, sensing mechanism to monitor the rotational speed of the machining spindle. In the RPM sensor, a magnet attached to the spindle generates a changing magnetic field as the spindle rotates, based on that the RPM sensor detects the rotational rate of the machining spindle of the HMC. Further, the laser sensor detects a feed rate of the workpiece. Based on detecting the feed rate of the workpiece and rotational rate of the spindle, the microcontroller evaluates deviations from optimal machining parameters.

[0033] Additionally, an infrared thermal imaging unit 108 disposed in the inspection unit 105 to detect a temperature of the workpiece that is being machined. The infrared thermal imaging unit 108 works by using infrared sensor to capture the heat emitted from the surface of the workpiece. The infrared sensor detects infrared radiation, which is emitted by the workpiece, and convert it into a thermal image or heat map. The resulting image shows temperature variations across the workpiece, allowing for precise monitoring of temperature distribution.

[0034] Based on detecting the temperature of the workpiece, the microcontroller actuates the artificial intelligence-based camera 107 to continuously detect machining and determine a type of fault from excessive machining speed. Simultaneously, an optical flow sensor incorporated in the structure 106 detect flow rate of coolant onto workpiece by the HMC. The flow sensor works by detecting the rate at which coolant is being delivered to the workpiece during machining. The sensor operates using a principle where it measures the velocity or volume of the coolant as it passes through a pipe or channel of the HMC. Typically, the sensor uses technologies such as mechanical wheels 102 in which a small impeller inside the sensor is pushed by the moving coolant, and the rotation speed of the impeller is proportional to the flow rate. Based on detection, the detected data is processed by the microcontroller to detect the flow rate of the coolant to determine inadequate coolant flow on the workpiece.

[0035] Moreover, a robotic arm 110 is integrated on the housing 101 to manipulate physical components of the HMC for operational or maintenance purposes. The robotic arm 110 operates using motors and sensors to move its joints (shoulder, elbow, and wrist) in different directions, allowing it to perform actions such as adjusting components, changing tools, or performing routine maintenance. The arm 110 is controlled by the microcontroller, which sends commands for tasks like tightening bolts, replacing parts, or realigning the machine. Sensors help the robotic arm 110 work accurately and safely, making maintenance tasks easier and more efficient to perform tasks efficiently and without causing damage. In this way, the robotic arm 110 enhances both the operational efficiency and ease of maintenance of the HMC.

[0036] Based on determining deviations from optimal parameters, inadequate coolant flow on the workpiece, the microcontroller actuates a holographic projection unit 109 installed on the housing 101, to project images indicated parameters of the workpiece and the HMC and indicate deviations and faults detected by the inspection unit 105 for a reference of user. The holographic projection unit 109 works by utilizing advanced light projection technology to create 3D images of the workpiece and the relevant parameters of the HMC (Hardware Machine Controller). The projection unit 109 uses a combination of lasers, mirrors, and optical methods to project detailed, interactive visual representations in mid-air.

[0037] The microcontroller then processes data from the inspection unit 105, which detects deviations and faults in the workpiece, and sends the necessary information to the holographic projection unit 109. This unit then generates dynamic holograms that display these detected anomalies, such as cracks, misalignments, or other faults, as well as the parameters that are out of specification. The presented holograms allow users to see the exact location and nature of the issues, providing user with a visual reference for easy identification and immediate corrective actions that aid for enhancing the efficiency in HMC operation.

[0038] The holographic projection unit 109 assists the user by showing important information about the clamping process by indicating any problems related to the clamping of the workpiece. By the laser sensor, the device finds the current position of the metal workpiece and uses a machine learning protocols to show the best position for clamping the workpiece via the holograms by the projection unit 109. The holographic projection unit 109 display the size of the workpiece so that the user manually adjust the X, Y, and Z axes of the machine to position the workpiece correctly and speed up the process for processing via the HMC.

[0039] A battery (not shown in figure) is associated with the device to offer power to all electrical and electronic components necessary for their correct operation. The battery is linked to the microcontroller and provides (DC) Direct Current to the microcontroller. And then, based on the order of operations, the microcontroller sends that current to those specific electrical or electronic components so they effectively carry out their appropriate functions.

[0040] The present invention works best in following manner that includes the cuboidal housing 101 having the pair of tracked wheels 102 for locomotion of the housing 101. Herein, the imaging unit 103 determine obstacle in path to trigger the microcontroller to actuate the wheels 102 to dodge the obstacle during locomotion. After that the articulated L-shaped telescopic having an inspection unit 105 at and end measure dimensions of a workpiece to be machined on an HMC to compare with machining blueprints stored on a database connected with the microcontroller to determine machining parameters for optimum machining. Further, the laser induced breakdown spectroscopy (LIB) unit detect a material of constriction of the workpiece to determine an ideal machining speed, wherein a rotational rate of a machining spindle of the HMC is monitored by the RPM (rotations per minute) sensor and a feed rate of the workpiece is recorded by the laser sensor to determine deviations from optimal machining parameters. Also, the infrared thermal imaging unit 108 detect a temperature of the workpiece being machined to trigger the microcontroller to actuate the artificial intelligence-based camera 107 to continuously monitor machining and determine a type of fault from excessive machining speed and inadequate coolant flow detected by the optical flow sensor incorporated in the structure 106 to detect flow rate of coolant onto workpiece. Further, the holographic projection project images indicated parameters of the workpiece and the HMC and indicate deviations and faults detected by the inspection unit 105 for a reference of user.

[0041] Although the field of the invention has been described herein with limited reference to specific embodiments, this description is not meant to be construed in a limiting sense. Various modifications of the disclosed embodiments, as well as alternate embodiments of the invention, will become apparent to persons skilled in the art upon reference to the description of the invention. , Claims:1) A horizontal machining center (HMC) tracking device, comprising:

i) a cuboidal housing 101 having a pair of motorized tracked wheels 102 disposed underneath said housing 101 for locomotion of said housing 101;
ii) an imaging unit 103, installed on said housing 101 and integrated with a processor for recording and processing images in a vicinity of said housing 101 to determine obstacle in path to trigger a microcontroller to actuate a motor associated with each of said wheels 102 to dodge said obstacle during locomotion;
iii) an articulated L-shaped telescopic linked 104 mounted on said housing 101, and having an inspection unit 105 at and end, wherein said inspection module comprises a cuboidal structure 106 having an artificial intelligence-based camera 107 installed on said structure 106 and integrated with a processor for recording and processing images in a vicinity of said structure 106, in synchronisation with a laser sensor embedded in said structure 106, to measure dimensions of a workpiece to be machined on an HMC to compare with machining blueprints stored on a database connected with said microcontroller to determine machining parameters for optimum machining;
iv) a laser induced breakdown spectroscopy (LIB) unit integrated in the structure 106 to detect a material of constriction of said workpiece to determine an ideal machining speed, wherein a rotational rate of a machining spindle of said HMC is monitored by an RPM (rotations per minute) sensor embedded in said structure 106 and a feed rate of said workpiece is recorded by a laser sensor provided in said structure 106, to determine deviations from optimal machining parameters;
v) an infrared thermal imaging unit 108 disposed in said inspection unit 105 to detect a temperature of said workpiece being machined to trigger said microcontroller to actuate an artificial intelligence-based camera 107, installed in said structure 106 and integrated with a processor for recording and processing images in a vicinity of said structure 106 to continuously monitor machining and determine a type of fault from excessive machining speed and inadequate coolant flow detected by an optical flow sensor incorporated in said structure 106 to detect flow rate of coolant onto workpiece; and
vi) a holographic projection unit 109 installed on said housing 101, to project images indicating parameters of said workpiece and said HMC and indicate deviations and faults detected by said inspection unit 105 for a reference of user.

2) The device as claimed in claim 1, wherein said database is configured to store G-codes, M-codes, received from a wireless communication unit provided in said housing 101, enabled to wirelessly connect with a computing unit of user.

3) The device as claimed in claim 1, wherein a robotic arm 110 is mounted on said housing 101 to manipulate physical components of said HMC for operational or maintenance purposes, including opening/closing of surfaces of said HMC to access internal components, wherein said surfaces are determined by said imaging unit 103.