Through Hole Electrode Substrate And Method For Manufacturing Through Hole Electrode Substrate

Abstract: This through-hole electrode substrate comprises: a substrate including a first surface and a second surface positioned on the opposite side from the first surface and having a through-hole penetrating from the first surface to the second surface; a metal layer including at least a hole metal layer positioned at the through-hole; and an adhesion layer positioned between the substrate and the metal layer and including a metal oxide. The through-hole has a side wall reaching from the first surface to the second surface. The side wall includes a first end connected to the first surface and a second end connected to the second surface. The adhesion layer includes a hole adhesion layer that is positioned between the side wall and a through-hole electrode so as to extend from the first end of the side wall to the second end thereof.

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