Abstract: This inspection system comprises: a semiconductor substrate on which a first inspection circuit and a second inspection circuit are formed; a measurement unit that measures a predetermined characteristic in each of the first inspection circuit and the second inspection circuit; and an estimation unit that, on the basis of a first measurement result of measurement of the first inspection circuit performed by the measurement unit and a second measurement result of measurement of the second inspection circuit performed by the measurement unit, estimates process variation when the first inspection circuit and the second inspection circuit are formed on the semiconductor substrate. The magnitude of variation of the characteristic with respect to the process variation in the second inspection circuit differs from the magnitude of variation of the characteristic with respect to the process variation in the first inspection circuit.
| # | Name | Date |
|---|---|---|
| 1 | 202517067485-TRANSLATIOIN OF PRIOIRTY DOCUMENTS ETC. [15-07-2025(online)].pdf | 2025-07-15 |
| 2 | 202517067485-STATEMENT OF UNDERTAKING (FORM 3) [15-07-2025(online)].pdf | 2025-07-15 |
| 3 | 202517067485-REQUEST FOR EXAMINATION (FORM-18) [15-07-2025(online)].pdf | 2025-07-15 |
| 4 | 202517067485-PROOF OF RIGHT [15-07-2025(online)].pdf | 2025-07-15 |
| 5 | 202517067485-POWER OF AUTHORITY [15-07-2025(online)].pdf | 2025-07-15 |
| 6 | 202517067485-FORM 18 [15-07-2025(online)].pdf | 2025-07-15 |
| 7 | 202517067485-FORM 1 [15-07-2025(online)].pdf | 2025-07-15 |
| 8 | 202517067485-DRAWINGS [15-07-2025(online)].pdf | 2025-07-15 |
| 9 | 202517067485-DECLARATION OF INVENTORSHIP (FORM 5) [15-07-2025(online)].pdf | 2025-07-15 |
| 10 | 202517067485-COMPLETE SPECIFICATION [15-07-2025(online)].pdf | 2025-07-15 |
| 11 | 202517067485-MARKED COPIES OF AMENDEMENTS [22-08-2025(online)].pdf | 2025-08-22 |
| 12 | 202517067485-FORM 13 [22-08-2025(online)].pdf | 2025-08-22 |
| 13 | 202517067485-Annexure [22-08-2025(online)].pdf | 2025-08-22 |
| 14 | 202517067485-AMMENDED DOCUMENTS [22-08-2025(online)].pdf | 2025-08-22 |