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Moisture Cure Solvent Free Laminating Adhesive And Laminates
Abstract: The present disclosure relates to a SFLA composition comprising the reaction product of precursors, the precursors comprise (i) a crystallizable polyol having: (1) a melting point of at least about 30°C; and (2) an OH number of at least about 10 mg KOH/ g, and (ii) less than 10 wt% of a tackifier having a melting point or softening point of at least about 40°C. A viscosity of the adhesive comprises at least one of: (1) less than about 10,000 cP at 60°C, (2) less than about 5,000 cP at 75°C and (3) combinations thereof. Applications for the SFLA include the making of flexible packaging, wall coverings and other uses that include the lamination or bonding of one or more porous substrates.
Notices, Deadlines & Correspondence
Patent Information
Applicants
ARKEMA FRANCE
Inventors
1. LEE, Byoungchul
2. STEED, Jared
3. JOHNSON, Randy
Specification
Documents
Application Documents
| # | Name | Date |
|---|---|---|
| 1 | 202517068680-TRANSLATIOIN OF PRIOIRTY DOCUMENTS ETC. [18-07-2025(online)].pdf | 2025-07-18 |
| 2 | 202517068680-STATEMENT OF UNDERTAKING (FORM 3) [18-07-2025(online)].pdf | 2025-07-18 |
| 3 | 202517068680-PRIORITY DOCUMENTS [18-07-2025(online)].pdf | 2025-07-18 |
| 4 | 202517068680-POWER OF AUTHORITY [18-07-2025(online)].pdf | 2025-07-18 |
| 5 | 202517068680-NOTIFICATION OF INT. APPLN. NO. & FILING DATE (PCT-RO-105-PCT Pamphlet) [18-07-2025(online)].pdf | 2025-07-18 |
| 6 | 202517068680-FORM 1 [18-07-2025(online)].pdf | 2025-07-18 |
| 7 | 202517068680-DRAWINGS [18-07-2025(online)].pdf | 2025-07-18 |
| 8 | 202517068680-DECLARATION OF INVENTORSHIP (FORM 5) [18-07-2025(online)].pdf | 2025-07-18 |
| 9 | 202517068680-COMPLETE SPECIFICATION [18-07-2025(online)].pdf | 2025-07-18 |
| 10 | 202517068680-FORM 18 [13-08-2025(online)].pdf | 2025-08-13 |