Polyamide Resin Composition And Molded Article

Abstract: This polyamide resin composition comprises a polyamide resin (A), a phosphorus compound (B), and glass fibers (C) containing a surface treatment agent or a sizing agent. The phosphorus element content of the polyamide resin composition is 500 to 10,000 ppm by mass with respect to the polyamide resin composition.

Patent Information

Application #

Filing Date

04 August 2025

Publication Number

51/2025

Publication Type

INA

Invention Field

POLYMER TECHNOLOGY

Status

Email

Parent Application

Applicants

MITSUI CHEMICALS, INC.

2-1, Yaesu 2-chome, Chuo-ku, Tokyo 1040028

Inventors

Specification

Documents

Application Documents

#	Name	Date
1	202517074112-TRANSLATIOIN OF PRIOIRTY DOCUMENTS ETC. [04-08-2025(online)].pdf	2025-08-04
2	202517074112-STATEMENT OF UNDERTAKING (FORM 3) [04-08-2025(online)].pdf	2025-08-04
3	202517074112-REQUEST FOR EXAMINATION (FORM-18) [04-08-2025(online)].pdf	2025-08-04
4	202517074112-PROOF OF RIGHT [04-08-2025(online)].pdf	2025-08-04
5	202517074112-PRIORITY DOCUMENTS [04-08-2025(online)].pdf	2025-08-04
6	202517074112-POWER OF AUTHORITY [04-08-2025(online)].pdf	2025-08-04
7	202517074112-FORM 18 [04-08-2025(online)].pdf	2025-08-04
8	202517074112-FORM 1 [04-08-2025(online)].pdf	2025-08-04
9	202517074112-DRAWINGS [04-08-2025(online)].pdf	2025-08-04
10	202517074112-DECLARATION OF INVENTORSHIP (FORM 5) [04-08-2025(online)].pdf	2025-08-04
11	202517074112-COMPLETE SPECIFICATION [04-08-2025(online)].pdf	2025-08-04