Description:FIELD OF THE INVENTION

[0001] The present invention relates to a PCB inspection and repairing device that is capable of detecting component faults, soldering defects, missing elements and damaged traces in the PCB and taking the necessary steps for repairing the PCB thereby enhancing the reliability and performance of the PCB.

BACKGROUND OF THE INVENTION

[0002] PCB inspection and repairing are essential processes in electronics manufacturing to ensure the reliability, performance, and safety of electronic devices. Inspection helps identify defects such as broken traces, soldering issues, and component misplacements early in the production cycle, preventing faulty products from reaching consumers. Repairing damaged or defective PCBs extends the lifespan of electronic devices, reduces costs associated with rework and warranty claims, and maintains quality standards. Additionally, thorough inspection and timely repairs enhance overall product performance, minimize downtime, and ensure compliance with industry regulations, ultimately leading to higher customer satisfaction and trust in the manufacturer's brand.

[0003] Traditional methods of PCB inspection and repairing rely on visual examination, magnifying tools, and manual skill. Inspectors use magnifying glasses or microscopes to detect surface defects, soldering issues, and component misplacements. Repair involves manual desoldering, replacing faulty components, and re-soldering connections. Traditional PCB inspection and repairing methods have several drawbacks, including being time-consuming and labor-intensive, which leads to longer production cycles. They rely heavily on human skill and judgment, increasing the risk of missed defects and inconsistencies. Additionally, these methods are less effective at detecting minute or hidden faults, and manual repairs do not ensure the high precision and reliability.

[0004] KR102549486B1 discloses a stage supporting the PCB, a carrier for sliding and transporting the PCB and passing it from one side of the stage to the other side, a first camera unit for acquiring image data by photographing the top surface of the PCB placed on the stage, and A second camera unit that acquires image data by taking a picture of the lower surface of the PCB placed thereon, and controls the first and second camera units to capture and collect image data, and to control standard image data previously stored in a data storage unit and the first and second camera units. 2Comparing the image data input from the camera unit, determining the part that needs repair or replacement according to whether or not it meets the preset criteria, and generating repair or replacement information for the part if repair or replacement is necessary as a result of the determination, An information processing unit that analyzes image data of the first camera unit to generate position values of parts requiring repair or replacement, image data collected through the first and second camera units, and repair or replacement information generated by the information processing unit A display unit for displaying, a laser pointer emitting visible light of a low-power laser beam by aiming at the PCB corresponding to the position value generated by the information processing unit, and a laser pointer installed above the stage to be movable in three axes Disclosed is a PCB inspection and repair device including a magnifying glass that enlarges and shows a spot indicated by a pointer.

[0005] US20070129837A1 discloses an in-circuit testing and repairing system for printed circuit boards includes an in-circuit testing device for testing printed circuit boards, a shop floor control system connected to the in-circuit testing device via a network for collecting and processing the test data produced by the testing device, and a repair station including an electronic device for displaying information of a faulty printed circuit board. The electronic device connected to the shop floor control system. The test data from the in-circuit testing device is automatically transferred to the shop floor via the network for processing, and the processed test data is sent back to the in-circuit testing device, the test data of the faulty printed circuit board is sent from the shop floor controlling system to the repair station.

[0006] Conventionally, many devices have been developed for inspecting and repairing the PCB but they lack in identifying the component types, orientations and solder joint dimensions of the PCB and accordingly selecting the suitable repairing material for enabling precise repairing operation. They also lack in polishing and cleaning the PCB surface post-repairing process for removing the residual contaminants for enhancing the quality and reliability of the repaired PCB.

[0007] In order to overcome the aforementioned drawbacks, there exists a need in the art to develop a device that requires to be capable of identifying the component types, orientations and solder joint dimensions of the PCB and accordingly selecting the suitable repairing material for enabling precise repairing operation. Additionally, the device requires to be capable of polishing and cleaning the PCB surface post-repairing process for removing the residual contaminants for enhancing the quality and reliability of the repaired PCB.

OBJECTS OF THE INVENTION

[0008] The principal object of the present invention is to overcome the disadvantages of the prior art.

[0009] An object of the present invention is to develop a device that is capable of detecting component faults, soldering defects, missing elements and damaged traces in the PCB and taking the necessary steps for repairing the PCB thereby enhancing the reliability and performance of the PCB.

[0010] Another object of the present invention is to develop a device that is capable of identifying the component types, orientations and solder joint dimensions of the PCB and accordingly selecting the suitable repairing material for enabling precise repairing operation.

[0011] Yet another object of the present invention is to develop a device that is capable of polishing and cleaning the PCB surface post-repairing process for removing the residual contaminants thereby enhancing the quality and reliability of the repaired PCB.

[0012] The foregoing and other objects, features, and advantages of the present invention will become readily apparent upon further review of the following detailed description of the preferred embodiment as illustrated in the accompanying drawings.

SUMMARY OF THE INVENTION

[0013] The present invention relates to a PCB inspection and repairing device that is capable of identifying the component types, orientations and solder joint dimensions of the PCB and accordingly selecting the suitable repairing material for enabling precise repairing operation.

[0014] According to an embodiment of the present invention, a PCB inspection and repairing device is disclosed comprises of a housing structure enclosing a platform, the platform comprising a plurality of storage compartments for holding PCBs (Printed Circuit Boards) and electronic components, a square-shaped work plate supported on the platform via a plurality of vertically adjustable telescopic rods to adjust the height of the work plate, each rod is connected to the work plate through first motorized hinges enabling dynamic angular positioning of the work plate for optimal PCB handling, a plurality of small suction units mounted at corners of the work plate through telescopic bars to grip and hold a PCB securely, an AI-enabled camera integrated with the plate configured to perform detailed inspection of the PCB surface for detecting component faults, soldering defects, missing elements, and damaged traces, an X-ray imaging module is synchronized with the AI camera to analyze internal layers of multilayer PCBs and identify hidden defects, a motorized linear slider arranged along the plate perimeter supporting a component removal module comprising a barrel-shaped member with an interchangeable soldering tip where the tip is embedded with a heating element and is selectable via a circular sliding unit holding multiple soldering tips of various shapes the sliding unit operable to position the appropriate tip based on component type detected.

[0015] According to another embodiment of the present invention, the device further comprises of a V-shaped lifting flap attached to the plate via a support unit with a first motorized ball-and-socket joint, a vibration unit operable at variable frequencies to gently loosen and remove components from the PCB surface without damage, a digital multimeter fixed on the plate, a pair of motorized clamps holding multimeter probes via first robotic links to give position probes accurately on PCB traces, an Optical Character Recognition (OCR) module reads resistance values displayed on the multimeter and a microcontroller processes the readings to assess trace continuity and conductivity activating an adhesive applicator for repairing partially lifted traces, a motorized roller holding copper wire provided within the housing, motorized clippers mounted on telescopic poles with second motorized ball-and-socket joints for wire alignment and a pair of semi-circular members connected to the slider via second motorized hinges and electromagnet-actuated springs to twist stranded copper wire to a defined torque before soldering, a hollow cylindrical flux storage chamber with an iris lid installed inside the housing, a flexible conduit and a final iris outlet to dispense solder flux in a controlled manner over the twisted wire, an ultrasonic sensor cooperating with the AI camera to identify component types, orientations and solder joint dimensions, enabling automated selection of suitable soldering tips for precise repair, a cleaning module comprising a storage vessel for PCB cleaning fluid and a motorized brush assembly with soft bristles mounted via a second robotic link to gently polish and clean the PCB surface post-repair and a battery is associated with the device for supplying power to electrical and electronically operated components.

[0016] While the invention has been described and shown with particular reference to the preferred embodiment, it will be apparent that variations might be possible that would fall within the scope of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

[0017] These and other features, aspects, and advantages of the present invention will become better understood with regard to the following description, appended claims, and accompanying drawings where:
Figure 1 illustrates an isometric view of a PCB inspection and repairing device.

DETAILED DESCRIPTION OF THE INVENTION

[0018] The following description includes the preferred best mode of one embodiment of the present invention. It will be clear from this description of the invention that the invention is not limited to these illustrated embodiments but that the invention also includes a variety of modifications and embodiments thereto. Therefore, the present description should be seen as illustrative and not limiting. While the invention is susceptible to various modifications and alternative constructions, it should be understood, that there is no intention to limit the invention to the specific form disclosed, but, on the contrary, the invention is to cover all modifications, alternative constructions, and equivalents falling within the spirit and scope of the invention as defined in the claims.

[0019] In any embodiment described herein, the open-ended terms "comprising," "comprises,” and the like (which are synonymous with "including," "having” and "characterized by") may be replaced by the respective partially closed phrases "consisting essentially of," consists essentially of," and the like or the respective closed phrases "consisting of," "consists of, the like.

[0020] As used herein, the singular forms “a,” “an,” and “the” designate both the singular and the plural, unless expressly stated to designate the singular only.

[0021] The present invention relates to a PCB inspection and repairing device that is capable of polishing and cleaning the PCB surface post-repairing process for removing the residual contaminants thereby enhancing the quality and reliability of the repaired PCB.

[0022] Referring to Figure 1, an isometric view of a PCB inspection and repairing device is illustrated, comprising a housing 101 structure enclosing a platform 102, a plurality of storage compartments 103 for holding PCBs, a square-shaped work plate 104 supported on the platform 102 via a plurality of vertically adjustable telescopic rods 105, a plurality of small suction units 106 mounted at corners of the work plate 104 through telescopic bars 107, an AI-enabled camera 108 integrated with the plate 104, a motorized linear slider 109 arranged along the plate 104 perimeter, a barrel-shaped member 110 with an interchangeable soldering tip 111, a circular sliding unit 112, a V-shaped lifting flap 113 is attached to the plate 104, the flap 113 embedding a vibration unit 114, a digital multimeter 115 fixed on the plate 104, a pair of motorized clamps 116 holding multimeter 115 probes via first robotic links 117, a motorized roller 118 holding copper wire 119 provided within the housing 101, motorized clippers 120 mounted on telescopic poles 121, a pair of semi-circular members 122 connected to the slider 109 via electromagnet-actuated springs 123, a hollow cylindrical flux storage chamber 124 with an iris lid 125, a flexible conduit 126, a storage vessel 127 for PCB cleaning fluid, a motorized brush assembly 128 mounted via a second robotic link 129.

[0023] The device disclosed herein employs a housing 101 structure, enclosing a platform 102. This platform 102 is typically constructed from material that include but not limited to high-strength materials such as reinforced steel or durable aluminum alloys, which provide a robust and resilient enclosure capable of withstanding physical impacts and environmental stressors.

[0024] For activating the device, the user needs to press a push button which is arranged on the housing 101 which in turn activates all the related components for performing the desired task. After pressing the button, a closed electrical circuit is formed and current starts to flow that powers an inbuilt microcontroller to allow all the linked components to perform their respective task upon actuation.

[0025] The platform 102 comprises of a plurality of storage compartments 103 for holding PCBs (Printed Circuit Boards) and electronic components. Each compartment 103 is configured to store components safely and provide access during repair operations. A square-shaped work plate 104 is supported on the platform 102 via a plurality of vertically adjustable telescopic rods 105. These telescopic rods 105 are operable to adjust the height of the work plate 104. The telescopic rod extends and retracts by using nested sections that slide within each other, driven by a pneumatic unit. The pneumatic unit for extension and retraction operates using compressed air to drive a piston inside a cylinder. When air is supplied to one side of the piston, it creates pressure that pushes the piston rod outward, causing extension. To retract, air is supplied to the opposite side while the initial chamber is vented, pulling the piston rod back.

[0026] Each rod is connected to the work plate 104 through first motorized hinges, enabling dynamic angular positioning of the work plate 104 for optimal PCB handling. The motorized hinges, connecting each rod to the work plate 104 are equipped with integrated motor, that precisely control their angular position. At the corners of the work plate 104, a plurality of small suction units 106 is mounted through telescopic bars 107. The suction units 106 are configured to grip and hold a PCB securely during repair and inspection processes. The suction unit 106 operates by creating a vacuum to generate a pressure difference, allowing it to grip and hold the PCB. The suction unit 106 typically consists of a vacuum pump, suction cup and control valve. When activated, the pump removes air from the suction cup, creating a low-pressure zone that causes atmospheric pressure to apply force against the cup, ensuring a firm grip.

[0027] An AI-enabled camera 108 is attached to the plate 104 that is configured to perform the detailed inspection of the PCB surface, capable of detecting component faults, soldering defects, missing elements and damaged traces. The camera 108 comprises of an image capturing arrangement including a set of lenses that captures multiple images in vicinity of the plate 104, and the captured images are stored within a memory of the camera 108 in form of an optical data. The camera 108 also comprises of the processor that is integrated with artificial intelligence protocols, such that the processor processes the optical data and extracts the required data from the captured images. The extracted data is further converted into digital pulses and bits and are further transmitted to the microcontroller. The microcontroller processes the received data and detects component faults, soldering defects, missing elements and damaged traces.

[0028] In synchronization with the AI camera 108, an X-ray imaging module works to analyze internal layers of multilayer PCBs and identify hidden defects, operatively coupled to the housing 101 for integrated imaging analysis. The X-ray imaging module functions by emitting controlled X-ray beams that penetrate the multilayer PCB to capture detailed internal images of the internal layers. Inside the module, an X-ray source, such as a micro-focus tube, generates high-energy photons directed towards the PCB. These rays pass through the board and are selectively absorbed or transmitted depending on the internal structures and potential defects. The transmitted X-rays are then detected by a highly sensitive detector array, often composed of scintillator materials coupled with photodiodes, converting the X-ray photons into electrical signals. These signals are processed by onboard imaging electronics to reconstruct high-resolution cross-sectional images of the PCB's internal layers, enabling detailed analysis of internal features and hidden defects. The entire arrangement operates in synchronization with the AI camera 108, allowing for real-time image acquisition, defect detection, and analysis, facilitating precise quality control during PCB inspection processes.

[0029] A motorized linear slider 109 is arranged along the plate 104 perimeter, supporting a component removal module comprising a barrel-shaped member 110 with an interchangeable soldering tip 111. The interchangeable soldering tip 111 include conical, chisel, and bevel shapes, automatically selected based on analysis of component size and type. The tip 111 is embedded with a heating element and is selectable via a circular sliding unit 112. The circular sliding unit 112 holds multiple soldering tips of various shapes. The sliding unit 112 is operable to position the appropriate tip 111 based on the component type detected. The sliding unit 112 consists of a sliding rail and a motorized slidable member connected to the sliding rail. The motorized slidable member is attached to the barrel-shaped member 110 and sliding rail on both sides to make the soldering tip 111 slide. The slidable member is attached to a motor which provides movement to the member in a bi-directional manner.

[0030] The heating element functions by converting electrical energy into thermal energy through resistive heating. When a specific soldering tip is selected via the circular sliding unit 112, an electrical current is directed from the power source through the resistive material embedded within the tip 111, typically a high-resistance alloy. As current flows, the resistance causes the material to heat up rapidly, reaching a precise temperature for soldering application. The circuit adjusts the current flow to stabilize the tip 111 temperature within the desired range, ensuring consistent soldering quality.

[0031] With the AI camera 108, an ultrasonic sensor cooperates to identify component types, orientations, and solder joint dimensions, enabling automated selection of suitable soldering tips for precise repair. The ultrasonic sensor integrated with the AI camera 108 operates by emitting high-frequency sound waves through a transducer, which are directed towards the PCB and the components. When these ultrasonic waves encounter interfaces such as component boundaries, solder joints or material changes, they are reflected back to the sensor's receiver transducer. The sensor's internal electronics measure the time delay and amplitude of these reflected echoes to determine the distance, size and orientation of components and solder joints. By analyzing the received ultrasonic signals, the arrangement accurately identifies the component types, their placement, and solder joint dimensions. This information is processed in real-time by the microcontroller, enabling precise assessment of component configurations and ensuring that the appropriate soldering tips are automatically selected for targeted repairs.

[0032] A V-shaped lifting flap 113 is attached to the plate 104 via a support unit with a first motorized ball-and-socket joint. The flap 113 is configured with a vibration unit 114 operable at variable frequencies to gently loosen and remove components from the PCB surface without damage. The vibration unit 114 operates by generating controlled oscillations at variable frequencies to facilitate the gentle loosening and removal of components from the PCB surface. When activated, the vibration unit 114 produces high-frequency vibrations that are transmitted through the flap 113 to the attached component, creating micro-movements that weaken the adhesion of solder joints without applying excessive force.

[0033] On the plate 104, a digital multimeter 115 is fixed. A pair of motorized clamps 116, is holding multimeter 115 probes via first robotic links 117 to position probes accurately on PCB traces. These first robotic links 117 consist of linked segments connected by joints, which are powered by motors to enable movement in all directions. The rotary joints of the links 117 enable rotational motion around a fixed axis, while prismatic joints allow for linear, sliding movement. The links 117 are activated by the microcontroller to move the clamps 116. The motorized clamps 116 work by using an electric motor connected to a sliding jaw via a screw. The motor provides power to the screw that is attached to the fixed frame of the clamp 116. As the screw rotates, it pushes or pulls the sliding jaw towards or away from the fixed jaw depending on the direction of rotation. This movement allows the clamp 116 to position probes accurately on PCB traces.

[0034] An Optical Character Recognition (OCR) module reads resistance values displayed on the multimeter 115, and the microcontroller processes the readings to assess trace continuity and conductivity, activating an adhesive applicator for repairing partially lifted traces. The OCR module functions by capturing high-resolution images of the multimeter 115 display to clearly view the resistance values. The captured image is then processed through a series of image enhancement steps, such as contrast adjustment and noise reduction, to improve the clarity of the digits. The processed image undergoes character segmentation to isolate individual numerals and symbols. These segmented characters are then analyzed by pattern recognition protocols, often based on machine learning models like convolutional neural networks (CNNs), which compare the extracted features to a trained database of digit patterns to accurately identify the displayed resistance values. Once recognized, the OCR module transmits the numerical data to the microcontroller, which evaluates the readings to determine the continuity and conductivity of traces.

[0035] Within the housing 101, a motorized roller 118 holding copper wire 119 is provided. The motorized roller 118 integrates an electric motor within the cylindrical body for holding copper wire 119. When powered, the motor generates rotational force, which drives the roller 118. They operate using direct current (DC) motor and controlled individually for precise movement and speed regulation. Motorized clippers 120 are mounted on telescopic poles 121 with second motorized ball-and-socket joints for wire 119 alignment and a pair of semi-circular members 122 connected to the slider 109 via second motorized hinges and electromagnet-actuated springs 123 to twist stranded copper wire 119 to a defined torque before soldering. The telescopic poles 121 work in the similar manner as the telescopic rods 105 explained above.

[0036] The electromagnet-actuated springs 123 function by utilizing an electromagnetic coil, which, when energized, generates a magnetic field capable of engaging or disengaging a tensioning component. The springs 123 are connected to the semi-circular members 122 and are held in a preloaded state to apply a specific twisting force to the stranded copper wire 119. When the electromagnet is activated, it pulls or releases a ferromagnetic core attached to the spring 123, allowing the spring 123 to either compress or extend, thereby controlling the amount of torque applied to the wire 119. This controlled actuation precisely twists the stranded wire 119 to a predetermined torque level before soldering, ensuring consistent and reliable electrical connections.

[0037] A hollow cylindrical flux storage chamber 124 with an iris lid 125 is positioned inside the housing 101. A flexible conduit 126 and a final iris outlet is also configured to dispense solder flux in a controlled manner over the twisted wire 119. The flux saturation is verified by the AI-enabled camera 108 prior to soldering. The flux storage chamber 124 applies solder flux selectively, guided by real-time image analysis to ensure adequate coverage without excess. The iris lid 125 operates using a series of interlinked, overlapping blades that open and close in a circular motion. The motor in the iris lid 125 drives a mechanical linkage that synchronously moves the blades apart, creating an opening for the liquid to dispense solder flux in a controlled manner over the twisted wire 119.

[0038] A cleaning module, comprising a storage vessel 127 for PCB cleaning fluid and a motorized brush assembly 128 with soft bristles that is mounted via a second robotic link 129 to gently polish and clean the PCB surface post-repair. The cleaning fluid stored is a non-corrosive, alcohol-based solution specifically selected for safe PCB cleaning. The second robotic link 129 works in the similar manner as the first robotic link 117 explained above. The motorized brush assembly 128 for gently polishing and cleaning the PCB surface operates by using an electric motor to drive the movement of the brush, ensuring consistent and efficient polishing and cleaning application. When powered on, the motor rotates the brush head, enabling gentle polishing and cleaning of the PCB surface post-repair.

[0039] The microcontroller is operatively connected to all modules and sensors, pre-fed to orchestrate component detection, removal, soldering, trace repair, wire reinforcement, flux coating, and cleaning operations in a fully automated manner with minimal human intervention. The microcontroller is trained on a dataset of PCB defects and repair outcomes to enhance diagnostic accuracy and repair efficiency over time.

[0040] For supplying power to electrical and electronically operated components, a battery is associated with the device. The battery powers electrical and electronic components by converting stored chemical energy into electrical energy. The battery’s terminals provide a voltage difference, allowing current to flow through circuits that supplies consistent energy to actuate and operate components like motors, sensors and microcontroller, ensuring seamless functionality.

[0041] The present invention works best in the following manner, where the housing 101 structure is enclosing the platform 102. The plurality of storage compartments 103 is for holding PCBs (Printed Circuit Boards) and electronic components where each compartment 103 is configured to store components safely and provide access during repair operations. The square-shaped work plate 104 is supported on the platform 102 via the plurality of vertically adjustable telescopic rods 105 where the telescopic rods 105 is operable to adjust the height of the work plate 104. Each rod is connected to the work plate 104 through first motorized hinges enabling dynamic angular positioning of the work plate 104 for optimal PCB handling. The plurality of small suction units 106 is mounted through telescopic bars 107 where the suction units 106 grips and holds the PCB securely during repair and inspection processes. The AI-enabled camera 108 performs the detailed inspection of the PCB surface, capable of detecting component faults, soldering defects, missing elements, and damaged traces, where the X-ray imaging module is synchronized with the AI camera 108 to analyze internal layers of multilayer PCBs and identify hidden defects, operatively coupled to the housing 101 for integrated imaging analysis. The motorized linear slider 109 is supporting the component removal module comprising the barrel-shaped member 110 with the interchangeable soldering tip 111 where the tip 111 is embedded with the heating element and is selectable via the circular sliding unit 112 holding multiple soldering tips of various shapes. The sliding unit 112 is to position the appropriate tip based on component type detected. The V-shaped lifting flap 113 is connected with the first motorized ball-and-socket joint, the flap 113 is embedding the vibration unit 114 operable at variable frequencies to gently loosen and remove components from the PCB surface without damage.

[0042] In continuation, the digital multimeter 115 is fixed on the platform 102, the pair of motorized clamps 116 holding multimeter 115 probes via the first robotic links 117 to position probes accurately on PCB traces where the Optical Character Recognition (OCR) module reads resistance values displayed on the multimeter 115 and the microcontroller processes the readings to assess trace continuity and conductivity activating the adhesive applicator for repairing partially lifted traces. The motorized roller 118 is holding copper wire 119 provided within the housing 101, motorized clippers 120 mounted on telescopic poles 121 with second motorized ball-and-socket joints for wire 119 alignment and the pair of semi-circular members 122 connected to the slider 109 via second motorized hinges and electromagnet-actuated springs 123 twists stranded copper wire 119 to the defined torque before soldering. The hollow cylindrical flux storage chamber 124 with the iris lid 125, the flexible conduit 126 and the final iris outlet dispenses solder flux in the controlled manner over the twisted wire where the flux saturation is verified by the AI-enabled camera 108 prior to soldering. The ultrasonic sensor is cooperating with the AI camera 108 to identify component types, orientations, and solder joint dimensions, enabling automated selection of suitable soldering tips for precise repair. The cleaning module is comprising the storage vessel 127 for PCB cleaning fluid and the motorized brush assembly 128 with soft bristles mounted via the second robotic link 129 to gently polish and clean the PCB surface post-repair. The interchangeable soldering tip 111 includes conical, chisel, and bevel shapes automatically selected based on analysis of component size and type. The cleaning fluid stored is the non-corrosive, alcohol-based solution specifically selected for safe PCB cleaning. The microcontroller is trained on the dataset of PCB defects and repair outcomes to enhance diagnostic accuracy and repair efficiency over time.

[0043] Although the field of the invention has been described herein with limited reference to specific embodiments, this description is not meant to be construed in a limiting sense. Various modifications of the disclosed embodiments, as well as alternate embodiments of the invention, will become apparent to persons skilled in the art upon reference to the description of the invention. , Claims:1) A PCB inspection and repairing device, comprising:
i) a housing 101 structure enclosing a platform 102, said platform 102 comprising a plurality of storage compartments 103 for holding PCBs (Printed Circuit Boards) and electronic components, each compartment 103 is configured to store components safely and provide access during repair operations;
ii) a square-shaped work plate 104 supported on said platform 102 via a plurality of vertically adjustable telescopic rods 105, said telescopic rods 105 is operable to adjust the height of the work plate 104, wherein each rod is connected to the work plate 104 through first motorized hinges enabling dynamic angular positioning of the work plate 104 for optimal PCB handling;
iii) a plurality of small suction units 106 mounted at corners of said work plate 104 through telescopic bars 107, said suction units 106 is configured to grip and hold a PCB securely during repair and inspection processes;
iv) an AI-enabled camera 108 is integrated with the plate 104 configured to perform detailed inspection of the PCB surface, is capable of detecting component faults, soldering defects, missing elements, and damaged traces, wherein an X-ray imaging module is synchronized with the AI camera 108 to analyze internal layers of multilayer PCBs and identify hidden defects, operatively coupled to the housing 101 for integrated imaging analysis;
v) a motorized linear slider 109 arranged along the plate 104 perimeter, supporting a component removal module comprising a barrel-shaped member 110 with an interchangeable soldering tip 111, wherein the tip 111 is embedded with a heating element and is selectable via a circular sliding unit 112 holding multiple soldering tips of various shapes, the sliding unit 112 operable to give position the appropriate tip based on component type detected;
vi) a V-shaped lifting flap 113 is attached to the plate 104 via a support unit with a first motorized ball-and-socket joint, the flap 113 is embedding a vibration unit 114 operable at variable frequencies to gently loosen and remove components from the PCB surface without damage;
vii) a digital multimeter 115 fixed on the plate 104, a pair of motorized clamps 116 are holding multimeter 115 probes via first robotic links 117 to give position probes accurately on PCB traces, wherein an Optical Character Recognition (OCR) module reads resistance values displayed on the multimeter 115, and a microcontroller processes the readings to assess trace continuity and conductivity, activating an adhesive applicator for repairing partially lifted traces;
viii) a motorized roller 118 holding copper wire 119 provided within the housing 101, motorized clippers 120 are mounted on telescopic poles 121 with second motorized ball-and-socket joints for wire 119 alignment, and a pair of semi-circular members 122 connected to the slider 109 via second motorized hinges and electromagnet-actuated springs 123, configured to twist stranded copper wire 119 to a defined torque before soldering; and
ix) a hollow cylindrical flux storage chamber 124 with an iris lid 125 installed inside the housing 101, a flexible conduit 126, and a final iris outlet, configured to dispense solder flux in a controlled manner over the twisted wire 119, wherein the flux saturation is verified by the AI-enabled camera 108 prior to soldering.

2) The device as claimed in claim 1, wherein an ultrasonic sensor is cooperating with the AI camera 108 to identify component types, orientations, and solder joint dimensions, enabling automated selection of suitable soldering tips for precise repair.

3) The device as claimed in claim 1, wherein a cleaning module comprising a storage vessel 127 for PCB cleaning fluid and a motorized brush assembly 128 with soft bristles mounted via a second robotic link 129 to gently polish and clean the PCB surface post-repair.

4) The device as claimed in claim 1, wherein the microcontroller is operatively connected to all modules and sensors, pre-fed to orchestrate component detection, removal, soldering, trace repair, wire reinforcement, flux coating, and cleaning operations in a fully automated manner with minimal human intervention.

5) The device as claimed in claim 1, wherein the interchangeable soldering tip 111 include conical, chisel, and bevel shapes, automatically selected based on analysis of component size and type.

6) The device as claimed in claim 1, wherein the flux storage chamber 124 applies solder flux selectively, is guided by real-time image analysis to ensure adequate coverage without excess.

7) The device as claimed in claim 1, wherein cleaning fluid stored is a non-corrosive, alcohol-based solution specifically selected for safe PCB cleaning.

8) The device as claimed in claim 1, wherein the microcontroller is trained on a dataset of PCB defects and repair outcomes to enhance diagnostic accuracy and repair efficiency over time.

9) The device as claimed in claim 1, wherein a battery is associated with said device for supplying power to electrical and electronically operated components associated with said device.