Description:Field of the invention

[0001] The present invention relates to sensors. More specifically, the present invention relates to a sensor array system.

Background of the invention

[0002] There are multiple devices like smartphones or car systems that have multiple gyroscopes present in a single device and they are placed compactly in a small place of the device. MEMS (micro electro mechanical system) gyroscopes or IMU (Inertial Measurement Unit) sensors are widely used to measure orientation, angular velocity, and linear acceleration in navigation systems, consumer electronics, and automotive systems. However, current technology places multiple MEMS gyroscopes or IMU sensors together on a single PCB, which causes them to interfere with each other electrically and mechanically.

[0003] This interference is especially problematic when the sensors have similar internal drive frequencies, leading to conflict in the sensor's performance issues like beat frequencies and systematic errors. By measuring this induced displacement, the gyroscope can calculate the rate of rotation. The drive frequency is inevitable for a MEMS gyroscope to operate however if multiple gyroscopes of the same frequency or the near same frequency are placed on the same PCB, sensors typically interfere with other sensors resulting in the manipulation of the drive itself. The system may not work properly due to the conflict in the data of the sensors.

[0004] The electrical interference is increased because the devices are connected physically and this limits the device flexibility and increases the dependency. Existing systems face the problem of mechanical and electrical interference because the sensors are placed very close to each other and there is no special arrangement to separate these sensors from each other or to eliminate their frequency interference.

[0005] Therefore, there is a need for a sensor array system to overcome a few or all drawbacks of the existing technologies.

Objects of the invention

[0006] An object of the present invention is to provide a sensor array system.

[0007] Another object of the present invention is to provide a sensor array system that is cost-efficient.

[0008] Another object of the present invention is to provide a sensor array system to eliminate mechanical and electrical interference.

[0009] Yet another object of the present invention is to provide a sensor array system that dampens vibrations, stress, and mechanical shocks.

[0010] One more object of the present invention is to provide a sensor array system that allows simple assembly and maintenance.

Summary of the Invention

[0011] According to the present invention, a sensor array system is provided. The system may include a tray having a plurality of compartments, a plurality of sensor boards, a damping element, a motherboard, and a communication unit. The tray may be a rectangular-shaped tray structure fabricated from micro-machined aluminium. The plurality of sensor boards is configured in the plurality of compartments of the tray. The plurality of sensor boards is arranged in each compartment of the plurality of compartments in such a way that each sensor board is isolated from each other to protect the motion sensor from the vibration of adjacent sensors, temperature fluctuations, and shock.

[0012] Each sensor board of the plurality of sensor boards is having a motion sensor mounted thereon. The motion sensor of the plurality of sensor boards may be a MEMS gyroscope or an IMU sensor.

[0013] Each sensor board of the plurality of sensor boards includes a capacitor that is charged via the wireless power transfer, a microcontroller for processing sensor measurements and applying calibration coefficients.

[0014] Further, the plurality of compartments is configured to hold and isolate each sensor board of the plurality of sensor boards. Further, the damping element is arranged in the plurality of compartments around each sensor board of the plurality of sensor boards to protect the motion sensor from vibrations and shocks and to reduce mechanical interference. The damping element may include an elastic polymer or elastomer like potting material.

[0015] The motherboard is arranged on the tray to connect with each sensor board of the plurality of sensor boards configured in the plurality of compartments. The motherboard is having a controller connected to the motion sensor of each sensor board to receive sensor data to perform signal averaging to improve accuracy.

[0016] The sensor data may be communicated using the communication unit. The communication unit establishes near-field communication between the motion sensor of each sensor board and the controller separately to send the data to the controller, thereby reducing electrical interference. The communication unit includes a first communication unit and a second communication unit. The first communication unit is arranged on each sensor board of the plurality of sensor boards and the second communication unit is arranged on the motherboard to establish communication between each sensor board and the controller for transferring data from the plurality of sensor boards to the controller of the motherboard.

[0017] In the present aspect, the first communication unit may be an antenna coil arranged on a top surface of the plurality of sensor boards communicatively connectable with a second communication unit to send the sensor data

[0018] The motherboard receives the sensor data from the plurality of sensor boards and adds the motion sensor signals together to perform signal averaging to improve the (SNR) Signal-to-Noise Ratio, for enhanced accuracy in measurements.

[0019] The motherboard is having a memory unit for storing calibration coefficients, a power regulation and a filter section for conditioning power to external devices, a communication and a power port for external communication, and a second communication unit for communication with the plurality of sensor boards.

[0020] In another aspect, a sensor array system includes a motherboard, a plurality of motion sensors, and a plurality of cavities. The plurality of motion sensors may be arranged on the motherboard. The plurality of motion sensors may be communicatively connected to a controller of the motherboard to reduce electrical interference.

[0021] The plurality of cavities is configured to cover the plurality of motion sensors to isolate each motion sensor of the plurality of motion sensors to avoid vibrations and shocks, thereby reducing mechanical interference.

Brief description of drawings

[0022] The advantages and features of the present invention will be understood better with reference to the following detailed description and claims taken in conjunction with the accompanying drawings, wherein like elements are identified with like symbols, and in which:

[0023] FIG. 1 shows a perspective view of a sensor array system assembly in accordance with the present invention;

[0024] FIG. 2 shows an exploded view of a sensor array system having a communication unit in accordance with the invention shown in FIG. 1;

[0025] FIG. 3 shows a perspective view of a sensor board of the plurality of sensor boards shown in FIG.1;

[0026] FIG. 4a shows an exploded view of a sensor array system in accordance with a second embodiment of the present invention; and

[0027] FIG. 4b shows an assembled view of the sensor array system in accordance with the embodiment shown in FIG. 4a.

Detailed description of the invention

[0028] An embodiment of this invention, illustrating its features, will now be described in detail. The words "comprising," "having," "containing," and "including," and other forms thereof, are intended to be equivalent in meaning and be open-ended in that an item or items following any one of these words is not meant to be an exhaustive listing of such item or items, or meant to be limited to only the listed item or items.

[0029] The present invention introduces a sensor array system. The sensor array system is designed to offer enhanced accuracy, reliability, and robustness in motion sensing applications. The sensor array system aims to deliver high-performance results while maintaining cost efficiency, making it suitable for a wide range of industrial and commercial uses. The sensor array system is developed to minimize interference, improve signal quality, and ensure consistent data output even in demanding operational environments. Additionally, it is built to handle mechanical stresses such as vibrations and shocks, ensuring long-term durability in challenging environments. The invention also serves easy assembly and maintenance, allowing for straightforward integration, maintenance, and servicing without complex procedures.

[0030] The terms “first,” “second,” and the like, herein do not denote any order, quantity, or importance, but rather are used to distinguish one element from another, and the terms “a” and “an” herein do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced item.

[0031] The disclosed embodiments are merely exemplary of the invention, which may be embodied in various forms.

[0032] Referring now to FIG. 1, a sensor array system (100) in accordance with the present invention is illustrated. The sensor array system (100) includes a tray (10) having a plurality of compartments (10a, 10b,…10l), a plurality of sensor boards (20a, 20b,…20l), a damping element (30), a motherboard (40) and a communication unit (50) (shown in FIG. 2).

[0033] The tray (10) is a rectangular-shaped structure having a base and vertical walls extending from the base to form a cavity. Further, the tray (10) includes a plurality of walls extending from the base within the cavity to create a grid-like structure, thereby forming the plurality of compartments (10a, 10b,…10l) within the cavity of the tray (10). Each compartment of the plurality of compartments (10a, 10b,…10l) is configured adjacent to each other and is separated by the plurality of walls having at least one wall common between each compartment.

[0034] The plurality of compartments (10a, 10b,…10l) is having a rectangular shape configured to receive the plurality of sensor boards (20a, 20b,…20l) having a shape corresponding to the shape of the plurality of compartments (10a, 10b,…10l). It may be obvious for a person skilled in the art to configure the plurality of compartments (10a, 10b,…10l) having any other shape configured to receive the plurality of sensor boards (20a, 20b,…20l). The shape of the plurality of compartments (10a, 10b,…10l) is configured based on the shape of the plurality of sensor boards (20a, 20b,…20l). In an alternative embodiment, the shape of the plurality of sensor boards (20a, 20b,…20l) is configured based on the shape of the plurality of compartments (10a, 10b,…10l).

[0035] The shape of the plurality of compartments (10a, 10b,…10l) is configured to snugly receive the plurality of sensor boards (20a, 20b,…20l) in their respective compartments.

[0036] In the present embodiment, the tray (10) has a rectangular shape. It may be obvious for a person skilled in the art to configure the tray (10) with any other shape. The tray (10) is fabricated from micro-machined aluminium material or the like.

[0037] In the present embodiment, the plurality of sensor boards (20a, 20b,…20l) are mounted in the plurality of compartments (10a, 10b,…10l). The plurality of sensor boards (20a, 20b,…20l) is hvaing a shape to fit within a corresponding compartment of the plurality of compartments (10a, 10b,…10l) of the tray (10). Each sensor board of the plurality of sensor boards (20a, 20b,…20l) includes a motion sensor (22) mounted thereon to measure orientation, angular velocity, and linear acceleration. The motion sensor (22) is a MEMS gyroscope. In an alternative embodiment, the motion sensor (22) may be an IMU (Inertial Measurement Unit) sensor or any other suitable sensor to measure orientation, angular velocity, and linear acceleration. The plurality of sensor boards (20a, 20b,…20l) is arranged in each compartment of the plurality of compartments (10a, 10b,…10l) in such a way that each sensor board is isolated mechanically from each other.

[0038] Specifically, the damping element (30) is arranged in the plurality of compartments (10a, 10b,…10l) around each sensor board of the plurality of sensor boards (20a, 20b,…20l) for isolating each sensor board to protect the motion sensor (22) from vibrations and shocks. The damping element (30) dampens vibrations and minimizes interference caused by similar internal drive frequencies. The damping element (30) is an elastic polymer or elastomer-like potting material covering the sensor board within the corresponding compartments of the plurality of compartments (10a, 10b,…10l) to absorb the vibrations or shocks created by the motion sensor (22) of the adjacent sensor boards. In another embodiment, the damping element (30) can be silicone rubber, polyurethane, epoxy resin, polybutadiene, acrylic, urethane foam, thermoplastic elastomers or the like. The damping element (30) can be selected based on its frequency damping coefficient based on the needs of the sensor array system (100).

[0039] Further, the motherboard (40) is arranged on the tray (10) to connect with each sensor board of the plurality of sensor boards (20a, 20b,…20l). The motherboard (40) is having rectangular shape similar to the shape of the tray (10) to cover the plurality of sensor boards (20a, 20b,…20l) when assembled. The motherboard (40) is communicatively connected to each sensor board of the plurality sensor boards. Specifically, the motherboard (40) includes a controller (45) to receive sensor data from the motion sensor (22) of each sensor board to perform signal averaging to improve accuracy.

[0040] The sensor data is transmitted to the controller (45) of the motherboard (40). The controller (45) aggregates the sensor data and performs statistical signal averaging. The controller (45) suppresses the random, uncorrelated noise from the motion sensors and preserves the true signal common to all motion sensors of the plurality of sensor boards (20a, 20b,…20l). The signal averaging process is done to improve the Signal-to-Noise Ratio (SNR) proportionally to the square root of the number of motion sensors, effectively enhancing the performance of the sensor array system (100) despite using low-cost sensors. The isolation and averaging strategies together ensure high fidelity and reliable sensor data in environments prone to mechanical and electrical disturbances. The plurality of sensor boards (20a, 20b,…20l) uses the signals of each of the motion sensors (22) and adds the signals together to perform signal averaging to improve the (SNR) Signal-to-Noise Ratio, for enhanced accuracy in measurements.

[0041] Referring now to FIG. 1 and 2, the sensor data is communicated with the controller (45) using the communication unit (50). The communication unit (50) is provided to establish near-field communication of each sensor board with the controller (45) separately to send the sensor data to the controller (45). The communication unit (50) is provided for the transmission of the sensor data and power between each sensor board of the plurality of sensor boards (20a, 20b,…20l) and the controller (45) of the motherboard (40). Specifically, the communication unit (50) establishes communication between the motion sensor (22) of each sensor board of the plurality of sensor boards (20a, 20b,…20l) and the controller (45) to reduce the electrical interference.

[0042] In the present embodiment, the communication unit (50) includes a first communication unit (52), and a second communication unit (54). The first communication unit (52) is arranged on the sensor board of the plurality of sensor boards (20a, 20b,…20l) for transferring data from the plurality of sensor boards (20a, 20b,…20l) to the motherboard (40), and the second communication unit (54) is arranged on the motherboard (40) for transferring data and power.

[0043] The communication unit (50) facilitates wireless communication between the plurality of sensor boards (20a, 20b,…20l) and the motherboard (40). In the present embodiment, the communication unit (50) establishes a near-field wireless (Binary Phase-Shift Keying) BPSK communication, which provides both power and data transmission. The communication unit (50) arrangement for near-field communication eliminates the need for physical connections, reducing electrical interference. The high-frequency continuous BPSK signal used for near-field wireless communication is in the MHz range, ensuring reliable power and data transmission between the motherboard (40) and the sensor board of the plurality of sensor boards (20a, 20b,…20l).

[0044] In the present embodiment, the communication unit (50) includes a plurality of first communication units (52a, 52b, …52l) arranged on the corresponding sensor boards of the plurality of sensor boards (20a, 20b,…20l). Further, the communication unit (50) includes a plurality of second communication units (54a, 54b, …54l) arranged on the motherboard (40), configured to communicate with the corresponding first communication unit (52) of the plurality of communication units (52a, 52b, …52l).

[0045] The first communication unit (52) is a trans-reception antenna etched onto the plurality of sensor boards (20a, 20b,…20l), to enable near-field wireless communication with the corresponding second communication unit (54) arranged on the motherboard (40). The second communication unit (54) is also a trans-reception antenna and is arranged on the motherboard (40) facing the plurality of sensor boards (20a, 20b,…20l) to establish near-field communication when the motherboard (40) is assembled on the tray (10). The trans-reception antenna facilitates power and data transfer.

[0046] The communication unit (50) facilitates near-field power and signal trans-reception for wireless communication between the plurality of sensor boards (20a, 20b,…20l) and the motherboard (40) to eliminate the need for physical connectors and reduce electrical interference.

[0047] Referring now to FIG. 3, the plurality of sensor boards (20a, 20b,…20l) has a rectangular shape. Each board of the plurality of sensor boards (20a, 20b,…20l) includes a capacitor (24) and a microcontroller (26). The capacitor (24) is charged via the wireless power received from the motherboard (40) through the communication unit (50). Specifically, the power is transferred from the second communication unit (54) to the first communication unit (52) which is connected to the microcontroller (26) of each sensor board of the plurality of sensor boards (20a, 20b,…20l). The capacitor (24) is arranged on the plurality of sensor boards (20a, 20b,…20l) to power the microcontroller (26) and the motion sensor (22). The microcontroller (26) is powered ON only when the capacitor (24) is charged to the required threshold voltage.

[0048] The microcontroller (26) is provided for processing sensor measurements and applying calibration coefficients. The microcontroller (26) of each sensor board of the plurality of sensor boards (20a, 20b,…20l) is connected to the motion sensor (22) to receive and process the sensor data before sending it to the controller (45) of the motherboard (40). The microcontroller (26) performs sensor sampling, data transmission, and command reception.

[0049] In an embodiment (not shown), the motherboard (40) is having a memory unit for storing calibration coefficients, a power regulation and filter unit for providing power to peripheral components, a communication module for external communication, a digital signal sampling processing unit for processing sensor measurements and applying calibration coefficients.

[0050] In another aspect (not shown), the communication unit (50) facilitates wired communication between the plurality of sensor boards (20a, 20b,…20l) and the motherboard (40). The wired communication includes physical connectors that are used for power and data transmission between the plurality of sensor boards (20a, 20b,…20l) and the motherboard (40) ensuring stable and reliable communication. In this aspect, the wired communication is established using a pigtail connectors and wires soldered to each sensor board of the plurality of sensor boards (20a, 20b,…20l) for power and signal trans-reception, providing a wired communication option.

[0051] The pigtail connectors are provided to connect each sensor board to its corresponding sensor connector on the motherboard (40). The pigtail connectors are physical connectors used for transmitting power and data between the plurality of sensor boards (20a, 20b,…20l) and the motherboard (40).

[0052] Referring to FIG. 4a-4b, in a second embodiment of the present invention, a sensor array system (200) is provided. The sensor array system (200) includes a motherboard (210), the controller (220), a plurality of motion sensors (230a,…230e), and a plurality of cavities (240a,…240e).

[0053] The plurality of motion sensors (230a,…230e) is arranged on the motherboard (210). The motion sensor of the plurality of motion sensors (230a,…230e) can be a MEMS gyroscope or an IMU sensor arranged on the motherboard (210).

[0054] The plurality of motion sensors (230a,…230e) is communicatively connected to the controller (220) of the motherboard (210) to reduce electrical interference. Each motion sensor is mounted on the motherboard (210) to eliminate the need for physical connections and reduce electrical interference. The plurality of motion sensors (230a,…230e) is communicatively connected to the controller (220) of the motherboard (210) using a wire-bonding technique to reduce electrical interference. The wire bonding technique uses fine bonding wires to connect the plurality of motion sensors (230a,…230e) to the motherboard (210). By using the wire-bonding technique, robust, low-resistance electrical paths are established between the plurality of motion sensors (230a,…230e) and the controller (220) of the motherboard (210), enabling seamless communication and interaction therebetween.

[0055] Further, the plurality of cavities (240a,…240e) is provided for each sensor of the plurality of motion sensors (230a,…230e). The cavity of the plurality of cavities (240a,…240e) is a rectangular hollow structure surrounded by closed walls to cover the plurality of motion sensors (230a,…230e) therein. The plurality of cavities (240a,…240e) is arranged on the motherboard (210) and is configured to cover the plurality of motion sensors (230a,…230e) to isolate each motion sensor of the plurality of motion sensors (230a,…230e) and to avoid vibrations and shocks, thereby reducing mechanical interference.

[0056] Therefore, the present invention has the advantage of providing a sensor array system that isolates each MEMS gyroscope or IMU sensor mechanically or electrically to prevent interference. The sensor array system with the sensor board is suspended in a tray with an elastic polymer potting compound to prevent mechanical interference and avoid signal mixing. The sensor array system improves the signal-noise ratio by using multiple low-performance sensors and averaging their signals. The sensor array system can be easily scaled by adding or removing sensor segments, allowing for flexible configurations and adaptability to various applications or environments. Even when any component or sensor from the sensor array system becomes unresponsive or damaged, it is replaceable very easily without disturbing the whole sensor array system. The sensor array system leverages affordable components like MEMS gyroscope or IMU sensor without compromising on performance, making it an economically viable solution for a wide range of industries.

[0057] The foregoing descriptions of specific embodiments of the present invention have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the present invention to the precise forms disclosed, and obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to explain the principles of the present invention best and its practical application, to thereby enabling others skilled in the art to best utilise the present invention and various embodiments with various modifications as are suited to the particular use contemplated. It is understood that various omission and substitutions of equivalents are contemplated as circumstance may suggest or render expedient, but such are intended to cover the application or implementation without departing from the scope of the claims of the present invention.
, Claims:1. A sensor array system (100) comprising:
a tray (10) having a plurality of compartments (10a, 10b,…10l);
a plurality of sensor boards (20a, 20b,…20l) mounted in the plurality of compartments (10a, 10b,…10l), the plurality of sensor boards (20a, 20b,…20l) is having a shape to fit within a corresponding compartment of the plurality of compartments (10a, 10b,…10l) of the tray (10), wherein each sensor board of the plurality of sensor boards (20a, 20b,…20l) is having a motion sensor (22) mounted thereon;
a damping element (30) arranged in the plurality of compartments (10a, 10b,…10l) around each sensor board of the plurality of sensor boards (20a, 20b,…20l) for isolating each sensor board to protect the motion sensor (22) from vibrations and shocks;
a motherboard (40) arranged on the tray (10) to connect with each sensor board of the plurality of sensor boards (20a, 20b,…20l), the motherboard (40) is having a controller (45) connected to each sensor board to receive a sensor data to perform signal averaging to improve accuracy; and
a communication unit (50) to establish near-field communication of each sensor board with the controller (45) separately to send the sensor data to the controller (45), thereby reducing electrical interference.

2. The sensor array system (100), as claimed in claim 1, wherein the communication unit (50) includes a first communication unit (52) and a second communication unit (54), the first communication unit (52) is arranged on the sensor board of the plurality of sensor boards (20a, 20b,…20l), and the second communication unit (54) is arranged on the motherboard (40) connected to the controller (45) to establish communication between each sensor board and the controller (45) for transferring the sensor data from the plurality of sensor board to the controller (45) of the motherboard (40).
3. The sensor array system (100) as claimed in claim 1, wherein each sensor board of the plurality of sensor boards (20a, 20b,…20l) includes a capacitor (24), a microcontroller (26) for processing sensor measurements and applying calibration coefficients, and a first communication unit (52) having a trans-reception antenna for communication, wherein the capacitor (24) is provided to power the microcontroller (26) and the motion sensor (22).

4. The sensor array system (100) as claimed in claim 3, wherein the first communication unit (52) is an antenna coil arranged on a top surface of the plurality of sensor boards (20a, 20b,…20l) communicatively connectable with a second communication unit (54) to send the sensor data.

5. The sensor array system (100) as claimed in claim 1, wherein the plurality of sensor boards (20a, 20b,…20l) is arranged in each compartment of the plurality of compartments (10a, 10b,…10l) in such a way that each sensor board is isolated from each other to protect the motion sensor (22) from the vibration of adjacent sensors, temperature fluctuations, and shock.

6. The sensor array system (100) as claimed in claim 1, wherein the motherboard (40) receives the sensor data from the plurality of sensor boards (20a, 20b,…20l), and adds the sensor data from the motion sensor (22) of each sensor board together to perform signal averaging to improve the Signal-to-Noise Ratio (SNR), for enhanced accuracy in measurements.

7. The sensor array system (100) as claimed in claim 1, wherein the motion sensor (22) is a MEMS gyroscope or an IMU sensor.

8. The sensor array system (100) as claimed in claim 1, wherein the damping element (30) includes an elastic polymer or elastomer-like potting material.

9. The sensor array system (100) as claimed in claim 1, wherein the motherboard (40) is having a memory unit for storing calibration coefficients, a power regulation and a filter section for conditioning power to external devices, a communication and a power port for external communication, and a second antenna for communication with the plurality of sensor boards (20a, 20b,…20l).

10. A sensor array system (100) comprising:
a motherboard (40);
a plurality of motion sensors (230a, …230e) arranged on the motherboard (210), communicatively connected to a controller (220) of the motherboard (210), wherein the plurality of motion sensors (230a, …230e) is connected to the motherboard (210) using a wire-bonding technique to reduce electrical interference;
a plurality of cavities (240a, …240e) arranged on the motherboard (210), configured to cover the plurality of motion sensors (230a, …230e) to isolate each motion sensor of the plurality of motion sensors (230a, …230e) to avoid vibrations and shocks, thereby reducing mechanical interference.