1
FORM 2
THE PATENTS ACT, 1970
(39 of 1970)
&
THE PATENTS RULES, 2003
COMPLETE SPECIFICATION
[See section 10, Rule 13]
DRIVE DEVICE AND AIR CONDITIONING DEVICE
MITSUBISHI ELECTRIC CORPORATION A CORPORATION ORGANISED AND
EXISTING UNDER THE LAWS OF JAPAN, WHOSE ADDRESS IS 7-3,
MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 1008310, JAPAN
THE FOLLOWING SPECIFICATION PARTICULARLY DESCRIBES THE
INVENTION AND THE MANNER IN WHICH IT IS TO BE PERFORMED.
5
2
DESCRIPTION
Field
[0001] The present disclosure relates to a drive device
for driving a motor and to an air conditioning apparatus5
including the same.
Background
[0002] An electronic substrate such as a circuit board
included in a drive device for driving a motor is required10
to prevent adhesion of a foreign matter such as water, dust,
dirt, or a small animal to the electronic substrate, and to
thereby prevent a tracking phenomenon, which may cause a
short circuit to occur on the electronic substrate. An
electronic substrate is hereinafter referred to simply as15
“substrate”. In addition, when a slightly flammable
refrigerant is used in a drive device for a compressor motor
of an air conditioning apparatus, leakage of the refrigerant
around the substrate needs to be prevented. Accordingly,
such drive device for a compressor motor of an air20
conditioning apparatus has a structure to include the
substrate in a sealed structure. A drive device having a
structure to include the substrate in a sealed structure has
lower property of releasing heat from the substrate to the
outside of the sealed structure, and accordingly has lower25
cooling performance with respect to the electronic
components mounted on the substrate.
[0003] Patent Literature 1 discloses a structure in which
a power supply module including a substrate, electronic
components disposed on the substrate, and a power module is30
configured in such a manner that a heat-dissipating metal
plate and a metal cover are tightly attached to the power
module on a side opposite the substrate, with a thermally
3
conductive electrically-insulating material interposed
therebetween. The power supply module disclosed in Patent
Literature 1 includes a casing that covers the substrate
from the side of the substrate, opposite to the surface on
which the power module is mounted. The casing and the metal5
cover together form a sealed structure.
[0004] The power supply module disclosed in Patent
Literature 1 transfers heat generated by a heat generating
component to the metal cover through the thermally conductive
electrically-insulating material and through the heat-10
dissipating metal plate, and allows heat to be released from
the metal cover to thus cool the heat generating component.
By using the foregoing cooling structure, the power supply
module disclosed in Patent Literature 1 improves heat
dissipation effect on electronic components that become high15
in temperature such as the power module, without using a
heat sink while forming a sealed structure in a drive device.
Citation List
Patent Literature20
[0005] Patent Literature 1: WO 2016/147345 A
Summary of Invention
Problem to be solved by the Invention
[0006] When the substrate is housed in a sealed structure25
such as in the case of the power supply module disclosed in
Patent Literature 1, a problem arises in achievement of both
more efficient heat release of a heat generating component
that becomes high in temperature and heat release of another
electronic component disposed on the substrate. That is,30
measures for improving heat dissipation effect are not taken
for electronic components other than the heat generating
component, heat generated by which can be released through
4
the metal cover. The power supply module disclosed in Patent
Literature 1 thus cannot prevent heat generated by electronic
components other than the heat generating component from
being accumulated within the sealed structure.
[0007] The present disclosure has been made in view of5
the foregoing, and it is an object of the present disclosure
to provide a drive device having a higher heat dissipation
effect on heat generated by an electronic component, other
than a heat generating component, disposed in a housing
forming a sealed structure.10
Means to Solve the Problem
[0008] In order to solve the above-described problems and
achieve the object, a drive device according to the present
disclosure is a drive device that converts electrical power15
supplied from a power supply into motor-driving electrical
power includes: a substrate on which a wiring pattern formed
of a metal foil and including a bonding portion is provided;
a heat generating component including a terminal portion for
connection, and mounted on the substrate by solder bonding20
of the terminal portion to the bonding portion; an electronic
component electrically connected to the heat generating
component via the wiring pattern; a housing made of metal to
surround the substrate; and a heat dissipation member
releasing heat generated by the heat generating component.25
The heat dissipation member is in contact with the housing,
with the terminal portion, and with the bonding portion.
Effects of the Invention
[0009] A drive device according to the present disclosure30
provides an advantage in capability of improving a heat
dissipation effect on heat generated by an electronic
component, other than a heat generating component, disposed
5
in a housing forming a sealed structure.
Brief Description of Drawings
[0010] FIG. 1 is a diagram illustrating a configuration
of a drive device according to a first embodiment.5
FIG. 2 is a cross-sectional view schematically
illustrating a state in which a heat generating component is
mounted on a substrate of the drive device according to the
first embodiment.
FIG. 3 is a cross-sectional view schematically10
illustrating a state in which the heat generating component
is mounted on the substrate of the drive device according to
a second embodiment.
FIG. 4 is a cross-sectional view schematically
illustrating a state in which the heat generating component15
is mounted on the substrate of the drive device according to
a modification of the second embodiment.
FIG. 5 is a cross-sectional view schematically
illustrating a state in which the heat generating component
is mounted on the substrate of the drive device according to20
a third embodiment.
FIG. 6 is a diagram illustrating a configuration of an
air conditioning apparatus according to a fourth embodiment.
FIG. 7 is a perspective view of an outdoor unit of the
air conditioning apparatus according to the fourth25
embodiment.
FIG. 8 is a perspective view of the outdoor unit of the
air conditioning apparatus according to a modification of
the fourth embodiment.
30
Description of Embodiments
[0011] A drive device and an air conditioning apparatus
according to embodiments will be described in detail below
6
with reference to the drawings.
[0012] First Embodiment.
FIG. 1 is a diagram illustrating a configuration of a
drive device according to a first embodiment. A drive device
200 according to the first embodiment is connected to a power5
supply 100 and to a motor 101. The drive device 200 is
supplied with electrical power from the power supply 100.
The drive device 200 has functions of a converter and of an
inverter and a function to control these components to
convert the electrical power supplied from the power supply10
100 into electrical power suitable for driving a motor, and
to output driving electrical power to the motor 101. Note
that the function to control the converter and the inverter
can be implemented by a known microcontroller.
[0013] The drive device 200 includes a substrate 1, on15
which a wiring pattern is formed. The wiring pattern is a
wiring of a conductor formed using a metal foil, a typical
example of which is a copper foil. The wiring pattern is
formed on a surface of, and in the inside of, a plate formed
of an insulator. Soldering of terminal portions for20
connecting, of electronic components, including a heat
generating component 2, to bonding portions formed on the
substrate 1 produces an electronic circuit. The electronic
components mounted on the substrate 1 are, for example, a
noise filter, a smoothing capacitor, sensors for detecting25
a current and a voltage, a microcontroller, and/or a
peripheral circuit.
[0014] When an electronic component has terminal portions
that are leads, the corresponding bonding portions of the
substrate 1 are pads, and the terminal portions are soldered30
to the pads. Alternatively, when an electronic component
has terminal portions that are pins, the corresponding
bonding portions of the substrate 1 are lands, and the
7
terminal portions are soldered to the lands.
[0015] Driving the motor 101 causes heat to be generated
in components mounted on the substrate 1 due to internal
loss of each thereof and the like. Among others, a large
amount of heat is generated due to a loss in association5
with switching or conduction of a semiconductor device during
electrical power conversion, due to a resistance loss in a
reactor, and due to a ripple current flowing through a
smoothing capacitor.
[0016] The drive device 200 includes a housing 3 made of10
metal to prevent adhesion of a foreign matter such as water,
dust, dirt, or a small animal to the substrate 1, and to
thereby prevent a tracking phenomenon, which may cause a
short circuit. The substrate 1 is disposed in a sealed
structure formed by the housing 3. Note that when an15
electric line and a communication line need to be penetrated
between the inside and the outside of the sealed structure,
a hole for penetrating these lines is formed in the housing
3. Formation of a hole in the housing 3 may allow water,
dust, dirt, or a small animal to enter through a gap between20
a hole edge and a line, the risk of which can be reduced by
reducing the size of gap between the hole edge and the line.
Alternatively, the gap between the hole edge and the line
may be filled with a seal material or a caulking material to
improve sealing property of the sealed structure. Although25
FIG. 1 illustrates the motor 101 as being disposed inside
the housing 3, the motor 101 may be disposed outside the
housing 3.
[0017] FIG. 2 is a cross-sectional view schematically
illustrating a state in which the heat generating component30
is mounted on the substrate of the drive device according to
the first embodiment. Note that FIG. 2 omits illustration
of the motor 101. The substrate 1 is disposed spaced apart
8
from a surface 31 of the housing 3 by legs 15a and 15b to
allow components to be mounted on both surfaces of the
substrate 1. The substrate 1 includes a first surface 1f,
on which electronic components 13 and 14 are disposed, and
a second surface 1s, which is the surface opposite the first5
surface 1f. The heat generating component 2 is disposed on
the second surface 1s.
[0018] FIG. 2 illustrates an example in which the heat
generating component 2 is a typical power device. Note that
although FIG. 2 illustrates an example of a power module of10
a dual inline package (DIP) type, the package of the power
device is not limited to a DIP package. The term “power
device” herein refers to a set of semiconductor devices that
performs processing such as rectification of a current
supplied from the power supply 100, and conversion of15
electrical power obtained by rectification into electrical
power for driving the motor 101. A power device has known
functions of an inverter and of a converter, and is used in
a configuration in which multiple discrete semiconductor
devices are arranged in combination or used in a form of a20
power module including multiple semiconductor devices
packaged in a single package.
[0019] Moreover, also known is a combined module that
integrates, into a single package, a converter function of
rectifying electrical power output by the power supply 10025
and an inverter function of converting electrical power into
electrical power for driving the motor 101. The conceptual
scope of power device includes a discrete semiconductor
device, a power module, and also a combined module.
[0020] The heat generating component 2 is thermally30
connected to the housing 3 by abutting onto the surface 31
of the housing 3. Heat of the heat generating component 2
is released through the housing 3. The housing 3 has a
9
function to release heat of the heat generating component 2.
The heat is transferred over the entire metal material
forming the housing 3. Namely, since heat dissipation area
is thus increased, thereby producing a high heat dissipation
effect.5
[0021] The substrate 1 includes lands 11a and 11b, which
constitute part of the wiring pattern formed by a metal foil.
The land 11a, which is one of the bonding portions, is formed
on the surfaces of the first surface 1f and of the second
surface 1s of the substrate 1. The portion thereof on the10
surface of the first surface 1f and the portion thereof on
the surface of the second surface 1s are linked together via
a through-hole 12a penetrating through the substrate 1.
Similarly, the land 11b, which is one of the bonding portions,
is formed on the surfaces of the first surface 1f and of the15
second surface 1s of the substrate 1. The portion thereof
on the surface of the first surface 1f and the portion
thereof on the surface of the second surface 1s are linked
together via a through-hole 12b penetrating through the
substrate 1. The heat generating component 2 is fixed to20
the substrate 1 by bonding in such a manner that pins 21a
and 21b serving as the terminal portions respectively
penetrate through the through-holes 12a and 12b of the
substrate 1, and are respectively solder bonded to the lands
11a and 11b. Note that when the heat generating component25
2 is a reactor or a capacitor, leads of the heat generating
component 2 serving as the terminal portions are solder
bonded to pads serving as the bonding portions of the
substrate 1.
[0022] The electronic component 13 and the electronic30
component 14 are each disposed on the surface of the first
surface 1f of the substrate 1, and are solder bonded to pads
(not illustrated) formed on the first surface 1f of the
10
substrate 1. The pads (not illustrated) to which each of
the electronic component 13 and the electronic component 14
are solder bonded respectively connect with the lands 11a
and 11b. This causes the electronic components 13 and 14 to
be electrically connected to the heat generating component5
2 through the wiring pattern.
[0023] The heat generating component 2 performs
electrical communication such as transmission of an
electrical signal with the electronic components 13 and 14
mounted on the substrate 1 through a metal foil on the10
substrate 1 electrically connected to the lands 11a and 11b.
The heat generating component 2 also performs electrical
communication such as supplying and receiving electrical
power and transmission of an electrical signal with another
substrate through the wiring pattern formed by using a metal15
foil on the substrate 1 and through a terminal or a connector.
[0024] FIG. 2 illustrates an example in which the heat
generating component 2 is a DIP-type module. In contrast,
when the heat generating component 2 is a small outline
package (SOP)-type device, which includes the pins 21a and20
21b having a gull wing shape, the pins 21a and 21b are solder
bonded to pads formed on the first surface 1f of the
substrate 1 to fix the heat generating component 2 to the
substrate 1 by solder bonding between the pins 21a and 21b
and the pads.25
[0025] The drive device 200 according to the first
embodiment is configured in which heat dissipation members
4a and 4b are in contact: with the lands 11a and 11b being
the bonding portions; with the pins 21a and 21b being the
terminal portions; and with the housing 3, to efficiently30
release heat from the heat generating component 2. The heat
dissipation members 4a and 4b are each a known electrically-
insulating heat dissipation sheet, highly heat-dissipating
11
gel, or highly heat-dissipating jelled material. Since the
heat dissipation members 4a and 4b have electrical insulation
property, electrical insulation between the housing 3 and
the pins 21a and 21b each having heat dissipation capability
can be ensured.5
[0026] In the drive device 200 according to the first
embodiment, heat of the heat generating component 2 is
transferred not only directly from the heat generating
component 2 to the housing 3 but also from the pins 21a and
21b of the heat generating component 2 to the housing 310
through the heat dissipation members 4a and 4b. In addition,
heat transferred from the pins 21a and 21b of the heat
generating component 2 to the lands 11a and 11b can also be
transferred to the housing 3 through the heat dissipation
members 4a and 4b. This enables the drive device 20015
according to the first embodiment to efficiently release
heat generated by the heat generating component 2. Moreover,
the drive device 200 according to the first embodiment is
capable of efficiently releasing not only heat generated by
the heat generating component 2, but also heat generated by20
the electronic components 13 and 14 electrically connected
to the heat generating component 2 via the lands 11a and 11b
and via the wiring pattern of the substrate 1. Accordingly,
heat generated by the heat generating component 2 and by the
electronic components 13 and 14 mounted on the substrate 125
disposed in the housing 3 forming a sealed structure can be
released through the lands 11a and 11b, the heat dissipation
members 4a and 4b, and the housing 3 made of metal.
[0027] As illustrated in FIG. 2, disposing the pins 21a
and 21b of the heat generating component 2 to be buried into,30
and fixed to, the heat dissipation members 4a and 4b enables
the heat dissipation members 4a and 4b to attenuate vibration
of the pins of the heat generating component 2 even when the
12
substrate 1 or the housing 3 vibrates during transportation
of the substrate 1 or conduction of a current. This can
prevent breaking of the pins 21a and 21b.
[0028] As described above, in the drive device 200
including the substrate 1 in a sealed structure enclosed by5
the housing 3 made of metal, the heat dissipation members 4a
and 4b are in thermal contact with the terminal portions of
the heat generating component 2, with the bonding portions
of the substrate 1, and with the housing 3. Not only can
this improve heat dissipation performance of the generating10
component 2, but also heat generated by the electronic
components 13 and 14 other than the heat generating component
2 can be released through the lands 11a and 11b being the
bonding portions, the heat dissipation members 4a and 4b,
and the housing 3. Thus, the drive device 200 according to15
the first embodiment is advantageous in being capable of
also preventing a thermal failure of the electronic
components 13 and 14, which is an issue of a sealed structure,
while using a sealed structure that enables a tracking
phenomenon to be prevented that might occur due to adhesion20
of a foreign matter such as water, dust, dirt, or a small
animal to the substrate 1.
[0029] Second Embodiment.
FIG. 3 is a cross-sectional view schematically
illustrating a state in which the heat generating component25
is mounted on the substrate of the drive device according to
a second embodiment. The drive device 200 according to the
second embodiment includes a heat dissipation member 4c
disposed between the heat generating component 2 and the
housing 3. That is, in the drive device 200 according to30
the second embodiment, the heat dissipation member 4c is
interposed between the heat generating component 2 and the
housing 3. The heat dissipation member 4c transfers heat
13
from the heat generating component 2 to the housing 3. To
this end, the heat generating component 2 is thermally
connected to the housing 3 via the heat dissipation member
4c.
[0030] The heat dissipation member 4c is, similarly to5
the heat dissipation members 4a and 4b described in the first
embodiment, a known electrically-insulating heat dissipation
sheet, highly heat-dissipating gel, or highly heat-
dissipating jelled material. In the second embodiment, the
heat dissipation member 4c, formed as a single member, is10
disposed to surround the pins 21a and 21b of the heat
generating component 2 and to fill a space between the heat
generating component 2 and the housing 3. In this regard,
the heat dissipation member 4c may be configured using
multiple different members in such a manner that a highly15
flexible gel or jelled material is used to release heat to
space around the pins 21a and 21b of the heat generating
component 2, and a heat dissipation sheet is disposed in the
space between the heat generating component 2 and the housing
3.20
[0031] Bringing the heat generating component 2 and the
housing 3 into thermal contact with each other through the
heat dissipation member 4c interposed therebetween can fill
a small space that is generated when the heat generating
component 2 and the housing 3 are disposed to come into25
contact with each other. Thus, the drive device 200
according to the second embodiment prevents an increase in
thermal resistance caused by a space between the heat
generating component 2 and the housing 3. This further
improves performance of heat transfer from the heat30
generating component 2 to the housing 3, and thus further
improves the heat dissipation effect on the heat generating
component 2.
14
[0032] As described above, interposing the heat
dissipation member 4c between the heat generating component
2 and the housing 3 enables heat generated by the heat
generating component 2 mounted on the substrate 1 disposed
in the housing 3 forming a sealed structure to be released5
through the lands 11a and 11b, the heat dissipation member
4c, and the housing 3 made of metal. That is, interposing
the heat dissipation member 4c between the heat generating
component 2 and the housing 3 can further improve the heat
dissipation effect on heat generated by the heat generating10
component 2. In addition, similarly to the drive device 200
according to the first embodiment, efficient heat release
can be achieved not only on heat generated by the heat
generating component 2, but also on heat generated by the
electronic components 13 and 14 on the substrate 115
electrically connected to the heat generating component 2
via the lands 11a and 11b and via the wiring pattern on the
substrate 1.
[0033] FIG. 4 is a cross-sectional view schematically
illustrating a state in which the heat generating component20
is mounted on the substrate of the drive device according to
a modification of the second embodiment. In the drive device
200 according to a modification of the second embodiment,
heat transfer grease 5 is interposed between the heat
generating component 2 and the housing 3, instead of the25
heat dissipation member 4c.
[0034] The drive device 200 according to a modification
of the second embodiment is assembled after application of
the heat transfer grease 5 on the heat generating component
2 or on the housing 3 to bring the heat generating component30
2 and the housing 3 into thermal contact with each other
through the heat transfer grease 5 interposed therebetween.
[0035] The heat transfer grease 5 can be, for example, a
15
known grease such as one including, as the base, modified
silicone having viscosity that varies only slightly in a
range from a normal temperature to a high temperature, and
further including particles of highly thermally conductive
metal or metal oxide being mixed thereto.5
[0036] Bringing the heat generating component 2 and the
housing 3 into thermal contact with each other through the
heat transfer grease 5 interposed therebetween can fill a
small space that is generated when the heat generating
component 2 and the housing 3 are disposed to come into10
contact with each other. Thus, the drive device 200
according to the modification of the second embodiment
prevents an increase in thermal resistance caused by a space
between the heat generating component 2 and the housing 3.
This further improves performance of heat transfer from the15
heat generating component 2 to the housing 3, and thus
further improves the heat dissipation effect on the heat
generating component 2.
[0037] As described above, interposing the heat transfer
grease 5 between the heat generating component 2 and the20
housing 3 further improves the heat dissipation effect on
heat generated by the heat generating component 2. This
enables heat generated by the heat generating component 2
mounted on the substrate 1 disposed in the housing 3 forming
a sealed structure to be released through the lands 11a and25
11b, the heat dissipation members 4a and 4b, the heat
transfer grease 5, and the housing 3 made of metal.
Similarly to the drive device 200 according to the first
embodiment, efficient heat release can be achieved not only
on heat generated by the heat generating component 2, but30
also on heat generated by the electronic components 13 and
14 on the substrate 1 electrically connected to the heat
generating component 2 via the lands 11a and 11b and via the
16
wiring pattern on the substrate 1.
[0038] Third Embodiment.
FIG. 5 is a cross-sectional view schematically
illustrating a state in which the heat generating component
is mounted on the substrate of the drive device according to5
a third embodiment. The drive device 200 according to the
third embodiment is configured in which the heat generating
component 2 is mounted on the first surface 1f of the
substrate 1. That is, in the drive device 200 according to
the third embodiment, the heat generating component 2 and10
the electronic components 13 and 14 are mounted on the same
surface of the substrate 1 as each other.
[0039] In the third embodiment, heat generated by the
heat generating component 2 is transferred to the housing 3
through the pins 21a and 21b and the heat dissipation members15
4a and 4b. In addition, heat transferred from the pins 21a
and 21b of the heat generating component 2 to the lands 11a
and 11b can also be transferred to the housing 3 through the
heat dissipation members 4a and 4b. This enables heat from
the heat generating component 2 to be efficiently released.20
Moreover, efficient heat release can be achieved not only on
heat generated by the heat generating component 2, but also
on heat generated by the electronic components 13 and 14 on
the substrate 1 electrically connected to the heat generating
component 2 via the lands 11a and 11b. Although FIG. 525
illustrates the heat dissipation members 4a and 4b as
separate components, the heat dissipation members 4a and 4b
may constitute a single component.
[0040] The drive device 200 according to the third
embodiment is capable of releasing heat generated by the30
heat generating component 2 and by the electronic components
13 and 14 mounted on the substrate 1 disposed in the housing
3 forming a sealed structure through the lands 11a and 11b,
17
the heat dissipation members 4a and 4b, and the housing 3
made of metal. In addition, the heat generating component
2 and the electronic components 13 and 14 can be totally
mounted on a same component mounting surface, thereby
enabling efficiency of component mounting work to be5
increased.
[0041] Fourth Embodiment.
FIG. 6 is a diagram illustrating a configuration of an
air conditioning apparatus according to a fourth embodiment.
An air conditioning apparatus 300 according to the fourth10
embodiment includes an indoor unit 150 and an outdoor unit
110. The indoor unit 150 includes an indoor heat exchanger
124. The outdoor unit 110 includes a fan motor 102, a
compressor 111, a fan 112, an outdoor heat exchanger 123, a
four-way valve 121, an expanding device 122, and the drive15
device 200. The compressor 111 includes the motor 101 and
a compression element (not illustrated) coupled to the motor
101. The drive device 200 is the drive device 200 described
in one of the first through third embodiments.
[0042] FIG. 7 is a perspective view of the outdoor unit20
of the air conditioning apparatus according to the fourth
embodiment. FIG. 7 omits illustration of one side surface
of the outdoor unit 110 to visualize an internal
configuration of the outdoor unit 110. FIG. 7 schematically
illustrates, among the components of the outdoor unit 110,25
the outdoor heat exchanger 123, the fan 112 for heat exchange
in the outdoor heat exchanger 123 with external air, the
substrate 1 of the drive device 200, the heat generating
component 2 mounted on the substrate 1, the electronic
components 13 and 14, which are other electronic components30
mounted on the substrate 1, and the compressor 111. FIG. 7
omits illustration of elements such as an electric line and
a refrigerant pipe in the outdoor unit 110.
18
[0043] In addition, the housing 3 made of metal, forming
a sealed structure, is formed by a housing metal plate 3a of
the outdoor unit 110 and by a separator 3b, which partitions
the inside of the outdoor unit 110 into a fan chamber 131
and a machine chamber 132. The drive device 200 is placed5
in the machine chamber 132. Note, however, that the housing
3 has a minimum hole for allowing elements such as an
electric line, a communication line, and a pipe to penetrate
between the inside and the outside of the outdoor unit 110.
Of the housing 3, the separator 3b serves as the surface 3110
to be thermally connected to the heat generating component
2.
[0044] The fan 112 for heat exchange with external air is
rotated to generate a wind in the inside of the fan chamber
131. The outdoor unit 110 illustrated in FIG. 7 is15
configured in which the separator 3b is faced to the fan
chamber 131, and is positioned on the side opposite the
surface of the heat generating component 2 facing the surface
of the substrate 1, thereby causing the wind generated by
rotation of the fan 112 to be blown onto the separator 3b to20
release heat of the heat generating component 2 through the
separator 3b.
[0045] Such configuration enables heat of the heat
generating component 2 to be effectively released using a
wind generated by rotation of the fan 112.25
[0046] The drive device 200 is supplied with electrical
power from the power supply 100 and outputs driving
electrical power to the motor 101 of the compressor 111.
Operation of the motor 101 then causes the compression
element coupled to the motor 101 to compress a refrigerant.30
[0047] The motor 101 of the compressor 111 generally
outputs power that is greater than power output by the fan
motor 102. In the context of cooling the power devices for
19
respectively driving the motor 101 and the fan motor 102,
preferably the power device that drives the motor 101 of the
compressor 111 is considered as the heat generating component
2 of the drive device 200. Note, however, that the heat
generating component 2 of the drive device 200 may be the5
power device that drives the fan motor 102 or may be a
combination of both the power device that drives the motor
101 and the power device that drives the fan motor 102. Use,
as the heat generating component 2, of at least one of the
power device that drives the motor 101 and the power device10
that drives the fan motor 102 provides the advantage of heat
release of the heat generating component 2 and of the
electronic components 13 and 14.
[0048] The air conditioning apparatus 300 illustrated in
FIG. 6 includes a refrigeration cycle 120, which is formed15
by the compressor 111, the four-way valve 121, the outdoor
heat exchanger 123, the expanding device 122, the indoor
heat exchanger 124, the four-way valve 121, and the
compressor 111 sequentially connected to each other in this
order using a refrigerant pipe. The drive device 200, the20
compressor 111, the four-way valve 121, the outdoor heat
exchanger 123, and the expanding device 122 are included in
the outdoor unit 110 of the air conditioning apparatus 300,
while the indoor heat exchanger 124 is included in the indoor
unit 150 of the air conditioning apparatus 300.25
[0049] An operation of the air conditioning apparatus 300
will next be described in the context of cooling operation
as an example. Note that the refrigeration cycle 120 is
capable of performing heating operation, which will not be
herein described. In cooling operation, the four-way valve30
121 switches flow paths to cause a refrigerant discharged
from the compressor 111 to flow to the outdoor heat exchanger
123, and a refrigerant flowed out of the indoor heat
20
exchanger 124 to flow to the compressor 111.
[0050] Compression of the refrigerant by the compression
element of the compressor 111 under control of the drive
device 200 causes a high temperature, high pressure
refrigerant to be discharged from the compressor 111. The5
high temperature, high pressure refrigerant discharged from
the compressor 111 passes through the four-way valve 121 and
flows into the outdoor heat exchanger 123. The outdoor heat
exchanger 123 performs heat exchange between the refrigerant
and the external air to release heat from the refrigerant.10
The refrigerant flowed out of the outdoor heat exchanger 123
is expanded and reduced in pressure by the expanding device
122, and thereby transformed into a gas-liquid two-phase
refrigerant having a low temperature and a low pressure.
The gas-liquid two-phase refrigerant then flows into the15
indoor heat exchanger 124, where the gas-liquid two-phase
refrigerant evaporates due to heat exchange with air in the
air-conditioned space, and is thereby transformed into a low
temperature, low pressure gas refrigerant, which then flows
out of the indoor heat exchanger 124. The gas refrigerant20
flowed out of the indoor heat exchanger 124 passes through
the four-way valve 121 and is taken into the compressor 111
to be compressed again. In cooling operation, the foregoing
process is repeated in the refrigeration cycle 120. Note
that to enable finer-grained control of the refrigerant, not25
only the outdoor unit 110 but also the indoor unit 150 may
include an expanding device.
[0051] FIG. 6 illustrates an example in which the drive
device 200 according to one of the first through third
embodiments is applied in the air conditioning apparatus 300,30
but the usage is not limited thereto. The drive device 200
may be applied in not only the conditioning apparatus 300
but also a heat pump device, a refrigeration device, and
21
another refrigeration cycle device in general.
[0052] FIG. 8 is a perspective view of the outdoor unit
of the air conditioning apparatus according to a modification
of the fourth embodiment. Similarly to FIG. 7, FIG. 8 omits
illustration of one side surface of the outdoor unit 110 to5
visualize an internal configuration of the outdoor unit 110.
A sealed structure that seals the substrate 1 using the
entire machine chamber 132 such as one in the outdoor unit
110 according to the fourth embodiment causes the sealed
structure to have a significantly large size as compared to10
the size of the substrate 1. In contrast, use of a metal
casing 3c, which encloses only the substrate 1, such as one
in the air conditioning apparatus according to the
modification can further improve the sealing effect.
[0053] As illustrated in FIG. 8, surrounding the15
substrate 1 from six directions by the housing metal plate
3a, the separator 3b, and the metal casing 3c of the outdoor
unit 110 can establish a sealed structure smaller than the
sealed structure of the outdoor unit 110 according to the
fourth embodiment. Note, however, that the metal casing 3c20
has a minimum hole for allowing elements such as an electric
line and a communication line to penetrate between the inside
and the outside of the sealed structure. Formation of a
sealed structure using the metal casing 3c can further
improve the effect of preventing adhesion of a foreign matter25
such as water, dust, dirt, or a small animal to the substrate
1.
[0054] As described above, applying the drive device 200
according to the first through third embodiments to the air
conditioning apparatus 300 enables heat of the heat30
generating component 2 and of the electronic components 13
and 14 of the drive device 200 to be released through the
housing metal plate 3a and the separator 3b of the outdoor
22
unit 110 of the air conditioning apparatus 300. In addition,
since the housing metal plate 3a has a large area being in
contact with external air, and the separator 3b is blown by
the wind generated by rotation of the fan 112, the heat can
be efficiently released.5
[0055] The configurations described in the foregoing
embodiments are merely examples of aspects of the present
invention. These configurations may be combined with another
known technology, and part of such configurations may be
omitted and/or modified without departing from the spirit of10
the present invention.
Reference Signs List
[0056] 1 substrate; 1f first surface; 1s second
surface; 2 heat generating component; 3 housing; 3a15
housing metal plate; 3b separator; 3c metal casing; 4a,
4b, 4c heat dissipation member; 5 heat transfer grease;
11a, 11b land; 12a, 12b through-hole; 13, 14 electronic
component; 15a, 15b leg; 21a, 21b pin; 31 surface; 100
power supply; 101 motor; 102 fan motor; 110 outdoor unit;20
111 compressor; 112 fan; 120 refrigeration cycle; 121
four-way valve; 122 expanding device; 123 outdoor heat
exchanger; 124 indoor heat exchanger; 131 fan chamber; 132
machine chamber; 150 indoor unit; 200 drive device; 300
air conditioning apparatus.25
23
WE CLAIM:
[Claim 1]A drive device (200) that converts electrical
power supplied from a power supply (100) into motor-driving
electrical power, the drive device (200) comprising:
a substrate (1) on which a wiring pattern formed of a5
metal foil is provided, the wiring pattern including a
bonding portion (11a, 11b);
a heat generating component (2) including a terminal
portion (21a, 21b) for connection, the heat generating
component (2) being mounted on the substrate (1) by solder10
bonding of the terminal portion (21a, 21b) to the bonding
portion (11a, 11b);
an electronic component (13, 14) electrically
connected to the heat generating component (2) via the
wiring pattern;15
a housing (3) made of metal to surround the substrate
(1); and
a heat dissipation member (4a, 4b) to release heat
generated by the heat generating component (2), wherein
the heat dissipation member (4a, 4b) is in contact20
with the housing (3), with the terminal portion (21a, 21b),
and with the bonding portion (11a, 11b).
[Claim 2] The drive device (200) according to claim 1,
wherein the heat generating component (2) and the housing25
(3) are thermally connected to each other.
[Claim 3] The drive device (200) according to claim 2,
wherein the heat dissipation member (4c) is interposed
between the heat generating component (2) and the housing30
(3).
[Claim 4]The drive device (200) according to claim 2
24
comprising heat transfer grease (5), the heat transfer
grease (5) being disposed between the heat generating
component (2) and the housing (3).
[Claim 5] The drive device (200) according to claim 1,5
wherein the heat generating component (2) is a power device
that converts the electrical power supplied from the power
supply (100) into the motor-driving electrical power.
[Claim 6] An air conditioning apparatus (300) comprising10
the drive device (200) according to any one of claims 1 to
5, the air conditioning apparatus (300) comprising:
an outdoor unit (110) including a compressor (111), a
fan motor (102), and an outdoor fan (112), the compressor
(111) including a motor (101) that is a drive source for15
compression of a refrigerant of a refrigeration cycle
(120), the outdoor fan (112) to be driven by the fan motor
(102), wherein
the drive device (200) outputs the motor-driving
electrical power to at least one of the motor (101) or the20
fan motor (102).
[Claim 7]The air conditioning apparatus (300) according to
claim 6, wherein
the outdoor unit (110) includes a separator(3b) that25
partitions a space inside the housing (3)into a fan chamber
(131)and a machine chamber (132), the fan chamber
(131)being a space where the outdoor fan (112) is mounted,
the machine chamber (132) being a space where the
compressor (111) is mounted, and30
the drive device (200) is mounted in the machine
chamber (132), and the heat generating component (2)is in
contact with the separator (3b).
25
[Claim 8] The air conditioning apparatus (300) according to
claim 7 comprising a metal casing (3c), the metal casing
(3c) being provided in the machine chamber (132) to
surround the substrate (1).5