Description:PD061771IN-SC
FORM 2
THE PATENTS ACT, 1970
(39 of 1970)
&
THE PATENTS RULES, 2003
COMPLETE SPECIFICATION
(See section 10, rule 13)
1. Title of the invention: COOLING ASSEMBLIES FOR DATA CENTERS
2. Applicant(s)
NAME NATIONALITY ADDRESS
OLA ELECTRIC MOBILITY
LIMITED
Indian Regent Insignia, #414, 3rd Floor, 4th
Block, 17th Main, 100 Feet Road,
Koramangala, Bangalore, Karnataka
560034, India
3. Preamble to the description
COMPLETE SPECIFICATION
The following specification particularly describes the invention and the manner in which it
is to be performed.
1
TECHNICAL FIELD
[0001] The present subject matter relates, in general, to cooling systems
for electronic components and, particularly but not exclusively, to liquid cooling
systems for data centers, such as servers with one or more electronic
components.
5
BACKGROUND
[0002] Thermal management of electronic components is essential for
maintaining the performance, reliability, and longevity of electronic devices.
During the operation, electronic components in the electronic device generate
10 heat due to electrical resistance and energy consumption. Therefore, for
optimal performance of the electronic device, efficient cooling systems are
required to dissipate this heat and prevent overheating of electronic
components, thereby enhancing their reliability, performance, and lifespan.
[0003] Air cooling system is one of the most widely used cooling systems
15 for thermal management in electronic components due to its simplicity and
cost-effectiveness. It relies on air as a medium to remove heat from electronic
components. Typically, this is done using heat sinks made of materials, such
as aluminum or copper, which are attached directly to the electronic
components. A fan may be added to increase the airflow of the heat sink,
20 thereby improving the rate of heat transfer.
[0004] Liquid cooling system, on the other hand, is a more advanced
system that uses coolants, such as water, to transfer heat away from electronic
components. During the operation, the coolant is circulated through tubes or
channels that come into contact with the heat generated electronic
25 components, thereby dissipating heat from the electronic components.
2
BRIEF DESCRIPTION OF DRAWINGS
[0005] The detailed description is provided with reference to the
accompanying figures. The left-most digit of a reference number identifies the
figure in which the reference number first appears in the figures. The same
5 numbers are used throughout the drawings to reference like features and
components.
[0006] Fig. 1a illustrates a perspective view of a cooling assembly, in
accordance with an implementation of the present subject matter;
[0007] Fig. 1b illustrates a perspective view of a cooling assembly, in
10 accordance with another implementation of the present subject matter;
[0008] Fig. 1c illustrates a data center implementing the cooling assembly
in a rack, in accordance with an implementation of the present subject matter;
[0009] Fig. 2 illustrates a coolant fluid path within the cooling assembly, in
accordance with an implementation of the present subject matter;
15 [0010] Fig. 3 illustrates a perspective view of the cooling assembly
incorporating a circuit board, in accordance with an implementation of the
present subject matter;
[0011] Fig. 4 illustrates an exploded view of a cross section of the coolant
fluid path within the cooling assembly, in accordance with an implementation
20 of the present subject matter.
DETAILED DESCRIPTION OF DRAWINGS
[0012] Data centers are facilities that house computer systems and
associated components for organizations to store, process, and distribute
large amounts of data.
25 [0013] Thermal management for the data center that includes numerous
electronic server racks is critical to ensure proper performance of servers and
other electronic equipment that is operating in the racks. Without proper
thermal management, the thermal environment (e.g., temperature) within the
3
racks may exceed thermal operational thresholds, which may result in adverse
consequences (e.g., processor slowing down, servers failing, etc.).
[0014] Conventional thermal management system utilizes air cooling
mechanisms to cool the electronic equipment in the server racks. During the
5 operation, the cooling air is recirculated through cooling units. The heat
generated by the electronic equipment is captured by the cooling air and is
extracted by the cooling unit.
[0015] However, as more powerful servers and equipment are packed in
smaller spaces, heat may become highly concentrated, leading to hot spots
10 where temperature exceeds safe operating limits. Moreover, in high-density
environments, airflow can be disrupted, creating uneven temperature
distribution and making it difficult to cool specific areas. The conventional air-
cooling mechanisms often fail to effectively remove the intense heat generated
by high-density racks. This can result in equipment overheating, performance
15 degradation, and hardware failures. To compensate for inadequate cooling,
data centers often increase the power consumption of their cooling systems,
leading to higher energy costs and a larger environmental footprint. In some
cases, a large number of fans are used to cater to the needs of a high-density
environment. However, the large number of fans may lead to increased
20 hardware costs and require frequent maintenance.
[0016] Liquid cooling has emerged as a promising solution for thermal
management in high-density server racks.
[0017] Liquid cooling leverages the superior thermal properties of liquids,
particularly water, to effectively dissipate heat generated by high-density
25 computing equipment. Direct-to-chip (D2C) cooling is an advanced liquid
cooling technology used to manage the heat generated by high-performance
computing systems. D2C cooling involves the direct application of liquid
coolants to the processors and other components with the help of cold plates.
4
Another type of liquid cooling is immersion cooling. In immersion cooling, the
components of data centre are directly submerged into a specially designed
tank containing dielectric fluid. The liquid cooling systems often use cold plates
having embedded tubes within the metal base. The coolant flows through
5 these tubes, absorbing and dissipating heat. However, the tubes are restricted
in terms of the portion of equipment that they can access. Often, the tubes are
not flexible thus limiting the kind of equipment that can be cooled using cold
plate cooling systems, and also increasing the risk of leaks.
[0018] Further, the conventional liquid cooling system distributes coolant
10 fluid within the server racks via the hose pipes connected to an internal
manifold. However, such a structure fails to provide the efficient circulation of
the coolant fluid to each component in the server racks, particularly to the
electronic components that are mounted in the compact space. Additionally,
the connection between the hose pipes and internal manifolds is susceptible
15 to leaks, which may lead to corrosion and equipment damage. Furthermore,
the conventional liquid cooling system requires additional supporting structure
to provide stiffness and mechanical strength to the cooling structure, thereby
increasing the cost and weight of the system.
[0019] Thus, there exists a need for a technique that counters the above-
20 mentioned shortcomings of techniques that utilize liquid cooling mechanisms
and/or air cooling mechanisms for thermal management of the data centers.
[0020] To this end, the present subject matter provides a cooling assembly
that addresses the deficiencies of the conventional cooling mechanisms, in
particular, inefficient cooling in high density environment, increased hardware
25 costs, and the risk of leaks.
[0021] In accordance with an embodiment of the present subject matter, a
cooling assembly comprises a chassis, a first channel, a second channel, an
inlet port, an outlet port, and a cold plate. The chassis comprises a pair of
5
longitudinal members and a pair of lateral members. The pair of longitudinal
members and the pair of lateral members are arranged such that it forms a
frame to support a circuit board. The first channel and the second channel are
aligned with respect to each other either along with the pair of longitudinal
5 members or along with the pair of lateral members. The inlet port is connected
to the first channel. The inlet port supplies a coolant fluid into the first channel.
The first channel comprises at least one first tab to draw the coolant fluid out
of the first channel. The second channel comprises at least one second tab to
transfer the coolant fluid into the second channel. The cold plate is mounted
10 atop the circuit board. The cold plate comprises an inlet tab and an outlet tab.
The inlet tab receives the coolant fluid from at least one first tab to pass the
coolant fluid through the cold plate. The outlet tab draws out the coolant fluid
from the cold plate. The outlet port is connected to the second channel,
wherein the outlet port draws the coolant fluid out of the second channel.
15 [0022] The presently disclosed cooling system provides efficient thermal
management in high-density data center environment. Further, by providing
the liquid cooling mechanism, it limits the use of external hardware, thereby
reducing the overall manufacturing cost. Furthermore, it enables precise
temperature regulation by allowing flexible and specific tapping of liquid
20 coolant onto heat generating components, thereby reducing the risk of
overheating and ensuring optimal temperature ranges for all equipment.
[0023] Further, the interleaved first channel and the second channel
provide stiffness and mechanical strength to the cooling assembly, thereby
eliminating the need for additional supporting structure, hence reducing the
25 weight of the system as well as manufacturing cost.
[0024] The above and other features, aspects, and advantages of the
subject matter will be better explained with regard to the following description
and accompanying figures. It should be noted that the description and figures
6
merely illustrate the principles of the present subject matter along with
examples described herein and should not be construed as a limitation to the
present subject matter. It is thus understood that various arrangements may
be devised that, although not explicitly described or shown herein, embody the
5 principles of the present disclosure. Moreover, all statements herein reciting
principles, aspects, and examples thereof, are intended to encompass
equivalents thereof. Further, for the sake of simplicity, and without limitation,
the same numbers are used throughout the drawings to reference like features
and components.
10 [0025] Fig. 1a illustrates a perspective view of a cooling assembly 100, in
accordance with an implementation of the present subject matter. Fig. 1b
illustrates a perspective view of a cooling assembly 100 in accordance with
another implementation of the present subject matter. Fig. 1c illustrates a data
center 154 implementing the cooling assembly 100 in a rack, in accordance
15 with an implementation of the present subject matter. For ease of explanation,
Figs. 1a-1c are explained together.
[0026] As shown in Fig. 1, a cooling assembly 100 comprises a chassis
102. The chassis 102 comprises a pair of longitudinal members 104 and a pair
of lateral members 106. The pair of longitudinal members 104 and the pair of
20 lateral members 106 is arranged to form a frame structure to support a circuit
board 122 (illustrated in Fig. 3). The circuit board 122 may be a printed circuit
board (PCB), such as motherboard or the like, that mounts one or more heat
generating electronic components 136 (illustrated in Fig. 4). In an embodiment,
the circuit board 122 may be secured to the chassis 102 using various
25 mounting mechanisms. In one example embodiment, the chassis 102 may
include mounting points or brackets specifically designed to support the circuit
board 122 and ensure proper alignment with a first channel 108 and a second
channel 110 (illustrated in Fig. 2). Techniques to form the chassis 102 by
7
connecting such members 104, 106 may be well understood by one skilled in
the art and have not been elaborated here for the sake of brevity of description.
[0027] The cooling assembly 100 is operable to dissipates heat from the
heat generating electronic components 136 mounted on the circuit board 122,
5 as explained in detail below.
[0028] In one embodiment, the cooling assembly 100 may include the first
channel 108 and the second channel 110. In accordance with example
embodiments of the present subject matter, the first channel 108 and the
second channel 110, may be understood as conductive structures having
10 hollow bodies configured to contain and transfer coolant fluid. In an
embodiment, the first channel 108 and a second channel 110 may run along
the length and width of at least one of the pair of longitudinal members 104
and the pair of lateral members 106 of the chassis 102.
[0029] The second channel 110 may be located opposite to first channel
15 108 on the chassis 102. In an example embodiment, the first channel 108 and
the second channel 110 may be positioned to be aligned with the pair of
longitudinal members 104, or the pair of lateral members 106 of the chassis
102. In some embodiments, one set of the first channel 108 and the second
channel 110 may be positioned on each of the pair of longitudinal members
20 104 as well as lateral members 106.
[0030] In one embodiment, each pair of the longitudinal members 104 and
the lateral members 106 may have a predefined length and width. The length
of the longitudinal members 104 may be in range of 450 mm to 1000 mm. The
width of the longitudinal members 104 may be in range of 40 mm to 440 mm.
25 Similarly, the length of the lateral members 106 may be in range of 430 mm to
537 mm. The width of the lateral members 106 may be in range of 40 mm to
440 mm. The dimensions of the longitudinal member 104 and the lateral
member 106, and in turn that of the chassis 102 mentioned above are merely
8
for sake of explanation and are not to be construed as limitation. As may be
understood by one skilled in the art, the dimensions are dependent on the end
application for which the chassis 102 is to be used. As mentioned previously,
the chassis 102 may be used to support the circuit board 122. Accordingly, the
5 circuit board 122 may dictate the dimensions for the members 104, 106.
[0031] In an embodiment, an inlet port 112 may be connected to the first
channel 108 to supply a coolant fluid into the first channel 108. In one example
embodiment, the coolant fluid may include at least one of the water, dielectric
fluid, and other specialized fluids. In an embodiment, the first channel 108
10 includes at least one first tab 116. The at least one first tab 116 allows the
coolant fluid received in the first channel 108 to be drawn out of the first
channel 108 for further circulation to different regions of the circuit board 122.
The second channel 110 includes at least one second tab 118 to transfer the
coolant fluid into the second channel 110. In operation, when the coolant fluid
15 drawn out of the first channel 108 is circulated across different regions of the
circuit board, the coolant fluid extracts heat dissipated by electronic
components mounted on the circuit board 122 at the corresponding locations.
The coolant fluid gets warm in the process and may need to be allowed to cool
down. An outlet port 114 is connected to the second channel 110 to draw the
20 coolant fluid out the second channel 110. The coolant fluid, so drawn out may
be cooled and may be recirculated through the inlet port 112. Techniques to
cool down coolant fluid and pump the same into the assembly being cooled
are well known in the art and have not been elaborated herein.
[0032] In accordance with example embodiments of the present subject
25 matter, to facilitate the coolant fluid to be drawn out of the first channel 108
and be injected into the second channel 110, one or more tabs are provided
on the respective channels 108, 110. The tabs 116, 118 may be understood
as openings that allow the coolant fluid to flow from the first channel 108 to the
9
second channel 110 (elaborated subsequently). In one example embodiment,
the opening may be a cylindrical tapping to which a connecter, such as a
flexible hose may be connected for extracting or injecting coolant fluid.
[0033] In one embodiment, the first tab 116 may be detachable from the
5 first channel 108. Similarly, the second tab 118 may be detachable from the
second channel 110. This detachable configuration of the first tab 116 and the
second tab 118 may allow for easier maintenance, replacement, or
customization of the cooling assembly 100.
[0034] In another embodiment, the first tab 116 may be fixedly attached to
10 the first channel 108. Similarly, the second tab 118 may be fixedly attached to
the second channel 110.
[0035] As shown in Fig. 1b, the first channel 108 may include a plurality of
first projecting channels 128 that extend from the first channel 108 in a
direction perpendicular to the first channel 108. Similarly, the second channel
15 110 may include a plurality of second projecting channels 130 that extend from
the second channel 1110 in a direction perpendicular to the first channel 108.
The first projecting channels 128 and the second projecting channels 130 are
fluidically connected to the first channel 108 and second channel 110,
respectively and comprise hollow tubular bodies that allow flow of the coolant
20 fluid therethrough. The first projecting channels 128 and the second projecting
channels 130 increase the coolant fluid path within the cooling assembly 100,
allowing efficient cooling of the circuit board 122 due to greater coverage of
the coolant fluid within the chassis 102.
[0036] In an embodiment, the first projecting channels 128 and the second
25 projecting channels 130 may be interleaved with each other. The interleaved
arrangement of the first projecting channels 128 and the second projecting
channels 130 may provide additional stiffness and mechanical strength to the
chassis 102 to support the circuit board 122. It may also eliminate the need for
10
additional supporting structures, thereby reducing the overall weight and
manufacturing cost of the cooling assembly 100.
[0037] In an embodiment, the first projecting channels 128 may include at
least one first tab 116. Similarly, the second projecting channels 130 may
5 include at least one second tab 118.
[0038] As shown in Fig. 1c, the cooling assembly 100 may be integrated
into a data center 154. In one embodiment, the cooling assembly 100
comprising the chassis 102 bearing one or more circuit boards, such as the
circuit board 122 that may be stacked in a server rack 156. The server rack
10 156 may be a multi-unit rack system designed to house the various heat
generating electronic components 136 mounted on the circuit board 122. The
server rack 156 may include multiple server units arranged in a parallel
configuration in an example.
[0039] In an embodiment, the server rack 156 may be assembled into the
15 data center 154 once the cooling assembly 100 is integrated into the server
rack 156. The incorporation of the cooling assembly 100 into the server rack
156 may allow efficient thermal management of the data center 154.
Integration of the cooling assembly 100 may also provide support to the server
rack 156 as the chassis 122 does not merely serve as channel for the coolant
20 fluid but also as strengthening member for the server rack 156.
[0040] In one embodiment, the cooling assembly 100 may be designed to
accommodate various configurations and sizes of electronic components. In
one example embodiment, the chassis 102 may be adjustable to fit different
server rack 156 dimensions. Further, the positioning of the inlet port 112 and
25 outlet port 114 may be customized based on the specific cooling requirements
of the data center 154.
[0041] Fig. 2 illustrates a coolant fluid path within the cooling assembly 100,
in accordance with an implementation of the present subject matter.
11
[0042] As shown in Fig. 2, the first channel 108 and the second channel
110 may be configured to facilitate the flow of coolant fluid through the chassis
102.
[0043] In an embodiment, the flow of coolant fluid through the chassis 102
5 may begin at the inlet port 112. From the inlet port 112, the coolant fluid flows
into the first channel 108. The coolant fluid then circulates in the first channel
108 and the first projecting channel 128, and flows to the second channel 110.
For the purpose, the coolant fluid is drawn out of the first channel 108 through
the first tab 116 and transferred through the second tab 118 into the second
10 channel 110 and in turn the second projecting channel 130. In some
embodiments (elaborated subsequently) the coolant fluid drawn out of the first
channel 108 via the first tab 118 may be circulated through a cold plate 120
(illustrated in Fig. 3) prior to being injected into the second channel 110 via the
second tab 118. Small hoses or fluid connectors may be connected the tabs
15 116, 118 for transferring the coolant fluid (elaborated subsequently). The cold
plate 120 may be made of materials with high thermal conductivity, such as
copper or aluminum, to efficiently transfer heat from the heat-generating
electronic components 136 to the coolant fluid.
[0044] The configuration of the cooling assembly 100 comprising the
20 plurality of the first projecting channels 128 and the second projecting
channels 130 that interleave each other throughout the area confined between
the chassis 102, allows the coolant fluid to flow throughout the chassis 102
before reaching the outlet port 114. This configuration may allow for efficient
distribution of coolant fluid throughout the cooling assembly 100.
25 [0045] In another embodiment, the coolant fluid may exit the cooling
assembly 100 through the outlet port 114, which is connected to the second
channel 110. This complete path may allow for effective heat dissipation from
the electronic components 136 within the cooling assembly 100.
12
[0046] The cooling assembly 100 may be designed to accommodate
various flow rates and pressures of coolant fluid. In one example embodiment,
the dimensions of the first channel 108, second channel 110, and their
respective projecting channels may be adjusted to optimize fluid flow
5 characteristics of the coolant fluid.
[0047] Fig. 3 illustrates a perspective view of the cooling assembly 100
incorporating the circuit board 122, in accordance with an implementation of
the present subject matter.
[0048] As shown in Fig. 3, the chassis 102 of the cooling assembly 100
10 may be arranged to form a frame to support at least one circuit board 122. In
one embodiment, the plurality of heat generating electronic components 136
(illustrated in Fig. 4) may be mounted on the circuit board 122. In an
embodiment, one or more cold plates 120 may be mounted on top of the
plurality of heat generating electronic components 136. While fig depicts cold
15 plates 120-1, 120-2, 120-3 and 120-4, collectively and singularly referred to as
cold plate 120, any number of cold plates 120 may be used depending on
various factors, such as the size and weight consideration of the chassis 102
and the amount of heat expected to be generated by the electronic
components 136 mounted thereon. The chassis 102, formed by the
20 longitudinal 104 and lateral 106 members, along with the interleaving first
projecting channels 128 and second projecting channels 130 supports weight
of the plurality of heat generating electronic components 136 and the cold
plates 120 on the circuit board 122.
[0049] In one embodiment, the cold plate 120 may include an inlet tab 124
25 and an outlet tab 126. The inlet tab 124 may be a tube having a hollow
structure that draws the coolant fluid from the first tab 116 and subsequently
pass the coolant fluid into the cold plate 120. Similarly, the outlet tab 126 that
draws the coolant fluid from the cold plate 120 and subsequently pass the
13
coolant fluid into the second tab 118 (elaborated subsequently). In one
example embodiment, the inlet tab 124 may receive the coolant fluid from at
least one first tab 116 to circulate the coolant fluid through the cold plate 120
and to transfer the coolant fluid out through the outlet tab 126. As will be
5 apparent, the cold plate 120 has a hollow body and is made of a conductive
material, for example, aluminum, that may extract heat from the coolant and
dissipate it into the surrounding efficient through its enlarged surface area.
[0050] In an implementation, the cooling assembly 100 includes at least
one inlet connector 132 and an outlet connector 134. The inlet connector 132
10 and the outlet connector 134 may be hollow connectors that connect the first
tab 116 and second tab 118, respectively, to the cold plate 120.
[0051] In operation, the inlet connector 132 and outlet connector 134
enables coolant fluid transfer from the inlet port 112 to the outlet port 114
through the channels, projection channels and intervening cold plates. The
15 inlet connector 132 and the outlet connector 134 may provide a secure and
leak-proof connection between the cold plate 120 and the first channel 108
and second channel 110, respectively. For example, the inlet connector 132
and the outlet connector 134 may be made of materials compatible with the
coolant fluid to prevent corrosion or degradation over time. The inlet connector
20 132 and outlet connector 134 are flexible, thereby providing connectivity for
efficient cooling in the highly dense data center 154 environment.
[0052] In an embodiment, the cold plates 120 may be strategically
positioned to cover specific areas of the circuit board 122 where the heat-
generating electronic components 136 may be concentrated. The size and
25 shape of the cold plate 120 may be customized based on the layout of the
circuit board 122 and the cooling requirements of the heat-generating
components 136. In one example embodiment, a surface of the cold plate 120
may be in contact with the heat generating electronic components 136.
14
[0053] The arrangement of the heat-generating electronic components 136
and cold plate 120 within the cooling assembly 100 may be designed to
minimize the overall footprint while maximizing cooling efficiency, thereby
allowing the efficient cooling of high density server rack 156 within the data
5 center 154.
[0054] Fig. 4 illustrates an exploded view of a cross section of the coolant
fluid path within the cooling assembly 100, in accordance with an
implementation of the present subject matter.
[0055] As shown in Fig. 4, the flow of coolant fluid may begin at the inlet
10 port 112. The inlet port 112 may include a funnel-like a hollow structure 162
that allows coolant fluid to flow into the first channel 108. The coolant fluid then
circulates in the first channel 108 and the first projecting channel 128 (not
illustrated in Fig. 4). The first tab 116 that is provided on the outer surface of
the first channel 108 and the first projecting channel 128 draws the coolant
15 fluid from the first channel 108 and the first projecting channel 128 and allow
the coolant fluid to flow into the inlet connector 132. The inlet connector 132
transfers the coolant fluid into the cold plate 120 that may be mounted atop
the heat generating electronic components 136 embedded on the circuit board
122. The heat dissipated by the electronic components 136 may be
20 concentrated on the cold plate 120 due to direct connection of the electronic
components 136 and the cold plate 120. The heat concentrated on the cold
plate 120 is extracted by the flow of coolant fluid inside the cold plate 120.
From the cold plate 120, the coolant fluid passes into the second connector
134 via the outlet tab 126 connected to the cold plate 120. As explained above,
25 the second connector 134 may be connected to the second tab 118 that
enables the coolant fluid to be transferred into the second projecting channels
130 and the second channel 110 via the second tab 118.The second channel
110, as explained above, is connected to the outlet port 114(not illustrated)
15
from where the coolant fluid exits the cooling assembly 114 completing the
coolant fluid circulation path through the cooling assembly 100.
[0056] In an embodiment, the inlet tab 124 and the outlet tab 126 of the
cold plate 120 may have a L-shaped structure. In one embodiment, the L-
5 shaped structure of the inlet tab 124 may include a first leg 146 and a second
leg 148. Similarly, the L-shaped structure of the outlet tab 126 may include a
first leg 150 and a second leg 152. The first leg 146 of the inlet tab 124 may
be configured to connect to the cold plate 120 while the second leg 148 of the
inlet tab 124 may be configured to connect to the inlet connector 132. Similarly,
10 the first leg 150 of the outlet tab 126 may be configured to connect to the cold
plate 120 and the second leg 152 of the outlet tab 126 may be configured to
connect to the outlet connector 134. This configuration may facilitate the flow
of coolant fluid from the cold plate 120 to the outlet connector 134.
[0057] In an embodiment, the first tab 116 may include a first end 142 and
15 a second end 158. In one example embodiment, the first end 142 of the first
tab 116 may be configured to accommodate the inlet connector 132. The
second end of the first tab 116 may be aligned with an outer surface of the first
channel 108.
[0058] In a similar embodiment, the second tab 118 may include a first end
20 144 and a second end 160. In one example embodiment, the first end 144 of
the second tab 118 may be configured to accommodate the outer connector
134. The second end 160 of the second tab 118 may be aligned with an outer
surface of the second channel 110.
[0059] In one embodiment, the coolant fluid path may begin at the inlet
25 connector 132. From the inlet connector 132, the coolant fluid may flow
through the inlet second leg 148 and then through the inlet first leg 146 of the
inlet tab 124. The coolant fluid may then enter the cold plate 120.
16
[0060] Within the cold plate 120, the coolant fluid may circulate to absorb
heat generated by the electronic components 136. In one example
embodiment, the internal structure of the cold plate 120 may be designed with
channels or fins to maximize heat transfer from the heat generating electronic
5 components 136 to the coolant fluid.
[0061] After circulating through the cold plate 120, the coolant fluid may exit
through the outlet first leg 150 of the outlet tab 126. The fluid may then flow
through the outlet second leg 152 and into the outlet connector 134.
[0062] The arrangement of the inlet port 112, outlet port 114, inlet tab 124,
10 outlet tab 126, inlet connector 132, and outlet connector 134 may allow for
efficient circulation of coolant throughout the cooling assembly 100. This
configuration may enable targeted cooling of specific heat generating
electronics components 136, potentially improving overall thermal
management efficiency in high-density date center 154 environments.
15 [0063] Although implementations of a cooling assembly are described, it is
to be understood that the present subject matter is not necessarily limited to
the specific features of the systems described herein. Rather, the specific
features are disclosed as implementations for the cooling assembly for high
density data center.
20
17
I/We Claim:
1. A cooling assembly (100) comprising:
a chassis (102) comprises a pair of longitudinal members (104) and a
pair of lateral members (106) arranged to form a frame to support a circuit
5 board (122),
a first channel (108) and a second channel (110) aligned with respect
to each other either along with the pair of longitudinal members (104) or along
with the pair of lateral members (106);
an inlet port (112) connected to the first channel (108) to supply a
10 coolant fluid into the first channel (108),
wherein the first channel (108) comprises at least one first tab (116) to
draw the coolant fluid out of the first channel (108);
wherein the second channel (110) comprises at least one second tab
(118) to transfer the coolant fluid into the second channel (110);
15 a cold plate (120) mounted atop the circuit board (122), the cold plate
(120) comprising an inlet tab (124) and an outlet tab (126),
wherein the inlet tab (124) is to receive the coolant fluid from at least
one first tab (116) to pass the coolant fluid through the cold plate (120) and to
transfer the coolant fluid out through the outlet tab (126); and
20 an outlet port (114) connected to the second channel (110) to draw the
coolant fluid out of the second channel (110).
2. The cooling assembly (100) as claimed in claim 1, wherein the first
channel (108) and the second channel (110) run along at least one of the pair
25 of longitudinal members (104) and the pair of lateral members (106) of the
chassis (102) to carry the coolant fluid along the respective length of the first
channel (108) and the second channel (110),
18
wherein the first channel (108) comprises a plurality of a first projecting
channels (128) to distribute the coolant fluid in a direction perpendicular to the
length direction of first channel (108),
wherein the second channel (110) comprises a plurality of a second
5 projecting channels (130) to distribute the coolant fluid in a direction
perpendicular to the length direction of second channel (110), and
wherein the first projecting channels (128) and the second projecting
channels (130) are interleaved with each other.
10 3. The cooling assembly (100) as claimed in claim 1, wherein an inlet
connector (132) is to connect the first tab (116) to the inlet tab (124) and an
outlet connector (134) is to connect the second tab (118) to the outlet tab (126).
4. The cooling assembly (100) as claimed in claim 3, wherein a first end
15 (142) of the first tab (116) is aligned with an outer surface of the first channel
(108) and a second end (158) of the first tab (116) is to accommodate the inlet
connector (132), and
wherein a first end (144) of the second tab (118) aligned with an outer
surface of the second channel (110) and a second end (160) of the second
20 tab (118) is to accommodate the outlet connector (134).
5. The cooling assembly (100) as claimed in claim 2, wherein a plurality of
heat generating electronic components (136) are mounted on the at least one
circuit board (122),
25 wherein the cold plate (120) is mounted on top of the plurality of heat
generating electronic components (136), and
19
wherein the interleaving first projecting channels (128) and second
projecting channels (130) support weight of the plurality of heat generating
electronic components (136) and the cold plate (120) on the chassis (102).
5 6. The cooling assembly (100) as claimed in claim 1, wherein the first tab
(116) is detachable from the first channel (108), and
wherein the second tab (118) is detachable from the second channel
(110).
10 7. The cooling assembly (100) as claimed in claim 1, wherein the first tab
(116) is fixedly attached to the first channel (108) and the second tab (118) is
fixedly attached to the second channel (110).
8. The cooling assembly (100) as claimed in claim 1, wherein the at least
15 one first tab (116) and the second tab (118) project above the surface of the
circuit board (122) through holes provided at corresponding locations in the
circuit board (122).
9. The cooling assembly (100) as claimed in claim 1, wherein the inlet tab
20 (124) and the outlet tab (126) have a L-shaped structure having a first leg (146,
150) and a second leg (148, 152),
wherein the first leg (146) of the inlet tab (124) is to connect to the cold
plate (120) and the second leg (148) of the inlet tab (124) is to connect to the
inlet connector 132, and
25 wherein the first leg (150) of the outlet tab (126) is to connect to the
cold plate (120) and the second leg (152) of the outlet tab (126) is to connect
to the outlet connector (134).
20
Date 21 May 2025
PRASHANT PHILLIPS
IN/PA-1229
Agent for the Applicant
T o,
The Controller of Patents
The Patent Office at Chennai
20
ABSTRACT
COOLING ASSEMBLIES FOR DATA CENTERS
A cooling assembly (100) comprises a chassis (102) with a pair of
5 longitudinal members (104) and lateral members (106) arranged to form a
frame to support a circuit board (122). First (108) and second (110) channels
are aligned either along the longitudinal members (104) or lateral members
(106). An inlet port (112) is connected to the first channel (108) to supply a
coolant fluid into the first channel (108). A first tab (116) draws the fluid out of
10 the first channel (108) and a second tab (118) transfers the fluid to the second
channel (110). A cold plate (120) is mounted atop the circuit board (122). An
inlet tab (124) of the cold plate (120) receives the fluid from the first tab (116),
passes it through the cold plate (120) and an outlet tab (126) of the cold plate
(120) transfers the fluid to an outlet port (114) connected to the second channel
15 (110), thereby allowing heat dissipation from the circuit board (122) while
providing support thereto.
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21

, Claims:I/We Claim:
1. A cooling assembly (100) comprising:
a chassis (102) comprises a pair of longitudinal members (104) and a
pair of lateral members (106) arranged to form a frame to support a circuit
5 board (122),
a first channel (108) and a second channel (110) aligned with respect
to each other either along with the pair of longitudinal members (104) or along
with the pair of lateral members (106);
an inlet port (112) connected to the first channel (108) to supply a
10 coolant fluid into the first channel (108),
wherein the first channel (108) comprises at least one first tab (116) to
draw the coolant fluid out of the first channel (108);
wherein the second channel (110) comprises at least one second tab
(118) to transfer the coolant fluid into the second channel (110);
15 a cold plate (120) mounted atop the circuit board (122), the cold plate
(120) comprising an inlet tab (124) and an outlet tab (126),
wherein the inlet tab (124) is to receive the coolant fluid from at least
one first tab (116) to pass the coolant fluid through the cold plate (120) and to
transfer the coolant fluid out through the outlet tab (126); and
20 an outlet port (114) connected to the second channel (110) to draw the
coolant fluid out of the second channel (110).
2. The cooling assembly (100) as claimed in claim 1, wherein the first
channel (108) and the second channel (110) run along at least one of the pair
25 of longitudinal members (104) and the pair of lateral members (106) of the
chassis (102) to carry the coolant fluid along the respective length of the first
channel (108) and the second channel (110),
wherein the first channel (108) comprises a plurality of a first projecting
channels (128) to distribute the coolant fluid in a direction perpendicular to the
length direction of first channel (108),
wherein the second channel (110) comprises a plurality of a second
5 projecting channels (130) to distribute the coolant fluid in a direction
perpendicular to the length direction of second channel (110), and
wherein the first projecting channels (128) and the second projecting
channels (130) are interleaved with each other.
10 3. The cooling assembly (100) as claimed in claim 1, wherein an inlet
connector (132) is to connect the first tab (116) to the inlet tab (124) and an
outlet connector (134) is to connect the second tab (118) to the outlet tab (126).
4. The cooling assembly (100) as claimed in claim 3, wherein a first end
15 (142) of the first tab (116) is aligned with an outer surface of the first channel
(108) and a second end (158) of the first tab (116) is to accommodate the inlet
connector (132), and
wherein a first end (144) of the second tab (118) aligned with an outer
surface of the second channel (110) and a second end (160) of the second
20 tab (118) is to accommodate the outlet connector (134).
5. The cooling assembly (100) as claimed in claim 2, wherein a plurality of
heat generating electronic components (136) are mounted on the at least one
circuit board (122),
25 wherein the cold plate (120) is mounted on top of the plurality of heat
generating electronic components (136), and
wherein the interleaving first projecting channels (128) and second
projecting channels (130) support weight of the plurality of heat generating
electronic components (136) and the cold plate (120) on the chassis (102).
5 6. The cooling assembly (100) as claimed in claim 1, wherein the first tab
(116) is detachable from the first channel (108), and
wherein the second tab (118) is detachable from the second channel
(110).
10 7. The cooling assembly (100) as claimed in claim 1, wherein the first tab
(116) is fixedly attached to the first channel (108) and the second tab (118) is
fixedly attached to the second channel (110).
8. The cooling assembly (100) as claimed in claim 1, wherein the at least
15 one first tab (116) and the second tab (118) project above the surface of the
circuit board (122) through holes provided at corresponding locations in the
circuit board (122).
9. The cooling assembly (100) as claimed in claim 1, wherein the inlet tab
20 (124) and the outlet tab (126) have a L-shaped structure having a first leg (146,
150) and a second leg (148, 152),
wherein the first leg (146) of the inlet tab (124) is to connect to the cold
plate (120) and the second leg (148) of the inlet tab (124) is to connect to the
inlet connector 132, and
25 wherein the first leg (150) of the outlet tab (126) is to connect to the
cold plate (120) and the second leg (152) of the outlet tab (126) is to connect
to the outlet connector (134).
20
Date 21 May 2025
PRASHANT PHILLIPS
IN/PA-1229
Agent for the Applicant
T o,
The Controller of Patents
The Patent Office at Chennai
20