Description:FIELD OF THE INVENTION

[0001] The present invention relates to a heat modulation system for power devices that is capable of monitoring the real time thermal characterization by and optimization by calculating thermal resistance and thermal capacitance.

BACKGROUND OF THE INVENTION

[0002] A heat modulation system is a technology used to control and adjust the amount of heat generated or distributed in a heating system to match the actual demand. Instead of operating at a constant output, it modulates the heat by varying the fuel input, fan speed, or valve position, ensuring energy efficiency and consistent indoor comfort. This system is commonly used in modern HVAC units, boilers, and furnaces, where it helps reduce energy consumption, extend equipment lifespan, and minimize temperature fluctuations by continuously adjusting the heat output based on real-time conditions.

[0003] Traditionally, heat modulation systems were relatively basic and relied on manual or simple mechanical controls to regulate heat output. These systems often used thermostats with on/off functionality, meaning the heating source would operate at full capacity until the desired temperature was reached, then shut off completely. This method led to frequent temperature fluctuations and inefficient energy use, as the system couldn't adjust gradually to varying heating needs. Traditional boilers or furnaces typically lacked variable control mechanisms, resulting in higher fuel consumption and wear on components due to constant cycling.

[0004] US6246831B1 discloses an improved system, method and apparatus for control of an instantaneous flow-through fluid heater system is disclosed. The control incorporates a logic control method providing modulation of power in small steps to a plurality of heating elements retaining responsiveness to closed-loop control needs without inducing light flicker. Further, the life of the coils of heating circuit electromechanical relays are extended by energizing the coils with a pulse-width-modulated drive decreasing in duty cycle and thus the latent coil heat when an increase in mains voltage is sensed. The life of the contacts of same relays are extended by inhibiting heating element triac drive immediately upon sensing loss of relay coil power, such as by an over temperature limit switch opening, thus ensuring that relay contacts open with zero heating element current. In addition to the protocol “watchdog timer” internal to the microcontroller, a redundant fail-safe circuit external to the microcontroller prevents a program lockup condition from leaving any heating element triac or relay drive in an energized state. A combination of control hardware and program provide self-diagnostic detection of an inoperative thermistor, stuck relay, or a failed triac or heating element. An improved means of sensing water level is disclosed incorporating a low-level, high frequency signal, allowing detection of non-conducting distilled water and the reliable detection of water in the presence of main-frequency currents as would exist in ungrounded sheathed heating elements with electrical leakage or as would exist with bare-elements.

[0005] WO2016029225A1 discloses a system, a method, and a device for controlling a heating element in electronic articles, and more particularly for controlling a heating element in electronic cigarettes. In one embodiment A system for controlling a heater can comprise a power source, a memory configured to store programing, an MCU, a solution, a heater configured to heat the solution, and a first sensor. The power source, the memory, the MCU, the heater, and the first sensor can be electrically coupled. The MCU can receive signals from the first sensor and control the heater, and the MCU can be configured to use programming stored in the memory to control the heater.

[0006] Conventionally, many system have been developed to module the heat in power devices but these devices are unable to enable accurate real time thermal characterization and optimization by allowing real-time computation of heat propagation pathways. Additionally, the existing device enables real-time power loss prediction and thermal optimization.

[0007] In order to overcome the aforementioned drawbacks, there exists a need in the art to develop a system that is capable of enabling accurate real-time thermal characterization and optimization, allowing real-time computation of heat propagation pathways. Additionally, the system is capable of enabling real-time power loss prediction and thermal optimization.

OBJECTS OF THE INVENTION

[0008] The principal object of the present invention is to overcome the disadvantages of the prior art.

[0009] An object of the present invention is to develop a system that is capable of, enabling accurate real-time power loss estimations.

[0010] Another object of the present invention is to develop a system that is capable of integrating external thermal pathways, for realistic power dissipation analysis.

[0011] Another object of the present invention is to develop a system that is capable of providing a computationally efficient simulation framework suitable for real-time circuit analysis and electronic design automation (EDA) tools.

[0012] Yet another object of the present invention is to develop a system that is capable of enhancing system reliability and thermal performance by optimizing heat dissipation.

[0013] The foregoing and other objects, features, and advantages of the present invention will become readily apparent upon further review of the following detailed description of the preferred embodiment as illustrated in the accompanying drawings.

SUMMARY OF THE INVENTION

[0014] The present invention relates to a heat modulation system for power devices that is capable of tracking the temperature changes in real time and calculate heat build-up in high-power electronic devices predicting heat and power loss efficiently ensuring devices operate safely under high power loads.

[0015] According to an embodiment of the present invention, a heat modulation system for power devices comprising a network of thermal resistance and capacitance, associated with the system that adjusts to surrounding conditions to track temperature changes in real time, to account heat generated by the power device during operation and uses external environmental data like ambient temperature, to improve accuracy in predicting how heat affects performance, the thermal network uses junction-to-case and case-to-ambient thermal resistance values from power device datasheets to calculate heat flow and also incorporates thermal capacitance to account for how heat is stored and released over time, ensuring accurate temperature predictions a calculation module to calculate heat build-up in high-power electronic devices by tracking power loss changes caused by switching speed and heat spread, a simulation module associated with the system, that predicts heat and power loss efficiently, suitable for high-power circuits and works with design protocol to simulate real-world conditions, ensuring devices operate safely under high power loads, the heat buildup calculation includes the effect of high-frequency switching in power devices and further considers how heat spreads through different parts of the device, using a model that adjusts for varying switching speeds to maintain reliable operation.

[0016] According to another embodiment of the present invention, the system further comprises of a simulation module associated with the system, that predicts heat and power loss efficiently, suitable for high-power circuits and works with design protocol to simulate real-world conditions, ensuring devices operate safely under high power loads, the stimulation module integrates with circuit simulation protocol to predict power loss and optimize heat management and supports two approaches: one using external thermal networks for detailed analysis and another using a single thermal voltage for faster calculations, both giving similar results, a model associated with the system, that combines electrical and thermal effects, using thermal resistance and capacitance, to monitor heat flow and improve device performance, by calculating how heat moves from the power device’s core to its surroundings, enabling better design of circuits to handle high power without failing, the thermal network estimate temperature based on device datasheets and external conditions, to continuously monitor heat during device operation and adjusts calculations based on real-world factors like air temperature to optimize performance and infrared thermography is used to measure heatsink temperature to improve heat estimation accuracy and also measured heatsink data is used to adjust its thermal model, ensuring it reflects real-world cooling performance in high-power applications.

[0017] While the invention has been described and shown with particular reference to the preferred embodiment, it will be apparent that variations might be possible that would fall within the scope of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] These and other features, aspects, and advantages of the present invention will become better understood with regard to the following description, appended claims, and accompanying drawings where:
Figure 1 illustrates a flowchart depicting simulation setup of a heat modulation system for power devices.

DETAILED DESCRIPTION OF THE INVENTION

[0019] The following description includes the preferred best mode of one embodiment of the present invention. It will be clear from this description of the invention that the invention is not limited to these illustrated embodiments but that the invention also includes a variety of modifications and embodiments thereto. Therefore, the present description should be seen as illustrative and not limiting. While the invention is susceptible to various modifications and alternative constructions, it should be understood, that there is no intention to limit the invention to the specific form disclosed, but, on the contrary, the invention is to cover all modifications, alternative constructions, and equivalents falling within the spirit and scope of the invention as defined in the claims.

[0020] In any embodiment described herein, the open-ended terms "comprising," "comprises,” and the like (which are synonymous with "including," "having” and "characterized by") may be replaced by the respective partially closed phrases "consisting essentially of," consists essentially of," and the like or the respective closed phrases "consisting of," "consists of, the like.

[0021] As used herein, the singular forms “a,” “an,” and “the” designate both the singular and the plural, unless expressly stated to designate the singular only.

[0022] The present invention relates to a heat modulation system for power devices that is capable of continuously monitor heat during device operation and adjusts calculations based on real-world factors like air temperature to optimize performance using thermal resistance and capacitance, to monitor heat flow and improve device performance.

[0023] Figure 1 illustrates a flowchart depicting simulation setup of a heat modulation system for power devices. The system disclosed herein includes a system that is activated by pressing a push button by the user. As the system activates, it activates the process and modules sequentially, manage the heat in the power devices.

[0024] A network of thermal resistance and capacitance that is associated with the system. The network adjusts to surrounding conditions to track temperature changes in real time. It accounts heat generated by the power device during operation and uses external environmental data like ambient temperature, to improve accuracy in predicting how heat affects performance. The network of thermal resistance and capacitance models simulates the heat flow and storage within a device by representing the thermal path from the heat-generating component to its surroundings. The thermal resistance characterizes how easily heat transfers between different elements, while the capacitance accounts for the heat stored within each component. This network dynamically adjusts its parameters based on real-time data, such as measured device temperatures and external environmental conditions like ambient temperature. By continuously solving the thermal equations, the model tracks temperature changes during operation, accounting for heat generated by the device. Incorporating external data allows the model to refine its predictions, ensuring that the estimated device temperature reflects actual operating conditions, thus enabling more accurate performance optimization and thermal management in real time

[0025] To calculate heat build-up in high-power electronic devices a microcontroller activates a calculation module. It calculates the heat buildup by tracking power loss changes caused by switching speed and heat spread. The calculation module monitors and analyzes variations in power loss, which are influenced by factors such as switching speed and heat spread. It employs models that relate power dissipation derived from device switching characteristics and conduction losses to thermal energy accumulation. By tracking changes in switching frequency, voltage, and current waveforms, the module calculates real-time power loss fluctuations. These losses translate into heat generation, which the module integrates over time, considering heat spreading effects within the device structure. This process enables the module to accurately estimate the temperature rise and heat accumulation, facilitating precise thermal management and ensuring the device operates within safe temperature limits under varying operational conditions.

[0026] The heat buildup calculation accounts for the impact of high-frequency switching in power devices. It also considers how heat spreads through different parts of the device, using a model that adapts to different switching speeds to keep the device working reliably. The heat buildup employs a dynamic thermal model that integrates the effects of switching losses and heat spreading by simulating how rapid switching transitions generate transient heat and how this heat disperses through different device regions. The model monitors switching parameters such as frequency, duty cycle, and voltage waveforms to estimate the associated switching losses, which directly contribute to heat generation. It then applies heat transfer equations that account for thermal resistance and capacitance within the device, dynamically adjusting for changes in switching speed higher frequencies increase switching losses and heat accumulation, while lower speeds reduce them. The model also considers the thermal diffusion pathways, modeling how heat spreads from hotspots to cooler areas, ensuring an accurate prediction of temperature distribution. By continuously updating these parameters in response to real-time switching conditions, the system maintains reliable operation by preventing thermal overstress and optimizing cooling strategies.

[0027] To predict the heat and power loss efficiently, a stimulation module is associated with the system. This is suitable for high power circuits. It works with design protocol to stimulate real- world conditions ensuring devices operate safely under power loads. The simulation module operates by integrating detailed models of electrical behavior, thermal dynamics, and system constraints within design protocol, enabling efficient prediction of heat and power loss under real-world conditions. It calculates power losses by analyzing switching events, conduction characteristics, and parasitic elements, using finite element analysis (FEA) to balance accuracy and computational efficiency. Simultaneously, it models heat generation from these losses and simulates heat flow through device structures, considering thermal resistance, capacitance, and heat spreading effects. The module dynamically couples electrical and thermal simulations, adjusting for operational variables such as load changes, switching frequency, and cooling conditions, to accurately forecast temperature rise and power dissipation. This integrated approach ensures that the device operates safely within thermal limits, guiding design optimization and preventing thermal overstress in high-power devices.

[0028] The stimulation module integrates with circuit simulation protocol to predict power loss and optimize heat management and supports two approaches: one using external thermal networks for detailed analysis and another using a single thermal voltage for faster calculations, both giving similar results.

[0029] External Thermal Networks Approach: This approach integrates the simulation module with detailed external thermal network models comprising multiple thermal resistances and capacitances to accurately represent heat flow paths within the device and its cooling environment. During simulation, electrical and thermal signals are coupled through this network, allowing precise calculation of heat generation from power losses and its subsequent dissipation, accounting for complex thermal interactions like hotspots and heat spreading. This detailed modeling provides high-fidelity thermal analysis, capturing transient and steady-state temperature distributions, which helps in optimizing thermal design and ensuring reliable operation under high power loads.

[0030] Single Thermal Voltage Approach: In this approach , the thermal behavior is simplified by representing the device’s thermal characteristics with a single "thermal voltage" parameter, analogous to a voltage in electrical circuits, which models the temperature rise resulting from power dissipation. The simulation treats heat flow as a straightforward voltage drop across a thermal resistance, enabling rapid computation of device temperature based on power loss data. Although less detailed, this approach offers faster calculations suitable for iterative design and real-time analysis, producing results that closely align with those from more detailed models, making it effective for initial design assessments and scenarios where computational efficiency is critical.

[0031] To monitor heat flow, a model is associated with the system that combines electrical and thermal effects, using thermal resistance and capacitance. It calculates how heat moves from the power device’s core to its surroundings, enabling better design of circuits to handle high power without failing. The combined electrical-thermal model utilizes thermal resistance and capacitance elements integrated into the circuit simulation to represent heat flow and storage within the device. Electrical power dissipation generates heat, which is modeled as a heat source that causes temperature rise. Thermal resistances simulate the material’s ability to conduct heat away from the device core, while thermal capacitances represent the device's thermal storage capacity, capturing transient temperature changes over time. The model solves coupled differential equations that describe how heat propagates through the device structure and dissipates into the surroundings, adjusting the electrical parameters dynamically based on the temperature-dependent behavior of components. By accurately tracking heat flow and temperature evolution, this approach allows designers to predict hot spots, identify thermal bottlenecks, and optimize cooling strategies, ultimately enhancing device reliability and ensuring that high-power circuits can operate safely without thermal failure.

[0032] The thermal network estimates the device's temperature using data from datasheets and external conditions. It continuously monitors heat during operation and updates its calculations based on real-world factors like air temperature to ensure optimal performance. The thermal network estimates device temperature by modeling the heat transfer pathways using the network of thermal resistances and capacitances derived from device datasheets and material properties, representing how heat flows from the device core to its surroundings. External conditions, such as ambient air temperature and cooling environment, are incorporated into the model as boundary conditions, influencing the heat dissipation rate. During operation, the thermal network continuously calculates temperature based on the device’s power dissipation, adjusting the thermal resistances and capacitances dynamically if needed to reflect real-world variations. By integrating real-time data like ambient temperature, airflow, and device load, the model refines its temperature estimates, enabling ongoing monitoring of heat buildup. This dynamic, data-driven approach allows the system to optimize thermal management strategies, prevent overheating, and improve overall device performance and reliability.

[0033] The thermal network uses junction-to-case and case-to-ambient thermal resistance values from power device datasheets to calculate heat flow and also incorporates thermal capacitance to account for how heat is stored and released over time, ensuring accurate temperature predictions. The thermal network uses junction-to-case (R_jc) and case-to-ambient (R_ca) thermal resistance values from datasheets as key parameters to model heat flow pathways from the device’s semiconductor junction to its external environment. Heat generated at the junction is transferred through the case, with R_jc quantifying the resistance to conduction between these points, while R_ca represents how effectively heat is dissipated from the case into the surrounding air. The model calculates the temperature difference across these resistances based on the power dissipation, allowing it to estimate the junction temperature from the case temperature and ambient conditions. Incorporating thermal capacitance elements (C_th) captures the device's ability to store and release heat over time, modeling transient thermal behavior. This combination of resistive and capacitive elements enables the network to simulate both steady-state and dynamic temperature changes accurately, accounting for how heat accumulates or dissipates during operation, thus providing precise temperature predictions to inform thermal management.

[0034] Herein, Infrared thermography is employed to measure the heatsink temperature, enhancing the accuracy of heat estimation. Additionally, the measured heatsink data is used to refine its thermal model, ensuring it accurately represents real-world cooling performance in high-power applications. Infrared thermography measures heatsink temperature by capturing the infrared radiation emitted from its surface, providing a non-contact, real-time temperature map with high spatial resolution. This thermal data accurately reflects the actual cooling performance of the heatsink under operating conditions, including effects like airflow and surface emissivity. The measured heatsink temperature is then used to calibrate and refine the thermal model by updating parameters such as thermal resistance and heat transfer coefficients, ensuring the model accurately reflects real-world cooling behavior. This iterative process allows the model to account for practical factors like fouling, uneven airflow, or surface degradation, thereby improving heat estimation precision during high-power operation and enabling more reliable thermal management.

[0035] The present invention works best in the following manner, the network of thermal resistance and capacitance that is associated with the system. The network adjusts to surrounding conditions to track temperature changes in real time. It accounts heat generated by the power device during operation and uses external environmental data like ambient temperature, to improve accuracy in predicting how heat affects performance. The calculation module calculates the heat buildup by tracking power loss changes caused by switching speed and heat spread. The calculation module monitors and analyzes variations in power loss, which are influenced by factors such as switching speed and heat spread. The heat buildup calculation accounts for the impact of high-frequency switching in power devices. It also considers how heat spreads through different parts of the device, using a model that adapts to different switching speeds to keep the device working reliably. The stimulation module is associated with the system. This is suitable for high power circuits. It works with design protocol to stimulate real- world conditions ensuring devices operate safely under power loads. It stimulation module integrates with circuit simulation protocol to predict power loss and optimize heat management and supports two approaches: one using external thermal networks for detailed analysis and another using a single thermal voltage for faster calculations, both giving similar results. To monitor heat flow the model is associated with the system that combines electrical and thermal effects, using thermal resistance and capacitance. It calculates how heat moves from the power device’s core to its surroundings, enabling better design of circuits to handle high power without failing. The thermal network estimates the device's temperature using data from datasheets and external conditions. It continuously monitors heat during operation and updates its calculations based on real-world factors like air temperature to ensure optimal performance. The thermal network uses junction-to-case and case-to-ambient thermal resistance values from power device datasheets to calculate heat flow and also incorporates thermal capacitance to account for how heat is stored and released over time, ensuring accurate temperature predictions. Infrared thermography is employed to measure the heatsink temperature, enhancing the accuracy of heat estimation. Additionally, the measured heatsink data is used to refine its thermal model, ensuring it accurately represents real-world cooling performance in high-power application.

[0036] Although the field of the invention has been described herein with limited reference to specific embodiments, this description is not meant to be construed in a limiting sense. Various modifications of the disclosed embodiments, as well as alternate embodiments of the invention, will become apparent to persons skilled in the art upon reference to the description of the invention. , C , Claims:We Claim:
1) A heat modulation system for power devices, comprising:

i) a network of thermal resistance and capacitance, associated with the system that adjusts to surrounding conditions to track temperature changes in real time, to account heat generated by the power device during operation and uses external environmental data, like ambient temperature, to improve accuracy in predicting how heat affects performance;
ii) a calculation module to calculate heat build-up in high-power electronic devices by tracking power loss changes caused by switching speed and heat spread;
iii) a simulation module associated with the system, that predicts heat and power loss efficiently, suitable for high-power circuits and works with design protocol to simulate real-world conditions, ensuring devices operate safely under high power loads;
iv) a model associated with the system, that combines electrical and thermal effects, using thermal resistance and capacitance, to monitor heat flow and improve device performance, by calculating how heat moves from the power device’s core to its surroundings, enabling better design of circuits to handle high power without failing; and
v) the thermal network estimate temperature based on device datasheets and external conditions, to continuously monitor heat during device operation and adjusts calculations based on real-world factors like air temperature to optimize performance.

2) The system as claimed in claim 1, wherein the thermal network uses junction-to-case and case-to-ambient thermal resistance values from power device datasheets to calculate heat flow and also incorporates thermal capacitance to account for how heat is stored and released over time, ensuring accurate temperature predictions.

3) The system as claimed in claim 1, wherein the heat buildup calculation includes the effect of high-frequency switching in power devices and further considers how heat spreads through different parts of the device, using a model that adjusts for varying switching speeds to maintain reliable operation.

4) The system as claimed in claim 1, wherein the stimulation module integrates with circuit simulation protocol to predict power loss and optimize heat management and supports two approaches: one using external thermal networks for detailed analysis and another using a single thermal voltage for faster calculations, both giving similar results.

5) The system as claimed in claim 1, wherein infrared thermography is used to measure heatsink temperature to improve heat estimation accuracy and also measured heatsink data is used to adjust its thermal model, ensuring it reflects real-world cooling performance in high-power applications.