Description:BACKGROUND
Field of Invention
[001] Embodiments of the present invention generally relate to a thermal insulation material and particularly to a method for preparing an advanced thermal insulation material with engineered microstructures.
Description of Related Art
[002] Thermal insulation plays a vital role in a wide range of sectors such as construction, aerospace, automotive, and electronics. The demand for efficient insulation materials arises due to the increasing need for energy efficiency, structural safety, and protection of heat-sensitive components. Conventional insulation solutions provide partial effectiveness but face notable challenges when subjected to extreme temperature conditions and mechanical stresses.
[003] Existing materials such as fiberglass, foam-based insulators, aerogels, ceramic wool, and refractory bricks remain widely adopted due to their availability and established manufacturing methods. These materials, however, show significant drawbacks. Fiberglass and aerogels display fragile structures that fail under mechanical stress. Foam-based insulators degrade under elevated temperatures and may release toxic emissions. Ceramic wool and refractory bricks, although heat resistant, lack versatility in application and involve high energy costs during production.
[004] Limitations of such solutions restrict their ability to serve as long-term, reliable insulation in diverse environments. High production expenses, poor adaptability to irregular surfaces, and reduced stability under harsh conditions limit their adoption across industries. As global applications demand advanced insulation performance with better structural reliability, environmental safety, and cost-effectiveness, the search for improved materials continues to remain critical.
[005] There is thus a need for an improved and advanced method for preparing an advanced thermal insulation material with engineered microstructures that can administer the aforementioned limitations in a more efficient manner.
SUMMARY
[006] Embodiments in accordance with the present invention provide a method for preparing an advanced thermal insulation material with engineered microstructures. The method comprising steps of selecting a material comprising a matrix of silica (SiO₂), alumina (Al₂O₃), or an inorganic-organic hybrid backbone, or a combination thereof; incorporating fillers selected from hollow microspheres, nano clay platelets, and graphene oxide flakes, in the matrix of the material, to reduce thermal conductivity and improve mechanical reinforcement; introducing binders, in the matrix of the material, comprising polyimides, silicone-based resins, silicates, or phosphate-based compounds to achieve cohesion and fire resistance; creating hierarchical pores of nano, micro, and meso scale dimensions within the material to trap air and disrupt conductive heat flow; forming nano-laminated layers, on the material, of alternating refractive index and thermal conductivity to reflect and scatter thermal radiation; establishing a cross-linked network, among the matrix of the material, to enhance dimensional stability, thermal durability, and mechanical strength; and obtaining the thermal insulation material with engineered microstructures.
[007] Embodiments of the present invention may provide a number of advantages depending on their particular configuration. First, embodiments of the present application may provide a method for preparing an advanced thermal insulation material with engineered microstructures.
[008] Next, embodiments of the present application may provide a thermal insulation material that simultaneously resists conduction, convection, and radiation unlike conventional insulators that focus mainly on a single mode of heat transfer.
[009] Next, embodiments of the present application may provide thermal insulation material that withstands extreme temperatures beyond 800 °C while maintaining structural integrity and insulation performance.
[0010] Next, embodiments of the present application may provide thermal insulation material that ensures reliability in harsh environments.
[0011] Next, embodiments of the present application may provide thermal insulation material that provides superior durability, impact resistance, and structural strength without adding significant weight.
[0012] Next, embodiments of the present application may provide thermal insulation material that uses hollow microspheres and engineered pores resulting in a lightweight material that supports scalable production methods such as roll-to-roll processing, mold casting, and spray application.
[0013] Next, embodiments of the present application may provide thermal insulation material that allows flexible use in construction, aerospace, automotive, electronics, and industrial systems, ensuring adaptability to varied sectoral needs.
[0014] These and other advantages will be apparent from the present application of the embodiments described herein.
[0015] The preceding is a simplified summary to provide an understanding of some embodiments of the present invention. This summary is neither an extensive nor exhaustive overview of the present invention and its various embodiments. The summary presents selected concepts of the embodiments of the present invention in a simplified form as an introduction to the more detailed description presented below. As will be appreciated, other embodiments of the present invention are possible utilizing, alone or in combination, one or more of the features set forth above or described in detail below.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The above and still further features and advantages of embodiments of the present invention will become apparent upon consideration of the following detailed description of embodiments thereof, especially when taken in conjunction with the accompanying drawings, and wherein:
[0017] FIG. 1 illustrates a thermal insulation material, according to an embodiment of the present invention;
[0018] FIG. 2A illustrates a placement of the thermal insulation material in a heat source and a heat sink, according to an embodiment of the present invention;
[0019] FIG. 2B illustrates a distance temperature graph, according to an embodiment of the present invention;
[0020] FIG. 3 depicts a flowchart of a method for functioning of an advanced thermal insulation material, according to an embodiment of the present invention; and
[0021] FIG. 4 depicts a flowchart of a method for preparing an advanced thermal insulation material, according to an embodiment of the present invention.
[0022] The headings used herein are for organizational purposes only and are not meant to be used to limit the scope of the description or the claims. As used throughout this application, the word "may" is used in a permissive sense (i.e., meaning having the potential to), rather than the mandatory sense (i.e., meaning must). Similarly, the words “include”, “including”, and “includes” mean including but not limited to. To facilitate understanding, like reference numerals have been used, where possible, to designate like elements common to the figures. Optional portions of the figures may be illustrated using dashed or dotted lines, unless the context of usage indicates otherwise.
DETAILED DESCRIPTION
[0023] The following description includes the preferred best mode of one embodiment of the present invention. It will be clear from this description of the invention that the invention is not limited to these illustrated embodiments but that the invention also includes a variety of modifications and embodiments thereto. Therefore, the present description should be seen as illustrative and not limiting. While the invention is susceptible to various modifications and alternative constructions, it should be understood, that there is no intention to limit the invention to the specific form disclosed, but, on the contrary, the invention is to cover all modifications, alternative constructions, and equivalents falling within the scope of the invention as defined in the claims.
[0024] In any embodiment described herein, the open-ended terms "comprising", "comprises”, and the like (which are synonymous with "including", "having” and "characterized by") may be replaced by the respective partially closed phrases "consisting essentially of", “consists essentially of", and the like or the respective closed phrases "consisting of", "consists of”, the like.
[0025] As used herein, the singular forms “a”, “an”, and “the” designate both the singular and the plural, unless expressly stated to designate the singular only.
[0026] FIG. 1 illustrates a thermal insulation material 100, according to an embodiment of the present invention. In an embodiment of the present invention, the thermal insulation material 100 may comprise a matrix formed from silica (SiO₂), alumina (Al₂O₃), or an inorganic-organic hybrid backbone. The inorganic-organic hybrid backbone may combine ceramic strength with polymer flexibility. The matrix provides a structural reliability and a high thermal resistance. The matrix may further integrate modified hybrid networks that may combine ceramic strength with polymer flexibility to ensure both rigidity and adaptability.
[0027] In an embodiment of the present invention, the thermal insulation material 100 may comprise fillers. The fillers may comprise hollow microspheres, nano clay platelets, and graphene oxide flakes. The hollow microspheres may enclose low-conductivity gases such as air or argon to create voids with low thermal conductivity, while nano clay platelets and graphene oxide flakes improve structural reinforcement and enhance resistance against thermal degradation.
[0028] In an embodiment of the present invention, the thermal insulation material 100 may comprise binders selected from polyimides, silicone-based resins, silicates, and phosphate-based compounds. The binders may ensure cohesion of a microstructure of the thermal insulation material 100 at elevated temperatures and provide additional fire resistance and environmental stability.
[0029] In an embodiment of the present invention, the thermal insulation material 100 may include nano-laminated layers composed of alternating films with distinct and contrasting refractive indices and thermal conductivities to achieve infrared radiation reflection. The nano-laminated layers act as reflective and scattering barriers to infrared radiation. Thus, reducing radiative heat transfer in high-temperature environments such as aerospace and industrial applications.
[0030] In an embodiment of the present invention, the thermal insulation material 100 may incorporate hierarchical pores ranging from nanoscale to microscale and meso-scale dimensions. The hierarchical pores may be generated by sol-gel synthesis, freeze casting, and so forth. The hierarchical pore may trap insulating gases and disrupt conductive pathways. Thus, reducing effective thermal conductivity below 0.02 Watt per meter-Kelvin (W/m-K).
[0031] In an embodiment of the present invention, the thermal insulation material 100 may comprise a cross-linked network formed by polymeric or inorganic chains. The cross-linked network maintains dimensional stability, prevents oxidation, and resists mechanical stress under compression or vibration. The cross-linked network may comprise polymeric chains or inorganic linkages to resist mechanical stress and oxidation.
[0032] In an embodiment of the present invention, the thermal insulation material 100 may be prepared by sol-gel synthesis to create highly porous structures, by freeze-casting to generate directional pore channels, or by thermal curing to cross-link the matrix. Supercritical drying may optionally be employed to preserve pore structures and achieve aerogel-like ultra-low density.
[0033] In an embodiment of the present invention, the thermal insulation material 100 may provide a multi-mode suppression of heat transfer, simultaneously reducing conduction, convection, and radiation. The thermal insulation material 100 may demonstrate superior thermal stability above 800 °C and maintain mechanical strength during prolonged high-temperature exposure.
[0034] In an embodiment of the present invention, the thermal insulation material 100 may exhibit versatility in application and may be fabricated in the form of sheets, panels, sprayable pastes, or pre-formed blocks. Thus, allowing adoption in construction, aerospace, automotive, electronics, and industrial systems.
[0035] FIG. 2A illustrates a placement of the thermal insulation material 100 in a heat source 200 and a heat sink 202, according to an embodiment of the present invention. In an embodiment of the present invention, the thermal insulation material 100 may be positioned between the heat source 200 and the heat sink 202 to minimize direct thermal transfer. The nano-laminated layers of the thermal insulation material 100 may reflect infrared radiation emitted by the heat source 200, while the hierarchical pore may disrupt conduction pathways. Thus, reducing the thermal load reaching the heat sink 202.
[0036] In an embodiment of the present invention, the thermal insulation material 100 may function as a thermal interface barrier between electronic components that act as a localized heat source 200 and the heat sink 202 attached to a component housing. The thermal insulation material 100 may fill microscopic air gaps at the interface. Thus, lowering overall interfacial resistance and improving heat dissipation uniformity.
[0037] In an embodiment of the present invention, the thermal insulation material 100 may be applied as a coating layer adjacent to high-temperature heat source 200 such as engines, turbines, or industrial furnaces. The nano-laminated layers scatter thermal radiation back toward the source, while the matrix resists degradation, thus preserving the efficiency of the heat sink 202 situated downstream.
[0038] In an embodiment of the present invention, the thermal insulation material 100 may be integrated with thermal management systems. The heat sink 202 may dissipate excess energy and the thermal insulation material 100 may prevent undesired reverse heat flow from an environment. This dual function may enhance the stability of sensitive electronic or aerospace systems operating under fluctuating thermal loads.
[0039] In an embodiment of the present invention, the thermal insulation material 100 may demonstrate anisotropic properties by orienting the directional pore channels. Thus, enabling preferential thermal conduction toward a controlled heat sink 202 while suppressing undesired heat leakage toward other structural regions. This selective pathway design ensures precise management of thermal gradients.
[0040] FIG. 2B illustrates a distance temperature graph 204, according to an embodiment of the present invention. In an embodiment of the present invention, a performance of the thermal insulation material 100 may be represented through the distance temperature graph 204 measured between the heat source 200 and the heat sink 202. The distance temperature graph 204 may demonstrate a steep temperature drop near a hot surface due to the nano-laminated layers that may scatter and reflect incident radiation, followed by a flattened region across the hierarchical pore where conductive heat transfer may be significantly reduced by trapped insulating gases and disrupted pathways, and finally a stable low-temperature zone adjacent to the heat sink 202 where the matrix may maintain structural integrity and may prevent heat leakage. This distance temperature graph 204 may confirm superior multi-mode suppression of heat transfer compared to conventional insulation materials that may exhibit gradual and nearly linear thermal decline across thickness.
[0041] FIG. 3 depicts a flowchart of a method 300 of functioning of the thermal insulation material 100, according to an embodiment of the present invention.
[0042] At step 302, external heat may encounter the thermal insulation material 100.
[0043] At step 304, the nano-laminated layers may scatter and reflect the incident radiation.
[0044] At step 306, the hollow microspheres may enclose the gases with low thermal conductivity, while the nano clay platelets and the graphene oxide flakes may improve structural reinforcement and enhance resistance against thermal degradation.
[0045] At step 308, the modified hybrid networks may be interlarded into the thermal insulation material 100 to combine ceramic strength with polymer flexibility to ensure both rigidity and adaptability.
[0046] FIG. 4 depicts a flowchart of a method 400 for preparing the thermal insulation material 100 with the engineered microstructures, according to an embodiment of the present invention.
[0047] At step 402, the material comprising the matrix of silica (SiO₂), alumina (Al₂O₃), or the inorganic-organic hybrid backbone, and so forth may be selected.
[0048] At step 404, the fillers may be incorporated. The fillers may be the hollow microspheres, the nano clay platelets, and the graphene oxide flakes, in the matrix of the material, to reduce thermal conductivity and improve mechanical reinforcement.
[0049] At step 406, the binders may be introduced into the matrix of the material. The binders may be the polyimides, the silicone-based resins, the silicates, or the phosphate-based compounds to achieve cohesion and fire resistance.
[0050] At step 408, the hierarchical pores of nano, micro, and meso scale dimensions may be created within the material to trap air and disrupt conductive heat flow.
[0051] At step 410, the nano-laminated layers may be formed on the material, of alternating refractive index and thermal conductivity, to reflect and scatter thermal radiation.
[0052] At step 412, the cross-linked network may be established, within the matrix of the material, to enhance dimensional stability, thermal durability, and mechanical strength.
[0053] At step 414, the thermal insulation material 100 with engineered microstructures may be obtained.
[0054] At step 416, the supercritical drying of the obtaining thermal insulation material 100 may be carried out to maintain porosity and achieve ultra-low density aerogel-like structures.
[0055] While the invention has been described in connection with what is presently considered to be the most practical and various embodiments, it is to be understood that the invention is not to be limited to the disclosed embodiments, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the scope of the appended claims.
[0056] This written description uses examples to disclose the invention, including the best mode, and also to enable any person skilled in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the invention is defined in the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements within substantial differences from the literal languages of the claims. , Claims:CLAIMS
I/We Claim:
1. A method (400) for preparing an advanced thermal insulation material (100) with engineered microstructures, the method (400) characterized by steps of:
selecting a material comprising a matrix of silica (SiO₂), alumina (Al₂O₃), or an inorganic-organic hybrid backbone, or a combination thereof;
incorporating fillers selected from hollow microspheres, nano clay platelets, and graphene oxide flakes, in the matrix of the material, to reduce thermal conductivity and improve mechanical reinforcement;
introducing binders, in the matrix of the material, comprising polyimides, silicone-based resins, silicates, or phosphate-based compounds to achieve cohesion and fire resistance;
creating hierarchical pores of nano, micro, and meso scale dimensions within the material to trap air and disrupt conductive heat flow;
forming nano-laminated layers, on the material, of alternating refractive index and thermal conductivity to reflect and scatter thermal radiation;
establishing a cross-linked network, among the matrix of the material, to enhance dimensional stability, thermal durability, and mechanical strength; and
obtaining the thermal insulation material (100) with engineered microstructures.
2. The method (400) as claimed in claim 1, comprising a step of supercritical drying of the obtained thermal insulation material (100) to maintain porosity and achieve ultra-low density aerogel-like structures.
3. The method (400) as claimed in claim 1, wherein the material comprises a modified inorganic-organic hybrid backbone to combine ceramic strength with polymer flexibility.
4. The method (400) as claimed in claim 1, wherein the hollow microspheres enclose low-conductivity gases selected from air or argon to minimize density and thermal conductivity.
5. The method (400) as claimed in claim 1, wherein the nano-laminated layers comprise alternating thin films with contrasting refractive indices to achieve infrared radiation reflection.
6. The method (400) as claimed in claim 1, wherein the hierarchical pores are generated by sol-gel synthesis, freeze casting, or a combination thereof.
7. The method (400) as claimed in claim 1, wherein the cross-linked network comprises polymeric chains or inorganic linkages to resist mechanical stress and oxidation.
8. The method (400) as claimed in claim 1, wherein the binders comprise a combination of polyimides with silicone resins to ensure high-temperature resistance.
9. The method (400) as claimed in claim 1, wherein the fillers are present in amounts effective to improve both thermal resistance and mechanical reinforcement without increasing overall material density.
10. The method (400) as claimed in claim 1, wherein the material exhibits thermal conductivity below 0.02 Watt per meter-Kelvin (W/m-K).
Date: September 02, 2025
Place: Noida
Nainsi Rastogi
Agent for the Applicant
(IN/PA-2372)