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Resin Composition, Cured Product, Multilayer Body, Method For Producing Cured Product, Method For Producing Multilayer Body, Method For Producing Semiconductor Device, And Semiconductor Device
Abstract: The present invention provides: a resin composition which contains a polymerizable compound, a polymerization initiator and at least one resin that is selected from the group consisting of polyimides and precursors thereof, wherein the dissolution rate of a film that is obtained from this resin composition and has a film thickness of 10 µm is 0.01 µm/sec to 0.55 µm/sec with respect to cyclopentanone; a cured product which is obtained by curing this composition; a multilayer body which comprises this cured product; a method for producing a cured product; a method for producing a multilayer body; a method for producing a semiconductor device, the method comprising a method for producing a cured product; and a semiconductor device which comprises a cured product.
Notices, Deadlines & Correspondence
Patent Information
Applicants
FUJIFILM CORPORATION
Inventors
1. YAMAKAWA Yuta
2. NOZAKI Atsuyasu
3. OOTA Kazuya
Specification
Documents
Application Documents
| # | Name | Date |
|---|---|---|
| 1 | 202547083309-STATEMENT OF UNDERTAKING (FORM 3) [02-09-2025(online)].pdf | 2025-09-02 |
| 2 | 202547083309-REQUEST FOR EXAMINATION (FORM-18) [02-09-2025(online)].pdf | 2025-09-02 |
| 3 | 202547083309-PROOF OF RIGHT [02-09-2025(online)].pdf | 2025-09-02 |
| 4 | 202547083309-PRIORITY DOCUMENTS [02-09-2025(online)].pdf | 2025-09-02 |
| 5 | 202547083309-FORM 18 [02-09-2025(online)].pdf | 2025-09-02 |
| 6 | 202547083309-FORM 1 [02-09-2025(online)].pdf | 2025-09-02 |
| 7 | 202547083309-DECLARATION OF INVENTORSHIP (FORM 5) [02-09-2025(online)].pdf | 2025-09-02 |
| 8 | 202547083309-COMPLETE SPECIFICATION [02-09-2025(online)].pdf | 2025-09-02 |
| 9 | 202547083309-Proof of Right [03-09-2025(online)].pdf | 2025-09-03 |
| 10 | 202547083309-FORM-26 [03-09-2025(online)].pdf | 2025-09-03 |