Electrostatic Chuck And Method For Producing Electrostatic Chuck

Abstract: The present invention provides a technology with which it is possible to reduce scratches formed on a rear surface of a substrate that is held by an electrostatic chuck. This electrostatic chuck for holding a substrate comprises a dielectric body, and an electrode that is disposed inside the dielectric body. The dielectric body includes an upper surface and a plurality of protrusions that protrude upward from the upper surface and are configured so as to support the substrate. The protrusions each include a crystalline base part and a non-crystalline surface layer that is disposed on the base part.

Patent Information

Application #

Filing Date

20 March 2026

Publication Number

17/2026

Publication Type

INA

Invention Field

ELECTRONICS

Status

Email

Parent Application

Applicants

TOKYO ELECTRON LIMITED

3-1 Akasaka 5-chome, Minato-ku, Tokyo 1076325

Inventors

1. KAWABATA, Atsushi

c/o Tokyo Electron Miyagi Limited, 1 Techno Hills, Taiwa-cho, Kurokawa-gun, Miyagi 9813629

2. SATO, Masanori

c/o Tokyo Electron Miyagi Limited, 1 Techno Hills, Taiwa-cho, Kurokawa-gun, Miyagi 9813629

3. TSUNAMOTO, Tetsu

c/o Tokyo Electron Miyagi Limited, 1 Techno Hills, Taiwa-cho, Kurokawa-gun, Miyagi 9813629

Specification

Documents

Application Documents

#	Name	Date
5	202617034144-DRAWINGS [20-03-2026(online)].pdf	2026-03-20
6	202617034144-DECLARATION OF INVENTORSHIP (FORM 5) [20-03-2026(online)].pdf	2026-03-20
7	202617034144-COMPLETE SPECIFICATION [20-03-2026(online)].pdf	2026-03-20
8	202617034144-Proof of Right [26-03-2026(online)].pdf	2026-03-26
9	202617034144-FORM-26 [26-03-2026(online)].pdf	2026-03-26
10	202617034144-WIPO_PCT_DOC.pdf	2026-04-09
11	202617034144-PATENT_APPLICATION_PUBLICATION.pdf	2026-05-02
12	202617034144-MARKED COPIES OF AMENDEMENTS [20-05-2026(online)].pdf	2026-05-20
13	202617034144-FORM 13 [20-05-2026(online)].pdf	2026-05-20
14	202617034144-AMMENDED DOCUMENTS [20-05-2026(online)].pdf	2026-05-20