Method For Manufacturing Glass Substrate Having Conductive Via, Metal

Method For Manufacturing Glass Substrate Having Conductive Via, Metal Paste For Forming Through Glass Via, And Glass Substrate Having Conductive Via

Abstract: This method for manufacturing a glass substrate having a conductive via comprises: a step a for preparing a glass substrate provided with a hole and providing a metal paste part, which contains metal particles and a volatile solvent, in a manner so as to cover at least the surface of the periphery of the hole in the glass substrate while filling the inside of the hole; a step b for heating the metal paste part to remove a portion of the volatile solvent; a step c for removing a portion of the heated metal paste part such that the surface is exposed, and forming, inside the hole, a conductive via precursor which has a flattened exposed surface and which contains the remainder of the metal particles and the volatile solvent; and a step d for burning the conductive via precursor. The metal particles include first metal particles having a volume average particle diameter of 0.8 µm or more and second metal particles having a volume average particle diameter of 0.5 µm or less. The metal particle concentration of the metal paste part provided in said step a is 95.0 mass% or more, and the content of the second metal particles in the metal paste part provided in said step a is 50 mass% or less with respect to the total amount of the metal particles. The method for manufacturing a glass substrate having a conductive via is also useful as a technique for reducing an environmental load due to plating.

Patent Information

Application #

Filing Date

17 August 2026

Publication Number

34/2026

Publication Type

INA

Invention Field

ELECTRONICS

Status

Email

Parent Application

Applicants