Abstract: The present disclosure relates to: an adhesive layer characterized by including a first adhesive layer and a second adhesive layer having a higher dielectric strength than the first adhesive layer, and by being used for electrical pulse peeling; a laminate including the adhesive layer; a curable composition for forming the adhesive layer; a method for producing a recycled product; and a method for reducing adhesive strength.
| # | Name | Date |
|---|---|---|
| 1 | 202647099036-WIPO_PCT_DOC.pdf | 2026-08-17 |
| 2 | 202647099036-STATEMENT OF UNDERTAKING (FORM 3) [17-08-2026(online)].pdf | 2026-08-17 |
| 3 | 202647099036-PROOF OF RIGHT [17-08-2026(online)].pdf | 2026-08-17 |
| 4 | 202647099036-Proof of Right [17-08-2026(online)]-1.pdf | 2026-08-17 |
| 5 | 202647099036-PRIORITY DOCUMENTS [17-08-2026(online)].pdf | 2026-08-17 |
| 6 | 202647099036-FORM 18 [17-08-2026(online)].pdf | 2026-08-17 |
| 7 | 202647099036-FORM 1 [17-08-2026(online)].pdf | 2026-08-17 |
| 8 | 202647099036-DRAWINGS [17-08-2026(online)].pdf | 2026-08-17 |
| 9 | 202647099036-DECLARATION OF INVENTORSHIP (FORM 5) [17-08-2026(online)].pdf | 2026-08-17 |
| 10 | 202647099036-COMPLETE SPECIFICATION [17-08-2026(online)].pdf | 2026-08-17 |
| 11 | 202647099036-FORM-26 [18-08-2026(online)].pdf | 2026-08-18 |
| 12 | 202647099036-PATENT_APPLICATION_PUBLICATION.pdf | 2026-08-22 |