Claims:1. A printed circuit board comprising:
a first signal trace and a second signal trace on a first layer, wherein the first
signal trace and second signal trace are non-intersecting;
a second layer below the first layer;
a third layer below the second layer; and
a three-dimensional (3D) ground plane, the 3D ground plane including:
a first plurality of segments on the third layer,
a second plurality of segments on the second layer, and
a plurality of metal vias to connect the first plurality of segments and the
second plurality of segments in the 3D ground plane. , Description:TECHNICAL FIELD
[0001] Embodiments described herein generally relate to the field of
electronic devices and, more particularly, a 3D high-inductive ground plane for crosstalk
reduction.
BACKGROUND
[0002] In the operation of electronic devices, which are continuing to be
reduced in size while also being operated at higher speeds, crosstalk noise is an
increasing problem. In particular, far-end crosstalk is generally associated with
microstrip (MS) routing configuration in printed circuit board (PCB) design. Far-end
crosstalk (FEXT) refers to interference at a far end of a circuit, while near-end crosstalk
(NEXT) refers to crosstalk at a near-end of the circuit.
[0003] As signaling speed increases with every new generation of high-speed
input/output (I/O) interfaces, crosstalk noise has become an increasingly significant
factor in constraining the physical aspects of PCB design, such as shorter lengths that are
supportable and additional PCB layer counts.