1. A full duplex antenna, comprising:
a metallic plate;
a transmitter antenna integrated at a first vertical edge of the metallic plate;
10 a receiver antenna integrated at a second vertical edge of the metallic plate opposite to the
first vertical edge;
a plurality of metallic vias arranged vertically on the metallic plate between the
transmitter antenna and receiver antenna;
a pair of L-shaped stubs integrated at horizontal edges of the metallic plate, positioned
15 diametrically opposite to each other; and
a metallic line running parallel to each of the horizontal edges of the metallic plate.
2. The antenna as claimed in claim 1, wherein the plurality of metallic vias are dimensioned and
spaced to optimize signal isolation between the transmitter and receiver antennas.
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3. The antenna as claimed in claim 1, wherein the plurality of metallic vias comprises a first set
and a second set of metallic vias positioned parallel to each on the metallic plate to facilitate
concurrent transmitter and receiver antennas on both sides of the plate.
25 4. The antenna of Claim 2, wherein the plurality of metallic vias are configured to minimize
signal coupling between transmitter and receiver antennas on each side of the metallic plate.
5. The antenna of claim 1, further comprising a dielectric substrate positioned beneath the
metallic plate for impedance matching.
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6. The antenna of claim 1, wherein the metallic line is coupled with the corresponding L-shaped
stubs, and
wherein the metallic plate are integrated to increase operational bandwidth of the full
duplex antenna.
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5 7. The antenna of claim 1, wherein the transmitter and receiver antennas are positioned on longer
edges of the metallic plate.
8. A method for manufacturing a full duplex antenna, the method comprising:
integrating a transmitter antenna at a first vertical edge of a metallic plate;
10 integrating a receiver antenna at a second vertical edge of the metallic plate opposite to
the first vertical edge;
arranging a plurality of metallic vias vertically on the metallic plate between the
transmitter antenna and receiver antenna;
integrating a pair of L-shaped stubs at horizontal edges of the metallic plate, positioned
15 diametrically opposite to each other; and
integrating a metallic line parallel to each of the horizontal edges of the metallic plate.
9. The method of claim 8, wherein the plurality of metallic vias comprises a first set and a second
set of metallic vias positioned parallel to each on the metallic plate to facilitate concurrent
20 transmitter and receiver antennas on both sides of the plate.
10. The method of claim 8, further comprises positioning a dielectric substrate beneath the
metallic plate for impedance matching.