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A Device And Method For Holding Conducting Means Againstouter Surface Of A Pipe

Abstract: A device and method for holding at least one conducting means 108 against outer surface of a pipe 110 is provided. The device comprising a first block 102a defining a first inner curved surface112a and a second block 102b defining a second inner curved surface 112b. The first block 102a and the second block 102b are configured for being assembled on the outer surface of the pipe 110. Further, at least one of the first block 102a and the second block 102b defines on the first inner curved surface 112a and second inner curved surface 112b respectively, at least one slot 106 configured for holding the conducting means 108 against the outer surface of the pipe 110 when the first block 102a and the second block 102b are assembled on the outer surface of the pipe 110. Reference figure: FIG. 2

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Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
15 April 2009
Publication Number
33/2012
Publication Type
INA
Invention Field
ELECTRONICS
Status
Email
Parent Application
Patent Number
Legal Status
Grant Date
2020-04-20
Renewal Date

Applicants

BHARAT HEAVY ELECTRICALS LIMITED
BHEL HOUSE  SIRI FORT  NEW DELHI – 110049  INDIA.  with one of its manufacturing units at High Pressure Boiler Plant  Tiruchirapalli - 620014  Tamil Nadu

Inventors

1. R.Dhanuskodi
B3-040  BHEL Township  Tiruchirappalli 620 014
2. R.Elankovan
35/4  AMRUTHA  Reynolds Road  Cantonment  Tiruchirappalli 620 001
3. V. Natarajan
119A  5th Street East  V.O.C Nagar  Thuvakkudi Malai  Tiruchirappalli 620 022
4. S. Arumugam
A1/2  Baskara Apartment  No. 1 Tollgate Trichy 621 216

Specification

FORM 2
THE PATENT ACT 1970
(39 OF 1970)
&
THE PATENT RULES, 2005

COMPLETE SPECIFICATION
(SEE SECTION 10 AND RULE 13)

TITLE OF THE INVENTION

“A DEVICE AND METHOD FOR HOLDING CONDUCTING MEANS AGAINST OUTER SURFACE OF A PIPE”

NAME NATIONALITY ADDRESS
BHARAT HEAVY ELECTRICALS LIMITED INDIAN BHEL HOUSE, SIRI FORT, NEW DELHI – 110049, INDIA., WITH ONE OF ITS MANUFACTURING UNITS AT
HIGH PRESSURE BOILER PLANT, TIRUCHIRAPALLI - 620014, TAMIL NADU

THE FOLLOWING SPECIFICATION PARTICULARLY DESCRIBES AND ASCERTAINS THE NATURE OF THIS INVENTION AND THE MANNER IN WHICH IT IS TO BE PERFORMED:-

BACKGROUND
Embodiments generally relates to a device and method for holding. More particularly, the embodiments relate to a device and method for holding conducting means on outer surface of a pipe.
It has been observed that conducting means such as pipes, conduits, strips and thermocouples among others are required to be attached to an outer surface of a pipe. For example, thermocouples have to be attached to the outer surface of a heated pipe to study thermal characteristics of the heated pipe. In another example, pipes of relatively smaller diameter are attached to the outer surface of a pipe of relatively large diameter. To enable such arrangement of conducting means on the outer surface of a pipe, methods and devices are provided.
One such approach for holding conducting means against outer surface of a pipe is using clips or clamps. The clips or clamps in use today do not ensure perfect contact of the outer surface of the conducting means with the outer surface of the pipe. Further, these clips or clamps loosen during operation, thus leading to disposition of the conducting means from its desired position. Further, these clips or clamps tend to rotate about the axis of the pipe and also move linearly along the axis of the pipe. If such clamps are used to hold thermocouples against the outer surface of the heat pipe, such loosening of the clamps result in disposition of thermocouples which are held against the outer surface of the heat pipe. Such disposition and imperfect contact between the outer surface of the thermocouple with the outer surface of the heat pipe results in loss of data and even incorrect measurement of data. Further, the clips or the clamps come in contact with electrical circuits in case the pipe is directly electrically heated.
Another approach for holding conducting means against outer surface of a pipe is by brazing the conducting means to the outer surface of the pipe. In this approach, it will be difficult to replace the conducting means which are attached to the outer surface of the pipe. This approach is used to fix thermocouples to the outer surface of the pipe. However, brazing the thermocouple to the outer surface of the electrically heated pipe results in erroneous reading of data due to indication of the drop in heating power supply voltage at the brazed location as temperature reading. Further, it is difficult to replace failed thermocouples in this approach.
Yet another approach for attaching the conducting means to the outer surface of the pipe is by making dents over the outer surface of the pipe and peening the conducting means to the dents in the pipe. However, this approach does not ensure accurate fixing of the conducting means to the outer surface of the pipe. Further, the pipe strength at the dented locations reduces and replacement of conducting means is also difficult.
In light of the foregoing discussion, there is a need for a device and method for holding conducting means on outer surface of a pipe. Further, the device and method should ensure good contact between the outer surface of the conducting means with the outer surface of the pipe. Additionally, the device and method should ensure against disposition of the conducting means from its desired position. Further, device should not rotate about the axis of the pipe and also should not linearly move along the axis of the pipe when the device is assembled on the outer surface of the pipe. The device and method should ensure correct data reading in case the device holds thermocouples against the outer surface of the pipe. The device and method should enable replacement of the conducting means.
STATEMENT OF INVENTION
An object is to provide a device and method for holding conducting means on outer surface of a pipe.
Another object is to establish good contact between the outer surface of the conducting means with the outer surface of the pipe.
Yet another object is to ensure against disposition of the conducting means from its desired position.
Still another object is to ensure that the device does not rotate about the axis of the pipe and also does not linearly move along the axis of the pipe when the device is assembled on the outer surface of the pipe.
Still another object is to ensure correct data reading in case the device holds thermocouples against the outer surface of the pipe.
Still another object is to enable easy replacement of conducting means.
An embodiment achieves one or more of the above object by providing a device for holding at least one conducting means against outer surface of a pipe. The device comprises a first block defining a first inner curved surface and a second block defining a second inner curved surface. The first block and the second block are configured for being assembled on the outer surface of the pipe. Further, at least one of the first block and the second block defines on the first inner curved surface and second inner curved surface respectively, at least one slot configured for holding the conducting means on the outer surface of the pipe when the first block and the second block are assembled on the outer surface of the pipe. Additionally, at least one of the first block and the second block defining the at least one slot on the first inner curved surface and second inner curved surface respectively, further defines at least one threaded hole for each of the slots. Further, screws are provided through the threaded holes wherein the screws are configured for pressing the conducting means against the outer surface of the pipe. Further, the slots are adapted to maintain gap between the blocks and the pipe when the blocks are assembled on the pipe and the conducting means are held by the slots against the outer surface of the pipe. Additionally, the blocks are adapted to maintain gap between the blocks when the blocks are assembled on the outer surface of the pipe.
Another embodiment achieves one or more of the above object by providing a method for holding at least one conducting means against outer surface of a pipe using a device. The device comprises a first block defining a first inner curved surface and a second block defining a second inner curved surface, wherein the first block and the second block are configured for being assembled on the outer surface of the pipe. Further, the at least one of the first block and the second block defines on the first inner curved surface and second inner curved surface respectively, at least one slot configured for holding the conducting means on the outer surface of the pipe when the first block and the second block are assembled on the outer surface of the pipe. The method comprises the steps of arranging the conducting means on the outer surface of the pipe and assembling the blocks on the outer surface of the pipe, wherein the conducting means passes through the slots. Further, the conducting means are pressed against the outer surface of the pipe.
These and other aspects of the embodiments herein will be better appreciated and understood when considered in conjunction with the following description and the accompanying drawings. It should be understood, however, that the following descriptions, while indicating preferred embodiments and numerous specific details thereof, are given by way of illustration and not of limitation. Many changes and modifications may be made within the scope of the embodiments herein without departing from the spirit thereof, and the embodiments herein include all such modifications.
BRIEF DESCRIPTION OF DRAWINGS
The embodiments herein will be better understood from the following description with reference to the drawings, in which:
FIG. 1 illustrates an isometric view of a device assembled on outer surface of a pipe, in accordance with an embodiment,
FIG. 2 illustrates an isometric view of a device assembled on outer surface of a pipe, including threaded holes configured for pressing conducting means against the pipe, in accordance with an embodiment,
FIG 2a illustrates an isometric view of one of the blocks of a device, showing slots and threaded holes, in accordance with an embodiment,
FIG 2b illustrates an isometric view of another block of a device, showing slot and threaded holes, in accordance with an embodiment, and
FIG. 3 illustrates an elevation view of a device assembled on outer surface of a pipe, in accordance with an embodiment.
DESCRIPTION OF EMBODIMENTS
The embodiments herein and the various features and advantageous details thereof are explained more fully with reference to the non-limiting embodiments that are illustrated in the accompanying drawings and detailed in the following description. Descriptions of well-known components and processing techniques are omitted so as to not unnecessarily obscure the embodiments herein. The examples used herein are intended merely to facilitate an understanding of ways in which the embodiments herein may be practiced and to further enable those of skill in the art to practice the embodiments herein. Accordingly, the examples should not be construed as limiting the scope of the embodiments herein.
As mentioned, there remains a need for holding at least one conducting means against outer surface of a pipe. The embodiments herein achieve this by providing a device and method for. Referring now to the drawings, and more particularly to FIGS. 1 through 3, where similar reference characters denote corresponding features consistently throughout the figures, there are shown preferred embodiments.
FIG. 1 illustrates a view of a device 100 assembled on outer surface of a pipe 110, in accordance with an embodiment. The device 100 is configured for holding at least one conducting means 108 against outer surface of the pipe 110. The device comprises a first block 102a and a second block 102b. The first block 102a defines a first inner curved surface 112a. Further, slots 106a, 106b and 106c are defined on the inner curved surface 112a. Alternatively, the inner curved surface 112a can have a single slot 106a. The second block 102b defines a second inner curved surface 112b. Further, slots 106d (not shown) is defined on the inner curved surface 112b. The first block 102a and the second block 102b are configured for being assembled on the outer surface of the pipe 110. The first block 102a defines through holes 304 (illustrated in FIG. 2a and 3) on either sides of the first inner curved surface 112a for receiving screws 104a and 104b. The second block 102b defines tapped holes 306 (illustrated in FIG. 2b and 3) along the axis of the through holes 304 for receiving the screws 104a and 104b, thereby enabling assembly of the first block 102a and the second block on the outer surface of the pipe 110, wherein the conducting means 108a, 108b and 108c and 108d are respectively held by the slots 106a, 106b 106c, and 106d against the outer surface of the pipe 110.
In an embodiment, at least one slot 106 is defined on either of the first inner curved surface 112a and the second inner curved surface 112b.
In an embodiment, multiple slots are defined on the first inner curved surface 112a and the second inner curved surface 112b.
In an embodiment, at least one of the first block 102a and the second block 102b further defines at least one threaded hole 114. FIG. 2 illustrates the device 100 in which first block 102a defines threaded holes 114a|, 114a||, 114b|, 114b||, 114c|, and 114c||. In FIG. 2, slots 106a, 106b and 106c are defined on the first inner curved surface 112a. For each of the slots 106a, 106b and 106c, the first block 102a defines threaded holes 114a|, 114a||, 114b|, 114b||, 114c|, and 114c||. The threaded holes 114a| and 114a|| interfaces with slot 106a. Similarly, threaded holes 114b| and 114b|| interfaces with slot 106b and threaded holes 114c| and 114c|| interfaces with slot 106c. The threaded holes 114 are configured for receiving screws. The screws are adapted to press the respective conducting means 108 being held by the slots 106 against the outer surface of the pipe 110. Similarly, second block 102b defines threaded holes 114d|, and 114d|| (Shown in FIG. 2b). Further, as shown in FIG. 2b, slots 106d is defined on the second inner curved surface 112b. For the slot 106d, the second block 102b defines threaded holes 114d| and 114d||. The threaded holes 114d| and 114d|| interfaces with slot 106d. Similarly, FIG 2a illustrates an isometric view of first block 102a, showing slots 106a, 106b and 106c. In an embodiment, for each of the slots 106 only one threaded hole 114 is provided.
In an embodiment, for each of the slots 106 multiple threaded holes 114 are provided.
In an embodiment, the slots 106 are adapted to maintain gap between the blocks 102a and 102b and the pipe 110 when the blocks 102a and 102b are assembled on the pipe 110 and the conducting means 108 are held by the slots 106 against the outer surface of the pipe 110. FIG. 3 illustrates slots 106a, 106b and 106c adapted to maintain gap between the blocks 102a and 102b and the pipe 110 when the blocks 102a and 102b are assembled on the pipe 110 and the conducting means 108a, 108b and 108c are respectively held by the slots 106a, 106b, and 106c against the outer surface of the pipe 110.
In an embodiment, depth of slots 106 are chosen such that only a part of the diameter of the conducting means 108 sits in the slots 106 and a gap equivalent to the remaining part of the diameter of the conducting means 108 is maintained all around the pipe 110, thereby, ensuring non-contact of the blocks 102a and 102b with the pipe 110.
In an embodiment, the slots 106 are of rectangular cross section.
Alternatively, in another embodiment, the slots 106 are of trapezoidal cross section.
Alternatively, in another embodiment, the slots 106 are of triangular cross section.
Alternatively, in another embodiment, the slots 106 are of semi circular cross section.
In an embodiment, blocks 102a and 102b are adapted to maintain gap between the blocks 102a and 102b when the blocks 102a and 102b are assembled on the outer surface of the pipe 110. As illustrated in FIG. 3, gap 302 is maintained between blocks 102a and 102b when they are assembled on the outer surface of the pipe 110. The gap 302 enables good grip of blocks 102a and 102b with the pipe 110 when they are assembled to the outer surface of the pipe 110, thereby, ensuring against the rotational movement of the blocks 102a and 102b around the axis of the pipe 110 and linear movement along the axis of the pipe 110.
In an embodiment, the material of the blocks 102a and 102b, screws 104, and screws received by threaded holes 114 are selected based on applicable maximum pipe 110 outer temperature and environment temperature.
In an embodiment, the conducting means are pipes which are capable of conducting fluid.
In an embodiment, the conducting means are pipes which are capable of conducting gases.
In an embodiment, the conducting means are thermocouples.
In an embodiment, the conducting means are thermocouples adapted to monitor thermal characteristics of the pipe 110.
In an embodiment, the pipe 110 is a heat pipe.
In an embodiment, the pipe 110 is directly heated by electricity.
In an embodiment, the pipe 110 can be in any orientation.
In an embodiment, the conducting means 108 are held against the outer surface of the pipe 110 by arranging the conducting means 108 on the outer surface of the pipe 110. Subsequently, the blocks 102a and 102b are assembled on the outer surface of the pipe 110, wherein the conducting means 108 passes through the slots 106.
In an embodiment, the conducting means 108 are pressed against the outer surface of the pipe 110. The conducting means 108 are pressed against the outer surface of the pipe 110 by tightening the screws.
In an embodiment, device 100 is used for monitoring thermal characteristics of a heated pipe (pipe 110) which is directly heated by electricity. Monitoring of thermal characteristics of the heated pipe is enabled by thermocouples (conducting means 108). The thermocouples are held against the outer surface of the heated pipe. The thermocouples are held against the outer surface of the heated pipe by assembling block 102a and 102b on the outer surface of the heated pipe. The thermocouples pass through the slots 106 which are defined on the first inner curved surface 112a and second inner curved surface 112b. Further, the thermocouples are pressed against the outer surface of the heat pipe by tightening the screws that are received by threaded holes 114. The dimension of the slots 106 are such that a section of the thermocouples sits in the slots, thereby maintaining a gap between the blocks 102a and 102b and the heat pipe. Further, the dimension of the blocks 102a and 102b are such that a gap is maintained between the blocks 102a and 102b when they are assembled. This gap ensures that the device and the thermocouples do not rotate about the axis of the heat pipe and do not move linearly along the axis of the heat pipe. Further, the gap maintained between the blocks 102a and 102b and the heat pipe ensures that electrical circuits used for heating the heat pipe do not cause measurement errors. Additionally, in case the thermocouples have to be replaced, the assembly formed by the blocks 102a and 102b can be disassembled or loosened to enable replacement of the thermocouples.
The foregoing description of the specific embodiments will so fully reveal the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the spirit and scope of the appended claims.

We claim:
1. A device for holding at least one conducting means against outer surface of a pipe, the device comprising:
a first block defining a first inner curved surface; and
a second block defining a second inner curved surface;
wherein the first block and the second block are configured for being assembled on the outer surface of the pipe, and at least one of the first block and the second block defining on the first inner curved surface and second inner curved surface respectively, at least one slot configured for holding the conducting means against the outer surface of the pipe when the first block and the second block are assembled on the outer surface of the pipe.
2. The device according to claim 1, wherein the conducting means are thermocouples.
3. The device according to claim 1, wherein the conducting means are pipes.
4. The device according to claim 1, wherein at least one of the first block and the second block defining the at least one slot on the first inner curved surface and second inner curved surface respectively, further defining at least one threaded hole for each of the slots.
5. The device according to claim 4, further comprising screws provided through the threaded holes, the screws configured for pressing the conducting means against the outer surface of the pipe.
6. The device according the claim 1, wherein the slots are adapted to maintain gap between the blocks and the pipe when the blocks are assembled on the pipe and the conducting means are held by the slots against the outer surface of the pipe.
7. The device according to claim 1, wherein the blocks are adapted to maintain gap between the blocks when the blocks are assembled on the outer surface of the pipe.
8. A method for holding at least one conducting means on outer surface of a pipe using a device, the device comprising a first block defining a first inner curved surface, a second block defining a second inner curved surface, wherein the first block and the second block are configured for being assembled on the outer surface of the pipe, and at least one of the first block and the second block defining on the first inner curved surface and second inner curved surface respectively, at least one slot configured for holding the conducting means on the outer surface of the pipe when the first block and the second block are assembled on the outer surface of the pipe, the method comprises the steps of:
arranging the conducting means on the outer surface of the pipe; and
assembling the blocks on the outer surface of the pipe such that the conducting means passes through the slots.
9. The method according to claim 8, further comprising pressing the conducting means against the outer surface of the pipe.
10. A device for holding at least one conducting means on the outer surface of a pipe substantially as hereinbefore described and illustrated in accompanying drawings.

Documents

Orders

Section Controller Decision Date

Application Documents

# Name Date
1 862-CHE-2009-Abstract_Granted 335587_20-04-2020.pdf 2020-04-20
1 Power of Authority.pdf 2011-09-03
2 862-CHE-2009-Claims_Granted 335587_20-04-2020.pdf 2020-04-20
2 Form-5.pdf 2011-09-03
3 Form-3.pdf 2011-09-03
3 862-CHE-2009-Description_Granted 335587_20-04-2020.pdf 2020-04-20
4 Form-1.pdf 2011-09-03
4 862-CHE-2009-Drawings_Granted 335587_20-04-2020.pdf 2020-04-20
5 Drawings.pdf 2011-09-03
5 862-CHE-2009-IntimationOfGrant20-04-2020.pdf 2020-04-20
6 862-CHE-2009-Marked up Claims_Granted 335587_20-04-2020.pdf 2020-04-20
6 862-CHE-2009 CORRESPONDENCE OTHERS 07-06-2012.pdf 2012-06-07
7 862-CHE-2009-PatentCertificate20-04-2020.pdf 2020-04-20
7 862-CHE-2009 POWER OF ATTORNEY 07-06-2012.pdf 2012-06-07
8 862-CHE-2009-PETITION UNDER RULE 137 [25-02-2020(online)].pdf 2020-02-25
8 862-CHE-2009 FORM-18 07-06-2012.pdf 2012-06-07
9 862-CHE-2009-RELEVANT DOCUMENTS [25-02-2020(online)].pdf 2020-02-25
9 abstract862-CHE-2009.jpg 2012-08-10
10 862-CHE-2009-Form 13-13-06-2013.pdf 2013-06-13
10 862-CHE-2009-Written submissions and relevant documents [25-02-2020(online)].pdf 2020-02-25
11 862-CHE-2009 CORRESPONDENCE OTHERS 13-06-2013.pdf 2013-06-13
11 862-CHE-2009-Correspondence to notify the Controller [13-02-2020(online)].pdf 2020-02-13
12 862-CHE-2009 FORM-13 13-06-2013.pdf 2013-06-13
12 862-CHE-2009-HearingNoticeLetter-(DateOfHearing-13-02-2020).pdf 2020-02-03
13 862-CHE-2009 CORRESPONDENCE OTHERS 24-06-2013.pdf 2013-06-24
13 Correspondence by Agent_Form26_11-10-2018.pdf 2018-10-11
14 862-CHE-2009 POWER OF ATTORNEY 30-09-2013.pdf 2013-09-30
14 862-che-2009-ABSTRACT [05-10-2018(online)].pdf 2018-10-05
15 862-CHE-2009 CORRESPONDENCE OTHERS 30-09-2013.pdf 2013-09-30
15 862-che-2009-CLAIMS [05-10-2018(online)].pdf 2018-10-05
16 862-CHE-2009 CORRESPONDENCE OTHERS 16-06-2014.pdf 2014-06-16
16 862-che-2009-FER_SER_REPLY [05-10-2018(online)].pdf 2018-10-05
17 Other Patent Document [10-05-2017(online)].pdf 2017-05-10
17 862-CHE-2009-FORM 3 [05-10-2018(online)].pdf 2018-10-05
18 862-CHE-2009-FER.pdf 2018-04-06
18 862-che-2009-OTHERS [05-10-2018(online)].pdf 2018-10-05
19 862-CHE-2009-FER.pdf 2018-04-06
19 862-che-2009-OTHERS [05-10-2018(online)].pdf 2018-10-05
20 862-CHE-2009-FORM 3 [05-10-2018(online)].pdf 2018-10-05
20 Other Patent Document [10-05-2017(online)].pdf 2017-05-10
21 862-CHE-2009 CORRESPONDENCE OTHERS 16-06-2014.pdf 2014-06-16
21 862-che-2009-FER_SER_REPLY [05-10-2018(online)].pdf 2018-10-05
22 862-CHE-2009 CORRESPONDENCE OTHERS 30-09-2013.pdf 2013-09-30
22 862-che-2009-CLAIMS [05-10-2018(online)].pdf 2018-10-05
23 862-che-2009-ABSTRACT [05-10-2018(online)].pdf 2018-10-05
23 862-CHE-2009 POWER OF ATTORNEY 30-09-2013.pdf 2013-09-30
24 862-CHE-2009 CORRESPONDENCE OTHERS 24-06-2013.pdf 2013-06-24
24 Correspondence by Agent_Form26_11-10-2018.pdf 2018-10-11
25 862-CHE-2009 FORM-13 13-06-2013.pdf 2013-06-13
25 862-CHE-2009-HearingNoticeLetter-(DateOfHearing-13-02-2020).pdf 2020-02-03
26 862-CHE-2009 CORRESPONDENCE OTHERS 13-06-2013.pdf 2013-06-13
26 862-CHE-2009-Correspondence to notify the Controller [13-02-2020(online)].pdf 2020-02-13
27 862-CHE-2009-Form 13-13-06-2013.pdf 2013-06-13
27 862-CHE-2009-Written submissions and relevant documents [25-02-2020(online)].pdf 2020-02-25
28 862-CHE-2009-RELEVANT DOCUMENTS [25-02-2020(online)].pdf 2020-02-25
28 abstract862-CHE-2009.jpg 2012-08-10
29 862-CHE-2009 FORM-18 07-06-2012.pdf 2012-06-07
29 862-CHE-2009-PETITION UNDER RULE 137 [25-02-2020(online)].pdf 2020-02-25
30 862-CHE-2009-PatentCertificate20-04-2020.pdf 2020-04-20
30 862-CHE-2009 POWER OF ATTORNEY 07-06-2012.pdf 2012-06-07
31 862-CHE-2009-Marked up Claims_Granted 335587_20-04-2020.pdf 2020-04-20
31 862-CHE-2009 CORRESPONDENCE OTHERS 07-06-2012.pdf 2012-06-07
32 Drawings.pdf 2011-09-03
32 862-CHE-2009-IntimationOfGrant20-04-2020.pdf 2020-04-20
33 Form-1.pdf 2011-09-03
33 862-CHE-2009-Drawings_Granted 335587_20-04-2020.pdf 2020-04-20
34 Form-3.pdf 2011-09-03
34 862-CHE-2009-Description_Granted 335587_20-04-2020.pdf 2020-04-20
35 Form-5.pdf 2011-09-03
35 862-CHE-2009-Claims_Granted 335587_20-04-2020.pdf 2020-04-20
36 862-CHE-2009-Abstract_Granted 335587_20-04-2020.pdf 2020-04-20
36 Power of Authority.pdf 2011-09-03

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1 PATSEER862CHE2009_05-04-2018.pdf

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