Claims:I claim:
1. A device for marking over a plurality of substrates, wherein the marking is visible in moist surrounding, wherein the device comprises:
an input selector, wherein the input selector is a manually controllable power supply socket;
a power interlocking circuit, wherein the power interlocking circuit is connected to the input selector, wherein the power interlocking circuit is further connected to an auxiliary power supply unit;
a switch mode power supply (SMPS) module, wherein the SMPS module is fed by a connector from the power interlocking circuit;
a programmable logic controller (PLC);
an interface relay, wherein the interface reply is parallel fed by the connector lines from the SMPS module, the PLC and the auxiliary power supply unit;
a high voltage circuit (HVC) module, wherein the HVC module comprises a right HVC and a left HVC, wherein the HVC module receives a common line from the power interlocking circuit, wherein the HVC module is further fed by the interface relay;
a plasma generation chamber (PGC) module, wherein the PGC module comprises a left PGC and a right PGC, wherein the left PGC is fed by a supply line from the left HVC and the right PGC is fed by a supply line from the right HVC;
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an electrode, wherein the electrode is connected to the PGC module, wherein the electrode is covered by a mask cap;
a substrate base, wherein the substrate base supports a target substrate, wherein the target substrate is a material selected for marking;
2. The device as claimed in claim 1, wherein the input selector is connected with a preferred input plug further comprising a 220VAC with grounding input plug and a 220VAC without grounding input plug.
3. The device as claimed in claim 1, wherein the interface relay auto reverses a polarity of the power supply during good grounding conditions.
4. The device as claimed in claim 1, wherein the PLC manipulates a plasma timing as per substrate for a minimum period of 2 seconds.
5. The device as claimed in claim 1, wherein a high voltage bombardment is enhanced by placing a 0.03 mm stainless steel mask between an electrode and a top surface of a stainless steel mask.
6. The device as claimed in claim 1, wherein the substrate is selected for a group of materials comprising an optical lens made of Resin, Polycarbonate, Acrylic, a glass with coating, a plastic, a polymer.
7. A method for marking over a plurality of substrates, wherein the marking is visible preferably in moist surrounding, wherein the method comprises the steps of:
determining a grounding condition at a place of marking;
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determining a nature of a target substrate, wherein the target substrate is a material selected for marking;
connecting an input selector with a preferred input plug, wherein the input plug a 220 VAC with grounding input plug and a 220 VAC without grounding input plug;
initiating a power supply, wherein the power supply is modulated by a power interlocking circuit and a programmable logic controller;
generating vacuum through a vacuum pump, wherein the vacuum pump activates a plurality of sensors to give an output to a high voltage circuit (HVC) module followed by generation of plasma in the vacuumed PGC;
marking selective design on a substrate through the generated plasma via a mask.
8. The method as claimed in claim 7, wherein a 220 VAC with grounding input plug is selected in a marking station with good grounding condition, wherein an interface relay auto reverses a polarity of the power supply during good grounding conditions.
9. The method as claimed in claim 7, wherein a 220 VAC without grounding input plug is selected in a marking station with good grounding condition.
10. The method as claimed in claim 7, wherein the substrate is selected for a group of materials comprising an optical lens, a glass with coating, a plastic, a polymer. , Description:A) TECHNICAL FIELD OF INVENTION
[001] The present invention generally relates to a marking device and particularly a device for providing a marking over a plurality of substrates and method for same. The present invention more particularly relates to a device to mark a logo or a word over a plurality of substrates with visibility only in moist ambience and invisible to naked eyes in dry environment.
B) BACKGROUND OF THE INVENTION
[002] A substrate marking is a process of placing a written symbol or word over the substrate that can be used as branding or information. One of the sub-category of substrate marking is a laser marking and laser engraving. The laser engraving, which is a subset of laser marking, is the practice of using lasers to engrave an object. The laser marking, on the other hand, is a broader category of methods to leave marks on an object, which also includes color change due to chemical/molecular alteration, charring, foaming, melting, ablation, and more. The technique does not involve the use of inks, nor does it involve tool bits which contact the engraving surface and wear out. laser engraving from alternative engraving or marking technologies where inks or bit heads have to be replaced regularly.
[003] Out of a plurality of technologies developed for marking a substrate, one discloses a system and method for providing a discernable marking within a substrate including forming a marking section substantially simultaneously with the formation of a bulk section of said lens. The marking section may be
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formed entirely during formation of the bulk section or may include preformed elements and may be extruded, inlaid, embedded, injected, or dyed within the bulk section. The bulk section may be formed as a rod, a sheet, or as an injection molded lens made of Resin, Polycarbonate, Acrylic, etc. The marking section extends substantially from the front to back surfaces of the lens.
[004] Another prior art for optical lens marking discloses a method including forming a mark outside a lens region set in a lens substrate, the mark being adapted to perform position alignment; pattern-forming a masking layer above one principal surface of the lens substrate while controlling formation position of the masking layer with the mark as a reference, the masking layer having an aperture at a predetermined position in the lens region; performing a selective process with respect to a surface exposed from the bottom of the aperture of the masking layer by performing a process from above the masking layer; and removing the masking layer from above the lens substrate to form a processed pattern by the selective process on the side of the one principal surface of the lens substrate.
[005] However, the prior arts mostly use automotive sparkplugs for a plasma conduction and water or a liquid borne principle for marking which leads inefficient transfer of electron onto the substrate. Thus, a quality of etched mark is low. Further, the prior arts techniques for marking is highly generic in nature i.e. a device or a system or a method used for an optical glass cannot be used with other substrates leading to a narrow utility.
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[006] In the view of foregoing, there is need for a device and a method for invisible marking over a range of substrates. Also there is a need for a device to implement an efficient plasma marking process enabling a mark with a longer life. Further there is a need for a device and a process with efficient working even under irregular grounding conditions.
[007] The above mentioned shortcomings, disadvantages and problems are addressed herein, as detailed below.
C) OBJECT OF THE INVENTION
[008] The primary object of the present invention is to provide a device and a method for marking over a range of substrates. The marking is visible only in moist ambience and invisible to the naked eyes during dry conditions.
[009] Another object of the present invention is to provide a device to implement an efficient plasma marking process enabling a mark with a longer life.
[0010] Yet another object of the present invention is to provide a device and a process with efficient working even under irregular grounding conditions.
[0011] Yet another objet of the present invention is to provide a device and a process for marking over a plurality of substrates with slow start switching modes to avoid interference with other power sensitive equipment.
[0012] Yet another object of the present invention is to provide a colorful interactive touch screen display for the easy changing of process parameters,
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process status and safety interlocking alarms taken from the input signal of the sensors used of the machine.
[0013] These and other objects and advantages of the embodiments herein will become readily apparent from the following detailed description taken in conjunction with the accompanying drawings.
D) SUMMARY OF THE INVENTION
[0014] The various embodiments of the present invention disclose a device for marking over a plurality of substrates. The marking is visible in moist surrounding. The device comprises an input selector, a power interlocking circuit, a switch mode power supply (SMPS) module, a programmable logic controller (PLC), a vacuum pump, a vacuum solenoid, a vacuum sensor, an interface relay, a high voltage circuit (HVC) module, a plasma generation chamber (PGC) module, an electrode, a substrate base, and a plurality of sensors. The input selector is a manually controllable power supply socket. The power interlocking circuit is connected to the input selector. The power interlocking circuit is further connected to an auxiliary power supply unit. The SMPS module is fed by a connector from the power interlocking circuit. The interface relay is fed in a parallel connection by the connector lines from the SMPS module, the PLC and the auxiliary power supply unit. The HVC module comprises a right HVC and a left HVC. The HVC module receives a common line from the power interlocking circuit. The HVC module is further fed by the interface relay. The PGC module is connected to the vacuum pump, the
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vacuum solenoid and the vacuum sensor. The PGC module comprises a left PGC and a right PGC. The left PGC is fed by a supply line from the left HVC and the right PGC is fed by a supply line from the right HVC. The left and right PGC is also connected to vacuum solenoid, a vacuum sensor individually which are connected to the vacuum pump. The electrode is connected to the PGC module. The electrode is covered by a mask cap. The substrate base supports a target substrate. The target substrate is a material selected for marking. The plurality of sensors are connected to the substrate base.
[0015] According to one embodiment of the present invention, the right PGC and the left PGC are connected to a vacuum pump which is continuously running and the solenoid switches ON either right or left PGC or both PGC. The set vacuum pressure after a certain time (minimally for 1 second) is reached, the timer will give pulse to the sensor which will trigger the HVC circuit and thus form the plasma. After plasma is generated the solenoid will automatically vent the chamber after the set marking time for a minimum period of 1 second. The said procedure is repeated for each marking cycle.
[0016] According to one embodiment of the present invention, the input selector is connected with a preferred input plug further comprising a 220VAC with grounding input plug and a 220VAC without grounding input plug.
[0017] According to one embodiment of the present invention, the interface relay auto reverses a polarity of the power supply during good grounding conditions.
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[0018] According to one embodiment of the present invention, the PLC manipulates a plasma timing as per substrate.
[0019] According to one embodiment of the present invention, the vacuum pump is continously ON for a set time. The pump is connected to a solenoid which will select to supply vacuum to the PGC as selected on the HMI (PLC), the vacuum generated on the PGC is will be sensed by a vacuum sensor connected to PGC. The vacuum sensor will give a pulse to the PLC once the target vacuum pressure is reached in a set time in PLC. Once this pulse is received by the PLC, it will trigger the interlocking relays, which will turn ON the HVC circuit, thus creating a plasma in the vacuumed PGC.
[0020] According to one embodiment of the present invention, a high voltage bombardment (Plasma) is enhanced by placing a 0.03 mm stainless steel between an electrode and a top surface of a stainless steel mask.
[0021] According to one embodiment of the present invention, the substrate is an optical lens with material selected from a group of materials comprising resin. polycarbonate, acrylic, a glass with coating, a plastic and a polymer.
[0022] The embodiments herein provide a method for marking over a plurality of substrates. The marking is visible preferably in moist surrounding. The method comprises the steps of:
a) determining a grounding condition at a place of marking;
b) determining a nature of a target substrate which is a material selected for marking;
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c) connecting an input selector with a preferred input plug. The input plug comprises a 220 VAC with grounding input plug and a 220 VAC without grounding input plug;
d) initiating a power supply which is modulated by a power interlocking circuit and a programmable logic controller;
e) generating vacuum with help of a vacuum pump, which is connected to a vacuum solenoid and vacuum sensor.
f) generating plasma through a high voltage circuit (HVC) module;
g) marking selective design on a substrate through the generated plasma via a mask.
[0023] According to one embodiment of the present invention, a 220 VAC with grounding input plug is selected in a marking station with good grounding condition. An interface relay auto reverses a polarity of the power supply during good grounding conditions.
[0024] According to one embodiment of the present invention, a 220 VAC without grounding input plug is selected in a marking station with good grounding condition.
[0025] These and other aspects of the embodiments herein will be better appreciated and understood when considered in conjunction with the following description and the accompanying drawings. It should be understood, however, that the following descriptions, while indicating preferred embodiments and numerous specific details thereof, are given by way of illustration and not of limitation. Many changes and modifications may be made within the scope of
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the embodiments herein without departing from the spirit thereof, and the embodiments herein include all such modifications.
[0026] According to one embodiment herein, the said apparatus and method for marking a substrate is not limited to 2 marking stations (Right & Left), but the same principle can be used with other variations, for example machine with only one marking station or multiple marking station.
E) BRIEF DESCRIPTION OF THE DRAWINGS
[0027] The other objects, features and advantages will occur to those skilled in the art from the following description of the preferred embodiment and the accompanying drawings in which:
[0028] FIG. 1 illustrates an architectural diagram of a device for marking over a plurality of substrates, according to one embodiment of the present invention.
[0029] FIG. 2A, 2B, 2C and 2D illustrates a rear view, a top view, a front view and an exploded view respectively of the device for marking over a plurality of substrates, according to one embodiment of the present invention.
[0030] FIG. 3A and 3B illustrates top view and a perspective view respectively of a circuit diagram for a power supply base plate, according to one embodiment of the present invention.
[0031] FIG. 4A, 4B, 4C, 4D and 4E illustrates a top view, a rear view, a sectional view, a perspective view and an exploded view respectively of a PGC module, according to one embodiment of the present invention.
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[0032] FIG. 5 illustrates a flowchart for a method for marking over a plurality of substrates, according to one embodiment of the present invention.
F) DETAILED DESCRIPTION OF THE DRAWINGS
[0033] In the following detailed description, a reference is made to the accompanying drawings that form a part hereof, and in which the specific embodiments that may be practiced is shown by way of illustration. The embodiments are described in sufficient detail to enable those skilled in the art to practice the embodiments and it is to be understood that the logical, mechanical and other changes may be made without departing from the scope of the embodiments. The following detailed description is therefore not to be taken in a limiting sense.
[0034] FIG. 1 illustrates an architectural diagram of a device for marking over a plurality of substrates, according to one embodiment of the present invention. With respect to FIG. 1, the device comprises an input selector 101, a power interlocking circuit 102, a switch mode power supply (SMPS) module 103, a programmable logic controller (PLC) 104, an interface relay 105, a high voltage circuit (HVC) module 106, a plasma generation chamber (PGC) module 107, an electrode, a substrate base and a plurality of sensors. The input power selection is manually selected by using either of the two input plugs 101 this input power plugs will be feed to the power interlocking relays 102, which will trigger the SMPS power supply 103, and the PLC 104, based on the power supply grounding available on site. The power interlocking circuit 102 chooses the type of supply to be fed to the HVC module 106, the SMPS 103, and the
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PLC 104. The SMPS module 103 gives power to the interfacing relays and the solenoids on both heads. The PLC 104 gives an output pulse to the interfacing relays 105 based on the programs setting and timing. The interface relay 105 turns on the vacuum pump (motor) and opens the solenoid valve so that vacuum is created in the PGC module 107. Once vacuum is created, the vacuum sensor 109 evaluates whether the vacuum setting is reached a preset unit. The vacuum sensor 109 then gives a pulse to the PLC 104 to turn the plasma, otherwise a ‘low vacuum message’ is displayed. Once plasma is turned on, the HVC module 106 gives plasma energy through the central electrode which is inside the vacuumed PGC. Each PGC comprises a central electrode further connected to the HVC module 106. The PGC module 107 is covered from a top surface by a mask. This mask is held in place with a Teflon alignment ring and a twist lock cap. The substrate is then placed on top of the mask. The target substrate is a material selected for marking.
[0035] FIG. 2A, 2B, 2C and 2D illustrates a rear view, a top view, a front view and an exploded view respectively of the device for marking over a plurality of substrates, according to one embodiment of the present invention. With respect to FIG. 2A, 2B, 2C and 2D, the marking device comprises a housing 212. The housing 212 supports a set of fans 202 for cooling an assembly of the marking device. Each fan 202 is covered by a fan guard which is fitted in a slot provided in the housing 212. The housing 212 further supports a PGC assembly 201, a PGC holder 204, a switch 208, a human machine interface 203, a resettable tripper 207, a PLC base plate 213, a MCB switch
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206, a vacuum pump hose inlet 205, a vacuum pump connector socket 211, an input selector, and a foot switch with connector 204. The PLC base plate 213 is fixed over a plurality of legs. The input selector comprises a socket with grounding 209 and a socket without grounding 210.
[0036] FIG. 3 illustrates a circuit diagram for a PLC base plate, according to one embodiment of the present invention. With respect to FIG. 3, the PLC base plate comprises a PLC power interfacing relays 301, a PLC 302, a main SMPS with 24V 303, a 24V distribution line 304, an auxiliary SMPS with 12V supply 305, a high voltage box 306, a wire housing 307, a relay support and a leg of the PLC base plate 308. The PLC interfacing relays 301 allows a switching of connection of the PLC 302 during a variable power requirement on the basis of a selection of a substrate. The 24V distribution line 304 derives a power directly from the auxiliary power supply.
[0037] FIG. 4A, 4B, 4C, 4D and 4E illustrates a front view, a rear view, a perspective view, a sectional view and an exploded view respectively of a PGC module, according to one embodiment of the present invention. With respect to FIG. 4A-4E, the PGC module comprises a Plasma Generation Chamber (PGC) 406 as a primary component in guiding a generated plasma towards the target substrate. The PGC 406 is fixed over an insulated jig holder (405 & 407) which in combination of the PGC 406 radially houses an electrode assembly. The electrode assembly comprises a HV Central Copper Electrode 409 for generating plasma, an insulation cap 410 surrounding the Central Copper Electrode 409, a Central Copper Electrode holder 411 and the electrode
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assembly safety cover 408. The insulated jig holder 405 further supports a fog nut 404, a mask 403, a body cap 402 and a Teflon ring 401. The fog nut 404, the mask 403, the body cap 402 and the Teflon ring 401 forms a cap assembly alternatively named as a twist lock. The cap assembly allows a device operator for quick change over of a plurality of labels done on a steel substrate. With the said cap assembly, no alignment of the mask 403 is needed and no hassle for tightening the body cap 402, thus making a process of changing the mask for label changeovers very fast for the operator. The PGC 406 is axially connected a solenoid valve 412 and an inch connector 413. The solenoid valve 412 and the inch connector 413 are connected to the PGC 406 at orthogonal position against each other.
[0038] According to one embodiment of the present invention, the power input plug comprises a 220 VAC, 50Hz/60Hz, with grounding input plug and a 220 VAC, 50Hz/60Hz without grounding input plug. The power input plug is adaptable to suit other voltages and frequencies as available. Any power input plug can be selected to run the machine depending on the input power conditions at the site. One power input can be used when the ground voltage condition is good (less than 5v from neutral to Earth potential difference), the other input power can be used when the Ground voltage condition is not good (more than 5v from neutral to earth potential difference).
[0039] According to one embodiment of the present invention, the interface relay auto reverses a polarity of the power supply during good grounding conditions.
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[0040] According to one embodiment of the present invention, the PLC manipulates plasma energy time as per substrate.
[0041] According to one embodiment of the present invention, the high voltage bombardment is enhanced by placing 0.03 mm stainless steel mask between the electrode and a top surface of the substrate. This is very important as the transfer of electrons or plasma is propagated to the top substrate surface creating a sharp mark on the substrate.
[0042] According to one embodiment of the present invention, the substrate is an optical lens with material selected from a group of materials comprising resin. polycarbonate, acrylic, a glass with coating, a plastic and a polymer.
[0043] FIG. 5 illustrates a flowchart for a method for marking over a plurality of substrates, according to one embodiment of the present invention. With respect to FIG. 5, the method comprises the steps of:
a) determining a grounding condition at a place of machine installation (501);
b) determining a nature of a target substrate which is a material selected for marking (502);
c) Based on the grounding voltage, connecting the input plug, to a 220 VAC socket with ground or a 220 VAC socket without grounding (503);
d) initiating a power supply which is modulated by a power interlocking circuit (504);
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e) initiating a marking cycle by a start switch to trigger a vacuum pump and create a vacuum in the PGC module (505);
f) generating a plasma through a high voltage circuit (HVC) module (506);
g) marking a selective design on a substrate through the generated plasma via mask (507).
[0044] According to one embodiment of the present invention, a 220 VAC with grounding input plug is selected in a marking station. An interface relay auto reverses a polarity of the power supply during good grounding conditions.
[0045] According to one embodiment of the present invention, a 220 VAC without grounding input plug is selected in a marking station without good grounding condition.
G) ADVANTAGES OF THE INVENTION
[0046] The said device provides a marking which is visible only in moist ambience and invisible to the naked eyes during dry conditions, thus enhancing a brand promotion of product. The device implements an efficient plasma marking process with help of vacuum, enabling a mark with a longer life and allows efficient working even under irregular grounding conditions. The present invention provides a device and a process for marking over a plurality of substrates with slow start switching modes to avoid interference with other power sensitive equipment.
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[0047] It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the spirit and scope of the claims.