The present disclosure described herein, in general, relates to a driver used for operating a light emitting diode (LED) device and more particularly relates to the configuration of the driver that helps in regulating the power required for an LED or array of LEDs.
BACKGROUND
[0002] Background description includes information that may be useful in understanding the present disclosure. It is not an admission that any of the information provided herein is prior art or relevant to the presently claimed subject matter, or that any publication specifically or implicitly referenced is prior art.
[0003] The present disclosure relates to LED devices and circuits of LED driver used for operating LEDs in lighting applications.
[0004] Nowadays, LEDs are increasingly being used in place of lamps and bulbs for lighting applications. An LED lamp or LED light bulb is an electric light that produces light using light-emitting diodes (LEDs). The LED devices are significantly more energy-efficient than equivalent incandescent lamps and can be significantly more efficient than most fluorescent lamps. The most efficient commercially available LED devices have efficiencies up to 200 lumens per watt (Lm/W). In addition, the commercial LED devices have a lifespan many times longer than incandescent lamps.
[0005] Generally, the LED devices require an electronic LED driver circuit with special Integrated Circuits to operate from mains power lines. This LED driver controls the brightness and uniformity of the light emitted from each string of LEDs. In addition, this LED driver has special electronic circuit that precisely control the LED current and voltage. For example, a string of "m" LEDs connected in series requires a voltage

approximately equal to 3.1 to 3.5 (typically 3.3) times "m" to operate consistently. Therefore, in order to supply the requisite amount of voltage to a LED string, a circuit is required which consists of set of capacitor and resistor that are connected with one another in such a manner that the circuit controls the excess voltage and reduces the fluctuation of voltage in a circuit.
[0006] Some of the prior arts tried to overcome this problem by proposing the circuit but fails to do it efficiently.
[0007] Hence, there is need of the driver having circuit that effectively controls the improve power factor, increased protection against high voltages and handle high Surge Voltages supplied to the LED device.
OBJECTS OF THE DISCLOSURE
[0008] Some of the objects of the present disclosure, which at least one for embodiment herein satisfy, are listed herein below.
[0009] It is a primary object of the present disclosure to provide the driver that increases the surge immunity of the LED device.
[0010] It is general object of the present disclosure to provide the driver that absorbs the excess voltage supplied to the LED device.
[0011] It is another object of the present disclosure to provide the driver that enhance the power factor.
[0012] It is yet another object of the present disclosure to provide the driver that limit the amount of inrush current supplied to the LED device.
[0013] It is another object of the present disclosure to provide the driver that protects the LED from abrupt input voltage.
[0014] It is further another object of the present disclosure to provide the driver that protects the LED from excess voltage variation.

[0015] These and other objects and advantages will become more apparent when reference is made to the following description and accompanying drawing.
[0016] It is further another object of the present disclosure to provide the driver that improve the power factor of the circuitry used to reduce line losses and also help to comply with the government regulations.
SUMMARY
[0017] This summary is provided to introduce concepts relates to a driver used for operating a Light emitting diode (LED) device.
[0018] In accordance with an embodiment, the present disclosure provides a driver that comprises a fuse resistor FR in connection with a positive terminal of a main power source; a capacitor C1 in series connection with said fuse resistor FR; and a resistor R3 in series connection with said capacitor C1 at one end and an output terminal at other end.
[0019] In accordance with an aspect, the present disclosure provides the driver in which a fuse resistor FR is connected in series with the resistor R1.
[0020] In accordance with an aspect, the present disclosure provides the resistor R1 that is connected in parallel with the capacitor C1.
[0021] In accordance with an aspect, the present disclosure provides a resistor R2 that is connected in parallel with the resistor R3.
[0022] In accordance with an aspect, the present disclosure provides a capacitor C2 that is connected in parallel with the resistor R3.
[0023] In accordance with an aspect, the present disclosure provides a bridge rectifier that is connected in series with the capacitor C1 at one end and the resistance R3 at other end.

[0024] In accordance with an aspect, the present disclosure provides the bridge rectifier that includes a set of diodes D1 to D4.
[0025] In accordance with an aspect, the present disclosure provides the LED device that includes bulb, downlight, spotlight, flood light, false ceiling lights etc.
[0026] In accordance with an aspect, the present disclosure provides the driver that is mounted over a printed circuit board (PCB).
[0027] In accordance with an aspect, the present disclosure provides the driver that is mounted over a metal core printed circuit board (MCPCB).
[0028] In accordance with an aspect, the present disclosure provides the driver that is standalone PCB.
[0029] In order to further understand the characteristics and technical contents of the present subject matter, a description relating thereto will be made with reference to the accompanying drawings. However, the drawings are illustrative only but not used to limit the scope of the present subject matter.
[0030] Various objects, features, aspects, and advantages of the inventive present disclosure will become more apparent from the following detailed description of preferred embodiments, along with the accompanying drawing figures in which like numerals represent like components.
BRIEF DESCRIPTION OF THE DRAWINGS
[0031] It is to be noted, however, that the appended drawings illustrate only typical embodiments of the present disclosure and are therefore not to be considered for limiting of its scope, for the invention may admit to

other equally effective embodiments. The detailed description is described with reference to the accompanying figures.
[0032] The illustrated embodiments of the present disclosure will be best understood by reference to the drawings, wherein like parts are designated by like numerals throughout. The following description is intended only by way of example, and simply illustrates certain selected embodiments of devices, systems, and methods that are consistent with the present disclosure as claimed herein, wherein:
[0033] FIG.1 illustrates the circuit of a driver that operates the LED lamp in accordance with an embodiment of the present disclosure;
[0034] FIG.2A and 2B illustrate the driver mounted over the PCB and the MCPCB of the LED lamp in accordance with an embodiment of the present disclosure;
[0035] FIG.3A and 3B illustrate the driver mounted over the PCB and the MCPCB of the LED downlight in accordance with an embodiment of the present disclosure;
[0036] FIGS.4A^E illustrate a structure of a heat sink of a LED lamp in accordance with an embodiment of the present disclosure;
[0037] FIGS.5A and 5B illustrate a structure of a base cap and a PC diffusor of the LED lamp in accordance with an embodiment of the present disclosure;
[0038] FIGS.6A-6C illustrate a structure of MCPCB and a child PCB and an assembly between them inside the LED lamp in accordance with the embodiment of the present disclosure;
[0039] FIGS.7A and 7B illustrate the insertion of the assembly between the MCPCB and the child PCB inside the heat sink of the LED lamp in accordance with the embodiment of the present disclosure;

[0040] FIGS.8A and 8B illustrate the attachment between the heat sink and the base cap of the LED lamp in accordance with the embodiment of the present disclosure;
[0041] FIGS.9A and 9B illustrate the attachment between the heat sink and the PC diffusor of the LED lamp in accordance with the embodiment of the present disclosure;
[0042] FIG.10 illustrates the various components of the LED bulb and placement of the same inside the LED bulb;
[0043] FIGS.11A and 11B illustrate the insertion of the assembly between the MCPCB and the child PCB inside the heat sink of the LED downlight in accordance with the embodiment of the present disclosure;
[0044] FIGS.12A and 12B illustrate the attachment between the heat sink and the PC diffusor of the LED downlight in accordance with the embodiment of the present disclosure; and
[0045] FIG.13 illustrates the various components of the LED downlight and placement of the same inside the LED downlight.
[0046] The figures depict embodiments of the present disclosure for the purposes of illustration only. A person skilled in the art will easily recognize from the following description that alternative embodiments of the structures and methods illustrated herein may be employed without departing from the principles of the disclosure described herein.
DETAILED DESCRIPTION [0047] The detailed description of various exemplary embodiments of the disclosure is described herein with reference to the accompanying drawings. It should be noted that the embodiments are described herein in such details as to clearly communicate the disclosure. However, the amount of details provided herein is not intended to limit the anticipated variations of embodiments; on the contrary, the intention is to cover all

modifications, equivalents, and alternatives falling within the spirit and scope of the present disclosure as defined by the appended claims.
[0048] It is also to be understood that various arrangements may be devised that, although not explicitly described or shown herein, embody the principles of the present disclosure. Moreover, all statements herein reciting principles, aspects, and embodiments of the present disclosure, as well as specific examples, are intended to encompass equivalents thereof.
[0049] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises", "comprising", "includes" and/or "including," when used herein, specify the presence of stated features, integers, steps, operations, elements and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof.
[0050] It should also be noted that in some alternative implementations, the functions/acts noted may occur out of the order noted in the figures. For example, two figures shown in succession may, in fact, be executed concurrently or may sometimes be executed in the reverse order, depending upon the functionality/acts involved.
[0051] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which example embodiments belong. It will be further understood that terms, e.g., those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0052] Embodiments described herein relates to a driver for an LED device. FIG.1 illustrates the circuit of a driver that operates the LED device in accordance with an embodiment of the present disclosure.
[0053] The driver for operating a Light emitting diode (LED) device comprises a primary circuit 102 for regulating an input source voltage Vac received from a main power source, a secondary circuit 106 for generating a resultant output voltage across output terminals ab, and an interconnection circuit 104 for connecting the output of the primary circuit 102with the input of the secondary circuit.
[0054] Here the primary circuit 102 comprises a fuse resistor FR whose first end is connected with the positive terminal of the main power source and the second end is connected with the resistor R1 that is further connected in parallel with the capacitor C1. The fuse resistor FR increases the surge immunity of the circuit. The surge immunity of the circuit is measured on the basis of the capacity of the circuit to bear high-energy disturbances caused by the fluctuations in power and interconnection lines & overvoltage's from switching and lightning transients. In this manner, this FR protect the whole circuit from getting damaged by increasing the surge immunity of the circuit that in turn increases the life of lamp. In past the surge immunity of the driver is generally 1.5KV, but because of the addition of the fuse resistor FR, the surge immunity of the proposed LED driver is increases up to 4KV, which in turn increases the life of the lamp device.
[0055] In addition, the capacitor is also attached in the primary circuit 102 that also regulates the voltage supplied to the LED by absorbing the excess voltage supplied to the LED from the main power source. Precisely, the capacitor C1 is connected in series with the fuse resistor FR that helps in reducing almost 100~120V of voltage, that fulfil the biggest requirement of circuit.

[0056] Moreover, the capacitor C1 of the primary circuit 102 is connected in parallel with the resistor R1 that also helps in regulating the voltage supplied.
[0057] The other end of the capacitor C1 of the primary circuit 102 is connected with the interconnection circuit. The interconnection circuit 104 consists of a set of diodes D1 to D4 forming a bridge rectifier 104-B for reducing the AC voltage coming out of the primary circuit. The interconnection circuit 104 mainly built up the connection between the primary circuit 102 and the secondary circuit.
[0058] The secondary circuit 106 consists of a resistor R3 that is connected in parallel with the resistor R2 and the capacitor C2 that enhances the overall efficiency of the circuit.
[0059] The resistor R3 of the secondary circuit 106 enhances the power factor of the circuit. It also limits the amount of inrush current and protect the LED from abrupt input voltage variation.
[0060] As mentioned above, the term "inrush current" indicates a huge amount of current that rushes into the circuit when a device is turned on during the initial stage. By definition, it can be defined as the maximum instantaneous input current drawn by an electrical device when it is turned on. This behavior can be well observed in AC inductive loads like Transformers and Motors, where the inrush current value will normally be twenty or thirty times more than the nominal values. Even though the value of inrush current is very high it occurs only for a few milliseconds or microseconds hence cannot be noticed without a meter. Inrush current can also be called as Input surge current or Switch-on surge current based on convenience. Since this phenomenon is more with AC loads, AC Inrush current limiter is more used than its DC counterpart.
[0061] Each and every circuit draws current from a source depending on the state of the circuit. Let's assume a circuit that has three states, that

is idle state, normal working state, and maximum working state. In idle state, the circuit draws 1mA of current, in a normal working state the circuit draws 500mA of current and in the maximum working state it can draw 1000mA or 1A of current. Therefore, if the circuit mostly works in a normal state, 500mA is the steady-state current for the circuit, whereas 1A is the peak current drawn by the circuit.
[0062] But, as mentioned earlier there is another state exists when the current drawn by the circuit can be 20 or even 40 times larger than the steady-state current. It is the initial state or power on stage of the circuit. So, when this high current such as 1mA to the 1000mA is suddenly drawn by the circuit that is rated for low current application, there is chances of failure of the circuit. Here this problem is solved by inclusion of resistant R3 in a circuit.
[0063] In general, the LED device includes all set of devices that includes a set of semiconductor light source that emits light when current flows through it. This set of semiconductor light are called as LED. The devices which incorporates LEDs for emitting light are called as LED devices. The LED device includes bulb, downlight, spotlight, flood light, false ceiling lights etc.
[0064] FIG.2 depicts the fixment of driver over the PCB and MCPCB of the LED bulb.
[0065] FIG.2A depicts the driver mounted over the printed circuit board and FIG.2B depicts the driver mounted over the MCPCB in LED bulb.
[0066] Similarly, FIG.3A and 3B depict the fitment of driver over the PCB and MCPCB in the LED downlight. FIG.3A depicts the driver mounted over the printed circuit board and FIG.3B depicts the driver mounted over the MCPCB in LED downlight. In some of the LED devices, the driver is on board PCB.

[0067] The present disclosure further proposes the various components of the LED bulb and the assembling of the same.
[0068] The LED lamp 400 proposed in the present disclosure comprises a heat sink 402 as shown in FIGS. 4A-4E. This FIGS. 4A^4E depict the LED heat sink 402 that is of cylindrical shaped structure in which the top end 402-T is of larger diameter as compared with the bottom end 402-B. This heat sink 402 is made of electrically Insulated plastic material like polyamide or Polybutylene Terephthalate having a lower conductivity up to 2w/m-k and also provide the complete electrical insulation properties to end user.
[0069] The experiments have been carried out to determine the material that can be used for manufacturing the heat sink as there is need to optimize the material's cost, manufacturing process, manufacturing costs required for manufacturing the heat sink 402 and also satisfy the ANSI dimensional requirements. In order to achieve all the objectives, the heat sink 402 is made of electrically Insulated plastic material like polyamide or Polybutylene Terephthalate through insert moulding process and.
[0070] In addition, FIG.4A illustrates a plurality of grooves 402-G formed at the inner circumference of the heat sink 402 that is used to fix MCPCB 204 on the provided grooves on heat sink 402. This kind of MCPCB 204 insertion inside the heat sink 402 will make a proper contact area between the MCPCB 204 and the heat sink 402. This configuration is best to protect the component from getting damage, which in turn compensates the process time during production.
[0071] FIG.4B indicates a plurality of slots 402-S formed at the inner circumference of the heat sink 402 above the plurality of grooves to lock the PC diffusor 406. Generally, the PC diffuser 406 is press fitted with the heat sink 402 during diffuser fitting process.

[0072] FIG.4C illustrates protrusions 402-P made at the bottom end 402-B of the heat sink 402. These protrusions 402-P are made in such manner that the heat sink 402 will pass the high potential test as well as cut down the material cost at the same time.
[0073] FIG.4D illustrates a circular band 402-C that is attached at the bottom end of the heat sink 402 and is used to fit the base cap 408 (not shown) via help of crimping process, it comes up in standard form as per inner diameter of a base cap 408.
[0074] FIG.4E illustrates an AL insert 402-1 that is fitted inside the heat sink 402 and it helps in better heat dissipation during lamp operation. This combination helps in achieving best class conductivity up to 205 W/m-k.
[0075] FIG.5A depicts the structure of the base cap 408 that is fitted at the bottom end 402-B of the heat sink 402.
[0076] FIG.5B depicts the PC diffusor 406 having dome-shaped structure. It has grooves that helps in locking with the heat sink 402. The PC diffusor of the present disclosure is made of polycarbonate material that diffuse the light emitting from the LED in a proper manner and also will not harm during direct exposure. The no. of experiments have been carried out to determine the material for manufacturing the PC diffusor that optimize the material's cost, manufacturing costs, manufacturing process and also meeting the ANSI dimensional requirements.
[0077] The present disclosure further focusses on the assembly between the MCPCB and the child PCB that is placed inside the LED device.
[0078] In the existing LED device, all the components are mounted on MCPCB that results in overheating of the board. Due to this overheating, some of the components got disconnected from the circuit that may results in discontinuing the power supply to the circuit. In addition, sometimes AC is directly supplied to board due to which there is great chances of

dielectric break of MCPCB. Therefore there is a need to made MCPCB of materials having high dielectric constant. This in turn increases the overall cost of the LED device.
[0079] Hence, there is requirement to connect the PCB and MCPCB in such a manner that overcomes the problem associated with the existing LED device.
[0080] Here, the FIG.6A illustrates the MCPCB 204 having circular shaped structure over which the multiple LED lamps are attached. It further comprises a rectangular slot formed at the centre
[0081] FIG.6B illustrates the child PCB 210 having rectangular shaped structure in which the upper end 210-U of said PCB 210 includes a rectangular shaped protrusion 210-P attached in a middle 210-M having a space in between to form a U-shaped structure.
[0082] FIG.6C depicts the assembly between the MCPCB 204 and the child PCB 210. This is the first stage of the assembly. During assembly, the protrusion 210-P of the child PCB 210 is fitted inside the slot 204-S formed in the MCPCB 204 through press fit mechanism. Through this configuration, the child PCB 210 is easily fitted and removed from the MCPCB 204 as per the requirements. This type of connection between the MCPCB 204 and the child PCB 210 increases the life of the lamp as well as provide better light distribution and also reduces the chances of excessive heating of the components as less no. of components are attached with the MCPCB 204.
[0083] This type of assembly between the MCPCB 204 and the PCB 210 avoid use of screw and application of thermal paste as used in most of the conventional LED device.
[0084] During assembly, the second stage is insertion of the unit assembled in first stage inside the heat sink 402 by matching the outer diameter of MCPCB 204 with groove 402-G provided inside the heat sink

402 and the next stage is to press the MCPCB 404 with the help of pressing jig into heat sink 402 to tightly fit the whole unit for better heat dissipation as depicted in FIG.7A. In addition, the FIG.7B depicts the complete assembly between the MCPCB 204 and the PCB 210 placed inside the heat sink 402.
[0085] The fitting between MCPCB & heat sink needs to be tight enough, as it directly affects the life of lamp, therefore the provision is made to establish the proper contact in between the MCPCB & heat sink, which will ultimately give better life to lamp from heat point of view.
[0086] The proposed fitting between the MCPCB and the heat sink results in no air gap between the MCPCB 204 and the heat sink 402 that in turn helps in dissipating the generated heat in an effective manner. In addition, the thermal resistance points are also less that results in zero tolerance in between the MCPCB outer diameter and the inner diameter of the groove of the heat sink.
[0087] After placing the assembly inside the heat sink 402, the third stage is insertion of the base cap 408 or Hard Wire at the bottom end 402-B of the heat sink 402 as shown in FIG.8A by inserting both input wire in to hole provided in base cap 408 , then next process is to crimp the base cap 408 with the help of crimping machine properly so that base cap 408 do not get open up during retrofit insertion in holder, now next process is to solder the input wire on eyelet provided on the base cap 408 in proper manner so that solder flux do not get over flow, it directly affect the high potential test criteria as per IS standard.
[0088] After attaching the base cap 408 at the bottom of the heat sink 402 as shown in FIG.8B, the fourth stage is to fix the PC diffuser 406 over the top end 402-T of the heat sink 102 as shown in FIG.9A, in this process the silicon glue is applied on heat sink 402 at 360 degree on defined surface & then the PC diffuser 406 is pressed on the same spot by aligning the protrusions in PC diffuser 406 & slot 402-S formed on the

inner circumference of the heat sink above the grooves 402-G as shown in FIG.9B, here diffuser transparency will have huge impact over end user, if diffuser transparency is good enough than then light coming out of lamp will be good for end user. If diffuser transparency is bad, then light coming out of lamp will harm the eye sight of end user.
[0089] FIG.10 depicts all the components that are fitted inside the LED bulb to form the complete LED bulb.
[0090] In addition, due to the proposed structure of the LED lamp, the LED lamp provides better performance. The power factor (PF) is also enhanced by 0.2, which give much benefit to whole circuit. It also limits the Inrush current of the driver circuit.
[0091] Moreover, with the proposed assembly between the MCPCB and the child PCB inside the LED lamp, as described in the present disclosure, various technical problems of the state of the art are resolved. Also, although a number of exemplary components and the method of installation are described herein, those skilled in the art can appreciate that proposed assembly inside the LED lamp helps the lamp to work effectively, without deviating from the scope of the subject matter of the present disclosure.
[0092] This proposed assembly between the MCPCB and the child PCB is also fitted inside the LED downlight, as described in the FIGS. 11A-11B. The LED (Light Emitting Diode) downlight is a light fixture that comes with an easy installation process and can be fitted into any blank surface on the ceiling. These are fantastic lighting discoveries with energy-saving capability that can be used in a wide array of applications. These emit light that is either in the below direction with a narrow and accurate beam.
[0093] FIG.11A depicts the assembly between the child PCB 210 and the MCPCB 204 placed inside the heat sink 402 of the LED downlight

similar to the one proposed in the LED bulb. FIG.11B depicts the complete assembly fitted inside the heat sink 402 of the LED downlight.
[0094] FIG.12A depicts the placement of the PC diffusor 406 over the heat sink 402 of the LED downlight. FIG.12B depicts the PC diffusor 406 tightly fitted over the heat sink 402. In this way, the proposed assembly between the child PCB 210 and the MCPCB 204 increases the overall efficiency of the LED lights.
[0095] FIG.13 depicts all the components that are fitted inside the LED downlight to form the complete LED downlight.
[0096] Further, it will be appreciated that those skilled in the art will be able to devise various arrangements that, although not explicitly described or shown herein, embody the principles of the invention and are included within its scope.
[0097] Furthermore, all examples recited herein are principally intended expressly to be only for pedagogical purposes to aid the reader in understanding the principles of the invention and the concepts contributed by the inventor(s) to furthering the art and are to be construed as being without limitation to such specifically recited examples and conditions. Also, the various embodiments described herein are not necessarily mutually exclusive, as some embodiments can be combined with one or more other embodiments to form new embodiments.
[0098] While the foregoing describes various embodiments of the invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof. The scope of the invention is determined by the claims that follow. The invention is not limited to the described embodiments, versions or examples, which are included to enable a person having ordinary skill in the art to make and use the invention when combined with information and knowledge available to the person having ordinary skill in the art.

TECHNICAL ADVANTAGES
[0099] The present disclosure provides the driver that increases the surge immunity of the LED device.
[00100] The present disclosure provides the driver that absorbs the excess voltage supplied to the LED device.
[00101] The present disclosure provides the driver that enhance the power factor.
[00102] The present disclosure provides the driver that limit the amount of inrush current supplied to the LED device.
[00103] The present disclosure provides the driver that protects the LED from abrupt input voltage variation.
[00104] While the foregoing describes various embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof. The scope of the invention is determined by the claims that follow. The present disclosure is not limited to the described embodiments, versions or examples, which are included to enable a person having ordinary skill in the art to make and use the present disclosure when combined with information and knowledge available to the person having ordinary skill in the art.

WE CLAIM:

1. A driver (100) for operating a Light emitting diode (LED) device
(400), the driver (100) comprises:
a fuse resistor (FR) in connection with a positive terminal (L) of a main power source;
a capacitor (C1) in series connection with said fuse resistor (FR); and
a resistor (R3) in series connection with said capacitor (C1) at one end and an output terminal (A) at other end.
2. The driver (100) as claimed in claim 1, wherein a resistor (R1) is connected in series with the fuse resistor (FR).
3. The driver (100) as claimed in claim 2, wherein the resistor (R1) is connected in parallel with the capacitor (C1).
4. The driver (100) as claimed in claim 1, wherein a resistor (R2) is connected in parallel with the resistor (R3).
5. The driver (100) as claimed in claim 1, wherein a capacitor (C2) is connected in parallel with the resistor (R3).
6. The driver (100) as claimed in claim 1, wherein a bridge rectifier (104-B) is connected in series with the capacitor (C1) at one end and the resistance (R3) at other end.
7. The driver (100) as claimed in claim 6, wherein the bridge rectifier (104-B) includes a set of diodes (D1-D4).

8. The driver (100) as claimed in claim 1, wherein the LED device (400) includes bulb, downlight, spotlight, flood light, false ceiling lights etc.
9. The driver (100) as claimed in claim 1, wherein the driver (100) is mounted over a printed circuit board (PCB) (102).
10. The driver (100) as claimed in claim 1, wherein the driver (100) is mounted over a metal core printed circuit board (MCPCB) (104).
11. The driver (100) as claimed in claim 1, wherein the driver (100) is standalone PCB.