Abstract: A system (200) for manufacturing a radio frequency identification (RFID) tag is disclosed. The system comprises a fixture (100), the fixture includes a base plate (101) and a receiving plate (119) fixed to the base plate. The receiving plate is configured to receive an IC chip (102) and a coil (103). A first module (106) is fixed to the base plate. The first module comprises of a first actuator (115) to align the IC chip. A second module (108) is fixed to the base plate and is provided with a second actuator (116). The second actuator is configured to displace and position the coil adjacent to the IC chip on the receiving plate. The fixture also includes a third module (110) fixed to the base plate and is configured to receive leads of the coil and position it on the IC chip for manufacturing the RFID tag. Figure 1 is the representative figure.
DESC:TECHNICAL FIELD
The present disclosure generally relates to the field of manufacturing. Particularly but not exclusively, the present disclosure relates to manufacturing of a Radio Frequency Identification (RFID) tag. Further embodiments of the present disclosure discloses a system for aligning coil and IC chip during manufacturing of the RFID tag.
BACKGROUND OF THE DISCLOSURE
RFID system enables radio communications to be carried out between RFID tags and an RFID reader-writer. Each of the RFID tags may be equipped with an IC chip and an antenna. The RFID tag works by transmitting and receiving information via the antenna and the IC chip also sometimes called a microchip. The IC chip embedded on an RFID reader is written with the information that is required by the user. There are two main types of RFID tags, namely active and passive. The active type RFID tags contain an onboard battery as a power supply, whereas a passive type RFID tag does not need on-board battery, instead it works by using electromagnetic energy transmitted from an RFID reader. The active type RFID tags might also be called as battery-operated RFID tags. Active-type RFID tags have merits, such as long-range communication and communicative stability as compared with the passive-type tags. However, active-type tags also have demerits, such as complication in their structure, enlargement of their size, and high cost. Given the demerits of active-type tags and with the advancement in technology, the downsizing and migration to higher performance of IC chips used for passive-type in semiconductor technologies can be seen. In the case of a passive-type tag of electromagnetic induction type which is applied to an RFID tag, a voltage is induced in the RFID tag due to an electromagnetic induction action between a transmission antenna coil of a reader-writer and an antenna coil of the RFID tag. This voltage starts the IC chip of the tag, so that communications may be carried out between them within the induction field caused by an RFID reader-writer.
When a passive RFID tag is scanned by a reader, the reader transmits energy to the tag which powers it for the chip and antenna to relay information back to the reader. The reader then transmits this information back to an RFID computer program for interpretation.
Passive RFID tags are economical than active RFID tags. This makes them a popular choice for tracking cattle, tracking consumer products, tracking vehicles, airline passengers, Alzheimer's patients, pets, supply chain management, race tracking, file management, and access control applications, etc. Also, they are small in size, lightweight, and can potentially last a lifetime. Thus, there is a huge demand for RFID tags.
An RFID system is time-consuming and labor-intensive to set up and manufacture. In order to meet the growing demands of the market for RFID, productivity has to be increased without reducing the reliability of the product. First step of manufacturing the RFID is to provide the connectivity between the terminals of the Integrated Circuit (IC) chip through pre-defined length of a conducting coil. Conventionally the connection between the chip and the coil is done using soldering process. Further, for accurate connectivity between the IC chip and coil, alignment between the two is critical. In the process of soldering, alignment may be manual and hence time consuming. To meet the growing demand for RFID, automation of the process is a feasible solution. However, automation of the soldering process has created additional difficulties due to product nature. The RFID tag requires the coil to be aligned with conductive pads present on the IC chip. Manual aligning of the coil with the conductive pads of the IC chip is generally time consuming and hence may not suitable for production of RFID tags at large quantities.
The present disclosure is proposed to overcome one or more limitations stated above or any other limitation associated with the prior art.
SUMMARY OF THE DISCLOSURE
One or more shortcomings of the prior art are overcome by a device as claimed and additional advantages are provided through the provision of device as claimed in the present disclosure. Additional features and advantages are realized through the aspects and techniques of the present disclosure. Other embodiments and aspects of the disclosure are described in detail herein and are considered a part of the claimed disclosure.
In one non-limiting embodiment of the present disclosure, a system for manufacturing a radio frequency identification (RFID) tag is disclosed. The system comprises of a fixture wherein the fixture includes a base plate and a receiving plate fixed to the base plate. The receiving plate is configured to receive an integrated circuit (IC) chip and a coil. A first module is fixed to the base plate, wherein the first module comprises of a first actuator to align the IC chip on the receiving plate. A second module fixed to the base plate and is positioned perpendicular to the first module, wherein the second module comprises of a second actuator. The second actuator is configured to displace and position the coil adjacent to the IC chip on the receiving plate. A third module is fixed to the base plate positioned adjacent to the second module, wherein the third module is configured to receive leads of the coil and position the leads of the coil on to the IC chip for manufacturing the RFID tag.
In an embodiment, the receiving plate is defined with a first groove to accommodate the IC chip and a second groove to accommodate the coil.
In an embodiment, the first module comprises of at least one finger connected to the first actuator to align the IC chip in the first groove.
In an embodiment, the second module comprises of a cover member connected to the second actuator to cover and arrest vertical movement of the coil in the second groove.
In an embodiment, the third module comprises of pair of cam pins to position leads of the coil on to a conductive pad of the IC chip.
In an embodiment, the second module comprises of at least one guide rod configured to displace the pair of cam pins provided in the third module.
In an embodiment, the system comprises of a fourth module positioned opposite to the second module, wherein the fourth module is configured with at least one arm connected to a third actuator to clamp the leads of the coil.
In an embodiment, the first actuator, the second actuator and the third actuator is associated to a control unit to control operations of the actuators.
In an embodiment, the actuators used in the system is one of a pneumatic actuator and a hydraulic actuator.
In another non-limiting embodiment of the present disclosure, a method for manufacturing a radio frequency identification (RFID) tag is disclosed. The method comprises of operating by a control unit, a positioning unit to place an integrated circuit (IC) chip and a coil on to a receiving plate that is fixed on a base plate of a fixture. Actuating by the control unit, a first actuator of a first module to align the IC chip on the base plate, wherein the first module is fixed to the base plate. Actuating by the control unit, a second actuator of a second module to displace and position the coil on the base plate, wherein the second module is fixed to the base plate. Actuating by the control unit, a third module to position leads of the coil on the IC chip, wherein the third module is fixed to the base plate for manufacturing the RFID tag.
It is to be understood that the aspects and embodiments of the disclosure described above may be used in any combination with each other. Several of the aspects and embodiments may be combined together to form a further embodiment of the disclosure.
The foregoing summary is illustrative only and is not intended to be in any way limiting. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features will become apparent by reference to the drawings and the following detailed description.
BRIEF DESCRIPTION OF THE ACCOMPANYING FIGURES
The novel features and characteristics of the disclosure are set forth in the description. The disclosure itself, however, as well as a preferred mode of use, further advantages thereof, will best be understood by reference to the following description of an illustrative embodiment when read in conjunction with the accompanying drawings. One or more embodiments are now described, by way of example only, with reference to the accompanying drawings wherein like reference numerals represent like elements and in which:
FIG.1 illustrates exploded view of a system comprising a fixture for aligning a coil and IC chip for manufacturing an RFID tag, according to an embodiment of the present disclosure.
FIG.1A illustrates perspective view of a receiving plate in the fixture of FIG.1 for placing the IC chip and the coil.
FIG.2 illustrates perspective view of a first module of the fixture comprising a finger for aligning IC chip, according to an embodiment of the present disclosure.
FIG.3A illustrates perspective view of a second module of the fixture comprising a cover member to cover the coil, according to an embodiment of the present disclosure.
FIG.3B illustrates perspective view of a third module of the fixture comprising a pair of cam pins to adjust the coil, according to an embodiment of the present disclosure.
FIG.4 illustrates perspective view of a fourth module of the fixture comprising at least one arm for clamping ends of the coil, according to an embodiment of the present disclosure.
FIG.5 illustrates perspective view of the coil aligned with the IC chip manufactured by the system of FIG. 1.
The figures depict embodiments of the disclosure for purposes of illustration only. One skilled in the art will readily recognize from the following description that alternative embodiments of the structures and methods illustrated herein may be employed without departing from the principles of the disclosure described herein.
DETAILED DESCRIPTION OF THE DISCLOSURE
The foregoing has broadly outlined the features and technical advantages of the present disclosure in order that the detailed description of the disclosure that follows may be better understood. Additional features and advantages of the disclosure will be described hereinafter which form the subject of the claims of the disclosure. It should be appreciated by those skilled in the art that, the conception and specific embodiment disclosed may be readily utilized as a basis for modifying or designing other mechanism for carrying out the same purposes of the present disclosure. It should also be realized by those skilled in the art that such equivalent constructions do not depart from the scope of the disclosure as set forth in the appended claims. The novel features which are believed to be characteristic of the disclosure, both as to its organization and method of operation, together with further objects and advantages will be better understood from the following description when considered in connection with the accompanying figures. It is to be expressly understood, however, that each of the figures is provided for the purpose of illustration and description only and is not intended as a definition of the limits of the present disclosure.
In the present document, the word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any embodiment or implementation of the present subject matter described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.
The terms “comprises”, “comprising”, or any other variations thereof, are intended to cover a non-exclusive inclusion, such that an assembly, device or method that comprises a list of components or steps does not include only those components or steps but may include other components or steps not expressly listed or inherent to such setup or device or method. In other words, one or more elements in a system or apparatus proceeded by “comprises… a” does not, without more constraints, preclude the existence of other elements or additional elements in the system or apparatus.
Embodiments of the present disclosure discloses a system for manufacturing RFID tag. The system comprises a fixture for aligning a coil and an Integrated Circuit (IC) chip for manufacturing a Radio Frequency Identification [RFID] tag, herein referred to as RFID. During the manufacture of the RFID tag, it is required for the coil to be aligned with conductive pads present on the IC chip. Conventionally, manual aligning of the coil with the conductive pads of the IC chip was generally time consuming and labor intensive. Hence manufacturing of RFID by such processes may not be suitable for production of RFID tags in large quantities.
Accordingly, the present disclosure is directed to overcome the problem by automating the process of alignment of the coil with the conductive pads of the IC chip. The automation may be carried out by the fixture by generating several precise motions or movements enabled by fabrication of precise components or modules. In an embodiment, the fixture may comprise several modules for aligning the coil and the IC chip for manufacturing. Aligning of the coil and the IC chip may be followed by a joining process such as welding of the coil with the IC chip at the location of conductive pads of the IC chip and trimming excess coil ends to obtain the RFID tag.
The fixture comprises of base plate which supports all the components. A receiving plate is positioned on the base plate, and is defined with grooves, wherein a first groove is provided for receiving and positioning the IC chip and a second groove is provided for receiving and positioning the coil. The fixture comprises a module to align the IC chip of the RFID circuit at the required position. The fixture further comprises another aligning module to adjust the coil of the RFID circuit. In an embodiment, the coil is placed in the second groove which may be a substantially circular provision, the module is then actuated to aid in alignment of the coil.
In an embodiment, the coil is received and positioned in the second groove. Leads of the coil are free and not anchored by any other means. Each of these leads are to be adjusted in order to align the coil on a conductive pad of the IC chip. Thus, the fixture comprises yet another aligning module for this purpose. This aligning module may consist of cam pins on either side of the second groove which may be actuated to hold the leads of the coil at the required position. The fixture also includes another aligning module having at least one arm which may be actuated to align free ends of the coil. This ensures that the coil is accurately placed on the conductive pads of the IC chip to carry out further steps for manufacturing the RFID tag.
Reference will now be made to the exemplary embodiments of the disclosure, as illustrated in the accompanying drawings. Wherever possible, same numerals will be used to refer to the same or like parts. The following paragraphs describe the present disclosure with reference to FIGS 1 to 5.
FIG.1 is an exemplary embodiment of the present disclosure which illustrates exploded view of a fixture (100) for aligning a coil (103) and an Integrated Circuit (IC) chip (102) during manufacturing of Radio Frequency Identification (RFID) tag. The coil (103) is received by a receiving plate (119) and is configured to be aligned on the conductive pads (118) of the IC chip (102). The coil (103) which is aligned is then welded together to form an antenna, which enables the coil (103) to transmit and receive signals from the IC chip (102). Thus, the present disclosure aims to provide an automated solution for aligning through the fixture (100) of the present disclosure.
The fixture (100) for aligning the coil (103) and IC chip (102) broadly comprises three modules which may be operated sequentially in order to align the coil (103) with the IC chip (102). The fixture (100) comprises a base plate (101) which supports several components of the fixture (100) for manufacturing of the RFID tag. The base plate (101) is required to bear heavy loads, and hence it may be made of a metallic material or any other material which serves the purpose. Further, the base plate (101) is also configured to house the receiving plate (119) for receiving the coil (103) from a source such as an inventory and then positioning the same within the receiving plate (119).
FIG.1A illustrates the receiving plate (119) fixed to the base plate (101). The receiving plate (119) of the fixture (100) may comprise grooves for receiving the coil (103) and the IC chip (102). In an embodiment, a first groove (104) may be defined in a predetermined geometrical shape in the receiving plate for securing the IC chip (102). The first groove (104) may be defined in the form of a slot on the receiving plate for placing the IC chip (102). In an embodiment, an automated robotic arm or robot may be configured to place the IC chip (102) on the receiving plate (119). The robotic arm may be a part of a placing unit (not shown in figure) which is configured to place the IC chip (102) and the coil (103) in the fixture (200). The system (200) may be configured with a control unit (not shown in figure) configured to operate the actuators provided in the fixture. Once the IC chip (102) is placed in the first groove (104), a first module (106) of the fixture may be operated to adjust and align the position of the IC chip (102) accurately as per the requirement.
The receiving plate (119) also includes a second groove (105) for positioning the coil (103). The second groove (105) may be substantially circular in shape, however it may be of other shapes as well as per the design of the coil (103) and the same should not to be construed as a limitation to the present disclosure. The positioning of the coil (103), similar to the IC chip (102) may be automated and the placing unit (automated robotic arm or robot) may be configured to position the coil (103) in the second groove (105). Further, the fixture (100) comprises a second module (108) to precisely align the coil (103) in the second groove (105).
Referring now to FIG.2, which illustrates perspective view of the first module (106). The first module (106) is fixed to the based plate (100) and is configured to adjust and align the IC chip (102) in the first groove (104). The first module (106) comprises at least one at least one finger (107) and a first actuator (115). The first actuator (115) is connected to the at least one finger (107) and is configured to displace the at least one finger (107) towards the IC chip (102). As the at least one finger (107) displaces, it comes in contact with the IC chip (102) and displaces the IC chip (102) to align it in the required position. The at least one finger (102) also ensures that the IC chip (102) is secured in the first groove (104) during manufacturing of the RFID tag. In an embodiment, the fixture (100) may include a fixed block [not shown] to support the IC chip (102) from one side while being displaced by the at least one finger (107) from the other side.
Moving on to FIG.3A, which depicts a perspective view of the second module (108) of the fixture (100). The second module (108) is fixed to the base plate (101) at a position perpendicular to the first module (106). The second module (108) comprises of a cover member (109) and a second actuator (116). The cover member (109) is connected to the second actuator (116) to displace the cover member (109). Once the coil (103) is placed in the second groove (105), the second module (108) may be actuated by the second actuator (116) to adjust the coil (103) in the second groove (105). The second actuator (116) actuates a cover member (109) of the second module (108) to displace the cover member (109) vertically and cover the coil (103). The cover member (109) comes in contact with the coil (103) and covers the coil (103) in a manner such that it arrests the vertical movement of the coil (103). Thus, during the production of the RFID tag, the coil (103) is firmly held in place in the second groove (105).
Further, the second module (108) comprises of at least one guide rod (114). These guide rods (114) are designed and positioned such that, as the second module (108) displaces to align the coil (103), it actuates the components of a third module (110). The at least one guide rods (114) are positioned below the cover member (109) and are provided on the frame of the second module (108).
FIG.3B illustrates, a third module (110) that comprises of a pair of cam pins (111). The third module (110) is fixed to the base plate (101) adjacent to the second module (108). The third module (110) is configured in the fixture (100) such that the pair of cam pins (111) are positioned on either side of the second groove (105). The pair of cam pins (111) are configured to adjust leads of the coil (103) such that the leads come in contact with the conductive pads (118) of the IC chip (102). Hence, the third module (110) ensures that these leads of the coil (103) are aligned to position the coil (103) accurately on the conductive pads (118) of the IC chip (102) for manufacturing of the RFID tag. The at least one guide rods (114) of the second module (108) are configured to actuate the pair of cam pins (111) of the third module (110) and thereby aligning the ends of the coil (103).
Further, after aligning the leads of the coil (103) the leads of the coil (103) are not secured and may move freely. In order to arrest the movement of the leads of the coil (103), the fixture (100) comprises a fourth module (112) positioned opposite to the second module (108) as shown in FIG.4. The fourth module (112) comprises of at least one arm (113) connected to a third actuator (117) for actuation. The at least one arm (113) is displaced to clamp the leads of the coil (103). The fourth module (112) is positioned adjacent to the receiving plate (119) so that it is capable of communicating with the leads of the coil (103). The at least one arm (113) ensures that the coil (103) is firmly held in its place by clamping the leads of the coil (103) and align the coil (103) on conductive pads (118) of the IC chip (102) enabling further process of the RFID manufacturing. In an embodiment, the at least one arm (113) may be configured to displace vertically in order to receive the freely moving leads of the coil (103) in order to clamp them for manufacturing.
FIG. 5 illustrates the aligned IC chip (102) and the coil (103). In an embodiment, once the IC chip (102) and the coil (103) are aligned, such that the leads of the coil (103) passes over the conductive pads (118) of the IC chip (102). The point at which the leads of the coil (103) comes in contact with the conductive pads (118) of the IC chip may be subjected to welding or heat staking process to fuse the coil (103) with the IC chip (102).
In an embodiment, the coil (103) acts as an antenna to transmit signals from the IC chip (102) of the RFID tag to a reader-writer.
In an embodiment, the actuators configured in the aligning modules may one of a pneumatic actuator or a hydraulic actuator.
In an embodiment, the base plate (101) may be manufactured using metals like but not limited to iron, aluminium, steel, etc.
In an embodiment, the receiving plate (119) and the aligning modules are fixed to the base plate (101) using various fastening methods.
In an embodiment, the IC chip (102) and the coil (103) is positioned in the fixture (100) using robots, mechanical arms and the like.
In an embodiment, the at least one arm (107), the cover member (109) and the at least one arm may be connected to the corresponding actuators by employing mechanical links.
In an embodiment, the shape of the coil (103) used to manufacture the RFID tags may be of circular shape, square shape, rectangular shape, triangular shape, or any shape as pre requirements.
In an embodiment, the joining of the IC chip (102) and the coil (103) may be carried out by an external component that is not attached to the fixture.
In an embodiment, the excess leads of the coil (103) left out after the welding operation may be trimmed by using a trimmer.
In an embodiment, the fixture (100) and the modules may be automated by associating it to a computer or a smart device, wherein the computer or smart device controls the actuators to perform the required operations.
In an embodiment, the actuators may be configured to actuate in a sequential order to complete the aligning process as per the requirement.
Equivalents:
The embodiments herein and the various features and advantageous details thereof are explained with reference to the non-limiting embodiments in the description. Descriptions of well-known components and processing techniques are omitted so as to not unnecessarily obscure the embodiments herein. The examples used herein are intended merely to facilitate an understanding of ways in which the embodiments herein may be practiced and to further enable those of skill in the art to practice the embodiments herein. Accordingly, the examples should not be construed as limiting the scope of the embodiments herein.
The foregoing description of the specific embodiments will so fully reveal the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the spirit and scope of the embodiments as described herein.
Throughout this specification the word “comprise”, or variations such as “comprises” or “comprising”, will be understood to imply the inclusion of a stated element, integer or step, or group of elements, integers or steps, but not the exclusion of any other element, integer or step, or group of elements, integers or steps.
The use of the expression “at least” or “at least one” suggests the use of one or more elements or ingredients or quantities, as the use may be in the embodiment of the disclosure to achieve one or more of the desired objects or results.
Any discussion of documents, acts, materials, devices, articles and the like that has been included in this specification is solely for the purpose of providing a context for the disclosure. It is not to be taken as an admission that any or all of these matters form a part of the prior art base plate or were common general knowledge in the field relevant to the disclosure as it existed anywhere before the priority date of this application.
The numerical values mentioned for the various physical parameters, dimensions or quantities are only approximations and it is envisaged that the values higher/lower than the numerical values assigned to the parameters, dimensions or quantities fall within the scope of the disclosure, unless there is a statement in the specification specific to the contrary.
While considerable emphasis has been placed herein on the particular features of this disclosure, it will be appreciated that various modifications can be made, and that many changes can be made in the preferred embodiments without departing from the principles of the disclosure. These and other modifications in the nature of the disclosure or the preferred embodiments will be apparent to those skilled in the art from the disclosure herein, whereby it is to be distinctly understood that the foregoing descriptive matter is to be interpreted merely as illustrative of the disclosure and not as a limitation.
Referral Numerals:
Reference Number Description
100 Fixture
200 System
101 Base plate
102 IC chip
103 Coil
104 First groove
105 Second groove
106 First module
107 At least one at least one finger
108 Second module
109 Cover member
110 Third module
111 Pair of cam-pins
112 Fourth module
113 At least one arm
114 At least one guide rod
115 First actuator
116 Second actuator
117 Third actuator
118 Conductive pad
119 Receiving plate
,CLAIMS:We Claim:
1. A system (200) for manufacturing a radio frequency identification (RFID) tag, the system (200) comprising:
a fixture (100) comprising:
a base plate (101);
a receiving plate (119) fixed to the base plate (101), the receiving plate configured to receive an integrated circuit (IC) chip (102) and a coil (103);
a first module (106) fixed to the base plate (101), the first module (106) comprises a first actuator (115) to align the IC chip (102) on the receiving plate (119);
a second module (108) fixed to the base plate (101) and is positioned perpendicular to the first module (106), the second module (108) comprises a second actuator (116) configured to displace and position the coil (103) adjacent to the IC chip (102) on the receiving plate (119);
a third module (110) fixed to the base plate (101) and is positioned adjacent to the second module (108), the third module (110) is configured to receive leads of the coil (103) and position the leads of the coil (103) on to the IC chip (102) for manufacturing the RFID tag.
2. The system (200) as claimed in claim 1, wherein the receiving plate (119) is defined with a first groove (104) to accommodate the IC chip (102) and a second groove (105) to accommodate the coil (103).
3. The system (200) as claimed in claim 1, wherein the first module (106) comprises of at least one finger (107) connected to the first actuator (115) to align the IC chip (102) in the first groove (104).
4. The system (200) as claimed in claim 1, wherein the second module (108) comprises of a cover member (109) connected to the second actuator (116) to cover and arrest vertical movement of the coil (103) in the second groove (105).
5. The system (200) as claimed in claim 1, wherein the third module (110) comprises of pair of cam pins (111) to position leads of the coil (103) on to a conductive pad (118) of the IC chip (102).
6. The system (200) as claimed in claim 1, wherein the second module (108) comprises of at least one guide rod (114) configured to displace the pair of cam pins (111) provided in the third module (110).
7. The system (200) as claimed in claim 1, comprises of a fourth module (112) positioned opposite to the second module (108), the fourth module is configured with at least one arm (113) connected to a third actuator (117) to clamp the leads of the coil (103).
8. The system (200) as claimed in claim 1, wherein the first actuator, the second actuator and the third actuator is associated to a control unit to control operations of the actuators.
9. The system as claimed in claim 1, wherein the actuators used in the system (200) is one of a pneumatic actuator and a hydraulic actuator.
10. A method for manufacturing a radio frequency identification (RFID) tag, the method comprising:
operating by a control unit, a positioning unit to place an integrated circuit (IC) chip (102) and a coil (103) on to a receiving plate (119) fixed on a base plate (101) of a fixture (100);
actuating by the control unit, a first actuator (115) of a first module (106) to align the IC chip (102) on the base plate (101), wherein the first module (106) is fixed to the base plate (101);
actuating by the control unit, a second actuator (116) of a second module (108) to displace and position the coil (103) on the base plate (101), wherein the second module (108) is fixed to the base plate (101);
actuating by the control unit, a third module (110) to position leads of the coil (103) on the IC chip (102), wherein the third module (110) is fixed to the base plate (101) for manufacturing the RFID tag.
| # | Name | Date |
|---|---|---|
| 1 | 201841012041-STATEMENT OF UNDERTAKING (FORM 3) [30-03-2018(online)].pdf | 2018-03-30 |
| 2 | 201841012041-PROVISIONAL SPECIFICATION [30-03-2018(online)].pdf | 2018-03-30 |
| 3 | 201841012041-FORM 1 [30-03-2018(online)].pdf | 2018-03-30 |
| 4 | 201841012041-DRAWINGS [30-03-2018(online)].pdf | 2018-03-30 |
| 5 | 201841012041-DECLARATION OF INVENTORSHIP (FORM 5) [30-03-2018(online)].pdf | 2018-03-30 |
| 6 | 201841012041-Proof of Right (MANDATORY) [01-10-2018(online)].pdf | 2018-10-01 |
| 7 | Correspondence by Agent_Form1_08-10-2018.pdf | 2018-10-08 |
| 8 | 201841012041-PostDating-(29-03-2019)-(E-6-85-2019-CHE).pdf | 2019-03-29 |
| 9 | 201841012041-APPLICATIONFORPOSTDATING [29-03-2019(online)].pdf | 2019-03-29 |
| 10 | 201841012041-PostDating-(30-04-2019)-(E-6-121-2019-CHE).pdf | 2019-04-30 |
| 11 | 201841012041-APPLICATIONFORPOSTDATING [30-04-2019(online)].pdf | 2019-04-30 |
| 12 | 201841012041-DRAWING [30-05-2019(online)].pdf | 2019-05-30 |
| 13 | 201841012041-COMPLETE SPECIFICATION [30-05-2019(online)].pdf | 2019-05-30 |
| 14 | 201841012041-FORM-26 [15-09-2021(online)].pdf | 2021-09-15 |
| 15 | 201841012041-FORM 18 [17-09-2021(online)].pdf | 2021-09-17 |
| 16 | 201841012041-FER.pdf | 2022-06-16 |
| 17 | 201841012041-OTHERS [16-12-2022(online)].pdf | 2022-12-16 |
| 18 | 201841012041-FER_SER_REPLY [16-12-2022(online)].pdf | 2022-12-16 |
| 19 | 201841012041-DRAWING [16-12-2022(online)].pdf | 2022-12-16 |
| 20 | 201841012041-COMPLETE SPECIFICATION [16-12-2022(online)].pdf | 2022-12-16 |
| 21 | 201841012041-CLAIMS [16-12-2022(online)].pdf | 2022-12-16 |
| 22 | 201841012041-US(14)-HearingNotice-(HearingDate-23-01-2024).pdf | 2024-01-04 |
| 23 | 201841012041-Correspondence to notify the Controller [19-01-2024(online)].pdf | 2024-01-19 |
| 24 | 201841012041-FORM-26 [22-01-2024(online)].pdf | 2024-01-22 |
| 25 | 201841012041-Response to office action [01-02-2024(online)].pdf | 2024-02-01 |
| 26 | 201841012041-Annexure [01-02-2024(online)].pdf | 2024-02-01 |
| 27 | 201841012041-US(14)-ExtendedHearingNotice-(HearingDate-28-02-2024).pdf | 2024-02-07 |
| 28 | 201841012041-Correspondence to notify the Controller [23-02-2024(online)].pdf | 2024-02-23 |
| 29 | 201841012041-REQUEST FOR ADJOURNMENT OF HEARING UNDER RULE 129A [26-02-2024(online)].pdf | 2024-02-26 |
| 30 | 201841012041-US(14)-ExtendedHearingNotice-(HearingDate-15-03-2024).pdf | 2024-02-27 |
| 31 | 201841012041-Correspondence to notify the Controller [12-03-2024(online)].pdf | 2024-03-12 |
| 32 | 201841012041-FORM-26 [14-03-2024(online)].pdf | 2024-03-14 |
| 33 | 201841012041-Written submissions and relevant documents [30-03-2024(online)].pdf | 2024-03-30 |
| 1 | SearchHistoryE_16-06-2022.pdf |