A HEAT DISSIPATION DEVICE AND A HEAT DISSIPATION SYSTEM
INCORPORATING THE SAME
Technical Field
This invention relates generally to a heat dissipation device and a heat
dissipation system incorporating the same, and method for an integrated circuit
assembly, and more particularly to a system and method of dissipating heat from an
integrated circuit device.
Background
Integrated circuit devices, microprocessors and other related computer
components are becoming more and more powerful with increasing capabilities,
resulting in increasing amounts of heat generated from these components. Packaged
units and integrated circuit device sizes of these components are decreasing or
remaining the same, but the amount of heat energy given off by these components per
unit volume, mass, surface area or any other such metric is increasing. In current
packaging techniques, heat sinks typically consist of a flat base plate, which is mounted
on to the integrated circuit device on one side. The heat sinks further include an array
of fins running perpendicular to the flat base plate on the other side. Generally, the
integrated circuit devices (which are the heat sources) have a significantly smaller
footprint size than the flat base plate of the heat sink. The flat base plate of the heat
sink has a large footprint, that is, it requires more motherboard real estate than the
integrated circuit device in contact there with. The larger size of the base plate causes
the outermost part of the base plate that is not directly in contact with the integrated
circuit device to have a significantly lower temperature than the part of the base plate
that is directly in contact with the integrated circuit device. Furthermore, as computer-
related equipment becomes more powerful, more components are being placed inside
the equipment and on the motherboard which further requires more motherboard real
estate. In addition, the base plate of prior art heat sink designs is at the same level as
the integrated circuit device to which it is attached. Consequently, the flat base plate
configuration of the heat sink generally ends up consuming more motherboard real
estate than the integrated circuit device on which it is mounted. As a result, the larger
footprint size of the base plate prevents other motherboard components, such as low-
cost capacitors, from encroaching around or on the microprocessor. Thus, the large
amounts of heat produced by many of such integrated circuits, and the increasing
demand for motherboard real estate need to be taken into consideration when designing
the integrated circuit mounting and packaging devices.
For the reasons stated above, and for other reasons stated below which will
become apparent to those skilled in the art upon reading and understanding the present
specification, there is a need in the art for an enhanced heat dissipation device and
method that conserve motherboard real estate and allow electronic components to
encroach on and around the microprocessor.
The present invention provides a heat dissipation device comprising :a thermally
conductive core, wherein the thermally conductive core has a solid body and an axis,
and the thermally conductive core has separate upper and lower outer surface areas
parallel to the axis ; and a first conductive ring having a first array of radially extending
fins, the first array being thermally coupled to the upper outer surface area of the
thermally conductive core, wherein the first conductive ring has a first outer diameter
and a first depth, and wherein the first outer diameter and the first depth are of sufficient
size to provide sufficient space below the first conductive ring to allow components to be
mounted around and in close proximity to the lower outer surface area and below the
first conductive ring when the device is mounted on an integrated circuit device.
This invention also provides a heat dissipation device comprising : a thermally
conductive core, wherein the thermally conductive core has upper and lower outer
surface areas ; and a first conductive ring having a first array of radially extending fins,
the first array being thermally coupled to the upper outer surface area of the thermally
conductive core, the first array comprising a first plurality of folded fins, and the first
plurality of folded fins having a plurality of alternating deep and shallow folds in a
continuous ribbon such that the alternating deep and shallow folds wrap around the
upper outer surface area.
This invention also provides a heat dissipation device comprising : a thermally
conductive core, wherein the thermally conductive core has upper and lower outer
surface areas ; a first conductive ring having a first array of radially extending fins, the
first array being thermally coupled to the upper outer surface area of the thermally
conductive core ; and a second conductive ring, thermally coupled to the lower outer
surface area, wherein the first conductive ring has a first outer diameter, wherein
the second conductive ring has a second outer diameter, and wherein the second outer
diameter is less than the first outer diameter.
This invention further provides a heat dissipation system comprising :
an integrated circuit device having a front side and a back side, wherein the front
side is disposed across from the back side, wherein the front side is attached to a circuit
board having components ; and
a heat dissipation device comprising : a thermally conductive core attached to
the back side of the integrated circuit device, the thermally conductive core having upper
and lower core surface areas, wherein the upper and lower core surface areas have a
first and second length, respectively ; and a first conductive ring having a first plurality
of folded fins, the first plurality of folded fins being thermally coupled to the upper
core surface area, the first plurality of folded fins surrounding the upper core
surface area, the first length of the upper core surface area being sufficient to permit
components to be mounted on the circuit board and below the first conductive
ring.
This invention still further provides a heat dissipation system comprising :
an integrated circuit device having a front side and a back side, wherein the front
side is disposed across from the back side, and the front side is attached to a circuit
board having components;
a heat dissipation device comprising : a thermally conductive core attached to
the back side of the integrated circuit device, the thermally conductive core having
upper and lower core surface areas, wherein the upper and lower core surface areas
have a first and second length, respectively ; a first conductive ring having a first
plurality of folded fins, the first plurality of folded fins being thermally coupled to
the upper core surface area, the first plurality of folded fins surrounding the upper
core surface area, the first length of the upper core surface area being sufficient
to permit components to be mounted on the circuit board and below the first
conductive ring, wherein the thermally conductive core comprises a base, wherein
the base is in close proximity to the lower core surface area, and wherein the base
and the back side of the integrated circuit device have coinciding footprint sizes
so that temperatures of the integrated circuit device, the base, the first plurality of
folded fins, and the thermally conductive core are close to each other during
operation to enhance heat transfer from the integrated circuit device ; a second
conductive ring having a second plurality of folded fins, the second plurality of folded
fins being thermally coupled to the lower core surface area, the second conductive
ring having a second diameter, the first conductive ring having a first diameter, wherein
the second diameter is less than the first diameter and is sufficient to permit
components to be mounted on the circuit board and below the first conductive ring ;
and a heat transport medium, wherein the thermally conductive core further has a
top surface disposed across from the base and in close proximity to the upper
core surface area, and wherein the heat transport medium is attached to the top
surface such that a direction of flow of a cooling medium introduced by the heat
transport medium over the first plurality of folded fins enhances heat extraction from the
integrated circuit device.
This invention also provides a method of forming a heat dissipation device to
extract heat from an integrated circuit device mounted on an assembled printed circuit
board, said method comprising :
forming a thermally conductive core having upper and lower core surface areas ;
forming a first array of radially extending fins ;
forming a first conductive ring from the formed first array, wherein the first
conductive ring has a first diameter; and
attaching the first conductive ring to the upper core surface area such that the
lower core surface area has sufficient space below the first conductive ring to allow
components to encroach around the integrated circuit device when the device is
mounted onto the integrated circuit device.
This invention further provides a method of forming a heat dissipation device to
extract heat from an integrated circuit device mounted on an assembled printed circuit
board, said method comprising :
forming a thermally conductive core having upper and lower core surface areas ;
forming a first array of radially extending fins ;
forming a first conductive ring from the formed first array, wherein the first
conductive ring has a first diameter;
attaching the first conductive ring to the upper core surface area such that the
lower core surface area has sufficient space below the first conductive ring to allow
components to encroach around the integrated circuit device when the device is
mounted onto the integrated circuit device ;
forming a second array of radially extending fins ; forming a second conductive
ring from the formed second array, wherein the second conductive ring has a second
diameter, wherein the second diameter is less than about half the first diameter; and
attaching the second conductive ring to the lower core surface area such that
the second diameter is of sufficient size to allow the components to encroach around
the integrated circuit device and below the first conductive ring.
Brief Description of the Accompanying Drawings
Figure 1 is an isometric view of a prior art heat sink attached to a microprocessor
on an assembled motherboard.
Figure 2 is an isometric view of one embodiment of an enhanced heat dissipation
device according to the present invention.
Figure 3 is an isometric view showing the enhanced heat dissipation device of
Figure 2 attached to a microprocessor on an assembled motherboard.
Figure 4 is a flow diagram of one exemplary method of forming the heat
dissipation device of Figure 2.
Detailed Description
In the following detailed description of the embodirnents, reference is made to
the accompanying drawings that illustrate the present invention and its practice. In the
drawings, like numerals describe substantially similar components throughout the
several views. These embodiments are described in sufficient detail to enable those
skilled in the art to practice the invention. Other embodiments may be utilized and
structural, logical, and electrical changes may be made without departing from the
scope of the present invention. Moreover, it is to be understood that the various
embodiments of the invention, although different, are not necessarily mutually exclusive.
For example, a particular feature, structure, or characteristic described in one
embodiment may be included in other embodiments. The following detailed description
is, therefore, not to be taken in a limiting sense, and the scope of the present invention
is defined only by the appended clams, along with the full scope of equivalents to which
such claims are entitled.
This document describes, among other things, an enhanced heat dissipation
device that allows electronic components to encroach on a microprocessor while
maintaining high performance and cost effectiveness by leveraging currently enabled
high-volume manufacturing techniques.
Figure 1 shows an isometric view 100 of a prior art heat sink 110 mounted
on a microprocessor 120 of an assembled mother board 130. Also, shown in
Figure 1 are low-cost capacitors 140 mounted around the heat sink 110 and on
the mother board 130.
The prior art heat sink 100 has a flat base plate 150 including an array of
fins 160 extending perpendicularly away from the flat base plate 150. This
configuration of the heat sink 110 dictates the use of the flat base plate 110, with
the array of fins 160 for dissipating heat from the microprocessor 120. Increasing
the heat dissipation using the prior art heat sink 110 shown in Figure 1, generally
requires enlarging the surface area of the flat base plate 150 and/or the array of
fins 160. This in turn results in consuming more motherboard real estate.
Generally, the microprocessor 120 (which is the heat source) have a smaller
footprint size than the flat base plate 150 configuration of the heat sink 110
shown in Figure 1. A larger footprint size of the flat base plate 150 can cause the
outermost part of the flat base plate 150 (the portion that is not directly in contact
with the integrated circuit device) to have a significantly lower temperature than
the part of the flat base plate 150 that is directly in contact with the integrated
circuit device. Consequenfly, the prior art heat sink 110 with the larger flat base
plate 150 is not effective in dissipating heat from the integrated circuit device.
Furthermore, the packaged units and integrated circuit device sizes are
decreasing, while the amount of heat generated by these components is
increasing. The prior art heat sink 110 configuration dictates that the array of fins
160 extend to the edge of the flat base plate 150 to extract heat from the
integrated circuit device. Also, the prior art heat sink 110 requires increasing the
size of the array of fins 160 to increase the heat dissipation. In order to enlarge
the fins 120 laterally, the flat base plate 150 has to increase in size. Enlarging the
flat base plate 150 consumes more motherboard real estate. Consuming more
motherboard real estate is generally not a viable option in an environment where
system packaging densities are increasing with each successive, higher
performance, integrated circuit device generation. Also, the prior art heat sink
110 is at the same level as the integrated circuit device on which it is mounted. It
can be seen in Figure 1, that the flat base plate 150 configuration of the prior art
heat sink 110 mounted on the microprocessor 120 generally prevents other
motherboard components, such as low-cost capacitors 140, from encroaching
around the microprocessor 120.
Figure 2 is an isometric view of one embodiment of the enhanced heat
dissipation device 200 according to the present invention. Shown in Figure 2 is
the enhanced heat dissipation device 200 including a thermally conductive core
210, and a first conductive ring 220. Also, shown in Figure 2 is the thermally
conductive core 210 having upper and lower outer surface areas 230 and 240. The
first conductive ring 220 includes a first array of radially extending fins 250. The
first conductive ring 220, including the first array of radially extending fins 250 is
thermally coupled to the upper outer surface area 230 of the thermally conductive
core 210. Figure 2 further shows an optional second conductive ring 290
thermally coupled to the lower outer surface area 240 of the thermally conductive
core 210.
The thermally conductive core has an axis 260. In some embodiments, the
upper and lower outer surface areas 230 and 240 are parallel to the axis 260. The
thermally conductive core 260 further has a base 270. In some embodiments, the
base 270 is disposed such a way that it is in close proximity to the lower outer
surface area 240 and perpendicular to the axis 260. The upper and lower outer
surface areas 230 and 240 can be concentric to the axis 260.
The first conductive ring 220 is thermally coupled to tlie upper outer
surface area such that components can be mounted around and in close proximity
to the lower outer surface area and below the first conductive ring when the
device 200 is mounted on to an integrated circuit device. In some embodiments,
the components can encroach on to the integrated circuit device without
mechanically interfering with the device 200.
The thermally conductive core 210 can be a solid body. The solid body can
be cylindrical, conical, square, rectangular, or any other similar shapes that
facilitates in mounting on to the integrated circuit device and in attaching the first
conductive ring 220 to the upper outer surface area 230. The thermally
conductive core 210 can include heat transport mediums such as one or more heat
pipes, a liquid, a thermo-siphon, or other such heat transport medium that
enhance heat dissipation from the integrated circuit device. The device 200,
including the thermally conductive core 210 and the first conductive ring 220,
can be made from materials such as aluminum, copper, or any other materials that
are capable of dissipating heat away from the integrated circuit device.
The first array of radially extending fins 250 can be made of a first plurality
of folded fins. The first plurality of folded fins can also be made of alternating
deep and shallow folds 280 and 285 from a continuous ribbon such that the
alternating deep and shallow folds 280 and 285 wrap around the upper outer
surface area 230. The shallow folds have a first depth, and the deep folds have a
second depth, and the first depth is less than the second depth. The thermally
conductive core 210 can have a plurality of slots 287 parallel to the axis 260 and
around the upper outer surface area 230. The first plurality of folded fins can be
attached to the plurality of slots 287.
The first conductive ring 220 has a first outer diameter and the second
conductive ring 290 has a second outer diameter. The second outer diameter is
less than the first outer diameter. The first conductive ring 220 has a first depth
and the second outer ring 290 has a second depth. The first and second outer
diameters including the first and second depths are of sufficient size to allow
components to be mounted around and in close proximity to the integrated circuit
device when the device is mounted on the integrated circuit device.
The second conductive ring 290 can have second array of radially
extending fins 292. The second array of radially extending fins are thermally
coupled to the lower outer surface area 240 of the thermally conductive core 210.
The second array can include a second plurality of folded fins. The second
plurality of folded fins can be made from a plurality of alternating deep and
shallow folds from a continuous ribbon similar to the first plurality of folded fins
shown in Figure 2.
Figure 3 is an isometric view 300 showing the enhanced heat dissipation
device 200 shown in Figure 2, attached to the microprocessor 120 on an
assembled motherboard 130. In the example embodiment shown in Figure 3, the
microprocessor 120 has a front side 340 and a back side 330. The front side 340
is disposed across from the back side 330. The front side 340 is attached to the
assembled motherboard 130 having components such as the low-cost capacitors
140 and other such electrical components. The base 270 shown in Figure 2, of the
enhanced heat dissipation device 200 attached to the back side 330 of the
microprocessor 120. It can be seen from Figure 3 that the first and second
conductive rings 220 and 290 including the first and second pluralit)' of folded
fins 250 and 292 are of sufficient size so as to allow low-cost capacitors 140
mounted on the assembled board 130 to encroach around the microprocessor 120.
It can also be seen the low-cost capacitors 140 are below the first conductive ring
220 and around the second conductive ring 290.
Also, it can be seen in Figure 3 that the first conductive ring 220 is larger
than the second conductive ring 290, thereby increasing the heat dissipation rate
without increasing a footprint size of the base 270 of the heat dissipation device
200 any more than the back side 330 of the microprocessor 120. The coinciding
footprint sizes of the base 270 of the heat dissipation device 200 and the back
side 330 of the microprocessor 120 enables the base 270 and the back side 330 of
the microprocessor 120 to have same heat transfer rates. This in turn increases the
efficiency of heat transfer between the base 270 and the back side 330 of the
microprocessor 120.
The thermally conductive core 210 further has a top surface 275 disposed
across from the base 270. In some embodiments, the top surface 275 is
perpendicular to the axis 260 and is in close proximity to the second conductive
ring 290. A heat transport medium can be attached to the top surface 275 to
introduce a heat transfer medium 297 such as air in a direction shown in Figure 2,
to enhance the heat dissipation by the heat dissipation device 200. A heat
transport medium 295 such as a heat pipe, or other such medium can be included
in the thermally conductive core 210 to further enhance the heat transfer from the
heat dissipation device 200.
Figure 4 is a flow diagram illustrating generally a method 400 of forming
an enhanced heat dissipation device to extract heat from an integrated circuit
device mounted on an assembled printed circuit board. Method 400 as shown in
Figure 4, begins with action 410 of forming a thermally conductive core having
upper and lower core surface areas. The next action 420 requires forming a first
array of radially extending fins. The next action 430 is to form a first conductive
ring having a first diameter fi-om the formed first array of radially extending fins.
The next action 440, requires attaching the first conductive ring to the upper core
surface area such that the lower core surface area has sufficient space below the
first conductive ring to allow components to be mounted in close proximity and
around the lower core surface area.
In some embodiments, forming the first array of radially extending fins
further includes forming a first conductive ribbon, and forming a first alternative
series of deep and shallow folds from the first conductive ribbon, and further
forming a first conductive ring from the formed first alternative series of deep
and shallow folds.
In some embodiments, the method 400 further includes forming a second
array of radially extending fins, and forming a second conductive ring having a
second diameter from the formed second array. Further, the second conductive
ring is attached to the lower core surface area of the thermally conductive core
such that the second diameter is sufficient to allow the components to encroach
around the integrated circuit device. In some embodiments, forming the second
array of radially extending fins further includes forming a second conductive
ribbon, and forming a second alternative series of deep and shallow folds from
the second conductive ribbon, and further forming a second conductive ring from
the formed second alternative series of deep and shallow folds. The second
diameter of the second conductive ring is less than the first diameter of the first
conductive ring.
In some embodiments, the enhanced heat dissipation device is made of
thermally conductive materials such as copper, aluminum, or any other such
material capable of extracting heat away from the integrated circuit device. In
some embodiments, the thermally conductive core can include heat transport
mediums such as one or more heat pipes, a liquid, a thermo-siphon, or other
similar heat transport medium suitable for enhancing the extraction of heat from
the integrated circuit device.
Conclusion
The above-described device and method provides, among other things, an
enhanced heat dissipation using an array of radially extending fins where
possible, to allow electronic components to encroach around an integrated circuit
device it is mounted on, while maintaining high performance and cost
effectiveness by leveraging currently enabled high volume manufacturing
techniques
CLAIMS :
1. A heat dissipation device comprising :
a thermally conductive core, wherein the thermally conductive core has a
solid body and an axis, and the thermally conductive core has separate upper
and lower outer surface areas parallel to the axis ; and
a first conductive ring having a first array of radially extending fins, the first
array being thermally coupled to the upper outer surface area of the thermally
conductive core, wherein the first conductive ring has a first outer diameter and a
first depth, and wherein the first outer diameter and the first depth are of
sufficient size to provide sufficient space below the first conductive ring to allow
components to be mounted around and in close proximity to the lower outer
surface area and below the first conductive ring when the device is mounted on
an integrated circuit device.
2. The device as claimed in claim 1, wherein the thermally conductive core
has a base, and wherein the base is perpendicular to the axis and in close
proximity to the lower outer surface area.
3. The device as claimed in claim 1, wherein the upper and lower outer
surface areas are concentric to the axis.
4. The device as claimed in claim 1, wherein the components can encroach
on the integrated circuit device without mechanically interfering with the
integrated circuit device.
5. The device as claimed in claim 1, wherein the thermally conductive core
has an outer shape selected from the group consisting of cylindrical, conical,
square, and rectangular.
6. The device as claimed in claim 1, wherein the thermally conductive core
and the first array of radially extending fins are made from materials selected
from the group consisting of aluminum and copper.
7. The device as claimed in claim 1, wherein the first array comprises a first
plurality of folded fins.
8. A heat dissipation device comprising :
a thermally conductive core, wherein the thermally conductive core has
upper and lower outer surface areas ; and
a first conductive ring having a first array of radially extending fins, the first
array being thermally coupled to the upper outer surface area of the thermally
conductive core, the first array comprising a first plurality of folded fins, and the
first plurality of folded fins having a plurality of alternating deep and shallow folds
in a continuous ribbon such that the alternating deep and shallow folds wrap
around the upper outer surface area.
9. The device as claimed in claim 8, wherein the shallow folds have a first
depth and the deep folds have a second depth, and wherein the first depth is
less than the second depth.
10. The device as claimed in claim 8, wherein the thermally conductive core
has a plurality of slots parallel to the axis and around the upper outer surface
area, and wherein the first plurality of folded fins are attached to the plurality of
slots.
11. A heat dissipation device comprising :
a thermally conductive core, wherein the thermally conductive core has
upper and lower outer surface areas ;
a first conductive ring having a first array of radially extending fins, the first
array being thermally coupled to the upper outer surface area of the thermally
conductive core,; and
a second conductive ring, thermally coupled to the lower outer
surface area, wherein the first conductive ring has a first outer diameter,
wherein the second conductive ring has a second outer diameter, and wherein
the second outer diameter is less than the first outer diameter.
12. The device as claimed in claim 11, wherein the second outer diameter
has a size sufficient to allow components to be mounted around and in close
proximity to the second conductive ring and below the first conductive ring when
the device is mounted on an integrated circuit device.
13. The device as claimed in claim 11, wherein the second conductive ring
has a second array of radially extending fins, and the second array
is coupled to the lower outer surface area of the thermally conductive core.
14. The device as claimed in claim 13, wherein the second array comprises
a second plurality of folded fins.
15. The device as claimed in claim 14, wherein the second plurality of
folded fins have a plurality of alternating deep and shallow folds in a continuous
ribbon around the lower outer surface area.
16. A heat dissipation system comprising :
an integrated circuit device having a front side and a back side, wherein
the front side is disposed across from the back side, wherein the front side is
attached to a circuit board having components ; and
a heat dissipation device comprising :
a thermally conductive core attached to the back side of the
integrated circuit device, the thermally conductive core having upper and
lower core surface areas, wherein the upper and lower core
surface areas have a first and second length, respectively ; and
a first conductive ring having a first plurality of folded fins, the first
plurality of folded fins being thermally coupled to the upper core surface
area, the first plurality of folded fins surrounding the upper core surface
area, the first length of the upper core surface area being sufficient to
pernriit components to be mounted on the circuit board and below the first
conductive ring.
17. The heat dissipation system as claimed in claim 16, wherein the
thermally conductive core comprises a base ; wherein the base is in close
proximity to the lower core surface area ; and wherein the base and the back
side of the integrated circuit device have coinciding footprint sizes so that
temperatures of the integrated circuit device, the base, the first plurality of folded
fins, and the thermally conductive core are close to each other during operation
to enhance heat transfer from the integrated circuit device.
18. The heat dissipation system as claimed in claim 17, comprising :
a heat transport medium, wherein the thermally conductive core has a
top surface disposed across from the base and in close proximity to the upper
core surface area ; and wherein the heat transport medium is attached to the
top surface such that a direction of flow of a cooling medium introduced by the
heat transport medium over the first plurality of folded fins enhances heat
extraction from the integrated circuit device.
19. A heat dissipation system comprising :
an integrated circuit device having a front side and a back side, wherein
the front side is disposed across from the back side, and the front side
is attached to a circuit board having components ;
a heat dissipation device comprising :
a thermally conductive core attached to the back side of the
integrated circuit device, the thermally conductive core having upper and
lower core surface areas, wherein the upper and lower core surface areas
have a first and second length, respectively ;
a first conductive ring having a first plurality of folded fins, the
first plurality of folded fins being thermally coupled to the upper core
surface area, the first plurality of folded fins surrounding the upper core
surface area, the first length of the upper core surface area being
sufficient to permit components to be mounted on the circuit board and
below the first conductive ring, wherein the thermally conductive core
comprises a base, wherein the base is in close proximity to the lower
core surface area, and wherein the base and the back side of the
integrated circuit device have coinciding footprint sizes so that
temperatures of the integrated circuit device, the base, the first plurality of
folded fins, and the thermally conductive core are close to each other
during operation to enhance heat transfer from tine integrated circuit
device;
a second conductive ring having a second plurality of folded fins,
the secohd plurality of folded fins being thermally coupled to the lower
core surface area, the second conductive ring having a second diameter,
the first conductive ring having a first diameter, wherein the second
diameter is less than the first diameter and is sufficient to permit
components to be mounted on the circuit board and below the first
conductive ring ; and
a heat transport medium, wherein the thermally conductive core
has a top surface disposed across from the base and in close
proximity to the upper core surface area, and wherein the heat transport
medium is attached to the top surface such that a direction of flow of a
cooling medium introduced by the heat transport medium over the first
plurality of folded fins enhances heat extraction from the integrated circuit
device.
20. The heat dissipation system as claimed in claim 19, wherein the
integrated circuit device is a microprocessor.
21. A method of forming a heat dissipation device to extract heat from
an integrated circuit device mounted on an assembled printed circuit board, said
method comprising :
forming a thermally conductive core having upper and lower core surface
areas ;
forming a first array of radially extending fins ;
forming a first conductive ring from the formed first array, wherein the first
conductive ring has a first diameter; and
attaching the first conductive ring to the upper core surface area such that
the lower core surface area has sufficient space below the first conductive ring to
allow components to encroach around the integrated circuit device when the
device is mounted onto the integrated circuit device.
22. The method as claimed in claim 21, wherein forming the first array of
radially extending fins comprises :
forming a first conductive ribbon ;
forming a first alternative series of deep and shallow folds from the first
conductive ribbon ; and
forming the first conductive ring from the formed first alternative series of
deep and shallow folds.
23. A method of forming a heat dissipation device to extract heat from an
integrated circuit device mounted on an assembled printed circuit board, said
method comprising :
forming a thermally conductive core having upper and lower core surface
forming a first array of radially extending fins ;
forming a first conductive ring from the formed first array, wherein the
first conductive ring has a first diameter;
attaching the first conductive ring to the upper core surface area such that
the lower core surface area has sufficient space below the first conductive ring to
allow components to encroach around the integrated circuit device when the
device is mounted onto the integrated circuit device ;
forming a second array of radially extending fins ;
forming a second conductive ring from the formed second array, wherein
the second conductive ring has a second diameter, wherein the second diameter
is less than about half the first diameter; and
attaching the second conductive ring to the lower core surface area such
that the second diameter is of sufficient size to allow the components to
encroach around the integrated circuit device and below the first conductive ring.
24. The method as claimed in claim 23, wherein forming the second array
of radially extending fins comprises :
forming a second conductive ribbon;
forming a second alternative series of deep and shallow folds from the
second conductive ribbon ; and
forming the second conductive ring from the formed second alternative
series of deep and shallow folds.
25. The method as claimed in claim 24, comprising attaching an integrated
circuit device to the thermally conductive core.
26. The method as claimed in claim 25, wherein the integrated circuit device
comprises a microprocessor.
27. The method as claimed in claim 25, wherein the thermally conductive
core, the first conductive ring and the second conductive ring are made of a
thermally conductive material.
28. The method as claimed in claim 27, wherein the thermally conductive
core, the first conductive ring, and the second conductive ring are made of
materials selected from the group consisting of aluminum and copper.
29. The heat dissipation system as claimed in claim 16, comprising :
a second conductive ring having a second plurality of folded fins, the
second plurality of folded fins being thermally coupled to the lower core surface
area, the second conductive ring having a second diameter, the first conductive
ring having a first diameter, wherein the second diameter is less than the first
diameter and is sufficient to permit components to be mounted on the circuit
board and below the first conductive ring.
30. The heat dissipation system as claimed in claim 19, wherein the thermally
conductive core has an outer shape selected from the group consisting of
cylindrical, conical, square, and rectangular.
31. The method as claimed in claim 21, wherein in forming a thermally
conductive core, the thermally conductive core has an outer shape selected
from the group consisting of cylindrical, conical, square, and rectangular.
32. A heat dissipation device, substantially as herein described particularly
with reference to and as illustrated in the accompanying drawings.
33. A heat dissipation system, substantially as herein described particularly
with reference to and as illustrated in the accompanying drawings.
34. A method of forming a heat dissipation device, substantially as herein
described particularly with reference to and as illustrated in the accompanying
drawings.

A heat dissipation device (200) comprises :
a thermally conductive core (210), having a solid body and an axis (260),
and separate upper and lower outer surface areas (230, 240) parallel to the
axis ; and
a conductive ring (220) having a first array of radially extending fins (250)
thermally coupled to the upper outer surface area (230), the conductive ring
(220) having an outer diameter and a depth of sufficient size to provide space
below the first conductive ring to allow components to be mounted around and in
close proximity to the lower outer surface area and below the first conductive ring
when the device is mounted on an integrated circuit device.