Claims: WE CLAIM:

1. A heat exchanger assembly 100 for dissipating heat, the assembly comprising:
a heat exchanger base plate 104;
a heat sink 105, attached to a bottom of the heat exchanger base plate 104;
at least one heat generating source attached to the bottom of the heat exchanger base plate 104;
at least one heat pipe 103 attached to a top of the heat exchanger base plate 104;
a plugging means affixed at the top of the heat pipe 103;
a suspension pipe attached to the top of the heat exchanger base plate 104 further comprising an electric cable affixed inside the suspension pipe;
wherein one end of each of the heat pipe 103 is embedded into the heat exchanger base plate 104 which further facilitates a contact area between the heat pipes 103 and the heat exchanger base plate 104,
wherein the contact area is enabled to transfer optimum heat from the heat exchanger base plate 104 to the heat pipes 103.

2. The heat exchanger assembly 100 of claim 1, wherein the heat generating source is one of a light emitting diode, a halogen lamp, a mercury bulb, incandescent bulb or any other lighting devices capable of generating heat.

3. The heat exchanger assembly 100 of claim 1, wherein the heat is dissipated from a plurality of fins which are an integrated part of the heat pipes 103.

4. The heat exchanger assembly 100 of claim 3, wherein the heat pipes 103 integrated with the plurality of fins are co-extruded to form a one single heat pipe 103.

5. The heat exchanger assembly 100 of claim 4, wherein the co-extruded finned heat pipes 103 are made up of metals or metal alloys further comprising either of aluminium, aluminium alloy or the like.

6. The heat exchanger assembly 100 of claim 4, wherein the co-extruded finned heat pipes 103 are monolithically casted in a metal alloy which bonds the heat pipes 103 and its plurality of fins at all contact points.

7. The heat exchanger assembly 100 of claim 4, wherein each of the heat pipe 103 is filled with a coolant fluid 401 for transferring the heat from heating end of the heat pipes 103 to the cooling end by convection process.

8. The heat exchanger assembly 100 of claim 5, wherein the coolant fluid 401 is either one of a water, an alcohol, an ammonia or the like.

9. The heat exchanger assembly 100 of claim 5, wherein the liquid phase of the coolant fluid 401 absorbs heat and convert to the vapor phase for transferring heat form heating end of the heat pipes 103 to the cooling end.

10. The heat exchanger assembly 100 of claim 5, wherein the vapor phase of the coolant fluid 401 releases its heat to the atmosphere and further travels back to the liquid phase either by gravity or by capillary action of the wick structure inside the heat pipes 103.

11. The heat exchanger assembly 100 of claim 10, wherein each of the heat pipes 103 comprise a wick structure which facilitates the back flow of the coolant fluid 401.

12. A method of dissipating heat, the method comprising:
co-extruding, at least one heat pipe 103 with a plurality of integrated fins;
embedding, one end of each of the heat pipe 103 into a heat exchanger base plate which further facilitates a contact area between the heat pipes 103 and the heat exchanger base plate 104, wherein the contact area is enabled to transfer optimum heat from the heat exchanger base plate 104 to the heat pipes 103;
conducting, via the contact area, the heat generated by at least one of a heat generating source from the heat exchanger base plate 104 to the heat pipes 103;
transferring, within the heat pipe 103, a vapor phase of the coolant fluid 401 from heating end of the heat pipes 103 to the cooling end by convection process;
condensing, within the heat pipe 103, the transferred vapour form of the coolant fluid 401 at the cooling end by releasing the heat from the vapour to the walls of the heat pipe 103.

13. A method of dissipating heat of claim 12, wherein the heat generating source is at least one of a light emitting diode, a halogen lamp, a mercury bulb, incandescent bulb or any other lighting devices capable of generating heat.

14. The method of dissipating heat of claim 12, wherein the coolant fluid 401 is either one of a water, an alcohol, an ammonia or the like.

Dated this 5th day of May 2017

Priyank Gupta
Agent for the Applicant
IN/PA- 1454
, Description:FORM 2

THE PATENTS ACT, 1970
(39 of 1970)
&
THE PATENT RULES, 2003

COMPLETE SPECIFICATION

(See Section 10 and Rule 13)

Title of invention:
A HEAT EXCHANGER ASSEMBLY FOR DISSIPATING HEAT AND A METHOD THEREOF

APPLICANT:
Tucana lights Pvt. Ltd.
An Indian Entity
having address
31, heritage homes,
Thaltej village
Ahmedabad, Gujarat-380059
India

The following specification describes the invention and the manner in which it is to be performed.

CROSS-REFERENCE TO RELATED APPLICATIONS AND PRIORITY
The present application does not claim priority from any other patent application.

TECHNICAL FIELD

The present subject matter described herein, in general, relates to a heat exchanger assembly for dissipating heat and a method thereof.

BACKGROUND

Many electric or electronic components such as Light Emitting diode (LED), a halogen lamp, a mercury bulb, incandescent bulb or any other diodes or lighting devices may produce heat when such lights are switched on upon application of current.

Use of high power LED in lighting system is increasing day-by-day because of their optimum brightness levels as output. LED lighting system which is based on LED chips, are made from Gallium-Indium type PNP Diode junction. Upon application of direct current, they emit light along with radiant energy. As one side of the chip has to be mounted on holding surface, the mounting side of the chip, light on mounting side is converted in to heat. While the other side coverts most of the electric energy to light and radiant heat energy.

However, with the advancement in high power LED lighting technology, the heat generated with high power LED is also increased, and the dissipation of heat from LED becomes a critical problem. This heat from LED becomes the limiting factor for the life of chip. Such problem also limits the development and applications of LED lamps. The poor heat dissipation results to the overheating of LED lamps. When the junction temperature exceeds 120° C., the high temperature damages the LED lamps and leads to lower performance of LED, shorter service life, and even the peril of burnout. Heat dissipation systems that are already available in market have vertical orientation. Mounting high power LEDs on the vertical base is very difficult.

In view of the above, it can be concluded that there is a long-felt need to have a provision to dissipate the generated heat and to keep the chip cool and functional. There is a long-standing need for a provision to have a horizontal base for mounting the LEDs. The vertical heat dissipating tubes should be embedded in the horizontal base to maximize the heat transfer.

SUMMARY

This summary is provided to introduce concepts related to a heat exchanger assembly for dissipating heat and a method thereof and the concepts are further described in the detail description. This summary is not intended to identify essential features of the claimed subject matter nor it is intended to use in determining or limiting the scope of claimed subject matter.

In one implementation, the invention discloses a heat exchanger assembly for dissipating heat. The heat exchanger assembly may comprise a heat exchanger base plate, a heat sink, attached to a bottom of the heat exchanger base plate and at least one heat generating source attached to the bottom of the heat exchanger base plate. The heat exchanger assembly may further comprise at least one heat pipe attached to a top of the heat exchanger base plate, a plugging means affixed at the top of the heat pipe. The heat exchanger assembly may further comprise a suspension pipe attached to the top of the heat exchanger base plate and an electric cable affixed inside the suspension pipe. One end of each of the heat pipe is embedded into the heat exchanger base plate which further facilitates a contact area between the heat pipes and the heat exchanger base plate. Further, the contact area is enabled to transfer optimum heat from the heat exchanger base plate to the heat pipes.

In another implementation, the invention discloses a method of dissipating heat. The method may comprise co-extruding, at least one heat pipe with a plurality of integrated fins. The method may further comprise embedding, one end of each of the heat pipe into a heat exchanger base plate which further facilitates a contact area between the heat pipes and the heat exchanger base plate, wherein the contact area is enabled to transfer optimum heat from the heat exchanger base plate to the heat pipes. Further, the method may comprise conducting, via the contact area, the heat generated by at least one of a heat generating source from the heat exchanger base plate to the heat pipes. The method may comprise
transferring, within the heat pipe, a vapor phase of the coolant fluid from heating end of the heat pipes to the cooling end by convection process. The method may further comprise condensing, within the heat pipe, the transferred vapour form of the coolant fluid at the cooling end by releasing the heat from the vapour to the walls of the heat pipe.

BRIEF DESCRIPTION OF DRAWINGS

The detailed description is described with reference to the accompanying Figures. In the Figures, the left-most digit(s) of a reference number identifies the Figure in which the reference number first appears. The same numbers are used throughout the drawings to refer like features and components.

Figure 1 illustrates a heat exchanger assembly 100 for dissipating heat, in accordance with an embodiment of a present subject matter.

Figure 2 illustrates a three-dimensional (3-D) cross sectional view of the heat exchanger assembly 100 for dissipating heat, in accordance with an embodiment of a present subject matter.

Figure 3 illustrates an embedding of plurality of heat pipes on a heat exchanger base plate, in accordance with the embodiment of the present subject matter.

Figure 4 illustrates a 3-D cross sectional view of the heat pipe, in accordance with the embodiment of the present subject matter.

Figure 5 illustrates a cross sectional view 500 across the longitudinal axis of the heat pipe, in accordance with the embodiment of the present subject matter.

Figure 6 illustrates method 600 of dissipating heat, in accordance with the embodiment of the present subject matter.

DETAILED DESCRIPTION

Reference throughout the specification to “various embodiments,” “some embodiments,” “one embodiment,” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, appearances of the phrases “in various embodiments,” “in some embodiments,” “in one embodiment,” or “in an embodiment” in places throughout the specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures or characteristics may be combined in any suitable manner in one or more embodiments.

Figure 1 illustrates a heat exchanger assembly 100 for dissipating heat, in accordance with an embodiment of a present subject matter.

In one embodiment, the heat exchanger assembly 100 may comprise an electric cable 101, a suspension pipe 102, at least one heat pipe 103, a heat exchanger base plate 104, a heat sink 105 and a plugging means 106.

In one embodiment, an electric cable 101 may be used to provide electricity to the heat generating sources. The electric cable 101 may be affixed inside the suspension pipe 102.

In one embodiment, the suspension pipe 102 may be used to hang or affix the heat exchanger assembly 100 on the ceiling. The heat exchanger assembly 100 may also be hanged or affixed on the walls or roofs or the like. The suspension pipe 102 may be attached on a top of the heat exchanger base plate 104.

In one embodiment, the at least one heat pipe 103 may also be referred to as the heat pipe 103 or the heat pipes 103, hereinafter, may be attached on the top of the heat exchanger base plate 104. The heat pipe 103 may be integrated with the plurality of fins. The heat pipe 103 that is integrated with the plurality of fine may be co-extruded to form a one single heat pipe 103. The co-extruded finned heat pipes may be made up of metal or metal alloys such as but are not limited to aluminium, aluminium alloy or the like. The heat pipes 103 may be monolithically casted in a metal alloy which bonds the heat pipe 103 and its plurality of fins at all contact points.

In one embodiment, the plurality of fins may provide a very high surface area which further facilitate and promote the dissipation of heat. Further, due to the co-extrusion of the finned heat pipes, the process of making fins on each of the heat pipes separately may be shortened. The fins may be of variable size.

In one embodiment, one end of each of the heat pipe 103 may be embedded into the heat exchanger base plate 104 which further facilitates a contact area between the heat pipe 103 and the heat exchanger base plate 104. The contact area may be enabled to transfer optimum heat from the heat exchanger base plate 104 to the heat pipe 103, wherein the heat may be generated by at least one of a generating source that may be connected at a bottom of the heat exchanger base plate 104. Further, the heat pipes 103 may be sealed from the top by using the plugging means. The one end of the heat pipe 103 that may be embedded into the heat exchanger base plate 104 may also be referred to as a heating end and the top end that is sealed by using the plugging means may also be referred to as a cooling end, hereinafter.

In one embodiment, the heat generating sources may be either one of a Light Emitting Diode (LED), a halogen lamp, a mercury bulb, incandescent bulb or any other lighting devices capable of generating heat.

In one embodiment, the plurality of heat pipes 103 may be attached to the top of the heat exchanger base plate 104. Number of heat pipes that may be attached to the top of the heat exchanger base plate 104 may depend on various parameter and may vary as per the requirement. The various parameters may be such as but are not limited to number of heat generating sources, power of heat generating sources, or the like. Similarly, plurality of heat generating sources may be connected to the bottom of the heat exchanger base plate 104 as per the requirement.

In one embodiment, the heat pipes 103 may be filled with a coolant fluid 401 for transferring the heat from a heating end of the heat pipes 103 to a cooling end of the heat pipes 103 by convection process. The coolant fluid 401 may be capable to transfer heat by absorbing heat from the heating end and further releasing heat at the cooling end. The coolant fluid 401 may be such as but are not limited to water, alcohol, ammonia or the like.

In one embodiment, in order to transfer heat, the liquid phase of the coolant fluid 401 may absorb heat and may convert to the vapor phase for transferring heat from the heating end of the heat pipes 103 to the cooling end. The vapor phase of the coolant fluid 401 may release its heat to the atmosphere and further travel back to the liquid phase either by gravity or by capillary action of the wick structure inside the heat pipes 103. The wick structure that is inside the heat pipes 103 may facilitate the back flow of the coolant fluid 401.

In one embodiment, the heat sink 105 may be attached to the bottom of the heat exchanger base plate 104. The heat sink 105 may further facilitate the dissipation of heat that is generated by the heat generating sources.

Referring to figure 2, illustrates a three-dimensional (3-D) cross sectional view of the heat exchanger assembly 100 for dissipating heat, in accordance with an embodiment of a present subject matter.

Figure 3 illustrates an embedding of plurality of heat pipes on a heat exchanger base plate, in accordance with the embodiment of the present subject matter.

In one embodiment, one end of each of the heat pipe 103 may be embedded into the heat exchanger base plate 104 which may further facilitate a contact area between the heat pipe 103 and the heat exchanger base plate 104. The contact area may be enabled to transfer optimum heat from the heat exchanger base plate 104 to the heat pipe 103, wherein the heat may be generated by at least one of a generating source that may be connected at a bottom of the heat exchanger base plate 104. Further, the heat pipes 103 may be sealed from the top by using the plugging means 106.

In one embodiment, the heat generating sources may be either of a light emitting diode (LED), a halogen lamp, a mercury bulb, incandescent bulb or any other lighting devices capable of generating heat.

In one embodiment, the plurality of heat pipes 103 may be attached to the top of the heat exchanger base plate 104. Number of heat pipes that may be attached to the top of the heat exchanger base plate 104 may depend on various parameter and may vary as per the requirement. The various parameters may be such as but are not limited to number of heat generating sources, power of heat generating sources or the like. Similarly, plurality of heat generating sources may be connected to the bottom of the heat exchanger base plate 104 as per the requirement.

Figure 4 illustrates a 3-D cross sectional view of the heat pipe 103, in accordance with the embodiment of the present subject matter.

In one embodiment, the heat pipes 103 may be filled with a coolant fluid 401 for transferring the heat from a heating end of the heat pipes 103 to a cooling end of the heat pipes 103 by convection process. The coolant fluid 401 may be capable to transfer heat by absorbing heat from the heating end and further releasing heat at the cooling end. The coolant fluid 401 may be such as but are not limited to water, alcohol, ammonia or the like.

In one embodiment, in order to transfer heat, the liquid phase of the coolant fluid 401 may absorb heat and may convert to the vapor phase for transferring heat from the heating end of the heat pipes 103 to the cooling end. The vapor phase of the coolant fluid 401 may release its heat to the atmosphere and further travel back to the liquid phase either by gravity or by capillary action of the wick structure inside the heat pipes 103. The wick structure that is inside the heat pipes 103 may facilitate the back flow of the coolant fluid 401.

Figure 5 illustrates a cross sectional view 500 across the longitudinal axis of the heat pipe, in accordance with the embodiment of the present subject matter.

In one embodiment, the heat pipe 103 may be integrated with the plurality of fins. The heat pipe 103 that is integrated with the plurality of fins may be co-extruded to form one single heat pipe 103. The co-extruded finned heat pipes may be made up of metal or metal alloy such as but are not limited to aluminium, aluminium alloy or the like. The heat pipes 103 may be monolithically casted in a metal alloy which may bond the heat pipe 103 and its plurality of fins at all contact points.

In one embodiment, the plurality of fins may provide a very high surface area which may further facilitate and promote the dissipation of heat. Further, due to the co-extrusion of the finned heat pipes, the process of making fins on each of the heat pipes separately may be shortened. The fins may be of variable size.

In one embodiment, the heat exchanger assembly 100 which may comprise the heat pipes 103 integrated with the plurality of fins which may be co-extruded to form a one single heat pipe 103 and further the heat pipes 103 may be embedded into the heat exchanger base plate 104 which may further facilitate a contact area between the heat pipes 103 and the heat exchanger base plate 104. Further, the contact area may be enabled to transfer optimum heat from the heat exchanger base plate 104 to the heat pipes 103. Due to the integration of the plurality of fins with the heat pipes 103 and embedding one end of the heat pipes 103 into the heat exchanger base plate 104, the heat exchanger assembly 100 may become compact and economical. Further, the functionality of the heat exchanger assembly 100 me be enhanced.

Figure 6 illustrates method 600 of dissipating heat, in accordance with the embodiment of the present subject matter.

At step 601, at least one heat pipe 103 with a plurality of heat fins may be co-extruded.

In one embodiment, the at least one heat pipe 103 may also be referred to as the heat pipe 103 or the heat pipes 103, hereinafter, may be attached on the top of the heat exchanger base plate 104. The heat pipe 103 may be integrated with the plurality of fins. The heat pipe 103 that is integrated with the plurality of fine may be co-extruded to form a one single heat pipe 103. The co-extruded finned heat pipes may be made up of metal or metal alloy such as but are not limited to aluminium, aluminium alloy or the like. The heat pipes 103 may be monolithically casted in a metal alloy which bonds the heat pipe 103 and its plurality of fins at all contact points.

In one embodiment, the plurality of fins provides a very high surface area which may further facilitate and promote the dissipation of heat. Further, due to the co-extrusion of the finned heat pipes, the process of making fins on each of the heat pipes separately may be shortened. The fins may be of variable size.

At step 602, one end of each of the heat pipe may be embedded into the heat exchanger base plate 104.

In one embodiment, one end of each of the heat pipe 103 may be embedded into the heat exchanger base plate 104 which further facilitates a contact area between the heat pipe 103 and the heat exchanger base plate 104.

At step 603, the heat generated by at least one of a heat generating source may be conducted from the heat exchanger base plate 104 to the heat pipes 103.

In one embodiment, the contact area between the heat exchanger base plate 104 to the heat pipes 103 may be enabled to transfer optimum heat from the heat exchanger base plate 104 to the heat pipe 103, wherein the heat may be generated by at least one of a generating source that may be connected at a bottom of the heat exchanger base plate 104. Further, the heat pipes 103 may be sealed from the top by using the plugging means 106.

At step 604, a vapor form of the coolant fluid 401 may be transferred from heating end of the heat pipes 103 to the cooling end.

In one embodiment, the heat pipes 103 may be filled with a coolant fluid 401 for transferring the heat from the heating end of the heat pipes 103 to the cooling end of the heat pipes 103 by convection process. The coolant fluid 401 may be capable to transfer heat by absorbing heat from the heating end and further releasing heat at the cooling end. The coolant fluid 401 may be selected from fluids comprising but not limited to water, alcohol, ammonia, or the like.

In one embodiment, in order to transfer heat, the liquid phase of the coolant fluid 401 may absorb heat and may convert to the vapor phase for transferring heat from the heating end of the heat pipes 103 to the cooling end.

At step 605, the transferred vapour form of the coolant fluid 401 may be condensed at the cooling end within the heat pipes 103.

In one embodiment, the vapor phase of the coolant fluid 401 may release its heat to the cooling and end which may further release the heat to the atmosphere and may further travel back to the liquid phase either by gravity or by capillary action of the wick structure inside the heat pipes 103. The wick structure that is inside the heat pipes 103 may facilitate the back flow of the coolant fluid 401.

The embodiments, examples and alternatives of the preceding paragraphs or the description and drawings, including any of their various aspects or respective individual features, may be taken independently or in any combination. Features described in connection with one embodiment are applicable to all embodiments, unless such features are incompatible.

Although implementations for a heat exchanger assembly for dissipating heat and a method thereof have been described in language specific to structural features and/or methods, it is to be understood that the appended claims are not necessarily limited to the specific features or methods described. Rather, the specific features and methods are disclosed as examples of implementations for a heat exchanger assembly for dissipating heat and a method thereof.