A heat dissipation device for an integrated circuit assembly is disclosed. A heat sink (100) for a microprocessor comprises a thermally conductive base (110) having a plurality of fin structures (120) upwardly extending from the thermally conductive base (110). The plurality of fin structures (120) having a first surface (123) comprises a plurality of surface area enhancer structures (130) to increase a convection surface area of the heat sink (100) for a given volume of a heat sink to enhance heat dissipation from the heat sink.
| # | Name | Date |
|---|---|---|
| 1 | IN-PCT-2002-1052-KOL-FER-[04-11-2004].pdf | 2004-11-04 |
| 2 | IN-PCT-2002-1052-KOL-LETTER OF PATENT CERTIFICATE-[28-05-2006].pdf | 2006-05-28 |
| 3 | in-pct-2002-1052-kol-granted-specification.pdf | 2011-10-08 |
| 4 | in-pct-2002-1052-kol-granted-reply to examination report.pdf | 2011-10-08 |
| 5 | in-pct-2002-1052-kol-granted-letter patent.pdf | 2011-10-08 |
| 6 | in-pct-2002-1052-kol-granted-gpa.pdf | 2011-10-08 |
| 7 | in-pct-2002-1052-kol-granted-form 5.pdf | 2011-10-08 |
| 8 | in-pct-2002-1052-kol-granted-form 3.pdf | 2011-10-08 |
| 9 | in-pct-2002-1052-kol-granted-form 18.pdf | 2011-10-08 |
| 10 | in-pct-2002-1052-kol-granted-form 1.pdf | 2011-10-08 |
| 11 | in-pct-2002-1052-kol-granted-examination report.pdf | 2011-10-08 |
| 12 | in-pct-2002-1052-kol-granted-drawings.pdf | 2011-10-08 |
| 13 | in-pct-2002-1052-kol-granted-description (complete).pdf | 2011-10-08 |
| 14 | in-pct-2002-1052-kol-granted-correspondence.pdf | 2011-10-08 |
| 15 | in-pct-2002-1052-kol-granted-claims.pdf | 2011-10-08 |
| 16 | in-pct-2002-1052-kol-granted-abstract.pdf | 2011-10-08 |
| 17 | IN-PCT-2002-1052-KOL-FORM-15.pdf | 2011-10-08 |
| 18 | IN-PCT-2002-1052-KOL-CORRESPONDENCE.pdf | 2011-10-08 |
| 19 | IN-PCT-2002-1052-KOL-(28-06-2013).RESTORATION-WITHDRAWN.pdf | 2013-06-28 |
| 20 | in-pct-2002-1052-kol-21-01-2023-relevent documents.pdf | 2023-01-21 |
| 21 | IN-PCT-2002-1052-KOL-25-01-2023-RELEVANT DOCUMENTS.pdf | 2023-01-25 |