A Heat Sink Device For Cooling An Integrated Circuit And Method For The Same.

Abstract: This invention relates to removing heat from a system, and more particularly to removing heat from an integrated circuit die. Figure 2 shows heat sink (100) comprises a heat sink body (201) comprising a number of fins (203) and a cavity (205) for holding a phase change material (211) and a number of particles (213) to enhance the mixing of the phase change material during the operation of the heat sink. In operation, the body of the heat sink conducts thermal energy to the phase change material. The energy is absorbed during the phase change of the phase change material. After absorbing energy and changing to a liquid state, the phase change material continues to dissipate energy by convection. The convention currents in the cavity are directed by the shape of the cavity surfaces and enhanced by the particles intermixed with the phase change material.

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